KR100988631B1 - Unit for supporting a tray, apparatus for transferring a tray and test handler including the same - Google Patents

Abstract

The tray support unit includes a pedestal and a support. The pedestal supports the lower part of the test tray having a groove on one side in a vertical state. The support extends along one side of the groove from the pedestal, and has a protrusion configured to pass through the groove in the horizontal direction when the test tray is raised while supporting the front and rear of the test tray above the groove. Therefore, the test tray can be supported as it is in the vertical state in order to linearly transfer the test tray.

Description

Tray support unit, tray transporting apparatus and test handler including the same {UNIT FOR SUPPORTING A TRAY, APPARATUS FOR TRANSFERRING A TRAY AND TEST HANDLER INCLUDING THE SAME}

The present invention relates to a tray support unit, a tray conveying apparatus and a test handler including the same, and more particularly, a unit supporting a test tray on which semiconductor elements for testing are mounted, and an apparatus for conveying the test tray including the same. And a test handler that handles testing of the semiconductor devices.

In general, a semiconductor device is one of electronic components having a structure in which chips are connected on a substrate. The semiconductor device may include a memory device such as a DRAM and an SRAM.

The semiconductor device is manufactured based on a wafer made of a thin single crystal substrate made of silicon. In detail, the semiconductor device may include a fab process for forming a plurality of chips patterned on the wafer, a bonding process for electrically connecting each of the chips formed in the fab process to each of the substrates, and the substrate connected to the substrate. It is manufactured by performing a molding process for protecting the chip from the outside. The semiconductor devices thus manufactured are subjected to a separate test process to test their electrical functions.

In this case, the test process is substantially performed through a test device for performing a test on the semiconductor devices and a test handler for providing the semiconductor devices to the test device.

The test handler includes a test chamber providing a space for connecting the semiconductor devices to the test apparatus while mounted on a test tray, and an inner chamber connected to the test chamber to provide a space for heating and cooling the semiconductor devices. It includes.

At this time, the test tray located in the inner chamber is converted to a vertical state and transferred from the position supplied from the outside through the plurality of cylinders to the entrance of the test chamber in a stepwise manner.

However, the step method as described above has a problem in that the transfer time of the test tray is relatively long because the stop timing occurs in the middle as the stepwise transfer is carried out with a certain period.

Accordingly, the present invention has been made in view of such a problem, and an object of the present invention is to provide a tray support unit for supporting the test tray in order to shorten the transfer time of the test tray in the chamber.

In addition, another object of the present invention is to provide a tray conveying apparatus capable of substantially shortening the conveying time of the test tray including the tray supporting unit.

In addition, another object of the present invention is to provide a test handler including the tray transfer device.

In order to achieve the object of the present invention described above, the tray support unit according to one feature comprises a pedestal and a first support.

The pedestal supports the lower part of the test tray having a first groove on one side in a vertical state. The first support extends from one side of the pedestal to one side along which the first groove is formed, and supports the front and rear surfaces of the test tray on the first groove, and then moves the first groove in a horizontal direction when the test tray is raised. It has a first protrusion configured to pass through.

Here, the first support may be divided into two to support the front and rear of the test tray, respectively, so that the elastic for grip the front and rear through a slit therebetween.

In addition, the pedestal may include a plurality of protrusions spaced apart from each other to support the test tray on a plate.

On the other hand, the test tray has a second groove on the other side facing the one side. Accordingly, the tray support unit extends from the pedestal along the other side where the second groove is formed and supports the front and rear surfaces of the test tray on the second groove, and then the test tray is raised so that the protrusion passes through the groove. The second support may further include a second support having a second protrusion configured to pass through the second groove in a horizontal direction.

In order to achieve the above object of the present invention, a tray conveying apparatus according to one feature includes a first conveying portion and a second conveying portion.

The first transfer unit linearly transfers a test tray on which a plurality of semiconductor devices are mounted in a vertical state in a first section of the chamber. The second transfer unit transfers the test tray non-linearly in a second section inside the chamber which is separated from the first section.

