KR102365528B1 - Apparatus for attaching substrates and method for attaching the substrates - Google Patents

Abstract

A substrate bonding apparatus according to an embodiment of the present invention includes an upper table having an upper support surface on which an upper substrate is supported in contact, a lower table having a lower support surface on which a lower substrate is supported in contact with a position facing the upper support surface, and a lower table. A plurality of lower support members installed to be connected to the lower table to support different regions, and a lower driving unit having a plurality of lower actuators respectively connected to the plurality of lower support members and capable of rising and lowering individually, the lower driving unit comprising: By operating to raise the lower table, the upper table and the lower table are positioned close to each other.
Therefore, according to the substrate bonding apparatus according to the embodiment of the present invention, it is possible to uniformly pressurize the upper substrate and the lower substrate, and it is possible to prevent adhesion failure due to non-uniform pressurization.

Description

Substrate bonding apparatus and substrate bonding method

The present invention relates to a substrate bonding apparatus and a substrate bonding method, and more particularly, to a substrate bonding apparatus and a substrate bonding method capable of improving bonding quality between an upper substrate and a lower substrate.

In flat panel display devices such as an organic light emitting display device and a liquid crystal display device, a bonding process between an upper substrate and a lower substrate is usually accompanied. A substrate bonding apparatus for performing a bonding process of upper and lower substrates is installed in a chamber, the upper substrate is supported on the lower side, installed in the chamber, an upper table that can be raised and lowered, and is installed on the lower side of the upper table in the chamber, and the lower substrate is provided on the upper surface It includes a supported lower table.

On the other hand, if the upper table and the lower table are not parallel to each other, or if the lower surface of the upper table on which the upper substrate is supported and the upper surface of the lower table on which the lower substrate is supported are not parallel to each other, adhesion failure due to non-uniform pressing force may occur. can occur. Accordingly, the spacing between the upper substrate and the lower substrate varies depending on the position, or a portion of the region between the upper substrate and the lower substrate is subjected to more pressure than necessary, or a necessary amount of pressure is not applied. This happens.

In addition, since the bonding process is performed without recognizing the non-parallel state between the upper table and the lower table, there is a problem in that the cost increases due to the occurrence of product defects and the operation efficiency of the device decreases.

Korean registered patent KR1378072

The present invention provides a substrate bonding apparatus and a substrate bonding method capable of bonding an upper substrate and a lower substrate in a parallel state.

The present invention provides a substrate bonding method and a substrate bonding method capable of bonding an upper substrate and a lower substrate by using a uniform pressing force.

A substrate bonding apparatus according to an embodiment of the present invention includes: an upper table having an upper support surface on which an upper substrate is supported in contact; a lower table having a lower support surface on which a lower substrate is supported in contact with the lower table at a position facing the upper support surface; and a plurality of lower support members installed to be connected to the lower table to support different regions of the lower table, and a lower driving unit having a plurality of lower actuators respectively connected to the plurality of lower support members to be able to move up and down individually. ; and by operating the lower driving unit to raise the lower table, the upper table and the lower table are positioned adjacent to each other.

The plurality of lower support members are installed to support different edge regions under the lower table.

a plurality of load cells mounted on each of the plurality of lower support members to measure a load of each of the plurality of lower support members supporting the lower table; and a lower control unit configured to raise and lower each of the plurality of lower actuators by using a difference between a plurality of load values measured from the plurality of load cells.

The lower driving unit may include: a lower support provided in a plate shape and installed to face the lower table, the plurality of lower support members mounted on the upper portion, and the plurality of lower actuators mounted on the lower portion; and a plurality of lower driving sources respectively connected to the plurality of lower actuators to elevate each of the plurality of lower actuators, wherein the lower support is provided according to the elevating operation of each of the plurality of lower actuators. The inclination is adjusted.

The plurality of lower support members includes an upper shaft and a lower shaft arranged vertically, and the load cell is installed between the upper shaft and the lower shaft.

The lower control unit, by using a difference between a plurality of load values measured from the plurality of load cells, a support surface monitoring unit for determining the arrangement state including whether the parallelism between the upper support surface and the lower support surface as normal or abnormal ; and a driving control unit respectively connected to the plurality of lower driving sources to control the operation of each of the plurality of lower driving sources according to a determination result of the support surface monitoring unit.

It is installed on at least one of the upper table and the lower table, and includes an arrangement state measuring unit that measures the arrangement state including whether the upper table and the lower table are parallel to each other.

The arrangement state measuring unit may include: a plurality of pressing members installed at different positions on the outer surface of the upper table; and a plurality of displacement sensors installed on the outer surface of the lower table to face each of the plurality of pressing members, at least one of a length and a shape deformable by an external force, and capable of measuring a displacement amount;

The lower control unit includes a table monitoring unit that determines an arrangement state including whether parallelism between the upper table and the lower table as normal or abnormal by using a difference between the displacement amounts measured by each of the plurality of displacement sensors.

The arrangement state measuring unit includes a plurality of distance sensors installed at different positions to respectively measure a distance between the upper support surface and the lower support surface, and the lower control unit includes a distance value measured by each of the plurality of distance sensors and a table monitoring unit that determines whether an arrangement state including parallelism between the upper table and the lower table is normal or abnormal by using the difference between the two tables.

a chamber unit in which the upper table and the lower table are accommodated, wherein the chamber unit includes: an upper chamber in which the upper table is fixedly installed; and a lower chamber installed to face the lower side of the upper chamber, wherein the upper table elevates and lowers together with the upper chamber.

an imaging unit positioned below the lower table to capture an image image of a lower alignment mark formed on the lower substrate; It is connected to the lower table to check the position of the lower alignment mark obtained by the imaging unit and the previously stored position of the upper alignment mark of the upper substrate to align the lower alignment mark and the upper alignment mark, It includes; a horizontal moving unit for horizontally moving the table.

The horizontal moving unit is connected to the lower driving unit to horizontally move the lower driving unit.

Each of which is installed to pass through the upper table in an up-down direction and can be raised and lowered, and includes a plurality of adhesive pins provided with an adhesive sheet at a tip facing the lower table.

The upper table may include: an upper body having the upper support surface; and a plurality of suction ports provided on the upper body so as to be exposed to the upper support surface, respectively, and arranged in an extension direction of the upper support surface to be spaced apart from each other; It includes a plurality of through-holes installed to penetrate the upper body in the vertical direction and into which the plurality of adhesive pins are respectively inserted and installed, and is connected to the plurality of suction ports to convert the pressure in the plurality of suction ports into vacuum pressure. It includes an upper suction drive for adjusting.

The adhesive pin includes a suction pipe provided to penetrate the pressure-sensitive adhesive sheet up and down, and is connected to the suction pipe, and includes an adhesive pin suction driving unit for adjusting the pressure of the suction pipe to a vacuum pressure.

A substrate bonding method according to an embodiment of the present invention includes the steps of adjusting a height of at least one edge region of a lower table having a lower support surface on which a lower substrate is supported to adjust the inclination of the lower support surface; and narrowing a gap between the upper table and the lower table having an upper support surface supporting the upper substrate by raising the lower table.

and bonding the upper substrate and the lower substrate after narrowing the gap between the upper table and the lower table. The upper substrate and the lower substrate are bonded together by pressing with the substrate, or the upper substrate supported on the upper support surface is dropped onto the lower substrate to bond.

The process of adjusting the inclination of the lower support surface may include: determining an arrangement state including whether parallel between the upper support surface and the lower support surface as normal or abnormal; and adjusting the inclination of the lower support surface by adjusting the height of at least one edge area of the lower table to become normal when the arrangement state between the upper support surface and the lower support surface is determined to be abnormal. and, when it is determined that the arrangement state between the upper and lower support surfaces is normal, the upper substrate and the lower substrate are bonded together.

