KR101021980B1 - Substrates transffer device, substrates treating apparatus having the same and method of transtffering substrates using the same - Google Patents

Abstract

The substrate transfer apparatus has a support plate and at least one fixing member. The support plate is movable horizontally, and the fixing member is detachably coupled to the support plate. The fixing member supports the substrate, and vacuum-adsorbs the substrate to fix the substrate on the support plate. As such, since the support part is detachably coupled to the support plate, when the support part is worn out due to friction with the substrate, the support part can be easily removed and replaced from the support plate. Thereby, maintenance of a board | substrate conveyance apparatus is easy and maintenance cost can be reduced.

Description

Substrate transfer apparatus, substrate processing apparatus having the same, and substrate transfer method using the same {SUBSTRATES TRANSFFER DEVICE, SUBSTRATES TREATING APPARATUS HAVING THE SAME AND METHOD OF TRANSTFFERING SUBSTRATES USING THE SAME}

The present invention relates to an apparatus for manufacturing a semiconductor substrate, and more particularly, to a substrate transfer apparatus for transferring a semiconductor substrate during semiconductor substrate processing, a substrate processing apparatus having the same and a substrate transfer method using the same.

In general, a semiconductor substrate manufacturing process is performed by repeatedly depositing an insulating film and a metal material, etching, coating a photo resist, coating, developing, and asher. To form a fine patterning (patterning) consisting of thin films.

A spinner device is a device for applying and developing a photoresist on a substrate as one of semiconductor manufacturing devices. The spinner device includes a loading / unloading unit, an index robot, a buffer unit, processing units, and a main transfer robot from one side. The index robot transfers the substrate between the buffer unit and the loading / unloading unit, and the main transfer robot transfers the substrate between the buffer unit and the process chambers. Process units perform application and development processes. The buffer unit waits for substrates to be introduced into the processing units, or waits for the substrates processed in the processing units to be transferred to the loading / unloading unit.

Transfer robots, such as an index robot and a main transfer robot, have a plurality of transfer hands that each load a substrate, and the substrate is transferred while being seated on the transfer hand.

Each transfer hand is provided with chucking members for preventing the substrate from being separated from the robot during the transfer process. Such chucking members include a vacuum method of fixing a substrate to an arm using a vacuum pressure, and an edge grip method of supporting a side surface of the substrate.

In the vacuum method, a vacuum hole is formed in the arm to adsorb the substrate onto the upper surface of the arm. The vacuum method causes wear of the surface of the arm by the substrate, and the substrate may fall off the arm if the vacuum pressure is not provided stably. On the other hand, since the edge grip method supports the side of the substrate, the chucking member is in contact with the side of the substrate. Therefore, when the substrate having the high viscosity thin film is transferred, the thin film may be damaged by the contact between the side surface of the thin film and the chucking member.

It is an object of the present invention to provide a substrate transfer apparatus capable of improving the yield of a product.

Moreover, the objective of this invention is providing the substrate processing apparatus provided with the said substrate transfer apparatus.

It is also an object of the present invention to provide a method for transferring a substrate using the substrate transfer apparatus described above.

A substrate transfer device according to one feature for realizing the above object of the present invention comprises a support plate and at least one fixing member.

The support plate is movable horizontally. The fixing member is detachably coupled to the support plate, supports the substrate, and fixes the substrate on the support plate by vacuum suction.

Specifically, the support plate is provided with at least one coupling groove on one surface, the fixing member is inserted detachably into the coupling groove.

The fixing member may include a support and a cover. The support portion is detachably inserted into the coupling groove, supports the substrate, and spaces the substrate from the support plate. The cover is detachably inserted into the coupling groove, provides an insertion hole into which the support is inserted, and fixes the support to the support plate.

Here, the support portion is made of a resin material, the support plate is made of a metal material.

In addition, the substrate transfer method according to one feature for realizing the above object of the present invention is as follows. First, the substrate is mounted on the fixing member provided in the transfer hand. The fixing member conveys the substrate while the substrate is vacuum-adsorbed. The worn member is replaced by checking the worn state of the fixing member installed in each transfer hand. Here, the substrate seated on the fixing member is spaced apart from the support plate of the transfer hand to which the fixing member is detachably coupled.

In addition, the substrate processing apparatus according to one feature for realizing the above object of the present invention may be composed of a storage container, at least one processing unit and a transfer unit.

