KR101015208B1 - Apparatus and method for processing a substrate - Google Patents

Abstract

PURPOSE: A device and a method for processing a substrate are provided to enable a pattern to be regularly processed on a substrate and to enable a plurality of substrates to be processed at a time since a laser head moves at a uniform speed using a driving unit. CONSTITUTION: A device(1000) for processing a substrate comprises a driving unit(400), at least one laser head(500) and at least one laser generator(700). The driving unit is arranged to rotate at a uniform speed along a closed curve on the substrate. The central axis of the driving unit rotates along with first and second rotary shafts(200,300). The first and second rotary shafts are arranged in parallel to each other. The at least one laser head is mounted on the driving unit to move along a planar trace. The laser head processes a pattern on the substrate using laser. The at least one laser generator is arranged adjacent to the driving unit. The laser generator supplies the laser to the laser head.

Description

Substrate processing apparatus and method {APPARATUS AND METHOD FOR PROCESSING A SUBSTRATE}

The present invention relates to a substrate processing apparatus and method, and more particularly, to an apparatus and method for processing a pattern on a substrate, such as a light guide plate used in a backlight unit of a liquid crystal display using a laser.

Recently, with the rapid development of semiconductor and information technology, a liquid crystal display (LCD) device having light weight, high resolution, low power, and environmentally friendly advantages has been widely used. Accordingly, the liquid crystal display device is rapidly spreading its application range from a small display device such as a mobile communication terminal, a navigation device, a portable game machine or a notebook computer to a large display device such as a desktop computer and a television.

However, the liquid crystal display device does not form an image by itself to emit light, but receives a light from the outside to form an image. Accordingly, it is common to arrange a backlight unit (BLU) that provides light behind a liquid crystal panel that displays image information such as text or images.

Such a backlight unit may be classified into a direct type and an edge type according to whether the position of the light source is located at the rear part or the side part. In this case, unlike the direct type backlight unit, the edge type backlight unit includes a light guide plate (LGP) for guiding light generated from a side part to the liquid crystal panel.

In this case, the light guide plate may have a scattering pattern in which dots or protrusions are processed regularly or irregularly to guide the light uniformly to the liquid crystal panel.

As a method of processing the scattering pattern on the light guide plate, a printing method including an exposure process using a mask, a mechanical method using cutting and injection processing, and a processing method using a laser are widely used.

In the printing method, a photolithography process using a mask is mainly used as a method of forming the scattering pattern on a medium-large light guide plate. However, during the photolithography process, a cleaning liquid penetrates between the mask and the surface of the light guide plate to provide sufficient luminance as the defect rate increases. It does not have the disadvantage. In addition, the mechanical method using the cutting and injection processing has a disadvantage in that the processing time is long, the production efficiency is low, and it is difficult to freely control the shape of the scattering pattern.

Accordingly, recently, the scattering pattern is processed by arranging a plurality of dots having a certain rule on the surface of the light guide plate by directly irradiating a laser directly to the surface of the light guide plate to form local dots and moving the laser head along a predetermined pattern. The processing method using the laser is widely used.

In the conventional processing method using a laser, the processing speed for processing the scattering pattern depends on the moving speed of the laser head by individually processing the unit by dots by the movement of the laser head.

However, when the moving speed of the laser head is moved at a high speed in order to improve the process speed, precise control is difficult due to the mechanical vibration caused by the heavy weight of the laser head, thereby increasing the moving speed of the laser head. Not only is it difficult to increase the process speed, it may be difficult to operate the speed at constant speed.

One object of the present invention is to provide a substrate processing apparatus capable of uniformly processing a pattern on a substrate such as a light guide plate at a higher processing speed using two laser heads.

Another object of the present invention is to provide a method for processing a pattern on the substrate using the substrate processing apparatus described above.

A substrate processing apparatus according to an embodiment of the present invention for achieving the above object includes a drive mechanism, at least one laser head and at least one laser generator.

