KR101023070B1 - Method for scribing substrate - Google Patents

Abstract

In a substrate cutting method of scribing a substrate having a plurality of unit substrates using a plurality of scribing wheels, the substrate is scribed into unit substrates using a scribing wheel, and the position information of each unit substrate is obtained. After storing together with the scribing result of the unit substrate, and using the stored scribing result and position information to measure the corresponding scribing wheel.

Scribing, Feedback, Correction, Scribing Wheel

Description

Substrate Cutting Method {METHOD FOR SCRIBING SUBSTRATE}

The present invention relates to a substrate cutting method used in the manufacture of a flat panel display panel, and more particularly, to a substrate cutting method in which defects are reduced by sharing information on a unit substrate between a scribing device and an inspection machine.

Recently, information processing devices have been rapidly developed to have various types of functions and faster information processing speeds. Such information processing apparatus has a display for displaying the activated information. Conventionally, a cathode ray tube monitor is mainly used as a display, but recently, a light and space-saving thin film transistor-liquid crystal display panel or organic light emitting diodes display The use of such flat panel displays is greatly increasing.

In general, a panel used for a flat panel display or the like is usually manufactured using a brittle substrate, and the panel is roughly classified into a single plate substrate composed of one sheet or a bonded substrate bonded to two substrates.

Since the bonded substrates are processed into small and various sizes such as panels for TVs and displays, such as panels for liquid crystal displays of mobile phones, they are cut from large substrates into unit substrates of a predetermined size and each panel is cut. Used as

As a representative method for cutting a substrate, there is a method of cutting using a scribe wheel (Scribe Wheel) in which fine diamond is embedded.

A method of cutting a substrate using a scribe wheel includes a scribing process of forming a scribe line having a predetermined depth along the cut schedule line after contacting the scribe wheel with the cut schedule line of the substrate, and physically forming the substrate on the substrate. By applying an impact to propagate cracks along the scribe line, a breaking process of cutting the substrate into the unit substrate and a distribution process of distributing the unit substrate in a subsequent process.

However, the scribing process and the dispensing process are separate devices, and if a defect occurs in the scribing wheel, even though the defect is continuously generated at the same position, the position of the substrate and the top of the scribing wheel are individually It was very difficult to grasp. Accordingly, the individual substrates had to be inspected, and there was a problem that it was not easy to find a defective scribing wheel. In addition, after changing the recipe such as the scribing order, it takes time to find the misalignment such as the flatness of the equipment and the squareness of the scribing head, which not only increases the overall processing time but also increases the manufacturing cost. .

SUMMARY OF THE INVENTION An object of the present invention is to provide a substrate cutting method for managing, feeding back, and automatically correcting a defect type of a unit substrate, thereby reducing process time and increasing process efficiency with a reduction in defect rate during substrate cutting.

Substrate cutting method for scribing a substrate having a plurality of unit substrates using a plurality of scribing wheel scribes the substrate to the unit substrates using a scribing wheel, the position of each unit substrate And storing the information together with the scribing result of the unit substrate, and then using the stored scribing result and the position information to measure the corresponding scribing wheel.

The location information of the unit substrate may include information of a corresponding scribing wheel used to scribe an edge of the unit substrate.

The stored scribing result is information on whether the edge of the unit substrate is defective, and the defect is determined by determining a plurality of reference points on the substrate, measuring a distance from the reference point to the scribing line, and then If it is greater than or equal to the standard range, it is regarded as defective.

Measuring the distance from the reference point is to measure the shortest distance from the reference point, to image the substrate using an imager, and to process the captured image signal to obtain the scribed edge from the reference point. Compute the shortest distance to get distance information.

The scribed unit substrate is then broken and then distributed in a subsequent process, and determining whether the defect is performed is performed in the distributing step.

The scribing wheel is deactivated or replaced according to the failure.