The storage container houses the substrate. The processing unit is subjected to the processing of the substrate. The transfer unit transfers the substrate between the receiving container and the processing unit. Specifically, the transfer unit may have a plurality of transfer hands and a body. The plurality of transfer hands may each have a substrate seated thereon, each arranged horizontally with respect to the ground, facing each other, and capable of horizontal movement. The body is coupled with the transfer hands and each moves the transfer hands horizontally. Each transfer hand comprises a support plate and at least one fixing member. The support plate is horizontally movable, at least one coupling groove is provided on one surface, and transports the substrate. The fixing member is detachably inserted into the coupling groove, and vacuum-adsorbs the substrate.

According to the present invention described above, the support portion that substantially supports the substrate during substrate transfer is coupled detachably from the support plate. Therefore, when the support part is worn out due to friction with the substrate, the support part can be easily removed and replaced from the support plate, so that the maintenance of the substrate transfer device is easy and the maintenance cost can be reduced.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the following, the wafer is described as an example of the substrate, but the technical spirit and scope of the present invention are not limited thereto.

1 is a schematic view of a substrate processing system according to an embodiment of the present invention.

Referring to FIG. 1, the substrate processing system 1000 of the present invention includes a loading / unloading unit 110, an index robot 200, a buffer unit 300, and a main transfer robot ( 500), a plurality of bake units 601, 602, 603, and a plurality of process units 701, 702, 703.

The loading / unloading unit 110 includes a plurality of load ports 110a, 110b, 110c and 110d. In this embodiment, the loading / unloading unit 110 has four load ports 110a, 110b, 110c, and 110d, but the number of load ports 110a, 110b, 110c, and 110d is the substrate. It may increase or decrease depending on the process efficiency and the foot print conditions of the processing system 1000.

Front open unified pods (FOUPs) 120a, 120b, 120c, and 120d in which wafers are accommodated are mounted in the load ports 110a, 110b, 110c, and 110d. Each of the pools 120a, 120b, 120c, and 120d is formed with a plurality of slots for storing the wafers in a state in which the wafers are arranged horizontally with respect to the ground. The wafers 120a, 120b, 120c, and 120d contain wafers that have been processed in the process units 701, 702, and 703 or wafers to be injected into the process units 701, 702, and 703. Hereinafter, for convenience of description, the wafers processed by the processing units 701, 702, and 703 are called processed wafers, and the wafers not yet processed are called raw wafers.

The index robot 200 is installed between the loading / unloading unit 110 and the buffer unit 300, and a first transfer rail 811 is installed below the index robot 200. The index robot 200 transfers wafers between the loading / unloading unit 110 and the buffer unit 300 while moving along the first transfer rail 811. That is, the index robot 200 extracts at least one raw wafer from the pools 120a, 120b, 120c, and 120d mounted on the loading / unloading unit 110, and loads the at least one raw wafer into the buffer unit 300. . In addition, the index robot 200 extracts at least one processed wafer from the buffer unit 300 and loads the processed wafers into the pools 120a, 120b, 120c, and 120d seated on the loading / unloading unit 110. .

In detail, the index robot 200 may include an arm driving unit 210, a plurality of index arms 220, and a horizontal moving unit 230. The arm driver 210 horizontally moves the index arms 220, and each index arm is individually driven by the arm driver 210. The index arms 220 are installed above the arm driver 210. The index arms 220 may be disposed to face each other in the vertical direction and may load one wafer.

A rotating unit (not shown) is installed below the arm driving unit 210, and a vertical moving unit (not shown) is installed below the rotating unit. The rotating part rotates the arm driver 210, and the vertical moving part raises and lowers the rotating part. A horizontal moving part 230 is installed below the vertical moving part. The horizontal moving unit 230 is coupled to the first transfer rail 811 to move horizontally along the first transfer rail 811.

On the other hand, the buffer unit 300 is installed on one side of the area where the index robot 200 is installed. The buffer unit 300 accommodates the raw wafers transferred by the index robot 200 and the processed wafers processed by the processing units 701, 702, and 703.

The main transport robot 500 is installed between the bake units 601, 602, and 603 and the process units 701, 702, and 703, and is disposed below the main transport robot 500. The transfer rail 812 is installed. The main transfer robot 500 moves along the second transfer rail 812 and between the buffer unit 300 and the bake units 601, 602, 603, the bake units 601, 602, The wafer is transferred between the 603 and the processing units 701, 702, and 703 and between the buffer unit 300 and the processing units 701, 702, and 703. That is, the main transfer robot 500 pulls out at least one raw wafer from the buffer unit 300 and provides it to the bake units 601, 602, 603, and the bake units 601, 602, 603. Wafers are processed into the processing units 701, 702, and 703. In addition, the main transfer robot 500 loads the wafer processed in the processing units 701, 702, and 703, that is, the processed wafer, into the buffer unit 300.

