KR100985668B1 - Light emitting device - Google Patents

Light emitting device Download PDF

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Publication number
KR100985668B1
KR100985668B1 KR1020080058292A KR20080058292A KR100985668B1 KR 100985668 B1 KR100985668 B1 KR 100985668B1 KR 1020080058292 A KR1020080058292 A KR 1020080058292A KR 20080058292 A KR20080058292 A KR 20080058292A KR 100985668 B1 KR100985668 B1 KR 100985668B1
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KR
South Korea
Prior art keywords
light emitting
lead
bent
opening
terminal
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Application number
KR1020080058292A
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Korean (ko)
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KR20090132168A (en
Inventor
강석진
Original Assignee
서울반도체 주식회사
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Priority to KR1020080058292A priority Critical patent/KR100985668B1/en
Publication of KR20090132168A publication Critical patent/KR20090132168A/en
Application granted granted Critical
Publication of KR100985668B1 publication Critical patent/KR100985668B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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Abstract

The light emitting device includes a first lead terminal, a second lead terminal, a housing, a light emitting chip, and a lead wire. The first lead terminal includes a chip mounting part having at least one first bent part bent in the vertical direction and a first terminal part bent from the chip mounting part. The second lead terminal is electrically separated from the first lead terminal and includes a wire bonding portion having at least one second bending portion bent in the vertical direction and a second terminal portion bent from the wire bonding portion. The housing secures the first and second lead terminals and includes an opening that exposes at least a portion of the chip mounting portion and the wire bonding portion. The light emitting chip is mounted in a chip mounting part. The lead wire electrically connects the light emitting chip and at least one of the first and second lead terminals. The housing may be formed with a cutout extending from the opening so as to increase an exposed area of the chip mounting portion and the wire bonding portion. Therefore, it is possible to reduce the thickness of the light emitting device, to make the shape of the directivity angle similar to the side light emitting type, to improve the light utilization efficiency, to suppress moisture penetration, and to improve the reliability.

Description

Light emitting device {LIGHT EMITTING DEVICE}

The present invention relates to a light emitting device, and more particularly, to a light emitting device for packaging a light emitting chip to generate light.

In general, light emitting diodes (LEDs) have many advantages such as high luminous efficiency, long life, low power consumption, and eco-friendliness. Therefore, the technical field using them is increasing.

Such a light emitting diode is usually manufactured in a package structure in which a light emitting chip is mounted, and is configured to perform a light emitting operation by receiving a current from the outside. To this end, the light emitting diode includes a lead frame for applying a current to the light emitting chip, and a housing for fixing the lead frame. In addition, the light emitting diode may further include a light-transmitting sealing member formed in an opening formed in the housing to expose the light emitting chip to protect the light emitting chip from the outside.

The light emitting diode can be manufactured in various structures according to its use. For example, light emitting diodes may be manufactured in various structures, such as top-view, side-view, power, lamp, and chip, depending on the application. Can be.

In order to reduce the thickness of the conventional top package, a method of reducing the height of the upper part of the housing having the opening and the bottom of the package has been attempted. However, in order to prevent cracking or damage to the bottom surface of the package when forming the lead frame, the thickness of the housing should be about twice the thickness of the lead frame, thereby limiting the thickness of the top package.

In addition, since the opening of the tower package mainly has a circular shape, it has the same direction angle in the long axis and short axis. However, when the top package is used in the side edge type backlight for arranging the light emitting diode on the side of the light guide plate, there is a problem that the efficiency is lower than that of the side light emitting package in order to obtain an optimal light utilization efficiency in the light guide plate.

Moreover, a problem arises in that the adhesive force between the lead frame exposed by the opening of the housing and the sealing member such as silicon is inferior and moisture easily penetrates therebetween.

Therefore, the present invention has been made in view of the above problems, and the present invention can reduce the thickness of the package, improve the light utilization efficiency by suppressing the penetration of moisture by making the orientation angle similar to the side emitting type, and improving the reliability. It provides a light emitting device.

A light emitting device according to an aspect of the present invention includes a first lead terminal, a second lead terminal, a housing, a light emitting chip, and a lead wire. The first lead terminal includes a chip mounting part having at least one first bent part bent in the vertical direction and a first terminal part bent from the chip mounting part. The second lead terminal is electrically separated from the first lead terminal and includes a wire bonding portion having at least one second bending portion bent in a vertical direction and a second terminal portion bent from the wire bonding portion. The housing fixes the first and second lead terminals and includes an opening that exposes at least a portion of the chip mounting portion and the wire bonding portion. The light emitting chip is mounted in the chip mounting unit. The lead wire electrically connects the light emitting chip and at least one of the first and second lead terminals.

