KR100982674B1 - Apparatus for forming a nano-pattern and method using the same - Google Patents

Abstract

The present invention relates to a micropattern forming apparatus and a method for forming a micropattern using the same, wherein an UV dimming unit is provided at an outer side thereof, and is provided to transmit light dimmed by the UV dimming unit, and is attached to a stamp and can be elevated. A chamber, a lower chamber provided below the upper chamber, and to which a substrate on which a pattern forming layer is applied is attached, a lifter for elevating the upper chamber to be in close contact with the lower chamber to form a process space, and provided in the lower chamber. A gap adjusting device for adjusting a gap between the stamp and the substrate and a pressing force between the stamp and the substrate, a position adjusting device provided in the lower chamber to adjust the position of the substrate, and formed by the upper chamber and the lower chamber. An exhaust device for exhausting the process space is provided.

Description

Apparatus for forming a nano-pattern and method using the same}

The present invention relates to a micropattern forming apparatus and a method of forming a micropattern using the same. More particularly, the present invention relates to a micropattern forming apparatus and a method of forming a micropattern using the same. It is about.

In recent years, as the information age rapidly enters, a display technology that displays information by text or image so that the user can see the information anytime and anywhere is becoming more important.

Looking at the consumption trend of such display devices, conventional CRTs are bulky and heavy, so the demand for flat panel displays such as liquid crystal displays (LCDs) and plasma display panels (PDPs) is increasing rapidly.

The manufacturing process of a flat panel display includes an electrode process for forming a color filter, a pixel, a thin film transistor, and the like on a large transparent substrate, a panel assembly process for injecting liquid crystals by bonding an alignment-treated substrate, and a liquid crystal panel. It can be divided into three steps of mounting process for attaching driver IC, substrate, backlight, etc.

The gate wiring layer of the thin film transistor, which is classified as a core process, is manufactured by lithography technology.

Photolithography is a method of coating a thin film such as SiO ₂ or Si ₃ N ₄ on the substrate by deposition. The photoresist, which is a chemical that reacts well to light, is uniformly coated by spin-coating or nozzle coating. The photosensitive film-coated substrate is placed on a mobile reduction projection stepper, which is a representative photolithography device, and a mask or reticle having a pattern to be formed is placed between the light source and the substrate to selectively pass light. As a result, there is a chemical difference between the part that receives light and the part that does not. The photoresist film that dissolves relatively well in response to the developer is called a positive photoresist film. On the contrary, the photoresist film that remains undissolved in the developer solution becomes larger due to the increased binding force of the lighted part. It is called a negative photoresist. Through this development process, a photoresist film remains to cover the thin film underneath, and a portion where the photoresist film is dissolved to reveal the thin film underneath. When chemicals are added, the part where no photoresist film is left is removed by chemical reaction (etching) with the exposed thin film, and the part where the photoresist film used as a protective film is not chemically reacted and the thin film under it remains as it is. . Stripping the remaining photoresist film finally forms a pattern of a desired shape.

The precision of the formation of the fine pattern of the photolithography technique is determined according to the wavelength of light to be used. Therefore, in the early days, visible light (visible light) was used, but soon ultraviolet light (ultraviolet) was used. Recently, an electron beam (eb) is used to handle fine patterns of 1 μm or less.

However, such a photolithography method has a problem of increasing the initial investment cost of exposure equipment and increasing the price of a mask having a resolution similar to the wavelength of light used as the circuit is miniaturized.

Therefore, the fine pattern formation technology is attracting attention as a technology that replaces the expensive photo development technology. The micropattern forming technique is a method of pressing a photoresist film of a polymer material uniformly coated on a substrate by stamping a fine pattern.

Such a micropattern forming method may be classified into a thermosetting method of changing a temperature after physically contacting a stamp and a photoresist film, applying a pressure, and an ultraviolet curing method that is cured through ultraviolet irradiation using an ultraviolet curable photosensitive film. .

