KR101013027B1 - Surface mount apparatus - Google Patents

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mounting apparatus capable of reducing a side foot print of a surface mounting apparatus, wherein the surface mounting apparatus includes first and second mounting electronic components on a substrate located at a mounting position in a base frame. A picker unit; A picker transfer unit configured to transfer each of the first and second picker units in at least one of an X axis and a Y axis, wherein the picker transfer unit is parallel to both sides of the base frame with the first and second picker units interposed therebetween Y-axis first and second gantry installed; First and second gantry X-axes installed between the first and second picker units and being transported between the first and second gantry Y-axis; A first cable carrier mounted on the first Y-axis gantry and transporting a first signal cable for driving the first X-axis gantry; And a second cable carrier installed on the first Y-axis gantry so as to be spaced apart from the first cable carrier to convey a second signal cable for driving the second X-axis gantry. .

Surface Mount, Pickers, Gantries, Signal Cables, Cable Carriers

Description

Surface Mount Device {SURFACE MOUNT APPARATUS}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mount apparatus, and more particularly, to a surface mount apparatus capable of reducing side foot prints of a surface mount apparatus.

Integrated circuits, resistors, or switches (hereinafter referred to as "electronic components") are mounted on a printed circuit board and are electrically connected. Equipment for automatically mounting such electronic components on a printed circuit board using surface mount technology (SMT) is a surface mount apparatus, also called a mounter.

1 is a perspective view schematically showing a general surface mounting apparatus, and FIG. 2 is a plan view schematically showing a general surface mounting apparatus.

1 and 2, a general surface mounting apparatus 10 may include a base frame 12; A substrate transfer part 20 for transferring the printed circuit board P supplied from the outside to the mounting position MP in the base frame 12; First and second electronic component supply parts 30a and 30b installed to face the first and second side surfaces of the base frame 12 to supply electronic components to be mounted on the printed circuit board P; The first and second picker portions 40a, which are installed with the mounting positions MP therebetween and pick up the electronic components from the first and second electronic component supply units 30a and 30b, and are mounted on the printed circuit board P, respectively. 40b); And a picker transfer unit 50 for transferring each of the first and second picker portions 40a and 40b.

The substrate transfer unit 20 is installed to penetrate the base frame 12 and transfers the printed circuit board P supplied from the outside to the mounting position MP.

The first electronic component supply unit 30a is installed at the first side of the base frame 12 to supply electronic components to be mounted on the printed circuit board P.

The second electronic component supply unit 30b is installed at a second side surface parallel to the first side surface of the base frame 12 to supply electronic components to be mounted on the printed circuit board P.

The first picker unit 40a picks up a plurality of electronic components from the first electronic component supply unit 30a, moves them to the mounting position MP by the XY gantry 50, and then mounts the picked up electronic components. It is mounted on the printed circuit board (P) located at (MP). To this end, the plurality of first nozzle devices 42a which suck the electronic components so that the first picker portion 40a can transfer the plurality of electronic components from the first electronic component supply portion 30a to the mounting position MP at one time. ).

The second picker part 40b picks up a plurality of electronic parts from the second electronic part supply part 30b, moves them to the mounting position MP by the XY gantry 50, and then mounts the picked up electronic parts. It is mounted on the printed circuit board (P) located at (MP). To this end, the second picker portion 40b is provided with a plurality of second nozzle devices 42b for adsorbing the electronic components so that the plurality of electronic components can be transferred from the second electronic component supply portion 30b to the mounting position MP at one time. ).