The process of determining the arrangement state between the upper support surface and the lower support surface as normal or abnormal may include: raising the lower table to bring at least a portion of the lower substrate into contact with the upper substrate; measuring a load in each of a plurality of load cells installed at different positions under the lower table; calculating a load difference between a minimum load value and a maximum load value among load values measured from each of the plurality of load cells; Comparing the calculated load difference with a preset load reference range, determining the arrangement state between the upper support surface and the lower support surface as normal or abnormal; including, wherein the calculated load difference is within the load reference range If included, it is determined that the arrangement state between the upper support surface and the lower support surface is normal, and when the calculated load difference is out of the load reference range, the arrangement state between the upper support surface and the lower support surface is determined to be abnormal do.

When it is determined that the arrangement state between the upper support surface and the lower support surface is abnormal, in adjusting the inclination of the lower support surface, a relatively low load value of the plurality of measured load values faces the measured load cell Raise the height of the lower table part, or lower the height of the lower table part facing the load cell where a relatively high load value is measured.

a process of supporting the upper substrate on the upper support surface and before supporting the lower substrate on the lower support surface, and determining an arrangement state including whether the upper table and the lower table are parallel to each other as normal or abnormal; and when it is determined that the arrangement state between the upper table and the lower table is abnormal, the height of the edge area of at least one of the upper table and the lower table is adjusted so as to be normal, so that the inclination of at least one of the upper table and the lower table is adjusted. The process of regulating; includes.

In the process of determining the arrangement state between the upper table and the lower table as normal or abnormal, the distance between the upper table and the lower table is narrowed so that at least a portion of the upper support surface and the lower support surface come into contact with each other, measuring displacement amounts of a plurality of displacement sensors installed at different positions on the outer surface; calculating a displacement difference between a minimum displacement amount and a maximum displacement amount among displacement amounts measured by each of the plurality of displacement sensors; Comparing the calculated displacement amount difference with a preset displacement amount reference range, determining whether the arrangement state between the upper table and the lower table is normal or abnormal; includes, wherein the calculated displacement amount difference is included in the displacement reference range In this case, it is determined that the arrangement state between the upper table and the lower table is normal, and when the calculated difference in the amount of displacement is out of the reference range of the amount of displacement, the arrangement state between the upper table and the lower table is determined to be abnormal.

The process of determining the arrangement state between the upper table and the lower table as normal or abnormal may include: measuring distances between the upper and lower support surfaces at different positions to measure a plurality of distance values; calculating a distance difference between a minimum distance value and a maximum distance value among a plurality of distance values; Comparing the calculated distance difference with a preset distance reference range, determining whether the arrangement state between the upper table and the lower table is normal or abnormal;

When the calculated distance difference is within the distance reference range, it is determined that the arrangement state between the upper table and the lower table is normal, and when the calculated distance difference is out of the distance reference range, the upper table and the lower table The disposition of the liver is judged to be abnormal.

Each of the upper table and the lower table is installed inside a chamber part having a divided upper chamber and a lower chamber, and the upper table is fixedly installed in the upper chamber, elevates and lowers together with the upper chamber, and the upper table and the upper table In narrowing the gap between the lower tables, the upper table maintains its height.

In supporting the upper substrate on the upper support surface of the upper table, the upper substrate is supported by adhesive force using a plurality of adhesive pins including the adhesive sheet exposed to the upper support surface, and the lower table is raised, after the process of pressing the lower substrate to the upper substrate, lifting the plurality of adhesive pins to press the upper substrate to the support surface, thereby separating the plurality of adhesive pins from the upper substrate; .

According to the substrate bonding apparatus according to the embodiment of the present invention, the lower table is horizontally moved to align the upper substrate and the lower substrate, and the lower table is moved upward to press the lower substrate to the upper substrate to be bonded. Accordingly, the occurrence of an alignment error between the upper substrate and the lower substrate may be minimized or prevented, and the bonding process may be stably performed.

In addition, before pressing the upper substrate and the lower substrate, the arrangement state between the upper support surface and the lower support surface is checked, and the arrangement state of the upper support surface and the lower support surface is adjusted to be parallel or normal. Accordingly, it is possible to uniformly pressurize between the upper substrate and the lower substrate, and to prevent adhesion failure due to non-uniform pressurization.

Then, after each of the upper table and the lower table is installed inside the chamber part or before the bonding process, the arrangement state between the upper table and the lower table is checked, and the arrangement state is adjusted so that the arrangement state is parallel or normal. Accordingly, it is possible to uniformly pressurize between the upper substrate and the lower substrate, and it is possible to prevent adhesion failure due to non-uniform pressurization. In addition, since the bonding process is not performed in a state in which the upper table and the lower table are abnormally arranged, it is possible to reduce the occurrence of product defects and thereby reduce the cost.

1 and 2 are views showing a substrate bonding apparatus according to an embodiment of the present invention.
3 is a cross-sectional view specifically illustrating an upper table and a plurality of adhesive pins according to an embodiment of the present invention.
4 is a view conceptually showing a state viewed from the upper side of the upper table in order to explain the arrangement of the pressing member of the arrangement state measuring unit according to an embodiment of the present invention.
5 is conceptually a view from the upper side of the lower table to explain the arrangement or connection relationship of the displacement sensor, the plurality of load cells, the plurality of lower support members, and the plurality of lower driving sources of the arrangement state measuring unit according to the embodiment of the present invention; the drawing shown.
6 is an enlarged view conceptually illustrating a state in which the upper table and the lower table are not parallel to each other when the upper table and the lower table are mounted inside the chamber.
7 to 9 are views for explaining a method of controlling the operation of the lower driving unit by the arrangement state measuring unit and the lower control unit according to an embodiment of the present invention.
10 is an enlarged view conceptually illustrating a state in which an upper support surface and a lower support surface are not parallel.
11 and 12 are diagrams for explaining a method of controlling an operation of a lower driving unit by a plurality of load cells and a lower control unit according to an embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, only these embodiments allow the disclosure of the present invention to be complete, and the scope of the invention to those of ordinary skill in the art completely It is provided to inform you. The drawings may be exaggerated to describe the embodiments of the present invention, and like reference numerals in the drawings refer to like elements.

1 and 2 are views showing a substrate bonding apparatus according to an embodiment of the present invention. Here, FIG. 1 shows a state before sealing in which an upper chamber and a lower chamber are separated, and FIG. 2 shows a sealed state. 3 is a cross-sectional view specifically illustrating an upper table and a plurality of adhesive pins according to an embodiment of the present invention.

4 is a view conceptually showing a state viewed from the upper side of the upper table in order to explain the arrangement of the pressing member of the arrangement state measuring unit according to an embodiment of the present invention. 5 is conceptually a view from the upper side of the lower table to explain the arrangement or connection relationship of the displacement sensor, the plurality of load cells, the plurality of lower support members, and the plurality of lower driving sources of the arrangement state measuring unit according to the embodiment of the present invention; the drawing shown.

A substrate bonding apparatus according to an embodiment of the present invention is a substrate bonding apparatus for bonding or bonding an upper substrate S1 and a lower substrate S2 to each other. Here, the upper substrate S1 and the lower substrate S2 may be substrates for manufacturing a display device, for example, an organic light emitting display device.