A general micropattern forming apparatus may form a micropattern by pressing and contacting a stamp and a substrate, forming a micropattern, and separating and dropping the stamp and the substrate (or substrate).

However, when the stamp and the substrate are pressed, and when the bonded stamp and the substrate are not smoothly operated, the micro pattern formed on the substrate may be defective, and in serious cases, the substrate may be damaged. This problem is more prominent due to the large area of the substrate.

The present invention has been made to solve the above problems, to provide a micro-pattern forming apparatus and a method for forming a micropattern using the same, which can pressurize the stamp and the substrate, and the separation process of the stamp and the substrate smoothly. There is this.

The micropattern forming apparatus according to an embodiment of the present invention for achieving the above object is provided with a UV light control unit on the outside, provided to transmit the light dimmed from the UV light control unit is provided with a stamp attached and can be elevated A lower chamber provided under the upper chamber, a lower chamber provided with a substrate on which a pattern forming layer is applied, and a lifter for elevating the upper chamber to be in close contact with the lower chamber to form a process space, and the lower chamber. A spacing device for adjusting a gap between the stamp and the substrate and a pressing force between the stamp and the substrate, a positioner for adjusting the position of the substrate in the lower chamber, and the upper chamber and the lower chamber. An exhaust device for exhausting the process space is formed.

 In order to achieve the above object, the method of forming a micropattern according to an embodiment of the present invention provides a substrate to which a stamp and a pattern forming layer are applied, and an import step of attaching the supplied stamp and the substrate to the upper chamber and the lower chamber, respectively. An environment forming step of forming a process space through the upper chamber and the lower chamber, exhausting the process space to form a process environment, and an alignment step of controlling an alignment state by reading an alignment state of the stamp and the substrate; Adjusting the gap between the substrate and the stamp by lowering the stamp, the bonding step to contact the stamp and the substrate by its own weight, the bonded stamp and the substrate by irradiating UV light to cure the pattern forming layer The curing step to separate the stamp and the substrate from the upper chamber, and to take out the separated stamp and the substrate And a step out.

According to the apparatus for forming a micropattern according to the present invention and a method for forming a micropattern using the same, it is possible to pressurize the stamp and the substrate and to perform the separation process of the stamp and the substrate smoothly, thereby preventing defects in the micropattern and damaging the substrate. There is an effect that can be prevented.

Hereinafter, a micropattern forming apparatus and a micropattern forming method using the same according to the present invention will be described in detail with reference to the accompanying drawings.

In the description of the present invention, the names of the elements defined are defined in consideration of functions in the present invention, and should not be understood as meanings that limit the technical elements of the present invention. May be referred to by other names in the art. In addition, the code added to each component is described for convenience of description, and the contents shown in the drawings in which these codes are described do not limit each component to the range in the drawing. In addition, as long as the functional similarity and identity thereof, even if the modified embodiment is adopted, it can be seen as an equivalent configuration, and even if the embodiment in which the modified part of the configuration is employed, it can be seen as an equivalent configuration.

First, the micropattern forming apparatus according to an embodiment of the present invention will be briefly described with reference to the accompanying drawings.

1 is a schematic diagram showing the configuration of a micropattern forming apparatus according to an embodiment of the present invention.

As shown, the fine pattern forming apparatus 100 according to an embodiment of the present invention, is provided to be elevated to the ground, and the light dimmed from the UV light dimming unit 180 to the outside is transmitted to the inside stamp (P1) A lower chamber 130 to which the upper chamber 110 to which the upper side is attached is attached, the lower chamber 130 to which the substrate P2 on which the pattern forming layer is formed, fixed and supported by the base 160 is attached, and a lifter which elevates the upper chamber 110 with respect to the lower chamber. 114, a gap adjusting device 137 provided in the lower chamber 130 to adjust a gap between the stamp P1 and the substrate P2, and a stamp provided between the base 160 and the lower chamber 130. Position adjusting device 150 for aligning (P1) and the substrate (P2), and the exhaust device 170 for exhausting the process space formed by the upper chamber 110 and the lower chamber 130.