Information of the unit substrate may be displayed using the stored scribing result and the position information, and the position of the edge of the unit substrate and the unit substrate when the number of defects of the unit substrate is equal to or greater than the predetermined number of times. Information on the scribing wheel used at the corners of the display can be displayed.

In addition, prior to scribing the substrate into the unit substrate, a usage recipe in which a matching condition between the scribing wheel and the edge of the unit substrate is set for the substrate may be prepared, and a predetermined recipe according to the usage recipe may be prepared. The scribe wheel may be used to scribe the edges of the unit substrate.

Hereinafter, a scribing apparatus according to a preferred embodiment of the present invention, and a substrate cutting apparatus and method using the same will be described in detail with reference to the accompanying drawings. First, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are assigned to the same components as much as possible, even if shown on different drawings. In addition, in describing the present invention, when it is determined that the detailed description of the related known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted.

1 is a diagram illustrating an example of a substrate 10.

Referring to FIG. 1, the substrate 10 may be a panel for a thin film transistor-liquid crystal display (TFT-LCD). The substrate 10 has a generally rectangular plate shape. The substrate 10 has a form in which the upper substrate 11 and the lower substrate 13 are bonded to each other. A plurality of unit substrates 15 may be formed on the substrate 10, and the unit substrates 15 may be arranged in a lattice shape on a plane of the substrate 10. The lower substrate 13 is a substrate on which a thin film transistor substrate is formed, and the upper substrate 11 is a substrate on which a color filter substrate is formed. The substrate 10 may be an organic light emitting display (OLED) panel or an electrophoretic display (EPD) panel, which is a kind of flat panel display panel.

2 is a view schematically showing the configuration of a substrate cutting device 100 according to the present invention.

Referring to FIG. 2, the substrate cutting apparatus 100 is for cutting the substrate 10 into a plurality of unit substrates 15, and the loading unit 110, the scribing apparatus 120, and the breaking unit 130. And a distribution unit 140. The loading unit 110, the scribing apparatus 120, the breaking unit 130, and the distribution unit 140 may be sequentially arranged in a line. However, the arrangement structure of the substrate cutting device 100 according to the present invention is not limited thereto, and in addition, the arrangement structure of the substrate cutting device 100 may have various arrangement structures, such as a c-shaped arrangement structure.

The substrate 10 is loaded into the substrate cutting device 100 through the loading unit 110, and the scribing device 120 forms a scribe line on the substrate 10 using the scribing device 120. do. The breaking unit 130 separates the unit substrates 15 from the substrate 10 by applying a force to a scribe line portion formed on the substrate 10 using a break bar (not shown), and separates the unit substrate. 15 are carried out to the subsequent process through the distribution unit 140,15.

3 is a view schematically showing the configuration of the scribing apparatus 120 of FIG. 2, and FIG. 4 is a view of scribing the substrate 10 using the scribing apparatus 120 of FIG. 3. It is the top view shown.

Referring to FIG. 3, the scribing apparatus 120 moves the support member 121 supporting the substrate 10, the scribing wheel 123 forming the scribe line, and the scribing wheel 123. It includes a mobile unit 125 to make. The substrate 10 is supported with the substrate 10 placed on the support member 121, and the scribing wheel 123 forms a scribe line on the substrate 10 placed on the support member 121. The moving unit 125 linearly moves the scribing wheel 123 along a cutting schedule line on the substrate 10 during the scribing process.

The scribing wheel 123 is provided in the form of a disk with a sharp edge to scribe on the substrate 10, the scribing wheel 123 is seated on the support 124.

The scribing unit 123 may be provided in plural, and the wheels 123a and 123b scribe the edges of the unit substrate 10.

With this configuration, the scribing apparatus 120 according to the present invention forms a scribe line on the substrate 10. In this case, a plurality of scribing wheels 123 forming the scribe line are provided. Referring to the drawings, there is shown a device with six scribing wheels 123 (wherein reference numerals are given to only some of the scribing wheels).