In addition, at least one of the upper substrate S1 and the lower substrate S2 may be in a state in which a sealant, which is a bonding material, is applied. More specifically, the sealant may be applied to at least one edge of one surface of the upper substrate S1 and one surface of the lower substrate S2 facing each other during bonding. In addition, the filler may be applied to any one of the upper substrate S1 and the lower substrate S2 . At this time, the filler is applied so as to be located inside the sealant applied to the edge. In addition, at least alignment marks are formed on each of the upper substrate S1 and the lower substrate S2 . This alignment mark is a mark for alignment between the upper substrate S1 and the lower substrate S2.

Hereinafter, a substrate bonding apparatus according to an embodiment of the present invention will be described with reference to FIGS. 1 to 5 .

1 to 3 , the substrate bonding apparatus has an internal space capable of bonding an upper substrate S1 and a lower substrate S2 to each other, and a chamber including an upper chamber 1110 and a lower chamber 1120 . The unit 1100, the upper table 2100 disposed inside the chamber unit 1100 and having one surface (hereinafter referred to as the upper support surface) on which the upper substrate S1 is supported, and the upper table 2100 in the chamber unit 1100 . The lower table 4100 is installed to face the upper support surface 2100a and has one surface (hereinafter, the lower support surface 4100a) on which the lower substrate S2 is supported at a position facing the upper support surface 2100a, each of which is upper and lower in the vertical direction. It is installed to pass through the table 2100 and can be raised and lowered, and a plurality of adhesive pins 2200 having an adhesive sheet 2320 provided at the tip facing the lower table 4100 and the lower table 4100 are supported, and the lower table is supported. The lower driving unit 4200 for raising and lowering the 4100, the arrangement state measuring unit 3000 for measuring a value capable of determining the arrangement state between the upper table 2100 and the lower table 4100, and the upper table 2100 and load cells 6000 (6000a to 6000d) for measuring a value capable of determining the arrangement state between the upper support surface 2100a and the lower support surface 4100a of the lower table 4100.

In addition, the substrate bonding apparatus includes an arrangement state measuring unit 3000 and a lower control unit 5000 for controlling the operation of the lower driving unit 4200 according to a value measured from the load cell 6000 .

In addition, the substrate bonding apparatus includes a pressure driving control unit (not shown) for controlling the pressure of the chamber unit 1100, an upper driving unit 1200 connected to the upper chamber 1110 to raise and lowering the upper chamber 1110, and an upper table ( 2100) a suction driving unit (hereinafter referred to as the upper suction driving unit 2200) that operates to provide a suction force, an adhesive pin operation unit 2400 for raising and lowering the plurality of adhesive pins 2200, and the adhesive pin 2200. A suction driving unit (hereinafter, adhesive pin suction driving unit 2500) that operates to provide, a horizontal moving unit 4300 that moves the lower table 4100 in a horizontal direction for alignment between the upper substrate S1 and the lower substrate S2 and an imaging unit 4400 positioned below the lower table 4100 to image the alignment mark provided on the lower substrate S2.

The chamber unit 1100 has an internal space in which a process for bonding the upper substrate S1 and the lower substrate S2 to each other can be performed. The chamber unit 1100 is mutually coupled and detachable, and includes an upper chamber 1110 and a lower chamber 1120 each having an internal space. In addition, a pressure adjusting unit for adjusting the pressure inside the chamber unit 1100 is connected to at least one of the upper chamber 1110 and the lower chamber 1120 . The pressure control unit may be configured to include a pump and a pipe connecting the chamber unit and the pump.

The upper table 2100 is installed to face the lower table 4100 inside the chamber unit 1100 . In this case, the upper table 2100 may be fixedly installed in the upper chamber 1110 . For example, a fixing member 1111 may be installed to connect the upper chamber 1110 and the upper table 2100 . Accordingly, the upper table may be raised and lowered together during the raising/lowering operation of the upper chamber 1110 . In addition, each of the fixing member 1111 and the upper table 2100 is provided to be coupled to and separated from the upper chamber 1110 .

The upper table 2100 includes a surface on which the upper substrate S1 is supported on a surface facing the lower table 4100, that is, an upper body 2110 having an upper support surface 2100a, and an upper support surface 2100a, respectively. A plurality of suction ports 2130 provided in the upper body 2110 to be exposed, a plurality of suction ports 2130 generating a suction force, installed to penetrate the upper body 2110 in the vertical direction, and a plurality of adhesive pins 2200 respectively inserted and installed of the through hole 2120 . In addition, the upper table 2100 may include a first connection pipe 2140 provided in the upper body 2110 to connect the plurality of suction ports 2130 .

The upper body 2110 is a means for supporting the upper substrate S1 , and is preferably provided in a shape corresponding to the shape of the upper substrate S1 , and may be provided, for example, in a rectangular plate shape. More specifically, as shown in FIG. 4 , the upper body 2110 each extends in the X direction (length direction), and first and The second sides 2111 and 2112, each extending in the Y direction (width direction), may have a rectangular shape including third and fourth sides 2113 and 2114 facing in the X direction (length direction). .

The upper body 2110 is installed on the upper side of the lower table 4100 to face the lower table 4100, and the lower surface of the upper body 2110 facing the lower table 4100 is the upper substrate S1. It is an upper support surface 2100a that is supported in contact.

The through hole 2120 is a means for providing a passage through which the adhesive pin 2200 can be moved up and down in a state in which the adhesive pin 2200 is inserted, and is provided to penetrate the upper body 2110 in the vertical direction. More specifically, the through hole 2120 is formed so that both the upper support surface 2100a (lower surface) of the upper body 2110 and the upper surface opposite to the upper support surface 2100a are open to the upper body 2110. It can be provided by penetrating in the up-down direction. These through-holes 2120 are provided in the same number as or corresponding to the plurality of adhesive pins 2200 so that each of the plurality of adhesive pins 2200 can be inserted thereinto. In addition, the plurality of through-holes 2120 may be provided to be spaced apart from each other so as to be distributed over the entire upper support surface 2100a.

The suction port 2130 is a means for supporting the upper substrate S1 by means of a suction force, and is provided such that an end facing the upper support surface 2100a is exposed to the upper support surface 2100a. The suction ports 2130 are provided in plurality, and may be provided to be spaced apart from each other so as to be distributed over the entire upper support surface 2100a. In addition, the through holes 2120 and the suction ports 2130 are to be alternately disposed. can

The first connection pipe 2140 may be provided in the upper body 2110 to communicate with the plurality of suction ports 2130 , and the first connection pipe 2140 is connected to the upper suction driving unit 2200 .

The upper suction driving unit 2200 may include a pump 2210 and a connection line 2220 connected to the first connection pipe. Accordingly, when the pump 2210 of the upper suction driving unit is operated to adjust the connection line 2220 and the first connection pipe 2140 to vacuum pressure, the plurality of suction ports 2130 connected to the first connection pipe 2140 is is the vacuum pressure. Accordingly, a vacuum suction force is generated in the plurality of suction ports 2130 , and accordingly, the upper substrate S1 is adsorbed and supported by the upper support surface 2100a by the vacuum suction force of the plurality of suction ports 2130 .

A member having an elastic force (hereinafter, an elastic member (not shown)) may be installed on a lower surface of the upper body 2110 facing the lower table 4100 . In addition, the upper substrate S1 may be supported in contact with a lower surface of the elastic member facing the lower table 4100 . The elastic member is a means for absorbing or buffering an impact applied to the upper substrate S1 when separating the upper substrate S1 from the plurality of adhesive pins 2200, and may be made of an inorganic material, for example, including silicon. It may be a rubber (rubber) made of a material.