Here, it is preferable that the pattern formation layer formed in the board | substrate P2 is apply | coated the photocurable resin hardened in response to the light of a specific wavelength.

The upper chamber 110 is in close contact with the lower chamber 130 to form a process space, and to form a process environment.

This, the upper chamber 110 is supported by the lifter 114 to be elevated and provided with an upper chamber body (110a) of the rectangular box shape that the lower side is embedded, the upper chamber body (110a) of the upper chamber (110) A chamber light transmission window 110b formed of a transparent quartz material is provided to transmit light of the UV light control unit 180 provided outside.

In addition, the depression of the upper chamber body (110a) is provided with a stamp stage 121 which is provided to be able to flow up and down with respect to the upper chamber body (110a), the stamp stage 121 is extended to the outer wall side of the upper chamber (110) The support rod 122 is provided, and the support rod 122 is supported by the gap adjusting device 137 to be described later and liftably.

The stamp stage 121 is a stage light transmission window formed of a transparent quartz material so that the light is transmitted from the UV light control unit 180 through the chamber light transmission window 110b provided in the upper chamber body 110a is transmitted. 124 is provided.

In addition, a stamp chuck 123 for attaching the stamp P1 is provided below the stamp stage 121. The stamp chuck 123 is provided as an electrostatic chuck (ESC: Electrostatic Chuck) to attach the stamp (P1) by the electrostatic force, the polyamide type of transparent material so that the light is emitted from the UV light control unit 180 It is preferable to provide an electrostatic chuck of.

In addition, the stamp P1 is attached to the outer circumferential surface of the upper chamber body 110a, the camera unit 111 for measuring the relative position of the substrate P2, and the stamp P1 is attached to the stamp chuck 123. In order to separate the stamp P1 from the stamp chuck 123, a stamp separator 117 is provided to suck or press the stamp P1.

Here, the camera 111 has a through hole 112 penetrating through the upper chamber body 110a and the stamp chuck 123, and a stamp chuck through the through hole 112 in the upper portion of the through hole 112. An alignment camera 113 for reading the alignment of the stamp attached to 123 and the substrate P2 to be described later is provided.

Such a camera unit 111 is mounted so that the alignment mark (not shown) provided on the stamp P1 and the substrate P2 can be superimposed, and at least the diagonal of the stamp P1 and the substrate P2 can be observed. It is arranged to observe the two corners over and over.

On the other hand, the stamp separator 117 is provided with a plurality of separating pins 118 provided through the upper chamber body 110a and the stamp chuck 123, the separation pin 118 is provided outside the upper chamber body (110a). It is provided with a separating pin operating body 119 to raise and lower.

Here, the separating pin 118 is formed in a tubular shape in which the hollow is formed, and is connected to a separate adsorption part (not shown), when the vacuum pressure is formed inside the separation pin 118 by the adsorption part stamp (P1) It is provided to adsorb.

The lower chamber 130 is to be in close contact with the upper chamber 110 to form a process space, and to adjust the alignment state of the stamp (P1) and the substrate (P2), located on the lower side of the upper chamber 110 Supported by the 160, the lower chamber body 130a of the rectangular housing shape that the upper side is embedded, the substrate stage 132 provided in the recessed portion of the lower chamber body 130a, and the substrate stage 132 Substrate elevating device 134 for elevating the seated substrate (P2) and the position adjusting device 150 is provided between the lower chamber body 130a and the base 160 to control the alignment state of the stamp (P1) and the substrate And a gap adjusting device 137 provided on the outer circumferential surface of the lower chamber body 130a to limit the lifting position of the stamp stage 121 to control the gap between the stamp P1 and the substrate P2.

Here, the substrate chuck 133 for attaching the substrate P2 to be inserted is provided on the upper surface of the substrate stage 132, and the outer circumferential surface of the lower chamber body 130a is in contact with the lower surface of the upper chamber body 110a. A sealing member 131 is provided to maintain the airtightness of the space. The substrate chuck 133 is preferably provided as an electrostatic chuck (ESC) for attaching the substrate P2 by electrostatic power.