The chip mounting part may include a first lower end part and a first upper end part. The first lower end portion extends horizontally from the lower end of the first bent portion toward the second lead terminal and is a portion in which the light emitting chip is mounted. The first upper end extends horizontally from an upper end of the first bent part in the opposite direction to the first lower end and is connected to an upper end of the first terminal part, and is formed at a position higher than the first lower end.

The wire bonding part may include a second lower end part and a second upper end part. The second lower end portion extends horizontally from the lower end of the second bent portion in the direction of the first lead terminal to face the first lower end portion. The second upper end portion is horizontally extended from the upper end of the second bent portion in the opposite direction to the second lower end portion and connected to the upper end of the second terminal portion, and is formed at a position higher than the second lower end portion.

The first lower end portion may be formed to be narrower as it moves away from the second lead terminal to suppress moisture penetration.

The opening may have a small circular area in the inner side adjacent to the first and second lead terminals, and may be formed in a funnel shape in which the circular area becomes wider toward the outside. The housing may be formed with a first cutout extending from the opening and cut within the widest circle area of the opening to increase an exposed area of the chip mounting part and the wire bonding part. The first cutout may be formed along the direction in which the light emitting devices are arranged.

An exposed area of the chip mounting part and the wire bonding part exposed by the opening part and the first cutout part is smaller than a bottom area of the opening part and the first cutout part to expose the injection resin of the housing to suppress moisture penetration. Can be formed.

Stepped portions may be formed on an inclined surface of the housing in which the opening is formed.

The housing may have a second cutout extending from the first cutout and cut out to the outside of the widest circular area of the opening.

The lead wire may include a first wire electrically connecting the light emitting chip and the first lead terminal, and a second wire electrically connecting the light emitting chip and the second lead terminal.

The light emitting device may further include an encapsulation member filled in the opening and the first cutout to cover the light emitting chip and the lead wire. The light emitting device may further include a lens part formed on the housing to cover the opening.

According to such a light emitting device, by forming a bent portion in the chip mounting portion and the wire bonding portion, it is possible to reduce the thickness of the light emitting device, to ensure the thickness of the flesh necessary for forming the housing to prevent cracks or damage generated during forming. have. In addition, by forming an incision in the opening of the housing to form a different orientation angle for the long axis direction and the short axis direction, it is possible to improve the product applicability to the LED backlight. In addition, by increasing the exposed areas of the chip mounting part and the wire bonding part through the formation of the cutout part, the mounting area and the wire bonding area of the light emitting chip may be enlarged to improve surface mountability. In addition, by forming the area of the lead terminal disposed on the bottom of the opening to be smaller than the area of the bottom of the opening, or by forming various types of bends in the lead terminal, it is possible to suppress moisture penetration into the light emitting device and to improve moisture-related reliability. Can be.

The above-described features and effects of the present invention will become more apparent from the following detailed description taken in conjunction with the accompanying drawings, and thus, those skilled in the art to which the present invention pertains may easily implement the technical idea of the present invention. Could be.

As the inventive concept allows for various changes and numerous embodiments, particular embodiments will be illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this application, the terms "comprise" or "having" are intended to indicate that there is a feature, number, step, action, component, part, or combination thereof described in the specification, and that one or more other features It should be understood that it does not exclude in advance the possibility of the presence or addition of numbers, steps, actions, components, parts or combinations thereof.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be referred to as the second component, and similarly, the second component may also be referred to as the first component.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

1 is a perspective view illustrating a light emitting device according to an exemplary embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line II ′ of FIG. 1, and FIG. 3 is a plan view of the light emitting device illustrated in FIG. 1. 4 is a perspective view illustrating first and second lead terminals illustrated in FIG. 1.

1 to 4, a light emitting device 100 according to an embodiment of the present invention includes a first lead terminal 200, a second lead terminal 300, a housing 400, a light emitting chip 500, and Lead wire 600.

The first lead terminal 200 and the second lead terminal 300 are electrically separated from each other at predetermined intervals. The first lead terminal 200 and the second lead terminal 300 are supplied with power required for light emission of the light emitting chip 500 from the outside and supplied to the light emitting chip 500. The first lead terminal 200 and the second lead terminal 300 are formed of, for example, a metal having excellent conductivity and excellent workability.