Thus, the first conveying part includes a guide rail, a tray support part, and a driving part. The tray support is movable along the guide rail and supports a lower portion of the test tray having a groove on at least one side, and extends along the side where the groove is formed from the pedestal and above the groove. At least one support having a protrusion configured to pass through the groove in the horizontal direction when the test tray is raised while supporting the front and rear. The driving unit is coupled to the pedestal, and includes a driving unit for generating a driving force for moving the pedestal along the guide rail.

Here, the second transfer unit is a first tray holder holding a lower portion of the test tray, the first tray holder connected to the first tray holder and the first tray holder to transfer step by step at a predetermined period with a predetermined period A plurality of cylinders for driving the first tray holder and a second tray holder disposed adjacent to the first tray holder and holding the test tray transferred step by step through the first tray holder.

Meanwhile, the pedestal includes a plurality of protrusions spaced apart from each other to support the test tray on a plate. Thus, the first tray holder may be inserted between the protrusions to raise the test tray through any one of the cylinders so that the protrusions pass through the grooves.

The driving unit may include a cylinder disposed outside of the chamber, a first connecting rod connected to the cylinder, a central axis extending into the chamber while being coupled with the first connecting rod, and controlling driving of the cylinder. A rotating body that is received and rotated through a connecting rod and coupled to the central axis of the rotating body in the interior of the chamber is linked to the pedestal and the pedestal moves the guide along the guide rail through the rotation of the rotating body. It can include two connecting rods.

In order to achieve another object of the present invention described above, a test handler according to one feature includes a core chamber, a test chamber and a first tray transfer unit.

The inner chamber is provided with a test tray in which a plurality of semiconductor devices are mounted in a vertical state, and provides a space for heating and cooling the semiconductor devices.

The test chamber is connected to the inner chamber and provides a space for connecting the semiconductor devices to an external test device while being mounted on the test tray.

The first tray transfer unit is installed in the inner chamber, and the first transfer unit linearly transfers the test tray in the first interval inside the inner chamber and the second interval inside the inner chamber separated from the first interval. And a second transfer unit for non-linearly transferring the test tray.

Here, the first transfer part includes a first guide rail, a first tray support part, and a first drive part.

The first tray support is a first pedestal for supporting a lower portion of the test tray having a first groove on at least one first side while being movable along the first guide rail and the first groove from the first pedestal. At least one having a first protrusion extending along the first side and configured to support the front and rear surfaces of the test tray above the first groove and pass the first groove in a horizontal direction when the test tray is raised. And a first support.

The first driving unit is coupled to the first pedestal, and generates a driving force for moving the first pedestal along the first guide rail.

On the other hand, the test handler may further include a desock chamber and a second tray transfer unit.

The desorption chamber is connected to the test chamber and provides a space for restoring the semiconductor elements mounted in the test tray to room temperature.

The second tray transfer unit is installed in the dichroic chamber, and the third transfer unit linearly transfers the test tray in a vertical state in a third section of the dichroic chamber and the dichroic chamber which is separated from the third section. And a fourth transfer unit configured to transfer the test tray non-linearly in a fourth section of the control unit.

Here, the third transfer part includes a second guide rail, a second tray support part, and a second drive part.

The second tray support portion may be movable along the second guide rail, and a second pedestal for supporting a lower portion of the test tray having a second groove on at least one second side and the second groove from the second pedestal. At least one second protrusion extending along the formed second side and configured to support the front and rear surfaces of the test tray above the second groove and pass through the second groove in a horizontal direction when the test tray is raised. And a second support.

The second driving unit is coupled to the second pedestal, and generates a driving force for moving the second pedestal along the second guide rail.

According to such a tray support unit, a tray transfer apparatus and a test handler including the same, the test tray in which the plurality of semiconductor elements are mounted in the inner chamber is stably supported by the tray support in a first section separated from the second section. By transporting at once, it is possible to shorten the transfer time of the test tray in the inner chamber.

As a result, productivity of a process for testing the semiconductor devices mounted on the test tray may be improved.

Hereinafter, a tray support unit, a tray transfer apparatus including the same, and a test handler according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings. As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text.

However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. Like reference numerals are used for like elements in describing each drawing. In the accompanying drawings, the dimensions of the structures are shown in an enlarged scale than actual for clarity of the invention.

The terms first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "have" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described on the specification, and one or more other features. It is to be understood that the present invention does not exclude the possibility of the presence or the addition of numbers, steps, operations, components, parts, or combinations thereof.