The position adjusting device 150 is positioned between the base 160 and the lower chamber body 130a to penetrate the lower chamber body 130a to support the substrate stage 132. It is configured by a plurality of transfer units 151 to move in the Y-axis, Z-axis direction and to rotate about each axis.

In addition, the gap adjusting device 137 is located on the outer circumferential surface of the lower chamber body 130a to limit the lifting position of the stamp stage of the upper chamber. The gap adjusting device 137 supports the support rod 122 of the stamp stage 121 to lift the stamp stage 121, the lifting device 138 and the stamp is lifted by the fine lifting device 138 It is provided with a load cell 139 for detecting a load applied to the stage 121.

And the substrate lifting device 134 is a plurality of lifting pins 135 provided through the lower chamber body 130a, and the lifting pins provided on the outside of the lower chamber body 130a to elevate a plurality of lifting pins 135 Actuator 136 is provided.

The lifter 114 lifts the upper chamber 110 toward the lower chamber 130 so that the lower chamber 130 and the upper chamber 110 form a bonding space, and a plurality of lifting devices 115 installed on the ground. And a lifting shaft 116 supporting the lower portion of the upper chamber body 110a and lifting up and down by the lifting device 115.

Here, the elevating device 115 is provided with a hydraulic cylinder (not shown) for generating power for raising and lowering the elevating shaft 116, or at the same time the direction of the power generated by the motor (not shown) and the motor is reduced It may be provided by a combination of a reducer (not shown) and a screw assembly (not shown) for converting the rotational movement of the reducer to linear movement. The structure of the elevating device 115 may be implemented by various embodiments and is not limited to the above-described structure.

The exhaust device 170 is for forming a vacuum pressure in the process space formed by the upper chamber 110 and the lower chamber 130, the exhaust pipe 171 communicates with the process space through the lower chamber body (130a) And a vacuum pump 172 which forms a vacuum pressure in the process space through the exhaust pipe 171.

Accordingly, the operation of the fine pattern forming apparatus according to an embodiment of the present invention will be described in detail with reference to the embodiment. Each element mentioned below should be understood with reference to the above description and drawings.

2 is a flowchart illustrating a method for forming a micropattern according to an embodiment of the present invention, and FIGS. 3A to 3D are operation diagrams illustrating a micropattern forming operation of the apparatus for forming a micropattern according to an embodiment of the present invention.

First, the stamp stage 121 and the substrate stage 132 of the fine pattern forming apparatus 100 according to an embodiment of the present invention is stamped into the space between the open upper chamber 110 and the lower chamber 130 ( P1 and the substrate P2 on which the pattern forming layer is formed are supplied and attached to the stamp stage 121 and the substrate stage 132 (step S110).

Here, in the case of the stamp P1, as the stamp P1 enters between the upper chamber 110 and the lower chamber 130, the stamp chuck is formed by the adhesive force of the stamp chuck 123 provided on the upper chamber body 110a. 123).

At this time, the entering stamp (P1) may be attached directly to the stamp chuck 123 by the attachment force of the stamp chuck 123, the separation pin 118 of the stamp separator 117 provided in the upper chamber body (110a) And it may be attached to the adhesive force of the stamp chuck 123 after being moved to the stamp chuck 123 in a state of being adsorbed by the separating pin 118 by an exhaust (not shown) for providing a vacuum pressure to the separating pin 118. have.

Then, as the substrate P2 is supplied, the lifting pin 135 provided in the lower chamber body 130a is elevated by the lifting pin actuator 136 to the upper portion of the lower chamber body 130a, and the lifting pin 135 is elevated. The substrate P2 supplied between the upper chamber 110 and the lower chamber 130 is supported.