A detailed description of the configuration of the main transport robot 500 will be described later with reference to FIGS. 2 to 7.

The baking units 601, 602, and 603 and the processing units 701, 702, and 703 are disposed to face each other with a transfer passage 400 provided with the second transfer rail 812 therebetween. Each bake unit 601, 602, 603 includes a bake plate 610 and a cooling plate 620. The bake plate 610 heats the raw wafer, and the cooling plate 620 cools the raw wafer heated in the bake plate 610 to an appropriate temperature. In one example of the present invention, the baking units 601, 602, 603 may be arranged in a multi-layered structure in which three to five stacked in a vertical direction.

Wafers preprocessed in the baking units 601, 602, and 603 are introduced into the processing units 701, 702, and 703 by the main transfer robot 500. Each of the processing units 701, 702, and 703 processes the injected wafer to generate a processed wafer. In one example of the invention, the processing units 701, 702, 703 apply and develop photoresist on a wafer.

Hereinafter, the main transfer robot 500 will be described in detail with reference to the accompanying drawings.

2 is a perspective view of the main transport robot shown in FIG.

1 and 2, the main transfer robot 500 may include a hand driver 510, a plurality of transfer hands 560, a rotating part 570, a vertical moving part 580, and a horizontal moving part 590. May include.

In detail, the hand driver 510 horizontally moves the transfer hands 560, and each transfer hand 520, 530, 540, and 550 is individually driven by the hand driver 510.

The transfer hands 560 are installed above the hand driver 510. The transfer hands 560 may be disposed to face each other in the vertical direction, and may load one wafer. In this embodiment, the main transfer robot 500 has four transfer hands 520, 530, 540, 550, but the number of transfer hands 520, 530, 540, 550 is the substrate processing system. It may increase with the process efficiency of (1000).

The transfer hands 560 are composed of first to fourth transfer hands 520, 530, 540, and 550. The transfer hands 560 may be divided into operation transfer hands 520 and 530 for transferring a raw wafer and discharge transfer hands 540 and 550 for transferring a processed wafer. In this case, The input transfer hands 520 and 530 and the discharge transfer hands 540 and 550 are not mixed with each other. In one example of the present invention, the first and second transfer hands 520 and 530 are used for input and the third and fourth transfer hands 540 and 550 are used for discharge. The discharge transfer hands 540 and 550 are located on the top of the transfer transfer hands 520 and 530. Accordingly, the main transfer robot 500 may prevent the processing wafer from being contaminated by the raw wafer in the process of transferring the raw wafer and the processing wafer, thereby improving the yield of the product.

The transfer transfer hands 520 and 530 take out the raw wafers from the buffer unit 300 and provide them to the baking unit in an idle state. The discharge transfer hands 540 and 550 take out the processed wafer from the completed process unit and load the processed wafers in the buffer unit 300, respectively.

In this embodiment, the transfer transfer hands 520 and 530 and the discharge transfer hands 540 and 550 each consist of two transfer hands, but the transfer transfer hands 520 and 530 The number of the discharge transfer hands 540 and 550 may increase according to the processing efficiency of the substrate processing system 1000.

Detailed description of the configuration of each transfer hand (520, 530, 540, 550) will be described later with reference to Figs.

On the other hand, the rotating unit 570 is installed below the hand driving unit 510. The rotating unit 570 is coupled to the hand driving unit 510 and rotates to rotate the hand driving unit 510. Accordingly, the transfer hands 560 rotate together.

The vertical moving part 580 is installed below the rotating part 570, and the horizontal moving part 590 is installed below the vertical moving part 580. The vertical moving part 580 is combined with the rotating part 570 to raise and lower the rotating part 570, whereby the vertical positions of the hand driving part 510 and the transfer hands 560 are adjusted. . The horizontal moving unit is coupled to the second transfer rail 812 to move horizontally along the second transfer rail 812.

3 is a partial perspective view of the fourth transfer hand shown in FIG. 2, and FIG. 4 is a partial plan view of the fourth transfer hand shown in FIG. 3.