When the elastic member is installed on the lower surface of the upper body 2110, the lower surface of the elastic member may be defined as the upper support surface 2100a on which the upper substrate S1 is supported. In this case, the plurality of suction ports 2130 are provided to be exposed to the lower surface of the elastic member. In addition, the plurality of through-holes 2120 may be installed to penetrate not only the upper body but also the elastic member in the vertical direction.

The adhesive pin 2200 is a means for supporting the upper substrate S1 by adhesive force, and is inserted and installed in the through hole 2120 provided in the upper table 2100 . The adhesive pin 2200 has at least a pin member 2310 having a lower portion inserted and installed into the through hole 2120, a suction pipe 2330 provided inside the pin member 2310, an upper support surface 2100a, or a lower table ( At the tip of the pin member 2310 facing 4100, it is mounted around the suction pipe 2330, and includes an adhesive sheet 2320 having an adhesive force.

The pin member 2310 may have a shape extending in the vertical direction, and the length in the vertical direction may be longer than that of the through hole 2120 . In addition, at least an upper end of the pin member 2310 may be installed to protrude upward of the upper table 2100 .

The adhesive sheet 2320 is a means having a sticky characteristic, and may be provided in the form of a sheet and mounted on the tip of the pin member 2310 .

The suction pipe 2330 is provided in each of the inside of the pin member 2310 and the adhesive sheet 2320 . In addition, the suction pipe 2330 provided in the pin member 2310 and the suction pipe 2330 provided in the pressure-sensitive adhesive sheet 2320 communicate with each other. In other words, the suction pipe 2330 is provided to penetrate the inside of the pin member 2310 and the pressure-sensitive adhesive sheet in the vertical direction. Accordingly, the pressure-sensitive adhesive sheet 2320 may be described as being installed around or around the suction pipe 2330 at the tip of the pin member 2310 .

The adhesive pins 2200 are provided in plurality, and are installed to be inserted into each of the plurality of through holes 2120 provided in the upper table 2100 . At this time, since the through-holes 2120 and the suction ports 2130 are provided to be alternately arranged, the adhesive pins 2200 and the suction ports 2130 are alternately arranged.

The adhesive pin operation unit 2400 is a device for raising and lowering the plurality of adhesive pins 2200, and includes an adhesive pin support 2410 on which the plurality of adhesive pins 2200 are supported, and a driving body connected to the adhesive pin support 2410 ( Hereinafter, it includes an adhesive pin driving body 2420) and a driving source (hereinafter, an adhesive pin driving source 2430) that provides elevating power to the adhesive pin driving body 2420 .

The adhesive pin support 2410 connects between the plurality of adhesive pins 2200 and the adhesive pin driving body 2420 , and transmits the lifting/lowering driving force of the adhesive pin driving source 2430 to the plurality of adhesive pins 2200 . The adhesive pin support 2410 may have a plate shape extending in the arranging direction of the plurality of adhesive pins 2200 , and may be located above the upper table 2100 in the upper chamber 1110 . In addition, a second connection pipe 2411 communicating with the suction pipes 2330 provided in each of the plurality of adhesive pins 2200 is provided inside the adhesive pin support 2410 .

The adhesive pin driving source 2430 is a means for providing elevating/lowering power to the adhesive pin driving body 2420 , and may be, for example, a means including a motor. Of course, the adhesive pin driving source 2430 is not limited to means including a motor, and various means capable of elevating the adhesive pin driving body 2420 may be applied.

The adhesive pin driving body 2420 connects the adhesive pin support 2410 and the adhesive pin driving source 2430 to transmit the lifting/lowering power provided from the adhesive pin driving source 2430 to the adhesive pin support 2410 . More specifically, the adhesive pin driving body 2420 may be a means for raising and lowering its height by extension and contraction by the operation of the adhesive pin driving source 2430, or for raising and lowering its height without extension and contraction. . A part of the adhesive pin driving body 2420 may be located inside the upper chamber to be connected to the adhesive pin support, and the rest may be located outside the upper chamber to be connected to the adhesive pin driving source.

The adhesive pin suction driving unit 2500 may include a pump 2510 and a connection line 2520 connected to the second connection pipe. Accordingly, when the pump 2510 of the adhesive pin suction driving unit 2500 is operated to adjust the connection line 2520 and the second connection pipe 2411 to vacuum pressure, a plurality of suction pipes connected to the second connection pipe 2411 (2330) is the vacuum pressure. Accordingly, a vacuum suction force is generated in the plurality of suction pipes 2330 , and thus the upper substrate S1 is adsorbed and supported by the adhesive pin 2200 by the vacuum suction force.

The upper driving unit 1200 is a means for elevating the upper chamber 1110, and is installed to connect a driving source (hereinafter referred to as an upper driving source 1220) providing an elevating driving force and the upper chamber 1110 and the upper driving source 1220. and a driving body (hereinafter, an upper driving body 1210). The upper driving source 1220 may be, for example, a means including a motor, and the upper driving body 1210 expands and contracts according to the operation of the upper driving source 1220 so that its height rises and falls, or its height without extension or contraction may be a means for ascending and descending. The upper driving source 1220 is not limited to means including a motor, and various means capable of elevating the upper driving body 1210 may be applied.

The lower table 4100 includes a lower body 4110 having a surface on which the lower substrate S2 is seated and supported on a surface facing the upper table 2100 , that is, a lower support surface 4100a . The lower body 4110 is preferably provided in a shape corresponding to the shape of the lower substrate S2, and may be provided, for example, in a rectangular plate shape.

More specifically, as shown in FIG. 5 , the lower body 4110 extends in the X direction (length direction), and faces the first and the The second sides 4111 and 4112, each extending in the Y direction (width direction), may have a rectangular shape including third and fourth sides 4113 and 4114 facing in the X direction (length direction). . The lower body 4110 is installed on the lower side of the upper table 2100 to face the upper table 2100, and the upper surface of the lower body 4110 facing the upper table 2100 is the lower substrate S2. It is the lower support surface 4100a that is supported in contact.

Also, the lower table 4100 may be a means for supporting the lower substrate S2 by adhesive force. To this end, an adhesive member 4120 having an adhesive force may be installed on the lower body 4110 . More specifically, the adhesive member 4120 may be installed on the upper surface of the lower body 4110 . In addition, a plurality of adhesive members 4120 may be provided and spaced apart so as to be uniformly distributed over the entire upper surface of the lower body 4110 . In this case, a portion of the lower surface of the lower substrate S2 is supported by contact with the adhesive member 4120 , and the rest is supported by contact with the upper surface of the lower body 4110 on which the adhesive member 4120 is not installed.

In this way, when the plurality of adhesive members 4120 are installed on the upper surface of the lower body 4110 , the upper surface of the adhesive member 4120 facing the upper table 2100 and the adhesive member 4120 are exposed without being installed. The upper surface of the lower body 4110 may be defined as a lower support surface 4100a on which the lower substrate S2 is seated and supported.

In the above description, it has been described that a plurality of adhesive members 4120 are provided and installed to be spaced apart from each other on the upper surface of the lower body 4110 . However, the present invention is not limited thereto, and the adhesive member 4120 may be provided with the same area as the upper surface of the lower body 4110 , and the adhesive member 4120 may be installed on the upper surface of the lower body 4110 . In this case, the entire upper surface of the adhesive member 4120 facing the upper table 2100 may be defined as the lower support surface 4100a.

The lower driver 4200 is a means for adjusting the height of the upper substrate S1 and the lower substrate S2 of the lower table 4100 . The lower driving unit 4200 according to the embodiment is provided to adjust the height of the lower table 4100 for each position. For example, the lower driving unit 4200 is provided to adjust the heights of different edge regions on the lower support surface 4100a of the lower table 4100 . In a more specific example, when the lower table 4100 has a quadrangular shape, the height of each of the four vertices can be adjusted on the lower support surface of the lower table 4100 .