The first lead terminal 200 includes a chip mounting unit 210 in which the light emitting chip 500 is mounted, and a first terminal unit 220 for receiving power from the outside.

The chip mounting unit 210 includes at least one first bent part 211 bent in the vertical direction. In addition, the chip mounting unit 210 may include a first lower end 212 connected to a lower end of the first bent part 211 and a first upper end 213 connected to an upper end of the first bent part 211. . The first lower end 212 is a portion in which the light emitting chip 500 is mounted, and extends horizontally from the lower end of the first bent part 211 toward the second lead terminal 300. The first upper end portion 213 extends horizontally in the opposite direction of the first lower end portion 212 from the upper end of the first bent portion 211 and is connected to the upper end of the first terminal portion 220. Therefore, the first upper end portion 213 is formed at a position higher than the first lower end portion 212 by the height of the first bent portion 211.

The first terminal unit 220 is a portion electrically connected to an external device such as a printed circuit board (PCB) in order to receive power from the outside. The first terminal portion 220 is formed to be exposed from the housing 400 for the electrical connection with the external device. The first terminal part 220 is bent from the chip mounting part 210 and is formed to face the chip mounting part 210 with a portion of the housing 400 interposed therebetween. For example, the first terminal part 220 may be bent from the first side part 221 bent downward from the first upper end part 213 and the lower end of the first side part 221 to face the chip mounting part 210. The first connector 222 is included. Here, the first connection portion 222 is a portion that is electrically connected to the external device substantially.

Therefore, the first lead terminal 200 is formed in a substantially “c” shape, and the injection resin constituting the housing 400 is filled in the space between the chip mounting unit 210 and the first terminal unit 220. do.

The second lead terminal 300 includes a wire bonding portion 310 to which the lead wire 600 is bonded, and a second terminal portion 320 to receive power from the outside.

The wire bonding part 310 includes at least one second bent part 311 bent in the vertical direction. In addition, the wire bonding part 310 includes a second lower end 312 connected to the lower end of the second bent part 311 and a second upper end part 313 connected to the upper end of the second bent part 311. The second lower end 312 is a portion to which the lead wire 600 is substantially bonded, and extends horizontally from the lower end of the second bent part 311 in the direction of the first lead terminal 200 to the first lower end 212. It is formed to face. The second upper end portion 313 extends horizontally in the opposite direction of the second lower end portion 312 from the upper end of the second bent portion 311 and is connected to the upper end of the second terminal portion 320. Therefore, the second upper end portion 313 is formed at a position higher by the height of the second bent portion 311 than the second lower end portion 312.

The second terminal part 320 is a part electrically connected to an external device such as a printed circuit board (PCB) in order to receive power from the outside. The second terminal part 320 is formed to be exposed from the housing 400 for the electrical connection with the external device. The second terminal portion 320 is bent from the wire bonding portion 310 and formed to face the wire bonding portion 310 with a portion of the housing 400 interposed therebetween. For example, the second terminal part 320 is bent from the lower end of the second side part 321 and the second side part 321 bent downward from the second upper end part 313 to face the wire bonding part 310. The second connection portion 322 is included. Here, the second connection portion 322 is a portion that is electrically connected to the external device substantially.

Therefore, the second lead terminal 300 is formed in a substantially “c” shape, and the injection resin constituting the housing 400 is filled in the space between the wire bonding portion 310 and the second terminal portion 320. do.

As such, when the first bent part 211 and the second bent part 311 are formed in the chip mounting part 210 and the wire bonding part 310, the first light emitting chip 500 is substantially mounted. The distance between the lower end 212 and the first connector 222 and the distance between the second lower end 312 and the second connector 322 to which the lead wire 600 is bonded are reduced, thereby reducing the overall thickness of the light emitting device 100. The height of the first bent portion 211 and the second bent portion 311 may be reduced. The distance between the first upper end portion 213 and the first connection portion 222 and the distance between the second upper end portion 313 and the second connection portion 322 may be defined as the distance between the first lower end portion 212 and the first connection portion 222. By maintaining a state larger than the distance between the second lower end 312 and the second connecting portion 322, it is possible to secure the flesh thickness required when forming the housing 500. For example, the distance between the first upper end portion 213 and the first connection portion 222 and the distance between the second upper end portion 313 and the second connection portion 322 may have a thickness of the first and second lead terminals 200 and 300. It is formed about 2 times. Accordingly, the thickness of the light emitting device 100 may be reduced, and cracks or damages that may occur in the lower portion of the chip mounting unit 210 and the wire bonding unit 310 may be prevented when the housing 400 is formed. have. In addition, by reducing the thickness of the light emitting device 100, it is possible to secure a space that can prevent the poor contrast of the problem in the LED backlight (LED BLU).