Picker transfer unit 50 is the Y-axis first gantry 52a installed on the third side of the base frame 12; A Y-axis second gantry 52b installed at a fourth side surface parallel to the third side surface of the base frame 12; An X-axis first gantry 54a installed between the Y-axis first and second gantry 52a and 52b such that the first picker portion 40a is installed to be transportable in the X-axis direction and transportable in the Y-axis direction; An X-axis second gantry 54b installed between the Y-axis first and second gantry 52a and 52b to allow the second picker portion 40b to be transportable in the X-axis direction and to be transportable in the Y-axis direction; A first cable carrier 56a installed at a side of the Y-axis second gantry 52b to convey the first signal cable according to the transfer of the first signal cable for conveying the X-axis first gantry 54a; A second cable carrier 56b installed at a side of the Y-axis first gantry 52a to transfer the second signal cable according to the transfer of the second signal cable for conveying the X-axis second gantry 54b; A third cable carrier 56c installed at a side of the X-axis first gantry 54a to transfer the third signal cable according to the transfer of the third signal cable for conveying the first picker portion 40a; And a fourth cable carrier 56d installed at the side of the X-axis second gantry 54b to transfer the fourth signal cable according to the transfer of the fourth signal cable for conveying the second picker portion 40b. .

As described above, the general surface mounting apparatus 10 transfers the printed circuit board P to the mounting position MP by driving the substrate transfer unit 20, and then, by driving the XY gantry 50, the first and the first When each of the two picker portions 40a and 40b is moved to the first and second electronic component supply portions 40a and 40b, and each of the first and second picker portions 40a and 40b sucks the electronic component, the XY gantry 50 The first and second picker portions 40a and 40b are moved to the mounting position MP by the driving of the printed circuit board. )

However, in the general surface mounting apparatus 10, each of the first and second cable carriers 56a and 56b that carries the signal cables of each of the X-axis first and second gantry 54a and 54b is the base frame 12. By installing at both edges, there is a problem in that the side foot print of the surface mounting apparatus 10 is increased.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and it is an object of the present invention to provide a surface mounting apparatus capable of reducing a side foot print of a surface mounting apparatus.

According to an aspect of the present invention, there is provided a surface mounting apparatus comprising: first and second picker portions for mounting an electronic component on a substrate positioned at a mounting position in a base frame; A picker transfer unit configured to transfer each of the first and second picker units in at least one of an X axis and a Y axis, wherein the picker transfer unit is parallel to both sides of the base frame with the first and second picker units interposed therebetween Y-axis first and second gantry installed; First and second gantry X-axes installed between the first and second picker units and being transported between the first and second gantry Y-axis; A first cable carrier mounted on the first Y-axis gantry and transporting a first signal cable for driving the first X-axis gantry; And a second cable carrier installed on the first Y-axis gantry so as to be spaced apart from the first cable carrier to convey a second signal cable for driving the second X-axis gantry. .

The picker transfer part may include: a first support part installed at one side of the X-axis first gantry corresponding to an upper portion of the Y-axis first gantry to have a first height, and supporting one side of the first cable carrier; A second support part installed on an upper portion of the base frame to have a second height different from the first height to support the other side of the first cable carrier; A third support part installed at one side of the X-axis second gantry corresponding to an upper portion of the Y-axis first gantry to have a third height higher than the first height to support one side of the second cable carrier; And a fourth support part installed on an upper portion of the base frame to have a fourth height higher than the second height, and supporting the other side of the second cable carrier.

According to an aspect of the present invention, there is provided a surface mounting apparatus including: first and second picker units for mounting an electronic component on a substrate positioned at a mounting position in a base frame; A pair of Y-axis gantry for transporting each of the first and second picker portions in the Y-axis direction; A pair of X-axis gantry installed to be transported between the pair of Y-axis gantry to transfer the first and second picker portions in the X-axis direction; And a first signal and a second signal cable for driving each of the pair of X-axis gantry, arranged side by side on one side of the base frame, and driven by each of the pair of X-axis gantry. And first and second cable carriers for transporting each of the second signal cables.

The second cable carrier is transported inside the first cable carrier to prevent interference with the first cable carrier during the transfer of each of the first and second signal cables.

The first and second cable carriers are installed on the first Y-axis gantry of the pair of Y-axis gantry.

The surface mounting apparatus may include: a first support part installed at one side of the first X-axis gantry corresponding to the first Y-axis gantry to have a first height, and supporting one side of the first cable carrier; A second support part installed on an upper portion of the base frame to have a second height different from the first height to support the other side of the first cable carrier; A third support part installed at one side of the X-axis second gantry corresponding to an upper portion of the Y-axis first gantry to have a third height higher than the first height to support one side of the second cable carrier; And a fourth support part installed on an upper portion of the base frame to have a fourth height higher than the second height, and supporting the other side of the second cable carrier.