The drive mechanism is arranged to rotate along a plane trajectory at the top of the substrate. The laser head is mounted to the drive mechanism to move along the plane trajectory, and processes the pattern on the substrate using a laser. The laser generator is disposed adjacent to the drive mechanism for providing the laser to the laser head.

In one embodiment, the drive mechanism may be a linear motor.

In one embodiment, the driving mechanism may have at least one straight section in which the substrate is processed. Specifically, the drive mechanism may have first and second straight sections. In this case, the laser head may include first and second laser heads mounted at positions opposite to each other of the driving mechanism.

In addition, the laser generator is a first laser generator for providing the laser to the first laser head or the second laser head moving the first straight section and the first laser head moving the second straight section. Or a second laser generator for providing the laser to the second laser head.

In one embodiment, the laser generator may provide the laser to the laser head through at least one light path switching member for changing the direction of travel of the laser.

In one embodiment, the substrate processing apparatus may further include a laser absorbing member disposed at a position where the laser is emitted from the laser generator to absorb the emitted laser.

In one embodiment, the substrate processing apparatus may further include a pedestal provided with a transfer mechanism for transferring the substrate in the in-line form at the bottom of the substrate.

A substrate processing apparatus according to another embodiment of the present invention for achieving the above object includes a first rotating shaft, a second rotating shaft, a drive mechanism, at least one laser head and at least one laser generator.

Each of the first and second rotational axes has a central axis parallel to each other. The drive mechanism is connected with the first and second rotation shafts to rotate together with the first and second rotation shafts between the first and second rotation shafts. The laser head is mounted to the driving mechanism to move in accordance with the rotation of the driving mechanism, and processes the pattern using a laser on a substrate to be transported from the lower portion of the driving mechanism. The laser generator is disposed adjacent to at least one of the first and second rotational axes to provide the laser to the laser head.

In one embodiment, the drive mechanism may be made of a belt or a chain.

In one embodiment, the drive mechanism may have at least one straight section in which the substrate is processed between the first and second rotational axes. Specifically, the drive mechanism may have first and second straight sections. In this case, the laser head may include first and second laser heads mounted at positions opposite to each other of the driving mechanism.

In addition, the laser generator is a first laser generator for providing the laser to the first laser head or the second laser head moving the first straight section and the first laser head moving the second straight section. Or a second laser head for providing the laser to the second laser head.

In one embodiment, the laser generator may provide the laser to the laser head through at least one light path switching member for changing the direction of travel of the laser.

In one embodiment, the substrate processing apparatus may further include a guide member for guiding the movement of the laser head outside the drive mechanism.

In one embodiment, the substrate processing apparatus may further include a laser absorbing member disposed at a position where the laser is emitted from the laser generator to absorb the emitted laser.

In one embodiment, the substrate processing apparatus may further include a pedestal provided with a transfer mechanism for transferring the substrate in the in-line form at the bottom of the substrate.

In one embodiment, the first and second rotation axes may be arranged to pass through the substrate therebetween.

The substrate processing method according to an embodiment of the present invention for achieving the above another object is at least one laser head mounted on the drive mechanism for connecting between the first and second rotational axis having a central axis parallel to each other Positioning at a first starting position to face the second rotation axis from the first rotation axis or at a second starting position toward the first rotation axis from the second rotation axis, transferring the substrate to the bottom of the drive mechanism; and Rotate at least one of the first and second rotational axes to provide a laser to the laser head while moving the laser head to the second or first rotational axis through rotation of the drive mechanism to provide a pattern to the substrate. Processing.

In one embodiment, the substrate processing method may further include absorbing a laser provided to the laser head after processing a pattern on the substrate.

According to the present invention, the laser head is rotated to the drive mechanism by rotating the first and second rotation shafts at the same speed as the at least one laser head is mounted on the drive mechanism that rotates together with the first and second rotation shafts. It can make constant motion by this. As a result, the laser head can process a pattern on a substrate.

In addition, by mounting two first and second laser heads to the drive mechanism so that the substrate can be thermally processed two times at a time, the substrate can be increased without increasing the moving speed of the first and second laser heads. The pattern can be processed at a faster rate than. Thus, by increasing the number of substrates in a predetermined time it can be expected to improve the productivity of the substrate.