On the other hand, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art. Terms such as those defined in the commonly used dictionaries should be construed as having meanings consistent with the meanings in the context of the related art and shall not be construed in ideal or excessively formal meanings unless expressly defined in this application. Do not.

1 is a configuration diagram schematically showing a test handler according to an embodiment of the present invention.

Referring to FIG. 1, the test handler 1000 according to an embodiment of the present invention may include a loading stacker 100, a loading unit 200, a inner chamber 300, a test chamber 400, and a first tray transfer unit ( 500, the dichroic chamber 600, the unloading unit 700, the second tray transfer unit 800, the sorting buffer unit 900, and the unloading stacker 950.

A plurality of first customer trays CT1 are disposed in the loading stacker 100. A plurality of semiconductor devices SD are accommodated in the first customer trays CT1 at first intervals. Here, the semiconductor devices SD may be one of components used in an electronic device, and may refer to memory devices such as DRAM and SRAM.

The test tray TT is disposed in a horizontal state in the loading unit 200. The semiconductor elements SD transferred from the first customer trays CT1 are loaded in the test tray TT and mounted at second intervals.

Accordingly, the test handler 1000 may load the picker 150 to change the semiconductor device SD from the first interval to the second interval between the loading stacker 100 and the loading unit 200. It may further include.

The inner chamber 300 is connected to the loading unit 200. The test tray TT is loaded into the inner chamber 300 by being converted from a horizontal state to a vertical state from the loading unit 200. The inner chamber 300 provides a space for heating or cooling the semiconductor devices SD mounted on the test tray TT to a predetermined temperature.

The test chamber 400 is connected to the inner chamber 300. The test chamber 400 provides a space for substantially testing the semiconductor devices SD. Accordingly, the test chamber 400 is connected to a test device 20 for substantially testing the semiconductor devices SD.

Accordingly, a pushing unit 410 may be installed in the test chamber 400 to push and connect the semiconductor elements SD mounted on the test tray TT to the test apparatus 20.

The first tray transfer part 500 is installed in the inner chamber 300. The first tray transfer part 500 transfers the test tray TT transferred from the loading part 200 to the entrance part of the test chamber 400.

Hereinafter, the first tray transfer unit 500 will be described in more detail with reference to FIGS. 2 and 3.

FIG. 2 is a view illustrating a first tray transfer unit installed in an inner chamber of the test handler illustrated in FIG. 1, and FIG. 3 is a view of the first tray transfer unit illustrated in FIG. 2 from above.

2 and 3, the first tray transporter 500 includes a first transporter 510 and a second transporter 550.

Thus, the first transfer unit 510 transfers the test tray TT at once in a linear sliding manner in the first section S1 adjacent to the loading unit 200 of the inner chamber 300.

The first transfer part 510 includes a guide rail 520, a tray support part 530, and a driving part 540. The guide rail 520 is elongated to linearly transfer the test tray TT in the first section S1. In the inner chamber 300, two first and second rail brackets 310 and 320 for fixing the guide rail 520 are fixed to an inner wall thereof.

The tray support part 530 supports the test tray TT loaded in the vertical state into the inner chamber 300 so as not to fall. The tray support 530 includes a pedestal 532 and a first support 534,

The pedestal 532 supports the lower portion of the test tray TT. The pedestal 532 is coupled to the guide rail 520 to be movable along the guide rail 520. At this time, the guide rail 520 is preferably made of at least two so that the movement of the pedestal 532 is made stable.

Accordingly, the first support 534 extends along the first side portion 10 of the test tray TT supported by the pedestal 532 to support the front and rear surfaces of the test tray TT.

The first support 534 includes a slit 535 divided in a direction extending to an end portion. That is, the first support 534 has a structure in which the end is divided into two to form the slit 535.

Thus, the first support 534 has a predetermined elasticity through the slit 535. This elasticity allows the test tray TT to be easily loaded into the pedestal 532 and to grip the loaded test tray TT with a predetermined force.

Hereinafter, the tray support 530 will be described in more detail with reference to FIGS. 4 and 5.

4 is a view illustrating a tray support of the first tray transport unit illustrated in FIG. 2, and FIG. 5 is an enlarged view of a portion A of FIG. 4.