The housing 400 is formed to surround portions of the first lead terminal 200 and the second lead terminal 300 to fix the first lead terminal 200 and the second lead terminal 300. The housing 400 has an opening 410 exposing at least a portion of the chip mounting unit 210 and the wire bonding unit 310. The housing 400 may be formed by, for example, molding molding using a polyphthalamide (PPA) resin.

The opening 410 formed in the housing 400 is formed to have a substantially circular shape when viewed in plan view, as shown in FIG. 3. Specifically, the opening 410 has the smallest circular area 410a in the inner side adjacent to the first and second lead terminals 200 and 300, and is formed in a funnel shape in which the circular area becomes wider toward the outer side. Therefore, the inner wall of the housing 400 in which the opening 410 is formed is formed as an inclined surface inclined at a predetermined angle.

The housing 400 may further include a first cutout 420 that is cut to increase an exposed area of the chip mounting part 210 and the wire bonding part 310. The first cutouts 420 are formed at both sides of the light emitting chip 500 corresponding to the positions of the first lower end 212 and the second lower end 312, respectively. As shown in FIG. 3, the first cutout 420 extends outward from the opening 410 in the widest circle area 410b of the opening 410 when viewed in plan view. It is formed to be incision. When the plurality of light emitting devices 100 are used in the LED backlight or the like, the first cutout 420 may be formed along the direction in which the light emitting devices 100 are arranged.

As such, when the first cutout 420 is formed by cutting a portion of the housing 400, the orientation angles of the long axis direction and the short axis direction are different from each other, and particularly correspond to the arrangement direction of the light emitting devices 100. The directing angle in the long axis direction is wider than the short axis direction. Therefore, the light incident efficiency from the LED backlight to the light guide plate can be improved and the quality of the LED backlight can be improved. In addition, when the exposed area of the chip mounting unit 210 and the wire bonding unit 310 is increased through the formation of the first cutout 420, a space for mounting the light emitting chip 500 and a space for wire bonding may be used. This is magnified. Therefore, the workability of the die bonding process for mounting the light emitting chip 500 and the wire bonding process for forming the lead wire 600 may be improved, and efficient space utilization may be possible.

The light emitting chip 500 is mounted on the first lower end 212 of the first lead terminal 200. The light emitting chip 500 may be made of a semiconductor material such as, for example, gallium nitride, arsenic nitride, phosphorus nitride, or the like. The light emitting chip 500 may emit light in various wavelength bands according to its purpose. For example, the light emitting chip 500 emits light in a blue, red, red, yellow, or ultraviolet wavelength band.

In this embodiment, since the exposed area of the chip mounting unit 210 is increased by the first cutout 420 cut along the long axis in addition to the opening 410, the area of the light emitting chip 500 to be mounted may be increased. The light efficiency can be improved. In addition, as the exposed area of the chip mounting unit 210 increases, the light emitting chip 500 may be mounted in various directions such as a horizontal direction, a vertical direction, and a diagonal direction as long as there is no problem in mounting the light emitting chip 500. Can be.

The lead wire 600 electrically connects the light emitting chip 500 and at least one of the first and second lead terminals 200 and 300 to supply power supplied from the first and second lead terminals 200 and 300. It is applied to the light emitting chip 500. The lead wire 600 electrically connects the first wire 610 and the light emitting chip 500 and the second lead terminal 300 to electrically connect the light emitting chip 500 and the first lead terminal 200. It may include a second wire 620 for. One end of the first wire 610 is electrically connected to the upper surface of the light emitting chip 500, and the other end of the first wire 610 is electrically connected to the first lead terminal 200. One end of the second wire 620 is electrically connected to the upper surface of the light emitting chip 500, and the other end of the second wire 620 is electrically connected to the second lead terminal 300. Therefore, the light emitting chip 500 generates light in response to the power applied through the first lead terminal 200, the second lead terminal 300, and the lead wire 600. The lower surface of the light emitting chip 500 is electrically connected to the first lead terminal 200, and the upper surface of the light emitting chip 500 is electrically connected to the second lead terminal 300 through a lead wire. May have

The light emitting device 100 is shown only in the encapsulation member 700 (FIG. 2) filled in the opening 410 and the first cutout 420 of the housing 400 to cover the light emitting chip 500 and the lead wire 600. ) May be further included. The encapsulation member 700 is to protect the light emitting chip 500 from the outside, and may be formed of, for example, epoxy or silicone resin. The encapsulation member 700 may include a phosphor for converting a wavelength of light generated from the light emitting chip 500.