Accordingly, as the lifting pin 135 is lowered by the lifting pin actuator 136, the substrate P2 supported by the lifting pin 135 is lowered together, and the adhesion force of the substrate chuck 133 positioned below the substrate P2 is lowered. Is attached to the lower chamber body 130a (see FIG. 3A).

Meanwhile, when the attachment of the stamp P1 and the substrate P2 is completed, the upper chamber 110 is lowered to the lower chamber 130 by the lifter 114 as shown in FIG. 3B, and the lower surface of the upper chamber 110 is lowered. In close contact with the upper surface of the lower chamber 130, a process space for imprinting the stamp P1 and the substrate P2 is formed. At this time, the upper chamber body 110a and the lower chamber body 130a maintain a state in which airtightness is maintained by the sealing member 131 provided on the upper surface of the lower chamber body 130a.

Here, the support rod 122 of the stamp stage 121 of the upper chamber 110 is maintained in a state supported by the gap adjusting device 137 of the lower chamber 130 is attached to the stamp stage 121 ( The gap between P1) and the substrate P2 attached to the substrate stage 132 is maintained. At this time, the interval between the stamp (P1) and the substrate (P2) is preferably maintained between 2 ~ 4mm.

Subsequently, the gas remaining in the process space by the exhaust pipe 171 and the vacuum pump (not shown) of the exhaust device 170 is exhausted to the outside of the fine pattern forming apparatus 100, and thus, the stamp P1 and the substrate P2 are removed. For bonding, the environment of the process space is controlled in a vacuum.

On the other hand, when the process space by the upper chamber 110 and the lower chamber 130 is converted to a vacuum state, the stamp stage 121 is lowered to the substrate stage 132 by the operation of the gap adjusting device 137, the stamp (P1) ) And the distance between the substrate P2 and 5 µm to 15 µm, and the position alignment of the substrate P2 is performed by the positioning device 150 (step S120). Here, the alignment of the substrate P2 and the stamp P1 is performed by a plurality of transfer units 151 provided in the position adjusting device 150.

Here, alignment of the stamp P1 and the substrate P2 is performed by aligning the positions of the stamp P1 and the substrate P2 read by the camera unit 111 provided in the upper chamber body 110a. Determined as a reference, the description of the operation of the camera unit 111 is a well-known technology, so a detailed description thereof will be omitted.

As described above, when the position adjustment of the stamp P1 and the substrate P2 is completed, the stamp stage 121 is lowered by the gap adjusting device 137 as shown in FIG. 3C, and the stamp P1 and the substrate ( P2) comes into contact with each other, and the bonding progresses due to the weight of the stamp stage 121.

In this case, the load applied to the substrate P2 is detected by the load cell 139 of the gap adjusting device 137, and the fine lifting device 138 provided in the gap adjusting device 137 based on the load amount detected by the load cell 139. The pressure displacement applied to the substrate P2 is adjusted by adjusting the amount of displacement (step S130).

Meanwhile, as described above, when the bonding of the stamp P1 and the substrate P2 proceeds, the UV light unit 180 irradiates light for curing the pattern forming layer. The light dimmed by the UV dimming unit 180 passes through the chamber light emitting window 110b of the upper chamber 110, the stage light transmitting window 124 of the stamp stage 121, and the stamp chuck 123 of a transparent material. The pattern forming layer is cured while P1 is irradiated onto the bonded substrate P2 (step S140).

When the bonding of the stamp P1 and the substrate P2 is completed, the stamp stage 121 is raised by the gap adjusting device 137, and the rising stamp stage 121 is bonded to the stamp P1. An interval between the P2 and the substrate stage 132 is raised to maintain an interval of about 10 to 30 µm.

Subsequently, the static electricity applied to the stamp chuck 123 of the stamp stage 121 is lost and at the same time, the stamp P1 and the substrate P2 bonded while the stamp P1 is pressed by the stamp separator 117 are applied to the substrate stage. Free fall to 132 (step S150).