The edges of each unit substrate 15 are scribed by the scribing wheel 123, and a scribing wheel 123 corresponding to each edge may be designated as necessary. That is, if the plurality of unit substrates 15 are on the substrate 10, one edge of the unit substrate 15 is driven by one scribing wheel 123, and the other edge thereof is the other scribing wheel ( 123). That is, the scribing wheel 123 may be matched with the corners of each unit substrate 15. For example, when there is the first scribing wheel 123a and the second scribing wheel 123b, the I-axis direction of the substrate uses the first scribing wheel 123a, and the II-axis direction The second scribing wheel 123b may be used. In addition, when the third scribing wheel is present, it is a matter of course that the edges of the I-axis direction or the II-axis direction of the partial region can be scribed. As described above, each unit substrate 15 is scribed using a plurality of scribing wheels 123.

At this time, before the scribing the substrate 10 to the unit substrate 15, the use recipe in which a matching condition between the scribing wheel 123 and the edge of the unit substrate 15 is set for the substrate 10. Can be prepared. The recipe corresponds to a cutting map, which corner of which unit substrate 15 is to be scribed using which scribing wheel 123, etc. The number or the state of the scribing wheel 123 is determined in consideration of. The edge of the unit substrate 15 may be scribed using the scribing wheel 123 predetermined according to the recipe.

When scribing the edges of the unit substrate 15 using the scribing wheel 123, the position information of the scribing wheel 123 and the unit substrate 15 used or the unit substrate 15 are used. Information about each of the corners is stored. The information is then shared with subsequent processes and used to calculate information about the failure of the unit substrate 15.

After the scribing is completed, the unit substrate 15 is then transferred to the distribution unit 140 to be discharged to the subsequent process through the braking process. The distribution unit 140 places the unit substrate 15 in an appropriate position to perform a subsequent process on the unit substrate 15, for example, a grinding process for polishing the edges of the scribed unit substrate 15. To distribute.

The distribution unit 140 is provided with a tester (not shown) for inspecting a scribing result, that is, whether the scribed unit substrate 15 is defective. Whether the unit substrate 15 is defective is information on whether the edge of the unit substrate 15 is defective, and a portion of the single substrate edge that is not scribed remains in the defect (remain), the unit substrate 15 Crack defects and the like which are overscribed to the inside of some regions of the crack and cause cracking.

The defect is determined by determining a plurality of reference points on the substrate 10, measuring a distance to the scribing line from the reference point, and evaluating the defect as a failure when the distance is greater than or equal to the reference range. do.

5 illustrates a substrate on which a reference point for evaluating scribing failure of the unit substrate 15 is displayed.

As illustrated, the unit substrate 15 is included on the substrate 10, and the first scribing line 129a and the second scribing line 129b are formed along the edge of the unit substrate 15. Formed. The first scribing line 129a and the second scribing line 129b may be formed of the same scribing wheel 123 or may be formed of different scribing wheels 123. A first reference point S1 for inspecting the distance to the scribing wheel 123 is located outside the unit substrate 15. Second to fourth reference points S2, S3, S4, and S5 for measuring a distance to a scribing line are positioned near each vertex of the unit substrate 15.

When measuring the distance from the reference points (S1 to S5), a method of measuring the shortest distance from the reference point is used. When measuring the shortest distance, various methods may be used, but the unit substrate 15 is photographed by using an imager capable of capturing an image, and the image signal is processed to process the image from the reference points S1 to S5. The shortest distance to the scribed edge may be calculated to obtain distance information.

Referring to the drawings, the distance D11 from the first reference point S1 to the first scribing line is measured, and the distance D21 from the second reference point S2 to the first scribing line and The distance D22 to the second scribing line is measured. In the same manner, the distance of the scribing lines that form the other edge of the unit substrate 15 is measured.

In this case, when the distance from the reference point to the scribed edge is larger or smaller than a prescribed range, it is determined to be a defect, and the information on whether the defect is stored in the scribing used scribing wheel 123 and the It is stored together with the position information of the unit substrate 15 or information about each corner of the unit substrate 15, and the like is fed back to the scribing apparatus and reflected in the recipe during scribing.