1 is a perspective view schematically showing a substrate processing apparatus according to an embodiment of the present invention.
FIG. 2 is a view of the substrate processing apparatus shown in FIG. 1 as viewed from above. FIG.
FIG. 3 is a side view of the substrate processing apparatus shown in FIG. 1.
4 is a view illustrating in detail the laser processing unit of the first laser head in the substrate processing apparatus shown in FIG.
FIG. 5 is a flowchart illustrating a method of processing a pattern on a substrate by using the substrate processing apparatus shown in FIG. 1.
6A and 6B are views illustrating a method of processing a pattern on a substrate according to the flowchart shown in FIG. 5.
7 is a schematic view of a substrate processing apparatus according to another embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

In each of the drawings of the present invention, the size or dimensions of the structures are shown to be enlarged or reduced than actual for clarity of the invention.

In the present invention, the terms first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

For the embodiments of the invention disclosed herein, specific structural and functional descriptions are set forth for the purpose of describing an embodiment of the invention only, and it is to be understood that the embodiments of the invention may be practiced in various forms, But should not be construed as limited to the embodiments set forth in the claims.

That is, the present invention may be modified in various ways and may have various forms. Specific embodiments are illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to a specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

1 is a perspective view schematically showing a substrate processing apparatus according to an embodiment of the present invention, Figure 2 is a view from above the substrate processing apparatus shown in Figure 1, Figure 3 is a substrate processing apparatus shown in FIG. The view from the side.

1 to 3, a substrate processing apparatus 1000 according to an embodiment of the present invention may include a pedestal 100, a first rotating shaft 200, a second rotating shaft 300, a driving mechanism 400, and a first And a first laser head 500, a second laser head 600, and at least one laser generator 700.

The substrate 10 is placed on the pedestal 100. Here, the substrate 10 is made of a resin material such as acrylic, which is easy to process. The substrate 10 may be a light guide plate for guiding light from a light source to a liquid crystal panel in an edge type liquid crystal display such as a mobile communication terminal, a navigation device, a portable game machine, or a notebook computer.

The pedestal 100 is provided with a transfer mechanism 110 for transferring the substrate 10 in the horizontal direction along the x-axis. The transfer mechanism 110 may transfer the substrate 10 in an in-line form. To this end, the transfer mechanism 110 may be composed of a driving unit 112 for generating a linear driving force and a guide unit 114 for guiding the transfer of the substrate 10.

The driving unit 112 may be a linear motor mounted along an x-axis on an upper surface of the pedestal 100, and the guide unit 114 may be connected to the linear motor on an upper surface of the pedestal 100. At least one may be mounted in the form of a bar along a parallel x-axis. Alternatively, the transfer mechanism 110 may have a conveyor belt or a roller structure capable of transferring the substrate 10 through the rotational force of the motor.

Each of the first and second rotation shafts 200 and 300 has a central axis 20 in a direction parallel to each other along a z axis and is spaced apart from each other on the upper surface of the pedestal 100. In detail, each of the first and second rotation shafts 200 and 300 may have a shape protruding from a top surface of the pedestal 100 in a cylindrical shape. In addition, the first and second rotation shafts 200 and 300 may be spaced apart from the width of the substrate 10 so that the substrate 10 passes along the x axis therebetween.

The first and second rotation shafts 200 and 300 may rotate at the same speed along the same rotation direction. To this end, the first and second rotation shafts 200 and 300 may be connected to one motor. Specifically, any one of the first and second rotation shafts (200, 300) is connected to the motor to rotate, the other is configured to only rotate, such as an idle roller (Idle Roller) from any one of Rotational force may be transmitted to the other through the belt 400 to be described later. Alternatively, each of the first and second rotation shafts 200 and 300 may be connected to each of two motors that are controlled in the same manner.