4 and 5, the first support 534 protrudes in the direction of the test tray TT to support the front and rear surfaces of the test tray TT at an end thereof. It includes.

Accordingly, the first groove 12 corresponding to the size of the first protrusion 536 is formed in the first side portion 10 of the test tray TT. The first groove 12 is formed at a portion below the first protrusion 536 when the test tray TT is supported by the pedestal 532.

Thus, when the test tray TT is raised by the test tray TT while being supported by the first support 534 like the pedestal 532, the first protrusion 536 is the first protrusion. The groove 12 can be passed in the horizontal direction. In this case, the test tray TT is released from the first support 534 to be detachable from the tray support 530.

Meanwhile, the pedestal 532 includes a plurality of protrusions 533 spaced apart from each other on the plate 531 to support the test tray TT. That is, a separate space is formed between the protrusions 533 to allow insertion of a member capable of moving the test tray TT.

As such, the tray support 530 stably supports the test tray TT loaded from the loading unit 200 through the pedestal 532 and the first support 534, and optionally, the test. Since the separation of the tray TT is possible, the linear transfer by the first transfer unit 510 in the first section S1 may be substantially realized.

In addition, the tray support 530 further includes a second support 538 at a position opposite to the first support 534 of the test tray TT in order to more stably support the test tray TT. can do.

The second support 538 may include a second protrusion 539 substantially corresponding to the first support 534, that is, the first protrusion 536. In this case, the test tray TT may have a second groove 22 corresponding to the size of the second protrusion 539 on the second side portion 20 opposite to the first side portion 10. .

The second protrusion 539 has the test tray TT ascending so that when the first protrusion 536 passes through the first groove 12, the second protrusion 539 moves in the horizontal direction. Configured to pass. Hereinafter, since the second support 538 has a configuration substantially the same as the first support 534, a detailed description thereof will be omitted.

The driving unit 540 is coupled to the pedestal 532. The driving unit 540 generates a driving force for moving the pedestal 532 along the guide rail 520.

Hereinafter, a detailed structure of the driving unit 540 will be described in detail with reference to FIG. 6.

FIG. 6 is a view illustrating a driving unit of the first transfer unit among the first tray transfer units illustrated in FIG. 2.

6, the driving unit 540 includes a first cylinder 542, a first connecting rod 544, a rotating body 546, and a second connecting rod 548.

The first cylinder 542 generates a linear driving force and is disposed outside the inner chamber 300. The first connecting rod 544 is linked with the first cylinder 542. The rotating body 546 has a central axis CA coupled with the first connection rod 544 and extends into the inner chamber 300. The rotating body 546 is fixed to the inner chamber 300.

In this structure, when the first cylinder 542 is in a linear reciprocating motion, the first connecting rod 544 is connected to the first cylinder 542 while being connected to the central axis of the rotating body 546 ( Since it is coupled to CA), the rotating body 546 makes a rotary motion through the first connecting rod 544.

To this end, since the first connecting rod 544 needs to be linked with the angle of the first cylinder 542, the central axis CA of the rotating body 546 is the first cylinder 542. It is necessary to be disposed at a position deviating from the extension line EL of the section in which the linear driving force of) is generated.

The second connecting rod 548 is coupled to the central axis CA of the rotating body 546 in the inner chamber 300. The second connecting rod 548 is linked with the plate 531 of the pedestal 532. As a result, the rotational movement of the rotating body 546 linearly moves the pedestal 532 along the guide rail 520 through the second connecting rod 548.

In this case, when the second connecting rod 548 linearly moves the pedestal 532 through the rotational movement of the rotating body 546, the rotating body 546 is fixed to the inner chamber 300, In the plate 531 of the pedestal 532, a flow groove 537 may be formed to move in a direction perpendicular to the guide rail 520 when the connection portion with the second connection rod 548 moves linearly. have.

Alternatively, a flow groove may be formed in the inner chamber 300 to which the rotating body 546 is fixed to move in a direction perpendicular to the guide rail 520.

In this way, the driving unit 540 is a linear driving force of the first cylinder 542 disposed outside the inner chamber 300, the first and second connecting rods (544, 548) and the rotating body ( By indirectly transmitting to the pedestal 532 through the 546, it is possible to minimize the space for installing the drive unit 540.