The lower driving unit 4200 includes a plurality of lower support members 4210 (4210a to 4210d) installed to support different regions of the lower surface of the lower table 4100, and a lower support for supporting the plurality of lower support members 4210 ( 4210 ). 4220), a plurality of lower actuators 4230 (4230a to 4230d) and a plurality of lower actuators 4230 installed under the lower support 4220 so as to face the plurality of lower support members 4210, respectively. It includes a plurality of lower driving sources (4240: 4240a to 4240d) for providing elevating power.

The lower support member 4210 is installed below the lower table 4100 to support the lower table 4100 . In addition, a plurality of lower support members 4210 are provided to support different positions of the lower surface of the lower table 4100 , and are installed to support different edge regions.

For example, when the lower table 4100 has a rectangular shape, four lower support members (hereinafter, first to fourth lower support members 4210a to 4210d) are provided as shown in FIG. 5 . In addition, lower support members 4210a to 4210d are installed at positions adjacent to the four vertices on the lower surface of the lower table 4100 . Accordingly, when the heights of the first to fourth lower support members 4210a to 4210d are individually adjusted, an area of the lower support surface 4100a facing each of the first to fourth lower support members 4210a to 4210d height is individually adjusted.

Each of the plurality of lower support members 4210 may be configured to include an upper shaft 4211 and a lower shaft 4212 divided in the vertical direction. In addition, load cells (6000: 6000a to 6000d) to be described later may be installed between the upper shaft 4211 and the lower shaft 4212 .

The lower support 4220 is positioned between the plurality of lower support members 4210 and the plurality of lower actuators 4230 . That is, the plurality of lower support members 4210 are supported on the upper portion of the lower support 4220 , and the plurality of lower driving bodies 4230 are installed on the lower portion of the lower support 4220 .

The lower actuators 4230 ( 4230a to 4230d ) are provided in the same number as the lower support members 4210 , and are installed under the lower support 4220 . In addition, the lower driving body 4230 is installed at a position facing the lower support member 4210 under the lower support 4220 . That is, the first lower driving body 4230a is installed at a position facing the first lower support member 4210a under the lower support 4220 , and the second lower driving body 4230a is installed at a position facing the second lower support member 4210b . The lower driving body 4230b is installed, the third lower driving body 4230c is installed at a position facing the third lower supporting member 4210c, and the fourth lower driving body 4230c is installed at a position facing the fourth lower supporting member 4210d. A lower driving body 4230d may be installed. Each of the first to fourth lower actuators 4230a to 4230d is expanded and contracted according to the operation of the lower driving source 4240: 4240a to 4240d to raise and lower its height or increase its height without extension or contraction. and means for descending.

The lower driving sources 4240: 4240a to 4240d are means for providing elevating/lowering power to the lower actuator 4230, and are identical to the plurality of lower actuators 4230 to individually control each of the plurality of lower actuators 4230. It is provided in number and is respectively connected to the plurality of lower actuators 4230 . That is, the first to fourth lower driving sources 4240a to 4240d are provided to be respectively connected to the first to fourth lower driving bodies 4230a to 4230d. These lower driving sources 4240a to 4240d may be means including a motor, and of course not limited thereto, and various means capable of elevating and lowering the lower driving body may be applied.

According to the lower driving unit 4200 as described above, the plurality of lower driving bodies 4230 are raised or lowered by the operation of the plurality of lower driving sources 4240 . And due to this, the lower support 4220 and the plurality of lower support members 4210 are raised or lowered. In this way, the lower support 4220 elevates or changes in inclination by the elevating operation of the plurality of lower actuators 4230 . In addition, the plurality of lower support members 4210 supported on the upper portion of the lower support 4220 are raised or lowered without changing their lengths.

The imaging unit 4400 is a means for imaging the alignment mark formed on the lower substrate S2 , and may be located below the lower table 4100 . The imaging unit 4400 may be a means including a camera.

The horizontal moving unit 4300 analyzes the image image captured by the imaging unit 4400 and horizontally moves the lower driving unit 4200 in at least one of XY and θ directions, the upper substrate S1 and the lower substrate S2 . ) is a means of sorting. The position of the alignment mark (hereinafter, referred to as the upper alignment mark) provided on the upper substrate S1 is stored in the horizontal moving unit 4300 .

And, when an image image obtained by capturing an alignment mark (hereinafter, referred to as a lower alignment mark) of the lower substrate is transferred from the imaging unit 4400 , the horizontal moving unit 4300 moves the lower alignment mark of the upper alignment mark in which the position is stored in advance. The lower driving unit 4200 is horizontally moved in at least one direction of XY and θ to overlap the position. Accordingly, the lower table 4100 is horizontally moved in at least one of X Y and θ.

In this way, while the lower table 4100 is horizontal in at least one direction of X Y and θ, the imaging unit 4400 images the lower alignment mark in real time, and transmits it to the horizontal moving unit 4300 . Then, the horizontal moving unit 4300 analyzes the transmitted image image to horizontally move the lower driving unit 4200 in real time.

In the embodiment of the present invention, when the upper table 2100 and the lower table 4100 are moved to be positioned close to each other in order to bond the upper substrate S1 and the lower substrate S2 to each other, the above-described lower driving unit 4200 is operated. The lower table 4100 is raised by using it. That is, in order for the upper table 2100 and the lower table 4100 to be positioned close to each other, the lower table 4100 is moved toward the upper table 2100 without lowering the upper table 2100 toward the lower table 4100 . elevate

In this way, when the upper table 2100 and the lower table 4100 are positioned close to each other by raising the lower table 4100, it is more stable than the opposite case (lower the upper table 2100 toward the lower table 4100). am. In other words, when the upper table 2100 and the lower table 4100 are positioned close to each other by raising the lower table 4100, less vibration or shaking is generated compared to the opposite case.

In addition, in the embodiment, in aligning the upper substrate S1 and the lower substrate S2, the lower table 4100 is horizontally moved. In this case, it is more stable than when the upper table 2100 is horizontally moved, and an alignment error between the upper alignment mark and the lower alignment mark can be reduced.

In this way, by raising the lower table 4100 to bring the upper table 2100 and the lower table 4100 close to each other, or by horizontally moving the lower table 4100 to align the upper substrate S1 and the lower substrate S2 The reason why it is stable compared to the opposite case is that the lower table 4100 is seated on the ground by the lower driving unit 4200 and the horizontal moving unit 4300, but the upper table 2100 is in a suspended state. Because. Accordingly, when moving the upper table 2100 down to the lower table 4100 or moving the upper table 2100 horizontally, the upper table 2100 may be moved less or more than the desired amount of movement due to vibration or shaking due to gravity. .

Accordingly, in the embodiment, the lower table 4100 is horizontally moved to align the upper substrate S1 and the lower substrate S2 , and the lower table 4100 is raised to raise the lower table 4100 and the upper table 2100 . ) to close the gap between them.

6 is an enlarged view conceptually illustrating a state in which the upper table and the lower table are not parallel to each other when the upper table and the lower table are mounted inside the chamber. Here, FIG. 6 is an extreme view to explain a state in which the upper table and the lower table are not parallel.

On the other hand, for the preparation or manufacture of the gluing apparatus, the prepared upper table 2100 and the lower table 4100 are installed inside the chamber unit 1100 . That is, the upper table 2100 is positioned inside the upper chamber 1110 , and the upper table 2100 is fixed to the upper chamber 1110 using a fixing member 1111 . In addition, the lower table 4100 is positioned inside the lower chamber 1120 , and is fastened or coupled to the lower driving unit 4200 .