Meanwhile, the stepped portion 430 may be formed on the inclined surface of the housing 400 in which the opening 410 is formed. As such, when the step 430 is formed on the opening 410, the molding shape may be more easily convex when the encapsulation member 700 is injected, thereby improving light efficiency. In addition, when the encapsulation member 700 is convex, the margin for protecting the lead wire 600 is increased. In addition, there is an effect that can be measured by the naked eye when molding the sealing member 700. On the other hand, the lens shape of the sealing member 700 may be formed flat or concave.

The light emitting device 100 according to the present embodiment has an improved structure for suppressing moisture penetration.

2 and 3, an exposed area of the chip mounting unit 210 and the wire bonding unit 310 exposed to the outside of the housing 400 by the opening 410 and the first cutout 420 is defined as the opening ( 410 and smaller than the bottom surface area of the first cutout 420. Accordingly, the injection resin of the housing 400 is exposed in the side regions of the chip mounting unit 210 and the wire bonding unit 310.

As such, the area of the first lead terminal 200 and the second lead terminal 300 disposed on the bottom surface of the opening 410 and the first cutout 420 is defined by the opening 410 and the first cutout 420. When the thickness is smaller than the bottom surface area, the sealing member 700 formed of silicon, etc., and the injection resin forming the housing 400 are adhered around the light emitting chip 500 and the lead wire 600. Therefore, rather than the plated first and second lead terminals 200 and 300 and the encapsulation member 700 are bonded to each other, the time for penetrating moisture is further delayed, so that the openings 410 and the first cutouts 420 The moisture penetrated along the adhesive surface between the inner surface and the sealing member 700 may be more effectively prevented.

In addition, as illustrated in FIG. 4, the first lower end 212 of the chip mounting unit 210 may be formed to have a narrower width from the second lead terminal 300 toward the first upper end 213. . In addition, a groove portion 214 cut into a predetermined depth may be formed at a corner portion where the first lower end portion 212 and the first upper end portion 213 meet. As such, when various types of bends are formed on a path through which moisture penetrates along the adhesive surface of the first lead terminal 200 and the housing 400, the penetration of moisture may be further delayed in time, thereby ensuring reliability related to moisture. Can be further improved.

5 is a perspective view showing a light emitting device according to another embodiment of the present invention.

5, an opening 410 is formed in the housing 400 to expose at least a portion of the chip mounting unit 210 and the wire bonding unit 310. In addition, the housing 400 is formed by extending from the opening 410 in the widest circle area 410b of the opening 410 so as to increase the exposed area of the chip mounting unit 210 and the wire bonding unit 310. One cutout 420 is further formed.

In the present embodiment, the housing 400 further includes a second cutout 440 extending outward from the first cutout 420 and cut out to the outside of the widest circle area 410b of the opening 410. do. The second cutouts 440 are formed at both sides of the light emitting chip 500, respectively. The second cutout 440 may be formed in various shapes such as a semicircle, a semi-ellipse, and a polygon in a plane.

As such, when the second cutout 440 is formed in the housing 400, the exposed area of the chip mounting unit 210 and the wire bonding unit 310 may be increased. Therefore, when using the large area light emitting chip 500, it is possible to more easily secure the wire bonding region for the first wire 610 and the second wire 620.

On the other hand, the rest of the configuration except for the housing 400 may be the same as the embodiment shown in Figures 1 to 4, detailed description of the same components will be omitted.

6 is a cross-sectional view illustrating a light emitting device according to still another embodiment of the present invention.

1 and 6, the light emitting device 100 may further include a lens part 800 formed to cover the opening 410 on an upper portion of the housing 400 through which light is emitted.

The lens unit 800 is formed to adjust the directivity angle of the light emitted from the light emitting device 100 and may be manufactured in various shapes according to the required directivity angle characteristics. For example, the lens unit 800 may be formed in the shape of a convex lens, as shown in FIG. 6, to implement the top emission type light emitting device. At this time, the curvature of the lens is determined according to the required orientation angle.

On the other hand, the rest of the configuration except for the lens unit 800 may be the same as the embodiments shown in Figures 1 to 5, detailed description of the same components will be omitted.

In the detailed description of the present invention described above with reference to the preferred embodiments of the present invention, those skilled in the art or those skilled in the art having ordinary skill in the art will be described in the claims to be described later It will be understood that various modifications and variations can be made in the present invention without departing from the scope of the present invention.