Each of the first and second rotation shafts 200 and 300 is mounted with first and second pulleys 210 and 310 at an upper portion thereof. Each of the first and second pulleys 210 and 310 rotates about the same central axis 20 as each of the first and second rotation shafts 200 and 300.

The driving mechanism 400 may be formed of a belt having a structure wound around the first and second pulleys 210 and 310. Alternatively, the drive mechanism 400 may be made of a chain (Chain). In this case, each of the first and second pulleys 210 and 310 may be formed of a sprocket coupled to the chain. Hereinafter, the drive mechanism 400 will be described in detail by renaming the belt 400 to the same reference numeral.

The belt 400 rotates together through the first and second pulleys 210 and 310 when the first and second rotation shafts 200 and 300 rotate. Accordingly, the belt 400 is directly connected to the first and second pulleys 210 and 310 to wind the first and second rotation shafts 200 and 300, respectively. RS1 and RS2 and the first and second rotation sections RS1 and RS2 have first and second straight sections LS1 and LS2 that are parallel to each other and drive in opposite directions. Here, the first and second straight sections LS1 and LS2 are formed along a y axis perpendicular to the x axis, which is a direction in which the substrate 10 is transferred.

The belt 400 rotates the first and second rotation shafts 200 and 300 at the same speed, so that the belt 400 may move at the same speed in the first and second straight sections LS1 and LS2.

The belt 400 may be mounted to the first and second pulleys 210 and 310 so as to have sufficient tension to prevent sagging in the first and second straight sections LS1 and LS2. In addition, the belt 400 and the first and second pulleys 210 and 310 may be formed of a timing belt and a timing pulley structure to be more stably coupled.

Each of the first and second laser heads 500 and 600 is mounted to the belt 400 to move in accordance with the rotation of the belt 400. Each of the first and second laser heads 500 and 600 is mounted at positions opposite to each other of the belt 400. For example, each of the first and second laser heads 500 and 600 may be mounted to face each other at the center of each of the first and second linear sections LS1 and LS2 and move in opposite directions. .

In the present embodiment, it has been described that the first and second laser heads 500 and 600 are composed of two, but in some cases, only one of them may be mounted on the belt 400.

Meanwhile, when the first and second laser heads 500 and 600 move along the belt 400, the belt 400 is made of a substantially flexible material, and thus the first and second laser heads 500 and 600 move. Due to their weight, the heads 500 and 600 may sag in the first and second straight sections LS1 and LS2.

Thus, the substrate processing apparatus 1000 may further include a guide member 800 for guiding movement of the first and second laser heads 500 and 600 at the outer side of the belt 400. The guide member 800 may be made of a metal material having excellent strength. The guide member 800 may have a structure supported by the pedestal 100 or an outer frame (not shown).

In this case, the substrate processing apparatus 1000 does not have a structure in which the belt 400 is connected to each of the first and second rotation shafts 200 and 300, and the guide member 800 may be formed on the substrate 10. It can be configured to rotate along a plane trajectory at the top. Here, the planar trajectory may be substantially made in a direction parallel to the substrate 10.

The guide member 800 is to replace the role of the drive mechanism 400 made of the belt 400. The guide member 800 may be formed of, for example, a driving rail including a linear motor.

As such, when the guide member 800 is configured as the driving rail, the first and second rotation shafts 200 and 300 and the belt 400 described above may be removed. In addition, the guide member 800 may be configured to have at least one of the first and second straight sections LS1 and LS2.

The laser generator 700 is disposed adjacent to at least one of the first and second rotation shafts 200 and 300 to provide the first and second laser heads 500 and 600 to the laser beam L. Occurs. Specifically, the laser generator 700 applies the laser L to the first laser head 500 or the second laser head 600 moving in each of the first and second linear sections LS1 and LS2. The first and second laser generators 710 and 720 may be provided.

Accordingly, since the laser L typically has a straightness, the first and second laser generators 710 and 720 each move in each of the first and second straight sections LS1 and LS2. Each of the first and second laser heads 500 and 600 may be disposed to directly emit the laser L along the y axis. Like the guide member 800, the first and second laser generators 710 and 720 may have a structure supported by the pedestal 100 or an outer frame (not shown).