However, when the upper table 2100 and the lower table 4100 are mounted inside the chamber unit 1100, they are parallel to each other, or as shown in FIG. 6 , the upper table 2100 and the lower table 4100 are parallel to each other. may have not been done.

For a more detailed description, in one end and the other end that are both ends in the longitudinal direction (X direction) of the upper table 2100, the center of one end in the thickness direction (Z direction) and the center of the other end in the thickness direction (Z direction) are defined. The connected line is defined as a first extension line L1. In addition, in one end and the other end, which are both ends in the longitudinal direction (X direction) of the upper table 2100, a line connecting the center of one end in the thickness direction (Z direction) and the center of the other end in the thickness direction (Z direction) is drawn It is defined as a second extension line L2.

Reflecting this and explaining again, when the upper table 2100 and the lower table 4100 are mounted inside the chamber unit 1100 , the first extension line L1 of the upper table 2100 and the first extension line L1 of the lower table 4100 are The two extension lines L2 may be in a parallel state. Here, when the first extension line L1 and the second extension line L2 are parallel, it may mean that the angle between the first extension line L1 and the second extension line L2 is 0°. In addition, the fact that the first extension line L1 and the second extension line L2 are parallel or the angle between the first extension line L1 and the second extension line L2 is 0° means that the upper table 2100 and the lower table 4100 ) means that they are arranged parallel to each other. In addition, when the upper table 2100 and the lower table 4100 are arranged in parallel, the upper support surface 2100a and the lower support surface 4100a may face each other so that they are parallel.

Conversely, when the upper table 2100 and the lower table 4100 are mounted inside the chamber unit 1100 , the first extension line L1 of the upper table 2100 and the second extension line L2 of the lower table 4100 are This may be in a non-parallel state as shown in FIG. 6 . When the first extension line L1 and the second extension line L2 are not parallel, it may mean that an angle between the first extension line L1 and the second extension line L2 exceeds 0°. In addition, the fact that the first extension line L1 and the second extension line L2 are not parallel or the angle between the first extension line L1 and the second extension line L2 exceeds 0° means that the upper table 2100 and It means a state in which the lower table 4100 is non-parallel. And, when the upper table 2100 and the lower table 4100 are not parallel, it is difficult for the opposing upper support surface 2100a and the lower support surface 4100a to be parallel.

When the angle between the first extension line L1 and the second extension line L2 exceeds 0°, the smaller the angle between the first extension line L1 and the second extension line L2, the smaller the angle between the first extension line L1 and the second extension line L1 and the second extension line L2 may mean that they are close to parallel. Accordingly, as the angle between the first extension line L1 and the second extension line L2 is smaller, the upper table 2100 and the lower table 4100 or the upper support surface 2100a and the lower support surface 4100a are parallel to each other. It may mean a state arranged to be close to . Conversely, as the angle between the first extension line L1 and the second extension line L2 increases, it may mean that the first extension line L1 and the second extension line L2 move away from parallelism. Accordingly, as the angle between the first extension line L1 and the second extension line L2 increases, the upper table 2100 and the lower table 4100 or the upper support surface 2100a and the lower support surface 4100a are parallel and It can mean a remote deployment state.

Meanwhile, when the upper substrate S1 and the lower substrate S2 are bonded together in a state where the upper table 2100 and the lower table 4100 are not parallel, a non-uniform pressing force is applied. Accordingly, the spacing between the upper substrate S1 and the lower substrate S2 varies depending on the location, or some of the regions between the upper substrate S1 and the lower substrate S2 are subjected to more pressure than necessary, A bonding defect such as not being applied as much pressure as necessary occurs.

Therefore, after the upper table 2100 and the lower table 4100 are installed in the chamber unit 1100 or before the bonding process of bonding the upper substrate S1 and the lower substrate S2 to each other, the upper table 2100 and It is necessary to inspect or check whether the lower tables 4100 are arranged parallel to each other or non-parallel to each other. In other words, it is necessary to inspect or confirm whether the arrangement state of the upper table 2100 and the lower table 4100 is normal or abnormal.

The normal arrangement of the upper table 2100 and the lower table 4100 may mean that the angle between the first extension line L1 and the second extension line L2 is less than or equal to a predetermined angle (more than 0°). Conversely, the abnormal arrangement of the upper table 2100 and the lower table 4100 means that the angle between the first extension line L1 and the second extension line L2 exceeds the predetermined angle (more than 0°). can be

Here, the arrangement state of the upper table 2100 and the lower table 4100 is not only when the angle between the first extension line L1 and the second extension line L2 is 0°, but also in the range of 0° or more and less than a predetermined angle. Determining that is normal is because it may be practically difficult for the first extension line L1 and the second extension line L2 to be perfectly parallel and the angle to be 0°.

Accordingly, the upper table 2100 and the lower table 4100 are not perfectly parallel (the angle between the first extension line and the second extension line is 0°), and even if the angle exceeds 0°, a normal cemented product is produced or The highest angle at which a defective cemented product is not produced may be set as the 'predetermined angle'.

Accordingly, when the angle between the first extension line L1 and the second extension line L2 is equal to or less than a predetermined angle (more than 0°), the arrangement state of the upper table 2100 and the lower table 4100 is determined to be normal. At this time, when the angle between the first extension line L1 and the second extension line L2 exceeds 0°, but is less than a predetermined angle, the first extension line L1 and the second extension line L2 can be considered to be parallel. there is.

Conversely, when the angle between the first extension line L1 and the second extension line L2 exceeds a predetermined angle, the arrangement state of the upper table 2100 and the lower table 4100 is determined to be abnormal. And, when the arrangement state of the upper table 2100 and the lower table 4100 is determined to be abnormal, the upper table 2100 and the lower table ( 4100), it is necessary to adjust the arrangement state of at least one of them.

Here, the operation of adjusting the arrangement state of at least one of the upper table 2100 and the lower table 4100 may include an operation of adjusting the height of at least one edge of the upper table 2100 and the lower table 4100 . there is. And, when the height of at least one edge of the upper table 2100 and the lower table 4100 is adjusted, the inclination of the height-adjusted table changes, and the angle between the first extension line L1 and the second extension line L2 is changed. change Accordingly, adjusting the arrangement state of at least one of the upper table 2100 and the lower table 4100 may include adjusting the inclination of the table whose height is adjusted.

In the embodiment of the present invention, the arrangement state measuring unit 3000 for checking the arrangement state between the upper table 2100 and the lower table 4100 is provided.

The arrangement state measuring unit 3000 according to the embodiment includes a plurality of pressing members 3100: 3100a to 3100d (see FIGS. 1 to 4 ) mounted at different positions on the outer surface of the upper table 2100 (see FIGS. 1 to 4 ) and a plurality of It includes a plurality of displacement sensors 3200 (3200a to 3200d) (refer to FIGS. 1, 2 and 5) mounted on the outer surface of the lower table 4100 to face the pressing member 3100, respectively.

The pressing members 3100 (3100a to 3100d) are provided in plurality, and it is preferable to provide the same or a corresponding number as the lower support member 4210 . In addition, each of the plurality of pressing members 3100 is installed on the outer surface of the upper table 2100 , and is installed to be positioned at the edges in the longitudinal direction and the width direction of the upper table 2100 . For example, as shown in FIG. 4 , the first and second pressing members 3100a and 3100b are spaced apart from each other in the width direction (Y direction) on the outer surface of the upper table 2100 corresponding to the third side 2113 . The third and fourth pressing members 3100c and 3100d may be installed to be spaced apart from each other in the width direction (Y direction) on the outer surface of the upper table 2100 corresponding to the fourth side 2114 . At this time, the first pressing member 3100a and the third pressing member 3100c face each other, and the second pressing member 3100b and the fourth pressing member 3100d are disposed to face each other. In addition, the separation distance between the first pressing member 3100a and the second pressing member 3100b and the spacing distance between the third pressing member 3100c and the fourth pressing member 3100d are the same. Of course, the installation position of each of the plurality of pressing members 3100 is not limited to the above-described example, and the installation position of each of the plurality of pressing members 3100 may be variously changed to face each of the plurality of displacement sensors 3200 .