On the other hand, the driving unit 540 may move the pedestal 532 along the guide rail 520, it is also possible to use a coupling form of the other motor and the ball screw or rack gear and pinion gear.

The second transfer part 550 is connected to the first section S1 of the inner chamber 300 while non-linearly forming the test tray TT in a second section S2 formed up to an entrance of the test chamber 400. To the enemy. That is, the second transfer unit 550 transfers the test tray TT step by step, that is, with a predetermined period.

The second transfer part 550 transfers the first tray holder 560 holding the test tray TT in the second section S2 and the first tray holder 560 step by step at regular intervals. The second and third cylinders 570 and 575 are driven to move in the vertical direction and the front-rear direction parallel to the guide rail 520.

The first tray holder 560 is provided between the protrusions 533 of the pedestal 532 when the test tray TT enters the second section S2 while the test tray TT is supported by the pedestal 532. Is inserted. The first tray holder 560 raises the test tray TT by driving the second cylinder 570.

As a result, the first tray holder 560 allows the first and second protrusions 536 and 539 to pass through the first and second grooves 12 and 22 in a horizontal direction. TT) is changed to a state in which the tray support 530 is detachable.

In addition, the first tray holder 560 moves the test tray TT in the entry direction of the test chamber 400 through the third cylinder 575 to separate from the tray support 530.

On the other hand, the second transfer unit 550 is fixed to the inner chamber 300 is further disposed a second tray holder 580 for holding the test tray (TT). For example, the second tray holder 580 may be fixed to the second rail bracket 320. The second tray holder 580 is disposed adjacent to the first tray holder 560.

The second tray holder 580 is disposed such that the position at which the test tray TT is held is located on the same line as the position of the test tray TT moving at the pedestal 532.

Here, if the second transfer unit 550 briefly describes a process for transferring the test tray TT step by step with the first and second tray holders 560 and 580, the first The test tray TT entered through the first trail holder in the second section S2 is moved in the direction of the entrance of the test chamber 400 using the third cylinder 575.

Subsequently, the first tray holder 560 is lowered using the second cylinder 570 to hold the test tray TT in the second tray holder 580. In this case, the first tray holder 560 is lowered than the second tray holder 580 to be separated from the test tray TT.

Subsequently, the first tray holder 560 is moved one step in the direction of the first section S1 by using the second cylinder 570. Subsequently, the first tray holder 560 is raised by using the third cylinder 575 to hold the test tray TT held in the second tray holder 580 again.

Subsequently, the first tray holder 560 is moved one step toward the test chamber 400 by using the second cylinder 570. Subsequently, the first tray holder 560 is lowered using the third cylinder 575 to hold the test tray TT back to the second tray holder 580.

As such, the second transfer part 550 repeatedly moves the first tray holder 560 through the second and third cylinders 570 and 575 as described above, thereby moving the test tray TT. It may move to the entrance of the test chamber 400.

As described above, the test tray TT is gradually transferred in the second chamber S2 step by step at a predetermined period in the second chamber S2, while the tray support unit (1) is transferred in the first section S1. By linearly conveying stably while steadily supporting through 530, the transfer time of the test tray TT in the inner chamber 300 may be significantly shortened.

As a result, productivity of a process for testing the semiconductor devices SD mounted on the test tray TT may be improved.

Meanwhile, the second transfer part 550 may include a third tray holder 590 disposed above the second tray holder 580 and a fourth cylinder for driving the third tray holder 590 in the vertical direction. 595 may be further included.

The third tray holder 590 may pass through the fourth cylinder 595 to prevent the test tray TT from falling when the test tray TT is held in the second tray holder 580. The test tray TT is held by lowering.

On the contrary, when the third tray holder 590 moves the test tray TT one step through the first tray holder 560, the third tray holder 590 moves up through the fourth cylinder 595 to allow the test tray TT. Separation from the first tray holder 560 does not interfere with the movement of the test tray TT.

Meanwhile, in the present exemplary embodiment, the first section S1 of the inner chamber 300 is set adjacent to the loading unit 200, and the second section S2 is set adjacent to the test chamber 400. However, it can be understood that this may be changed in some cases. That is, the first and second sections S1 and S2 may be set opposite to each other, and the effects thereof may also be mentioned in the same way.