2 and 3, in this embodiment, the first to fourth transfer hands 520, 530, 540, and 550 have the same configuration. Therefore, hereinafter, the configuration of each of the transfer hands 520, 530, 540, and 550 will be described in detail using the fourth transfer hand 550 as an example, and the configuration of the first to third transfer hands 520 is described. Description of the description is omitted.

The fourth transfer hand 550 may include a support plate 551 and a plurality of fixing members 552 and 553. The support plate 551 may include a first plate 551a on which the wafer 10 is seated and a second plate 551b connected to the hand driver 510. The first plate 551a is disposed parallel to the ground and has a 'U' shape. However, the shape of the first plate 551a is not limited thereto.

In detail, the first plate 551a may include first and second support bars 51a and 51b and a connection part 51c. The first and second support bars 51a and 51b have a rod shape, are spaced apart from each other, and face each other, and extend in the same direction. Both ends of the connecting portion 51c are connected to the first and second support bars 51a and 51b, respectively.

The first and second support bars 51a and 51b and the connecting portion 51c have a plurality of alignment holes 53a, 53b, 53c, 53d, 53e, 54a, 54b, for aligning positions between adjacent transfer hands. 55a, 55b, 55c, 55d) are formed. Four alignment holes 53a, 53b, 53c, 53d, 53e, 55a, 55b, 55c, and 55d are formed in the first and second support bars 51a and 51b, respectively, and two in the connection part 51c. Alignment holes 54a and 54d are formed, but the number of the alignment holes may increase or decrease. That is, the four transfer hands 520, 530, 540 and 550 are all formed at the same position with alignment holes 53a, 53b, 53c, 53d, 53e, 54a, 54b, 55a, 55b, 55c and 55d, and these alignment holes are adjacent to each other. These are the reference points used to align the transfer hands (located above and below) to be side by side on the same line. The alignment of the transfer hands is achieved by adjusting the positions of the transfer hands to position the alignment holes formed in the four transfer hands 520, 530, 540, and 550 on the same vertical line.

The second plate 551b is connected to the first plate 551a and moves horizontally according to the driving of the hand driver 510.

Vacuum passages 52a and 52b are formed inside the first and second plates 551a and 551b. The vacuum flow path 52a formed on the first plate 551a is connected to the vacuum flow path 52b formed on the second plate 551b, and the vacuum flow path 52b formed on the second plate 551b is a vacuum pump. 820 is connected.

The fixing members 552 and 553 supporting the wafer 10 are detachably installed on an upper surface of the first plate 551a. In this embodiment, the fourth transfer hand 550 has two fixing members 552, 553, but the number of the fixing members 552, 553 is the size and conveyance of the first plate 551a. It may increase or decrease with efficiency.

The fixing members 552 and 553 may include first and second fixing members 552 and 553. The first fixing member 552 is detachably installed on the upper surface of the first support bar 51a, and the second fixing member 553 is detachably installed on the upper surface of the second support bar 51b. do.

In this embodiment, the first and second fixing members 552 and 553 have the same configuration. Therefore, in the following detailed description of the configurations of the first and second fixing members 552 and 553, the first fixing member 552 is described as an example, and the description of the second fixing member 553 is described. Is omitted.

5 is an exploded perspective view illustrating the first fixing member illustrated in FIG. 3, and FIG. 6 is a cross-sectional view taken along the line II ′ of FIG. 4.

4 to 6, a coupling groove 51d is formed on an upper surface of the first plate 551a, and the first fixing member 552 is inserted into the coupling groove 51d. The first fixing member 552 may include a cover 552a and a support 552b. The cover 552a is detachably coupled to the first plate 551a, and the cover 522a has a generally rectangular plate shape. Each corner of the cover 552a is formed with a screw hole 22 into which the screw 41 is inserted, and the cover 552a is coupled to the first plate 551a through screwing.

An insertion hole 21 into which the support part 552 is inserted is formed at the center of the cover 552a. The support part 552b has a ring shape and supports the wafer 10 spaced apart from the first plate 551a.

In detail, the support part 552b may include a base ring 31 having a ring shape and an insertion part 32 surrounding the lower end portion of the side surface of the base ring 31. The base ring 31 is inserted into the insertion hole 21 of the cover 552a, and the insertion portion 32 is inserted into the insertion groove 23 formed in the cover 552a. That is, the insertion groove 23 is in contact with the insertion hole 21 on the lower surface of the cover 552a and surrounds the insertion hole 21.