Each of the plurality of pressing members 3100 is provided to have at least a surface facing the displacement sensor (hereinafter, the pressing surface). When the upper table 2100 and the lower table 4100 are disposed close to each other, the pressing surface is a surface that comes into contact with the displacement sensor 3200 and presses or presses the displacement sensor 3200 .

The displacement sensors 3200 (3200a to 3200d) are provided in the same or corresponding number as the pressing member 3100, and are installed to face the plurality of pressing members 3100, respectively. For example, four displacement sensors (hereinafter, first to fourth displacement sensors 3200a to 3200d) may be provided. In addition, each of the first to fourth displacement sensors 3200a to 3200d is installed on the outer surface of the lower table 4100 , and is installed to be positioned at the edge of the lower table 4100 in the longitudinal direction and the width direction. For example, as shown in FIG. 5 , first and second displacement sensors 3200a and 3200b are installed on the outer surface of the lower table corresponding to the third side 4113 to be spaced apart in the width direction (Y direction), Third and fourth displacement sensors 3200c and 3200d may be installed on the outer surface of the lower table 4100 corresponding to the fourth side 4114 to be spaced apart from each other in the width direction (Y direction). At this time, the first displacement sensor 3200 includes the first pressing member 3100a, the second displacement sensor 3200 includes the second pressing member 3100b, and the third displacement sensor 3200 includes the third pressing member 3100c. ) and the fourth displacement sensor 3200 are disposed to face the fourth pressing member 3100d in the vertical direction (Z direction).

The plurality of displacement sensors 3200 may be a means for changing their height or shape when a force is applied from the outside. In addition, the plurality of displacement sensors 3200 may be a device for measuring or sensing an initial state before a force is applied from the outside and a displacement amount when a force is applied. For example, the displacement sensor 3200 may be a means capable of being contracted in the Z direction by a force applied from the outside. In addition, the displacement sensor 3200 may be a means for measuring an initial state in which no force is applied and a change in length (displacement amount) in the Z direction or a change in height of the uppermost part when a force is applied from the pressing member 3100. . More specifically, the displacement sensor 3200 maintains an initial state before contact with the pressing member 3100 or before being pressed from the pressing member 3100, and the pressing member 3100 comes into contact with or the pressing member 3100. When pressed by , a displacement that contracts in the Z direction may occur. At this time, displacement amounts (hereinafter, first to fourth displacement amounts) are measured by each of the first to fourth displacement sensors 3200 .

When the displacement sensor 3200 is a means for measuring the amount of displacement between the length in the initial state (hereinafter, the initial length) and the length when it is contracted and deformed when a force is applied from the outside (hereinafter, the deformation length), the displacement amount (the initial length) The unit of length-deformation length) may be a unit of length, such as 'mm'. Of course, the unit of the displacement amount is not limited to 'mm', and various length units may be applied.

A difference between the first to fourth displacement amounts may vary depending on an arrangement state between the upper table 2100 and the lower table 4100 .

For example, as the angle between the first extension line L1 and the second extension line L2 is smaller, the difference between the maximum value (hereinafter referred to as the maximum displacement amount) and the minimum value (hereinafter referred to as the minimum amount of displacement) among the first to fourth displacement amounts (hereinafter referred to as the minimum displacement amount) , the difference in displacement) may be small. Also, as the angle between the first extension line L1 and the second extension line L2 increases, the difference in the displacement amount, which is a difference value between the maximum displacement amount and the minimum displacement amount among the first to fourth displacement amounts, may increase. Accordingly, it may be determined that the arrangement state of the upper table 2100 and the lower table 4100 is closer to parallel as the difference between the maximum displacement amount and the minimum displacement amount among the first to fourth displacement amounts is smaller. Conversely, as the difference between the first to fourth displacements increases, the arrangement state of the upper table 2100 and the lower table 4100 may be determined to be far from parallel.

Accordingly, the arrangement state between the upper table 2100 and the lower table 4100 may be determined by analyzing the first to fourth displacement amounts measured by the first to fourth displacement sensors 3200a to 3200d. That is, in the embodiment, when the displacement amount difference, which is the difference value between the maximum displacement amount and the minimum displacement amount among the first to fourth displacement amounts, is included in the preset reference range (hereinafter, the displacement reference range), the upper table 2100 and the lower table 4100 It is judged that the arrangement of the liver is normal. Conversely, when the displacement amount difference is out of the displacement reference range, the arrangement state between the upper table 2100 and the lower table 4100 is determined to be abnormal.

Here, the displacement reference range may be, for example, '10 mm or less (0 mm or more)'. Of course, the reference range of the displacement amount is not limited to the above-described example, and may be variously changed within a range in which a normal cemented product is produced during the cementing process. For example, the displacement reference range may be variously set in a range less than 10 mm or exceeding 10 mm, which is the above-described reference standard. For example, the displacement reference range may be variously set, such as '5 mm or less (0 mm or more)', '1 mm or less (0 mm or more)', 20 mm or less, 50 mm or less.

Hereinafter, with reference to FIGS. 1 to 5 , the arrangement state between the upper table and the lower table is determined as normal or abnormal using the arrangement state measuring unit according to an embodiment of the present invention, and the arrangement of at least one of the upper table and the lower table is determined. Describes how to control the state.

The process of determining whether the arrangement state between the upper table 2100 and the lower table 4100 is normal or abnormal is performed before the bonding process between the upper substrate S1 and the lower substrate S2, and includes the upper table 2100 and the lower table 4100. No substrate is supported on each of the tables 4100 .

First, in a state in which the upper chamber 1110 and the lower chamber 1120 are separated from each other, the upper table 2100 into the upper chamber 1110 and the lower table 4100 into the lower chamber 1120 are respectively charged and fixed make it Then, the upper chamber 1110 and the upper table 2100 are lowered by operating the upper driving unit 1200 . At this time, the upper chamber 1110 and the lower chamber 1120 are coupled to each other and sealed, until the upper support surface 2100a of the upper table 2100 comes into contact with the lower support surface 4100a of the lower table 4100 . lower it In addition, at this time, at least one of the first to fourth pressing members 3100a to 3100d mounted on the outer surface of the upper table 2100 descends until it contacts or presses the displacement sensor facing it, and the movement is stopped.

When the lowering of the upper table 2100 is stopped, first to fourth displacement amounts measured by the first to fourth displacement sensors 3200a to 3200d, respectively, are compared. Then, a difference between the maximum displacement amount and the minimum displacement amount, ie, a displacement amount difference, is calculated among the first to fourth displacement amounts.

Next, the calculated displacement difference is compared with the displacement reference range. When the calculated displacement difference is included in the displacement reference range, the current arrangement or installation state of the upper table 2100 and the lower table 4100 is maintained.

However, when the calculated displacement difference is out of the displacement reference range, the arrangement state of at least one of the upper table 2100 and the lower table 4100, that is, the slope is adjusted. To this end, first, the upper chamber 1110 and the upper table 2100 are raised by operating the upper driving unit 1200 to separate the upper table 2100 and the lower table 4100 from each other.