In addition, when the test tray TT is stepped to the entry part of the test chamber 400 by the second transfer part 550, the first tray transfer part 500 transfers the transferred test tray TT. ) May further include a tray supply unit (not shown) for supplying the test chamber 400.

The dichroic chamber 600 is connected to the test chamber 400. The desorption chamber 600 is provided with the test tray TT loaded with the semiconductor devices SD under test. In the dichroic chamber 600, the semiconductor elements SD heated or cooled in the genus chamber 300 are restored to room temperature.

The unloading part 700 is connected to the desorption chamber 600. The unloading unit 700 is provided with the test tray TT loaded with the semiconductor devices SD in a room temperature state from the di-speed chamber 600.

At this time, the test tray TT is switched to the horizontal state again. In the unloading unit 700, the semiconductor devices SD are separated from the test tray TT.

The second tray transfer unit 800 is installed in the dichroic chamber 600. The second tray transfer part 800 transfers the test tray TT supplied from the test chamber 400 to the inlet of the unloading part 700.

The second tray transporter 800 includes a third transporter 810 and a fourth transporter 850. The third transfer part 810 linearly transfers the test tray TT at once in a third section S3 adjacent to the test chamber 400 of the dichroic chamber 600.

The fourth transfer unit 850 is non-linear to the test tray TT in the fourth section S4 formed to the inlet of the unloading section 700 while being connected to the third section S3 of the dichroic chamber 600. To the enemy.

Each of the third and fourth transfer units 810 and 850 may have substantially the same configuration as the first and second transfer units 510 and 550, respectively, and thus detailed description thereof will be omitted. .

The sorting buffer unit 900 is connected to the unloading unit 700. The sorting buffer unit 900 is provided with a plurality of sorting tables 910 for classifying and classifying the semiconductor devices SD according to the test results of the test chamber 400. In this case, the semiconductor devices SD are mounted on the sorting tables 910 at the second intervals.

In the unloading stacker 950, a plurality of second customer trays CT2 divided by grades are disposed. The semiconductor devices SD mounted at the second interval from the sorting buffer unit 900 are classified into grades and mounted at the first interval in the second customer trays CT2.

Accordingly, the test handler 1000 may change an unloading picker between the sorting buffer unit 900 and the unloading stacker 950 to change the semiconductor devices SD from the second interval to the first interval. 960 may be further included.

While the present invention has been described in connection with what is presently considered to be practical and exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, It will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

According to the present invention, a plurality of test trays in which a plurality of semiconductor elements are mounted in a chamber is linearly transported at a time while stably supporting the test tray in a first section separated from a second section, thereby performing the test in the chamber. It can be used in a test handler that can shorten the transport time of the tray.

1 is a configuration diagram schematically showing a test handler according to an embodiment of the present invention.

FIG. 2 is a view illustrating a first tray transfer unit installed in an inner chamber of the test handler illustrated in FIG. 1.

FIG. 3 is a view from above of the first tray transport unit shown in FIG. 2.

4 is a view illustrating a tray supporter of the first tray transporter illustrated in FIG. 2.

FIG. 5 is an enlarged view of a portion A of FIG. 4.

FIG. 6 is a view illustrating a driving unit of the first transfer unit among the first tray transfer units illustrated in FIG. 2.

<Explanation of symbols for the main parts of the drawings>

SD: Semiconductor Device TT: Test Tray

100: loading stacker 200: loading unit

300: inner chamber 400: test chamber

500: first tray transfer unit 510: first transfer unit

520: guide rail 530: tray support

532: pedestal 534: first support

538: second support 540: drive unit

550: second transfer unit 600: Dichoxy chamber

700: unloading portion 800: second tray transfer portion

810: third transfer unit 850: fourth transfer unit

900: sorting buffer unit 950: unloading stacker

1000: test handler

Claims (10)