Here, the coupling relationship between the first fixing member 552 and the first plate 551a will be described. First, the support part 552b is seated in the coupling groove 51d, and then the cover 552a is inserted into the coupling groove 51d. In this process, the base ring 31 is inserted into the insertion hole 21 of the cover 552a, the upper surface is exposed to the outside. The insertion portion 32 of the support portion 552b is inserted into the insertion groove 23, and the cover 552a presses the insertion portion 32 toward the lower surface side of the first plate 551a to support the support portion ( 552b) is fixed to the first plate 551a.

The upper surface of the support part 552b seated in the coupling groove 51d is located above the upper surface of the first plate 551a.

A vacuum hole 51e is formed in a surface defining the coupling groove 51d, and the vacuum hole 51e communicates with a vacuum flow path 52a formed in the first plate 551a. A suction hole 31a is formed in the central portion of the support part 552b to communicate with the vacuum hole 51e. Accordingly, when the vacuum pump 820 (see FIG. 3) is driven, the wafer 10 seated on the support 552b is adsorbed to the support 552b by a vacuum pressure, whereby the wafer 10 Is fixed to the fourth transfer hand 550.

The base ring 31 may further include a protrusion 31b protruding from the upper surface. The protrusion part 31b is formed at the end of the base ring 31, and has a ring shape in plan view. The protrusion part 31b supports the wafer 10 spaced apart from the suction hole 31a.

The support part 552b is made of a different material from the first plate 551a, and is made of a resin material, for example, polyether ether ketone (PEEK). In one example of the present invention, the first plate 551a and the cover 552a are made of a metal material, for example, aluminum.

As such, since the support part 552b substantially supports the wafer 10 when the wafer 10 is transported, wear due to friction with the wafer 10 occurs only in the support part 522b. Therefore, it is not necessary to replace the entire fourth transfer hand 550, and only the worn support part 522b needs to be replaced, so maintenance is easy.

In addition, since the support part 552b is made of a lower cost material than the first plate 551a, maintenance cost is reduced.

3 and 4, the fourth transfer hand 550 may further include a plurality of guide members 554a, 554b, 555a, and 555b. The plurality of guide members 554a, 554b, 555a, and 555b are upper surfaces of the first guide members 554a and 554b and the connecting portion 51c provided on the upper surfaces of the first and second support bars 51a and 51b, respectively. And second guide members 555a and 555b installed at the upper and lower sides of the second guide member. The first guide members 554a and 554b are installed at ends of the first and second support bars 51a and 51b, and the second guide members 555a and 555b are spaced apart from each other.

The guide members 554a, 554b, 555a, and 555b are positioned outside the wafer 10 seated on the first and second fixing members 552 and 553. When a high viscosity thin film is formed on the wafer 10, the thin film may be damaged when the guide members 554a, 554b, 555a, and 555b contact the wafer 10. To prevent this, the guide members 554a, 554b, 555a, and 555b are spaced apart from the wafer 10.

The guide members 554a, 554b, 555a, and 555b guide the side surfaces of the wafer 10 so that the vacuum pressure leaks from the first and second fixing members 552 and 553. Is prevented from being separated from the fourth transfer hand 550.

FIG. 7 is a cross-sectional view taken along the line II-II ′ of FIG. 4.

4 and 7, the guide members 554a, 554b, 555a, and 555b are detachably coupled to the first plate 551a. As shown in FIG. 7, the guide member 554a installed in the first support bar 51a is coupled to the first support bar 51a using a screw 42, and the remaining guide members 554b, 555a and 555b are also coupled to the first plate 551a in the same manner.

As such, the guide members 554a, 554b, 555a, and 555b are coupled to the first plate 551a through screwing, and thus are easily replaced.

Hereinafter, a process in which the transfer hands 560 transfer the wafer 10 and the replacement of the support part 552a will be described in detail using the fourth transfer hand 550 as an example.

8 is a flowchart illustrating a process of transferring a wafer by using the main transfer robot shown in FIG. 2, and FIG. 9 is a cross-sectional view illustrating a state in which a wafer is seated in a fourth transfer hand illustrated in FIG. 6.

3, 8, and 9, the fourth transfer hand 550 is moved horizontally to seat the wafer 10 on the first and second fixing members 552 and 553, and the first and second fastening hands 550. The second fixing members 552 and 553 vacuum suction the wafer 10 to fix the wafer 10 to the fourth transfer hand 550 (step S110). In this case, the wafer 10 is spaced apart from the guide members 554a, 554b, 555a, and 555b.