Hereinafter, since the first and second laser heads 500 and 600 have the same structure except for the position mounted on the belt 400, the first and second laser heads 500 and 600 will be described on behalf of the first laser head 500. In this case, reference is made to FIG. 4.

4 is a view illustrating in detail the laser processing unit of the first laser head in the substrate processing apparatus shown in FIG.

Referring to FIG. 4, the first laser head 500 is integrally formed with the first mounting portion 510 and the first mounting portion 510 mounted to the belt 400 to the guide member 800. The second mounting part 520 is mounted, and the laser processing part 530 is mounted at a position opposite to the first mounting part 510 of the second mounting part 520.

The laser processing unit 530 processes the pattern 30 on the surface of the substrate 10 using the laser L provided from the first laser generator 710. In the present exemplary embodiment, the laser L is provided from the first laser generator 710, but the laser L may be provided from the second laser generator 720. Hereinafter, repeated description of the above will be omitted.

In this case, the pattern 30 may be formed of a plurality of dots 32 which are constantly arranged by the laser (L). Thus, when the substrate 10 processed with the pattern 30 is to be used as the light guide plate, the light incident from the light source may be scattered by the dots 32 to be uniformly emitted to the liquid crystal panel.

The laser processing unit 530 is mounted on the body 532 at the upper portion of the hollow 533, the body 532 having a hollow 533 in the vertical direction in the z-axis while being mounted on the second mounting unit 520. The reflector 534 and the focus lens 536 mounted to the body 532 at the lower portion of the hollow 533 may include.

The reflector 534 reflects the laser L, which is generated from the first laser generator 710 and exits along the y-axis, by 90 degrees toward the substrate 10 and reflects the z-axis. Thus, the reflector 534 may have a reflecting surface 535 inclined at 45 degrees to a portion where the laser L collides.

The focus lens 536 concentrates the laser L redirected from the reflector 534 on the surface of the substrate 10 so that the laser L may be substantially processed into the pattern 30. Make it. At this time, on the side of the focus lens 536 to adjust the focal length between the surface of the substrate 10 and the focus lens 536 to maximize the energy of the laser (L) concentrated on the surface of the substrate 10 An adjustable member (not shown) may be further disposed.

As such, the first and second laser heads 500 and 600 are mounted on the belt 400 that rotates at a constant speed, such as the first and second rotation shafts 200 and 300, to the substrate 10. The pattern 30 can be processed uniformly.

Meanwhile, when each of the first and second laser heads 500 and 600 moves in each of the first and second rotation sections RS1 and RS2, that is, the first and second laser heads 500 and 600 respectively. When the first and second laser generators 710 and 720 do not process the pattern 30 on the substrate 10, the laser L generated from the first and second laser heads 500 is reduced. , 600, but may damage other external devices or other configurations of the present substrate processing apparatus 1000.

Accordingly, the substrate processing apparatus 1000 is disposed at a position where the laser L is emitted from each of the first and second laser generators 710 and 720, and thus the first and second laser heads 500 and 600. ) May further include first and second laser absorbing members 900 and 950 for absorbing the emitted laser L when the respective ones move in the first and second rotation periods RS1 and RS2. .

In this case, each of the first and second laser absorbing members 900 and 950 is connected to a separate driving mechanism 910 such as a cylinder so that each of the first and second laser heads 500 and 600 is formed of the first and second laser absorbing members 900 and 950. It can be controlled to absorb the laser (L) only when moving in the first and second rotation period (RS1, RS2). As a result, the first and second laser generators 710 and 720 may stably generate the laser L regardless of a standby state or an operating state.

In addition, the first and second laser generators 710 and 720 may generate the laser L in the form of a pulse so that the pattern 30 is entirely processed in a lattice form on the substrate 10. For example, the first and second laser generators 710 and 720 may generate the pulse oscillation type CO ₂ laser L to have a wavelength band of 1 μm.