Thereafter, the pressure of the process space is converted to an atmospheric pressure state by the exhaust device 170, and the process chamber formed by the upper chamber 110 and the lower chamber 130 is raised by the upper chamber 110 by the lifter 114. Is opened. At this time, the bonded stamp P1 and the substrate P2 are maintained by the lifting pins 135 of the substrate lifting device 134 of the lower chamber 130.

Thereafter, the stamp P1 and the substrate P2 in the state supported by the lifting pin 135 are discharged to the outside of the fine pattern forming apparatus 100 by a separate substrate discharge device (not shown) to complete the process. (Step S160).

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is clearly understood that the same is by way of illustration and example only and is not to be taken by way of limitation, The present invention may be modified in various ways. Therefore, modifications of the embodiments of the present invention will not depart from the scope of the present invention.

For example, the micropattern forming apparatus according to the present invention and the micropattern forming method using the same may be implemented by adding a component having another additional function or by replacing with another component. However, all other modified embodiments include the essential elements of the present invention should be considered to be included in the technical scope of the present invention.

1 is a schematic diagram showing the configuration of a micropattern forming apparatus according to an embodiment of the present invention.

2 is a flowchart illustrating a method for forming a fine pattern according to an embodiment of the present invention.

3A to 3D are operation diagrams illustrating a micro pattern forming operation of the micro pattern forming apparatus according to an embodiment of the present invention.

Claims (18)