1 is a perspective view showing a light emitting device according to an embodiment of the present invention.

FIG. 2 is a cross-sectional view taken along the line II ′ of FIG. 1.

3 is a plan view of the light emitting device illustrated in FIG. 1.

4 is a perspective view illustrating first and second lead terminals illustrated in FIG. 1.

5 is a perspective view showing a light emitting device according to another embodiment of the present invention.

6 is a cross-sectional view illustrating a light emitting device according to still another embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

100: light emitting device 200: first lead terminal

210: chip mounting portion 211: first bent portion

212: first lower portion 213: first upper portion

220: first terminal 300: second lead terminal

310: wire bonding part 311: second bending part

312: second lower end 313: second upper end

320: second terminal 400: housing

410: opening 420: first incision

430: step 440: second incision

500: light emitting chip 600: lead wire

700: sealing member 800: lens portion

Claims (13)

A first lead terminal including a chip mounting portion having at least one first bent portion bent in a vertical direction and a first terminal portion bent from the chip mounting portion; A second lead terminal electrically separated from the first lead terminal and including a wire bonding portion having at least one second bending portion bent in a vertical direction and a second terminal portion bent from the wire bonding portion; A housing in which the first and second lead terminals are fixed, and an opening for exposing at least a portion of the chip mounting portion and the wire bonding portion; A light emitting chip mounted on the chip mounting unit; And A lead wire electrically connecting the light emitting chip to at least one of the first and second lead terminals, The housing is provided with a first cutout extending from the opening and cut in the largest circle area of the opening so that the exposed area of the chip mounting portion and the wire bonding portion is increased. The method of claim 1, wherein the chip mounting portion A first lower end extending horizontally from a lower end of the first bent part toward the second lead terminal and having the light emitting chip mounted thereon; And Light emission characterized in that it comprises a first upper end extending horizontally from the upper end of the first bent portion in the opposite direction of the first lower end and connected to the upper end of the first terminal, and formed at a position higher than the first lower end. Device. The method of claim 2, wherein the wire bonding portion A second lower end extending horizontally from a lower end of the second bent part in the direction of the first lead terminal to face the first lower end; And And a second upper end portion extending horizontally from an upper end of the second bent portion in an opposite direction to the second lower end portion and connected to an upper end of the second terminal portion and formed at a position higher than the second lower end portion. Device. The method of claim 2, The first lower end of the light emitting device is characterized in that the width becomes narrower away from the second lead terminal. The method of claim 1, And the opening is formed in a funnel shape having a smallest circular area in the inner side adjacent to the first and second lead terminals and having a larger circular area toward the outside. delete The method of claim 1, The first cutout is a light emitting device, characterized in that formed along the direction in which the light emitting devices are arranged. The method of claim 1, An exposed area of the chip mounting part and the wire bonding part exposed by the opening part and the first cutout part may be smaller than a bottom area of the opening part and the first cutout part so that the injection resin of the housing is exposed. Light emitting device. The method of claim 1, The light emitting device of claim 1, wherein a stepped portion is formed on an inclined surface of the housing in which the opening is formed. The method of claim 1, And a second cutout extending from the first cutout to the outside of the widest circular area of the opening. The method of claim 1, wherein the lead wire A first wire electrically connecting the light emitting chip and the first lead terminal; And And a second wire electrically connecting the light emitting chip and the second lead terminal. The method of claim 1, And a sealing member filled in the opening and the first cutout to cover the light emitting chip and the lead wire. The method of claim 12, And a lens unit formed on the housing to cover the opening.
KR1020080058292A 2008-06-20 2008-06-20 Light emitting device KR100985668B1 (en)

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KR1020080058292A KR100985668B1 (en) 2008-06-20 2008-06-20 Light emitting device

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Application Number Priority Date Filing Date Title
KR1020080058292A KR100985668B1 (en) 2008-06-20 2008-06-20 Light emitting device

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KR20090132168A KR20090132168A (en) 2009-12-30
KR100985668B1 true KR100985668B1 (en) 2010-10-05

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KR102086126B1 (en) * 2019-06-27 2020-03-06 엘지이노텍 주식회사 Light emitting device and light apparatus having thereof
KR102109139B1 (en) * 2019-07-31 2020-05-11 엘지이노텍 주식회사 Light emitting device and lighting system

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KR101347454B1 (en) 2012-05-02 2014-01-03 김미숙 Led package and fabricating method

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