As such, since the laser L is already generated in a pulse form from the first and second laser generators 710 and 720, a plurality of dots having a constant arrangement on the surface of the substrate 10 without any additional configuration. The pattern 30 consisting of the 32 can be processed.

Hereinafter, a method of processing the pattern 30 on the substrate 10 using the substrate processing apparatus 1000 will be described in more detail with reference to FIGS. 5, 6A, and 6B.

5 is a flowchart illustrating a method of processing a pattern on a substrate using the substrate processing apparatus illustrated in FIG. 1, and FIGS. 6A and 6B are views illustrating a method of processing a pattern on a substrate according to the flowchart illustrated in FIG. 5. .

With further reference to FIGS. 5, 6A and 6B, a first start to first direct each of the first and second laser heads 500, 600 from the first axis of rotation 200 to the second axis of rotation 300. Position and at each of the second starting position toward the first rotating shaft 200 from the second rotating shaft 300 (S10). For simplicity, each of the first and second laser heads 500 and 600 is positioned at opposite ends of each of the first and second straight sections LS1 and LS2.

In the present embodiment, it has been described that each of the first and second laser heads 500 and 600 is positioned at each of the first and second start positions, but the first and second laser heads 500 and 600 are described. Only one of them may be located at the first starting position or the second starting position.

Subsequently, the substrate 10 is transferred to the lower portion of the belt 400 such that the surface of the substrate 10 is positioned on the path of each of the first and second straight sections LS1 and LS2 (S20). .

Subsequently, first and second rotation shafts to which the belt 400 is connected so that each of the first and second laser heads 500 and 600 move along each of the first and second straight sections LS1 and LS2. At the same time each of the first and second laser generators 710, 720 provides the laser L to each of the first and second laser heads 500, 600 while rotating the 200, 300. The first and second laser heads 500 and 600 process the pattern 30 on the substrate 10 (S30).

In this case, since the laser L generated from the first and second laser generators 710 and 720 is generated in a pulse form as described above, the pattern 30 may have a grating shape as a whole.

In addition, when each of the first and second laser heads 500 and 600 moves in each of the first and second rotation sections RS1 and RS2, the first and second laser heads 710 and 720 are moved from the first and second laser generators 710 and 720. Since the generated laser L may damage other external devices or other components of the substrate processing apparatus 1000, the laser L may be passed through the first and second laser absorbing members 900 and 950, respectively. ) Can be temporarily absorbed.

As described above, the substrate 10 may be processed by two first and second laser heads 500 and 600 so that the pattern 30 corresponding to two columns may be processed at once. The pattern 30 may be processed at a higher speed on the substrate 10 without increasing the moving speed of the laser head. As a result, a greater number of substrates 10 may be processed at a predetermined time, thereby improving productivity of the substrate 10.

Meanwhile, as the pattern 30 is thermally processed two times by the first and second laser heads 500 and 600, the lengths of the first and second rotation sections RS1 and RS2 are interposed therebetween. There is at least one row of raw.

Accordingly, the transfer mechanism 110 installed in the pedestal 100 continuously transfers the substrate 10 by one row as many as the number of the unprocessed rows, and then transfers the same number of rows moved up to that time, as in S30. The pattern 30 may be processed on the substrate 10.

In this case, the first and second laser heads 500 and 600 rotate the first and second rotation shafts 200 and 300 continuously so that the process speed is not reduced, so that the first and second laser heads 500 and 600 rotate through the belt 400. Second straight sections LS1 and LS2 and the first and second rotation sections RS1 and RS2 may be continuously moved. Thus, the transfer of the substrate 10 by the transfer mechanism 110 may be performed when the first and second laser heads 500 and 600 move the first and second rotation sections RS1 and RS2. .

Such processing of the pattern 30 of the substrate 10 may be performed on a single substrate 10 as shown in FIG. 6A, but as shown in FIG. 6B, another second substrate 15 as in the substrate 10 is performed. It can also proceed simultaneously with the target.