Pedestal for supporting the lower portion in a vertical state of the test tray having a groove on one side; And A tray including a support extending from one side of the pedestal, the support having a protrusion configured to pass through the groove in a horizontal direction when the test tray is raised while supporting the front and rear surfaces of the test tray above the groove; Support unit. The method of claim 1, wherein the support comprises a first support and a second support so as to support the front and rear of the test tray, respectively, to form an elastic for grip the front and rear through a slit therebetween. Tray support unit. The tray supporting unit according to claim 1, wherein the pedestal includes a plurality of protrusions spaced apart from each other to support the test tray on a plate. According to claim 1, The test tray has a second groove on the other side facing the one side, The second groove is extended along the other side formed from the pedestal, and while supporting the front and rear of the test tray on the second groove while the test tray is raised and the projection passes through the groove in the horizontal direction And a second support having a second protrusion configured to pass through the second groove. A first transfer unit linearly transferring a test tray on which a plurality of semiconductor elements are mounted in a vertical state in a first section of the chamber; And And a second transfer part for non-linearly transferring the test tray in a second section inside the chamber which is separated from the first section. The first transfer unit, Guide rails; A pedestal for supporting a lower portion of the test tray having a groove on at least one side and movable along the guide rail and extending along the side where the groove is formed and extending from the pedestal to the front and rear surfaces of the test tray. A tray support including at least one support having a protrusion configured to pass through the groove in a horizontal direction when the test tray is raised while being supported; And And a drive unit coupled to the pedestal, the drive unit generating a driving force for moving the pedestal along the guide rail. The method of claim 5, wherein the second transfer unit A first tray holder holding a lower portion of the test tray; A plurality of cylinders connected to the first tray holder and driving the first tray holder to transfer the test tray held in the first tray holder step by step with a predetermined period; And And a second tray holder disposed adjacent to the first tray holder and holding the test tray transferred step by step through the first tray holder. The apparatus of claim 6, wherein the pedestal includes a plurality of protrusions spaced apart from each other to support the test tray on a plate, And the first tray holder is inserted between the protrusions to raise the test tray through one of the cylinders such that the protrusion passes through the groove. The method of claim 5, wherein the driving unit A cylinder disposed outside the chamber; A first connecting rod linked with the cylinder; A rotation body having a central axis extending into the chamber while engaging with the first connecting rod and rotating by receiving the driving of the cylinder through the first connecting rod; And A tray coupled to the pedestal while being coupled to the central axis of the rotatable body in the chamber, the tray comprising a second connecting rod for moving the pedestal along the guide rail through rotation of the rotatable body; Conveying device. A test chamber provided with a plurality of semiconductor devices in a vertical state, the inner chamber providing space for heating and cooling the semiconductor devices; A test chamber connected to the inner chamber and providing a space for connecting the semiconductor elements to an external test device while being mounted on the test tray; And The first tray is installed in the inner chamber, the first transfer unit for linearly transferring the test tray in the first section of the inner chamber and the non-linear test tray in the second section of the inner chamber separated from the first section. It includes a tray conveying unit having a second conveying unit for conveying automatically, The first transfer unit, Guide rails; A pedestal for supporting a lower portion of the test tray having a groove on at least one side and movable along the guide rail and extending along the side where the groove is formed and extending from the pedestal to the front and rear surfaces of the test tray. A tray support including at least one support having a protrusion configured to pass through the groove in a horizontal direction when the test tray is raised while being supported; And And a drive unit coupled to the pedestal, the drive unit generating a driving force for moving the pedestal along the guide rail. 10. The apparatus of claim 9, further comprising: a dichroic chamber connected to the test chamber and providing a space for restoring the semiconductor elements mounted on the test tray to room temperature; And A third transfer part installed in the dichroic chamber and linearly transferring the test tray in a vertical state in a third period inside the dichroic chamber and in a fourth period in the dichroic chamber separated from the third period; A second tray conveying portion having a fourth conveying portion for conveying the test tray non-linearly; The third transfer unit, Second guide rail; A second pedestal for supporting a lower portion of the test tray having a second groove on at least one second side and movable along the second guide rail, and a second side having the second groove formed from the second pedestal; At least one second support having a second protrusion extending along and supporting the front and rear surfaces of the test tray above the second groove and passing through the second groove in a horizontal direction when the test tray is raised; Second tray support; And And a second drive unit coupled to the second pedestal, the second drive unit generating a driving force for moving the second pedestal along the second guide rail.

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