As described above, the surface mounting apparatus according to the present invention provides the following effects.

First, the side foot print of the surface mount device can be reduced by arranging two cable carriers for carrying two signal cables for driving a pair of X-axis gantry together on one side of the base frame. have.

Second, it is possible to reduce the installation space of the surface mount device by reducing the side footprint of the surface mount device.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

3 is a plan view showing a surface mounting apparatus according to an embodiment of the present invention, Figure 4 is a cross-sectional view schematically showing a cross-section of the line I-I shown in FIG.

3 and 4, the surface mounting apparatus 100 according to the embodiment of the present invention includes a base frame 112; A substrate transfer part 120 for transferring the printed circuit board P supplied from the outside to the mounting position MP in the base frame 112; First and second electronic component supply parts 130a and 130b installed to face the first and second side surfaces of the base frame 112 to supply electronic components to be mounted on the printed circuit board P; First and second picker parts 140a installed with the mounting position MP therebetween to pick up the electronic parts from the first and second electronic component supply parts 130a and 130b and mount them on the printed circuit board P, respectively. 140b); And a picker transfer unit 150 for transporting each of the first and second picker units 140a and 140b, wherein the picker transfer unit 150 is installed along the base frame 112 in the Y-axis first and second gantry 152a. 152b); Each of the first and second picker parts 140a and 140b is installed to be transportable, and is installed between the Y-axis first and second gantry 152a and 152b to respectively connect the first and second picker parts 140a and 140b. X-axis first and second gantry 154a, 154b for feeding in the Y-axis direction; A first cable carrier 156a installed in the Y-axis first gantry 152a for transporting a first signal cable for driving the first picker unit 140a; A second cable carrier 156b installed on the Y-axis first gantry 152a so as to be spaced apart from the first cable carrier 156a to carry a second signal cable for driving the second picker unit 140b. It is configured by.

The substrate transfer part 120 is installed to penetrate the base frame 112 and transfers the printed circuit board P supplied from the outside to the mounting position MP.

The printed circuit board P is transferred to the electronic component mounting position MP by the transfer part 120, and the mounting position MP while the electronic components are mounted by the first and second picker parts 140a and 140b, respectively. Located in

The first electronic component supply unit 130a is installed at the first side of the base frame 112 to supply electronic components to be mounted on the printed circuit board P. The first electronic component supply unit 130a classifies various types of semiconductor components and provides them to the first picker unit 140a.

The second electronic component supply unit 130b is installed at a second side surface parallel to the first side surface of the base frame 112 to supply electronic components to be mounted on the printed circuit board P. Referring to FIG. The second electronic component supply unit 130b classifies various types of semiconductor components and provides them to the second picker unit 140b.

The first picker unit 140a picks up a plurality of electronic components from the first electronic component supply unit 130a, moves them to the mounting position MP by the picker transfer unit 150, and then mounts the picked up electronic components. It is mounted on the printed circuit board (P) located at (MP). To this end, the first picker part 140a may include a plurality of first nozzle devices 142a for adsorbing the electronic parts so as to transfer the plurality of electronic parts from the first electronic part supply part 130a to the mounting position MP at one time. ).

The second picker unit 140b picks up a plurality of electronic components from the second electronic component supply unit 130b, moves them to the mounting position MP by the picker transfer unit 150, and then mounts the picked up electronic components. It is mounted on the printed circuit board (P) located at (MP). To this end, the second picker part 140b includes a plurality of second nozzle devices 142b for adsorbing the electronic parts so as to transfer the plurality of electronic parts from the second electronic part supply part 130b to the mounting position MP at one time. ).

Meanwhile, nozzles suitable for the electronic component, such as the size, thickness, and weight of the electronic component to be mounted on the printed circuit board P may be coupled to each of the plurality of first and second nozzle devices 142a and 142b. .