The main transport apparatus 500 may move the wafer 10 to a destination, for example, the baking units 601, 602, while vacuuming the wafer 10 onto the first and second fixing members 552 and 553. 603, the process units 701, 702, and 703 and the buffer unit 300 are transferred to one of the process units (S120).

In the process of repeating the transfer of the wafer, the support 552b provided in each of the transfer hands 520, 530, 540, and 550 may be damaged by friction with the wafer 10, and the support 552b may be replaced. The process is as follows.

First, the state of the support part 552b of each fixing member installed in each transfer hand 520, 530, 540, 550 is checked to determine the wear level of each support part 552b (step S130).

After the cover 552a of the fixing member having the worn portion 552b is removed from the first plate, the worn portion is replaced with a new support portion (step S140).

Although described with reference to the embodiments above, those skilled in the art will understand that the present invention can be variously modified and changed without departing from the spirit and scope of the invention as set forth in the claims below. Could be.

1 is a schematic view of a substrate processing system according to an embodiment of the present invention.

2 is a perspective view of the main transport robot shown in FIG.

3 is a partial perspective view showing the fourth transport hand shown in FIG. 2.

4 is a partial plan view of the fourth transfer hand shown in FIG. 3.

5 is an exploded perspective view illustrating the first fixing member illustrated in FIG. 3.

6 is a cross-sectional view taken along the line II ′ of FIG. 4.

FIG. 7 is a cross-sectional view taken along the line II-II ′ of FIG. 4.

FIG. 8 is a flowchart illustrating a process of transferring a wafer using the main transfer robot shown in FIG. 2.

9 is a cross-sectional view illustrating a state in which a wafer is seated in a fourth transfer hand illustrated in FIG. 6.

Explanation of symbols on the main parts of the drawings

100: loading / unloading unit 200: index robot

300: buffer unit 400: connection passage

500: main transfer robot 601, 602, 603: bake unit

701, 702, 703: process unit

Claims (15)

A plurality of transfer hands each having a substrate seated thereon, each disposed horizontally with respect to the ground to face each other, and capable of horizontal movement; And A hand driver coupled to the transfer hands and configured to horizontally move each of the transfer hands; The transfer hand A horizontally movable support plate having a first plate on which a substrate is seated and a second plate connected to the hand driver; And At least one fixing member detachably coupled to the first plate, supporting the substrate, and fixed to the support plate by vacuum suction of the substrate, The first plate is a substrate transfer apparatus, characterized in that a plurality of alignment holes are formed for alignment with the adjacent transfer hand. The method of claim 1, The support plate is provided with at least one coupling groove on one surface, And the fixing member is detachably inserted into the coupling groove. The method of claim 2, wherein the fixing member, A support part detachably inserted into the coupling groove to support the substrate and to separate the substrate from the support plate; And And a cover which is detachably inserted into the coupling groove, provides an insertion hole into which the support is inserted, and fixes the support to the support plate. The method of claim 3, The support plate is provided on the surface defining the coupling groove provides a vacuum hole for providing a vacuum pressure, The support portion substrate transfer apparatus, characterized in that for providing a suction hole in communication with the vacuum hole. The substrate transport apparatus of claim 3, wherein the support portion further includes a support protrusion protruding from an upper surface to support the substrate. The substrate transport apparatus of claim 3, wherein the support and the support plate are made of different materials. The substrate transport apparatus of claim 6, wherein the support part is made of a resin material, and the support plate is made of a metal material. The method according to any one of claims 1 to 7, And at least one guide member detachably coupled to the support plate and positioned outside the substrate seated on the support plate, the guide member guiding a position of the substrate. The substrate transfer apparatus of claim 8, wherein the guide member engages the support plate through screwing. delete delete delete In a substrate transfer method for transferring a substrate using the substrate transfer device claimed in claim 1, Aligning the positions of the transfer hands by adjusting the transfer hands such that the positions of the alignment holes corresponding to each other formed in two adjacent transfer hands coincide on the same vertical line; Mounting a substrate on the fixing member; Transferring the substrate by the fixing member in a state in which the substrate is vacuum-adsorbed; And Checking the wear state of the fixing member installed in each of the transfer hands, and replacing the worn fixing member, And a substrate seated on the fixing member is spaced apart from the support plate of the transfer hand to which the fixing member is detachably coupled. delete delete

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