Meanwhile, in the present embodiment, each of the two first and second laser generators 710 and 720 respectively provides the laser L to each of the first and second laser heads 500 and 600. As described above, either one of the first and second laser generators 710 and 720 is removed, and the other one of the first laser head 500 or the second moves the first straight section LS1. The laser head L may also be provided to the laser head 600.

7 is a schematic view of a substrate processing apparatus according to another embodiment of the present invention.

In the present embodiment, the substrate processing apparatus uses the same reference numerals, except that the configuration except for the configuration of providing the laser to the first and second laser heads is the same as the configuration shown in Figs. Detailed description thereof will be omitted.

Referring to FIG. 7, the laser generator 750 of the substrate processing apparatus 1100 according to another exemplary embodiment may include at least one light path switching member 760 that may change the advancing direction of the laser L. Referring to FIG. The laser L may be provided to the first laser head 500 or the second laser head 600. Here, the light path switching member 760 may have the same configuration as the reflector 534 of FIG. 4 described with reference to FIG. 4.

For example, as shown in FIG. 7, when the laser generator 750 is disposed outside the belt 400 between the first and second rotational shafts 200 and 300, the laser generator 750 may be turned at 90 degrees. Each of the light path switching members 760 may be parallel to the laser generator 750 along the y-axis, and may be parallel to the first position and the x-axis. (LS2) and the second position parallel to the y-axis may be disposed to provide two laser beams 90 degrees.

Also, a laser absorbing member 960 for absorbing the laser L in some cases may be disposed at the position where the laser L is emitted from the laser generator 750 as described with reference to FIGS. 1 to 4. Can be.

Therefore, when the laser generator 750 is to be installed on the pedestal 100, the laser generator 750 may prevent the width of the pedestal 100 from increasing along the y axis. The space for installing the substrate processing apparatus 1100 may be utilized efficiently.

While the present invention has been described in connection with what is presently considered to be practical and exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

L: laser 10: substrate
20: central axis 30: pattern
100: pedestal 110: transfer mechanism
200: first rotating shaft 210: first pulley
300: second rotation axis 310: second pulley
400: drive mechanism, belt 500: first laser head
510: first mounting portion 520: second mounting portion
530: laser processing unit 532: body
534: reflector 536: focus lens
600: second laser head 700, 750: laser generator
710: first laser generator 720: second laser generator
760: light path switching member 800: guide member
900: first laser absorbing member 950: second laser absorbing member
1000, 1100: Substrate Processing Equipment

Claims (20)

A drive mechanism arranged to rotate at a constant velocity along the closed curve at the top of the substrate and connected to rotate with the first and second rotation shafts whose central axes are parallel to each other;
At least one laser head mounted to the driving mechanism to move along the plane trajectory, and for processing a pattern using a laser on the substrate; And
And at least one laser generator disposed adjacent said drive mechanism for providing said laser to said laser head. The substrate processing apparatus of claim 1, wherein the driving mechanism is formed of a belt or a chain. The substrate processing apparatus of claim 1, wherein the driving mechanism has at least one straight section in which the substrate is processed. The method of claim 3, wherein the drive mechanism has first and second straight sections,
And the laser head includes first and second laser heads mounted at opposing positions of the drive mechanism. The laser generator of claim 4, wherein the laser generator
A first laser generator for providing the laser to the first laser head or the second laser head moving the first straight section; And
And a second laser head for providing the laser to the first laser head or the second laser head moving the second straight section. The substrate processing apparatus of claim 1, wherein the laser generator provides the laser head to the laser head through at least one optical path changing member for changing the direction of travel of the laser. The substrate processing apparatus of claim 1, further comprising a laser absorbing member disposed outside a region of the substrate to absorb the emitted laser from a position where the laser is emitted from the laser generator. The substrate processing apparatus of claim 1, further comprising a pedestal provided with a transfer mechanism for transferring the substrate in-line from the bottom of the substrate. delete delete delete delete delete delete The substrate processing apparatus of claim 1, further comprising a guide member for guiding movement of the laser head outside the drive mechanism.
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