If the specification of the electronic component to be mounted on the printed circuit board P is changed, the nozzles coupled to each of the plurality of first and second nozzle devices 142a and 142b in the surface mounting apparatus 100 should be replaced. And, when there are more types of electronic components to be mounted on the printed circuit board P than the number of nozzles coupled to each of the plurality of first and second nozzle devices 142a and 142b, the plurality of first and second nozzles The nozzles coupled to each of the devices 142a and 142b can be replaced even during the mounting operation.

The picker transfer part 150 may be an X-Y gantry including Y-axis first and second gantry 152a and 152b and X-axis first and second gantry 154a and 154b. At this time, the X-Y gantry may be composed of a linear motor including a N / S pole permanent magnet and an electromagnet. Here, the X-Y gantry may be configured as a driving device such as a ball screw or a timing belt in addition to the linear motor.

The Y-axis first gantry 152a is installed on the third side surface of the base frame 112 so as to be supported by the plurality of first supports 160.

The Y-axis second gantry 152b is installed at a fourth side surface parallel to the third side surface of the base frame 112 so as to be supported by a plurality of second supports (not shown).

The X-axis first gantry 154a is installed between the Y-axis first and second gantry 152a and 152b such that the first picker unit 140a is transportable in the X-axis direction and transportable in the Y-axis direction. . The third signal cable for transporting the first picker part 140a is protected on the side of the first X-axis first gantry 154a and the third signal cable is transported according to the transfer of the first picker part 140a. The third cable carrier 156c is installed.

The X-axis second gantry 154b is installed between the Y-axis first and second gantry 152a and 152b so that the second picker unit 140b is transportable in the X-axis direction and transportable in the Y-axis direction. . The fourth signal cable for transporting the second picker part 140b is protected on the side of the X-axis second gantry 154b and the fourth signal cable is transported according to the transfer of the second picker part 140b. The third cable carrier 156d is installed.

The first cable carrier 156a is installed above the Y-axis first gantry 152a to protect the first signal cable for driving the X-axis first gantry 154a, and to protect the first signal cable of the X-axis first gantry 154a. The first signal cable is transferred in accordance with the transfer. One side of the first cable carrier 156a is provided by the first support part 172 provided on one side of the X-axis first gantry 154a corresponding to the upper portion of the Y-axis first gantry 152a to have a first height. And the other side of the first cable carrier 156a is supported by a second support portion 174 installed on the top (or ceiling) 180 of the base frame 112 to have a second height different from the first height. .

The second cable carrier 156b is installed above the Y-axis first gantry 152a to protect the second signal cable for driving the X-axis second gantry 154b, and the X-axis second gantry 154b of the second cable carrier 156b. The second signal cable is transferred in accordance with the transfer. In this case, the second cable carrier 156b is disposed to be stepped with the first cable carrier 156a so that mutual interference is prevented during the transfer of each of the first and second signal cables. To this end, one side of the second cable carrier 156b is installed on one side of the X-axis second gantry 154b corresponding to the upper portion of the Y-axis first gantry 152a to have a third height higher than the first height. A fourth support part (176) supported by the support part 176 and installed on the upper side (or ceiling) 180 of the base frame 112 so that the other side of the second cable carrier 156b has a fourth height higher than the second height. 178). Accordingly, the interference with the first cable carrier 156a does not occur during the transfer by being transferred from the inside of the second cable carrier 156b.

On the other hand, each of the first and second cable carriers 156a and 156b described above is provided on the Y-axis second gantry 152b disposed on the fourth side of the base frame 112 according to the installation location of the surface mounting apparatus 100. Can be installed together.

As such, the surface mounting apparatus 100 according to the embodiment of the present invention transfers the printed circuit board P to the mounting position MP by driving the substrate transfer part 120, as shown in FIG. 4. The first and second picker parts 140a and 140b are moved to the first and second electronic component supply parts 140a and 140b by driving the XY gantry, and the first and second picker parts 140a and 140b are moved. When each adsorbs the electronic component, as shown in FIG. 5, each of the first and second picker portions 140a and 140b is moved to the mounting position MP by driving the XY gantry, and thus the first and second picks. The electronic parts adsorbed by the Kerr parts 140a and 140b are mounted on the printed circuit board P. FIG. Accordingly, the present invention provides a first and a second cable carrier for transporting each of the first and second signal cables for driving the X-axis first and second gantry 154a, 154b on one side of the base frame 112. By arranging, the side foot print of the surface mounting apparatus 100 can be reduced.