An upper chamber provided to transmit light dimmed by the UV light control unit; A lower chamber provided below the upper chamber and to which a substrate on which a pattern forming layer is applied is attached; A lifter for elevating the upper chamber to closely contact the lower chamber to form a process space; A stamp stage provided to be movable up and down at the recess of the upper chamber and having a stamp attached thereto; A gap adjusting device provided in the lower chamber to adjust a gap between the stamp and the substrate; A position adjusting device provided in the lower chamber to adjust the position of the substrate; An exhaust device for exhausting a process space formed by the upper chamber and the lower chamber, The spacing device is provided in the lower chamber fine pattern forming apparatus comprising a fine lifting device for lifting the stamp stage in a state in which the process space is maintained. The method of claim 1, The pattern forming layer formed on the substrate is fine pattern forming apparatus, characterized in that the photocurable resin is applied in response to curing of light of a specific wavelength. delete The method of claim 1, wherein the upper chamber A camera unit for reading the alignment of the stamp and the substrate through the upper chamber body and the stamp stage; And a stamp separator for attaching and detaching the stamp to the stamp stage. The method of claim 4, wherein the stamp separator is A plurality of separation pins provided through the upper chamber body and the stamp stage; It is provided on the outside of the upper chamber fine pattern forming apparatus characterized in that it comprises a separating pin operating body for lifting the separating pin. The method of claim 5, The separation pin is formed in a tubular shape in which the hollow is formed, connected to the adsorption unit to form a vacuum pressure, the fine pattern forming apparatus, characterized in that for supporting the stamp by the vacuum pressure provided to the adsorption unit. The method of claim 1, The stamp stage is provided with a transparent stage transparent window made of a transparent quartz material so that the light is illuminated in the UV light control unit, the transparent light for attaching the stamp at the same time as the light illuminated in the UV light control unit passes through the lower surface of the stage Fine pattern forming apparatus characterized in that the stamp chuck of the polyimide type of the state is provided. The method of claim 1, wherein the lower chamber is Located in the lower side of the upper chamber is fixed to the base and the lower chamber body of the rectangular box shape, the upper side is embedded; A substrate stage provided in the recess of the lower chamber body; And a substrate lifting device for elevating the substrate seated on the substrate stage. The method of claim 8, wherein the substrate lifting device A plurality of lifting pins provided through the lower chamber body; Fine pattern forming apparatus characterized in that it is provided on the outside of the lower chamber body to have a lifting pin operating body for lifting a plurality of lifting pins. According to claim 8, wherein the position adjusting device And a plurality of transfer units provided between the lower chamber and the base and moving the substrate stage in X, Y, and Z directions and rotating about each axis. The method of claim 1, The spacing device further comprises a load cell for detecting a load applied to the stamp stage is elevated by the fine lifting device. The method of claim 1, wherein the lifter An elevating device providing power for supporting and elevating the upper chamber with respect to the lower chamber; And a lifting shaft which is lifted by the lifting device and supports the upper chamber. The method of claim 1, wherein the exhaust device An exhaust pipe passing through the lower chamber and communicating with the process space; And a vacuum pump connected to the exhaust pipe to provide a vacuum pressure for forming a vacuum pressure in the process space. delete Supplying a substrate coated with a stamp and a pattern forming layer, and attaching the supplied stamp and substrate to the upper chamber and the lower chamber, respectively; An environment forming step of forming a process space through the upper chamber and the lower chamber and exhausting the process space to form a process environment; An alignment step of controlling an alignment state by reading an alignment state of the stamp and the substrate; A gap adjusting step of adjusting the gap between the substrate and the stamp by lowering the stamp; Bonding step to contact the stamp and the substrate by its own weight, A curing step of curing the pattern forming layer by irradiating UV-bonding the bonded stamp and the substrate; Separating the stamp and the substrate from the upper chamber, and carrying out the separated stamp and the substrate; The method of forming a fine pattern, characterized in that the gap between the stamp and the substrate in the environment forming step is 2 ~ 4mm. Supplying a substrate coated with a stamp and a pattern forming layer, and attaching the supplied stamp and substrate to the upper chamber and the lower chamber, respectively; An environment forming step of forming a process space through the upper chamber and the lower chamber and exhausting the process space to form a process environment; An alignment step of controlling an alignment state by reading an alignment state of the stamp and the substrate; A gap adjusting step of adjusting the gap between the substrate and the stamp by lowering the stamp; Bonding step to contact the stamp and the substrate by its own weight, A curing step of curing the pattern forming layer by irradiating UV-bonding the bonded stamp and the substrate; Separating the stamp and the substrate from the upper chamber, and carrying out the separated stamp and the substrate; The alignment step of forming a fine pattern, characterized in that for performing the alignment by maintaining the distance between the stamp and the substrate 5 ~ 15㎛. Supplying a substrate coated with a stamp and a pattern forming layer, and attaching the supplied stamp and substrate to the upper chamber and the lower chamber, respectively; An environment forming step of forming a process space through the upper chamber and the lower chamber and exhausting the process space to form a process environment; An alignment step of controlling an alignment state by reading an alignment state of the stamp and the substrate; A gap adjusting step of adjusting the gap between the substrate and the stamp by lowering the stamp; Bonding step to contact the stamp and the substrate by its own weight, A curing step of curing the pattern forming layer by irradiating UV-bonding the bonded stamp and the substrate; Separating the stamp and the substrate from the upper chamber, and carrying out the separated stamp and the substrate; The joining step includes a sensing step of detecting a load of the stamp lowered by its own weight in a load cell, and a displacement amount adjusting step of adjusting a displacement amount of the stamp based on the load amount detected by the load cell. Formation method. Supplying a substrate coated with a stamp and a pattern forming layer, and attaching the supplied stamp and substrate to the upper chamber and the lower chamber, respectively; An environment forming step of forming a process space through the upper chamber and the lower chamber and exhausting the process space to form a process environment; An alignment step of controlling an alignment state by reading an alignment state of the stamp and the substrate; A gap adjusting step of adjusting the gap between the substrate and the stamp by lowering the stamp; Bonding step to contact the stamp and the substrate by its own weight, A curing step of curing the pattern forming layer by irradiating UV-bonding the bonded stamp and the substrate; Separating the stamp and the substrate from the upper chamber, and carrying out the separated stamp and the substrate; The carrying out step is fine pattern forming method characterized in that for dropping the stamp and the substrate by maintaining a drop interval of 10 ~ 30㎛ with respect to the lower surface of the substrate bonded to the stamp.

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