The defect can be easily corrected by changing the scribing wheel 123 or the condition of the recipe according to the feedback. For example, when a failure occurs due to a problem of the scribing wheel 123 itself such as abrasion or malfunction of the scribing wheel 123 due to the feedback, the problematic scribing wheel 123 may be replaced. Can be. Alternatively, the scribing wheel 123 having a problem may be deactivated so as not to be used, and another spare scribing wheel 123 may be used.

At this time, if necessary, the number of repetitions of the failure may be determined, and if the number of failures is equal to or greater than the determined number of failures, measures may be taken to indicate whether or not the failure occurs.

The scribing information, the unit substrate 15 information, the corner information, the defectiveness, and whether the scribing wheel 123 is replaced or whether the recipe is changed are all displayed to the user through a separate display device. The user can optionally apply the process according to the requirements or needs of the process.

As described above, the scribing result and the position information of the substrate are linked to each other in the scribing unit and the distribution unit.

Substrate cutting device according to the present invention having the configuration as described above, in the cutting device having a plurality of scribing wheel, the overall equipment inspection by automatically verifying and correcting the cutting error of each individual scribing wheel Improve productivity by eliminating time spent. In addition, by utilizing the existing tester has the advantage that no additional cost.

In addition to this, there is an effect of inspecting the entire edge of the substrate for the abnormality of the scribing line, and even if the scribing line is changed individually, the abnormality or the defect can be immediately confirmed.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of the present invention.

1 is a diagram illustrating an example of a substrate.

2 is a view schematically showing the configuration of a substrate cutting device according to the present invention.

FIG. 3 is a diagram schematically illustrating a configuration of the scribing unit of FIG. 2.

FIG. 4 is a plan view illustrating scribing a substrate using the scribing unit of FIG. 3.

5 illustrates a substrate on which a reference point for evaluating a scribing failure of a unit substrate is indicated.

** Detailed Description of Symbols in Drawings **

100: substrate cutting device 110: loading part

120: scribing apparatus 121: support member

123: scribing wheel 130: breaking part

140: distribution unit

Claims (10)

In the substrate cutting method for scribing a substrate having a plurality of unit substrates using a plurality of scribing wheel, Scribing the substrate into the unit substrates using the scribing wheel; Storing the position information of each unit substrate together with the scribing result of the unit substrate; And Deactivating or replacing the scribing wheel by using the stored scribing result and the position information; The scribing result is a substrate cutting method characterized in that the information about whether the edge of the unit substrate. The method of claim 1, And the position information of the unit substrate includes information of a corresponding scribing wheel used to scribe an edge of the unit substrate. The method of claim 2, Determining whether the defect is, Defining a plurality of reference points on the substrate; Measuring a distance from the reference point to a scribing line; And And determining that the defect is bad when the distance is greater than or equal to the reference value range. The method of claim 3, Measuring the distance from the reference point is measuring the shortest distance from the reference point. The method of claim 3, Measuring the distance from the reference point Imaging the substrate using an imager; And Processing the captured image signal to calculate a shortest distance from the reference point to the scribed edge to obtain distance information. The method of claim 3, Breaking the scribed unit substrate and dispensing the broken unit substrate in a subsequent process, Determining whether the defect is performed in the distributing step. delete delete The method of claim 1, And displaying information of the unit substrate by using the stored scribing result and the position information, and when the number of defects of the unit substrate is equal to or greater than a predetermined number, And displaying information of a corresponding scribing wheel used at an edge of the unit substrate. The method of claim 1, A scribing step further comprising the step of preparing a usage recipe in which a matching condition between the scribing wheel and the edge of the unit substrate is set for the substrate, and separating into a unit substrate using a plurality of scribing wheels. The method of cutting a substrate, characterized in that for scribing the edge of the unit substrate using a scribing wheel predetermined according to the use recipe.

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