Those skilled in the art to which the present invention pertains will understand that the present invention can be implemented in other specific forms without changing the technical spirit or essential features. Therefore, it is to be understood that the embodiments described above are exemplary in all respects and not restrictive. The scope of the present invention is shown by the following claims rather than the detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts should be construed as being included in the scope of the present invention. do.

1 is a perspective view schematically showing a general surface mounting apparatus.

2 is a plan view schematically showing a general surface mounting apparatus.

3 is a plan view showing a surface mounting apparatus according to an embodiment of the present invention.

4 is a cross-sectional view schematically illustrating a cross section of the line I-I shown in FIG. 3.

FIG. 5 is a cross-sectional view illustrating a transfer of the first and second picker units shown in FIG. 3.

<Explanation of Signs of Major Parts of Drawings>

100: surface mount device 112: base frame

120: substrate transfer unit 130a, 130b: electronic component supply unit

140a, 140b: Picker section 142a, 142b: nozzle device

150: picker transfer unit 152a, 152b: Y-axis gantry

154a, 154b: X-axis gantry 156a, 156b, 156c, 156d: cable carrier

Claims (6)

First and second picker portions for mounting electronic components on a substrate located at a mounting position in the base frame; A picker transfer unit configured to transfer each of the first and second picker units in at least one of an X axis and a Y axis, The picker transfer unit, Y-axis first and second gantry installed side by side on both sides of the base frame with the first and second picker portion therebetween; First and second gantry X-axes installed between the first and second picker units and being transported between the first and second gantry Y-axis; A first cable carrier mounted on the first Y-axis gantry and transporting a first signal cable for driving the first X-axis gantry; And a second cable carrier installed above the first Y-axis gantry so as to be spaced apart from the first cable carrier to convey a second signal cable for driving the second X-axis gantry. Surface Mount Device. The method of claim 1, The picker transfer unit, A first support part installed at one side of the X-axis first gantry corresponding to an upper portion of the Y-axis first gantry to have a first height, and supporting one side of the first cable carrier; A second support part installed on an upper portion of the base frame to have a second height different from the first height to support the other side of the first cable carrier; A third support part installed at one side of the X-axis second gantry corresponding to an upper portion of the Y-axis first gantry to have a third height higher than the first height to support one side of the second cable carrier; And And a fourth support part installed on the base frame to have a fourth height higher than the second height and supporting the other side of the second cable carrier. First and second picker portions for mounting electronic components on a substrate positioned at a mounting position in the base frame; A pair of Y-axis gantry for transporting each of the first and second picker portions in the Y-axis direction; A pair of X-axis gantry installed to be transported between the pair of Y-axis gantry to transfer the first and second picker portions in the X-axis direction; And It is arranged side by side on the base frame to support each of the first and second signal cables for driving each of the pair of X-axis gantry, and according to the driving of each of the pair of X-axis gantry And a first and a second cable carrier for conveying each of the second signal cables. The method of claim 3, wherein And the second cable carrier is transported inside the first cable carrier to prevent interference with the first cable carrier when the first and second signal cables are respectively transported. The method of claim 4, wherein The first and second cable carriers are surface-mounted device, characterized in that installed on the top of the Y-axis first gantry of the pair of Y-axis gantry. The method of claim 5, A first support part installed at one side of the X-axis first gantry corresponding to an upper portion of the Y-axis first gantry to have a first height, and supporting one side of the first cable carrier; A second support part installed on an upper portion of the base frame to have a second height different from the first height to support the other side of the first cable carrier; A third support part installed at one side of the X-axis second gantry corresponding to an upper portion of the Y-axis first gantry to have a third height higher than the first height to support one side of the second cable carrier; And And a fourth support part installed on the base frame to have a fourth height higher than the second height and supporting the other side of the second cable carrier.

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