In addition, at least one of the upper table 2100 and the lower table 4100, for example, the arrangement state or the inclination of the lower table 4100 is adjusted. In this case, the inclination of the lower table 4100 may be adjusted by increasing the height of at least one edge of the lower table 4100 . In addition, the rising position and the rising height may be adjusted using the measured first to fourth displacement amounts and the difference in the displacement amounts. In this case, a position with a relatively small displacement amount may be raised, and a difference between the first to fourth displacement amounts may be relatively compared to adjust the elevation height.

The operation of adjusting the inclination of the lower table 4100 in this way includes a separate member (hereinafter, height adjustment member) can be inserted and installed. This may be performed by an operator.

Although the arrangement of the lower table 4100 has been described above, the arrangement of the upper table 2100 can be adjusted. For example, when the upper table 2100 is fixedly installed in the upper chamber by connecting the upper table 2100 and the fixing member 1111, the arrangement state of the upper table 2100 is by adjusting the position of the fixing member 1111, that is, , the inclination can be adjusted.

Also, the present invention is not limited thereto, and the arrangement state of both the upper table 2100 and the lower table 4100 may be adjusted.

When the operation of adjusting the arrangement state of at least one of the upper table 2100 and the lower table 4100 is finished, it is necessary to check the arrangement state of the upper table 2100 and the lower table 4100 again. To this end, the upper chamber 1110 and the upper table 2100 are lowered again to measure the first to fourth displacement amounts from the first to fourth displacement sensors 3200a to 3200d, the process for calculating the displacement amount difference, and calculation A process of determining the arrangement state of the upper table 2100 and the lower table 4100 is performed by comparing the difference in the displacement amount with the displacement reference range. Then, the above process is repeated until the difference in the amount of displacement is included in the reference range of the amount of displacement.

In the method as described above, when the displacement amount difference is included in the displacement reference range, the arrangement state of the upper table 2100 and the lower table 4100 is maintained in the current state. Accordingly, the upper table 2100 and the lower table 4100 may be disposed in a normal state or parallel to each other. Accordingly, during the bonding process, the upper substrate and the lower substrate may be bonded to each other with a uniform pressing force.

In the above, it was explained that the operator directly adjusts the arrangement state of at least one of the upper table 2100 and the lower table 4100, that is, the inclination, so that the arrangement state between the upper table 2100 and the lower table 4100 becomes normal. .

However, the present invention is not limited thereto, and the operation of the lower driving unit 4200 is automatically controlled according to the displacement amounts measured from the first to fourth displacement sensors 3200a to 3200d, and the arrangement between the upper table 2100 and the lower table 4100 is not limited thereto. It can be adjusted so that the state becomes normal.

To this end, the lower control unit is connected to the first to fourth displacement sensors 3200a to 3200d and controls the operation of the lower driving unit 4200 according to the displacement amount measured by the first to fourth displacement sensors 3200a to 3200d. (5000) is prepared.

The lower control unit 5000 compares the displacement amount difference with a preset displacement reference range, and determines the arrangement state of the upper table 2100 and the lower table 4100 as normal or abnormal. A table monitoring unit 5100 and a table monitoring unit ( 5100 includes a driving control unit 5300 that adjusts the operation of the lower driving unit 4200 according to the determination result.

In addition, the lower control unit 5000 is disposed between the upper support surface 2100a of the upper table 2100 and the lower support surface 4100a of the lower table 4100 according to load values measured from a plurality of load cells 6000 to be described later. It may further include a support surface monitoring unit 5200 for determining the state as normal or abnormal. In addition, the driving control unit 5300 controls the operation of the lower driving unit 4200 according to the determination result of the support surface monitoring unit 5200 . The operation of the support surface monitoring unit 5200 and the driving control unit 5300 according to the determination result by the support surface monitoring unit 5200 will be described in detail again later.

The table monitoring unit 5100 receives the first to fourth displacement amounts measured by the first to fourth displacement sensors 3200a to 3200d, and calculates a difference between the maximum displacement amount and the minimum displacement amount, that is, the displacement amount difference. Then, the table monitoring unit 5100 compares the calculated displacement amount difference with a preset displacement reference range, and determines whether the arrangement state of the upper table 2100 and the lower table 4100 is normal or abnormal.

Here, the displacement amount reference range set in the table monitoring unit 5100 may be the same as in the above-described example. That is, the displacement reference range may be, for example, '10 mm or less (0 mm or more)'. Of course, the reference range of the displacement amount is not limited to the above-described example, and may be variously changed within a range in which a normal cemented product is produced during the cementing process. For example, the displacement reference range may be variously set in a range less than 10 mm or exceeding 10 mm, which is the above-described reference standard. For example, the displacement reference range may be variously set, such as '5 mm or less (0 mm or more)', '1 mm or less (0 mm or more)', 20 mm or less, 50 mm or less.

The driving control unit 5300 is connected to the arrangement state measuring unit 3000 and the table monitoring unit 5100 to control the operation of the lower driving unit 4200 . That is, when the table monitoring unit 5100 determines that the arrangement state between the upper table 2100 and the lower table 4100 is abnormal, the driving control unit 5300 controls among the first to fourth lower driving sources 4240a to 4240d. At least one works.

Accordingly, at least one of the first to fourth lower actuators 4230a to 4230d rises or falls. Due to this, a portion of the lower support 4220 connected to the lower driving body that rises or falls is raised or lowered. In addition, the lower support members supported by the lower support parts that rise or fall among the first to fourth lower support members 4210a to 4210d rise or fall. That is, when any one of the first to fourth lower actuators 4230a to 4230d is raised, the lower support member positioned to face the raised lower actuator is raised. Similarly, when any one of the first to fourth lower actuators 4230a to 4230d is lowered, the lower support member positioned to face the lowered lower actuator is lowered. Also, a portion of the lower table 4100 connected to the rising lower support member rises, and a portion of the lower table 4100 connected to the lower support member is lowered.

7 to 9 are views for explaining a method of controlling the operation of the lower driving unit by the arrangement state measuring unit and the lower control unit according to an embodiment of the present invention.

Hereinafter, a method of controlling the operation of the lower driving unit by the arrangement state measuring unit and the lower control unit will be described with reference to FIGS. 7 to 9 .

First, in a state in which the upper chamber 1110 and the lower chamber 1120 are separated from each other, the upper table 2100 into the upper chamber 1110 and the lower table 4100 into the lower chamber 1120 are respectively loaded and fixed make it At this time, as shown in FIG. 7 , the upper table 2100 and the lower table 4100 are disposed to face each other.

Then, by operating the upper driving unit 1200 , the upper chamber 1110 and the lower chamber 1120 are coupled to each other to seal the chamber portion, and the upper support surface 2100a of the upper table 2100 is the lower table 4100 . The upper chamber 1110 and the upper table 2100 are lowered until they come into contact with the lower support surface 4100a. In addition, at this time, as shown in FIG. 8 , the upper table 2100 descends until at least one of the first to fourth pressing members 3100a to 3100d mounted on the outer surface comes into contact with or presses the facing displacement sensor. and stop the movement.

When the lowering of the upper table 2100 is stopped, each of the first to fourth displacement sensors 3200a to 3200d transmits the measured first to fourth displacement amounts to the table monitoring unit 5100 of the lower control unit 5000 . Then, the table monitoring unit 5100 calculates a difference between the maximum displacement amount and the minimum displacement amount, that is, the displacement amount difference among the first to fourth displacement amounts. Thereafter, the table monitoring unit 5100 compares the calculated displacement amount difference with a preset displacement reference range, and determines the arrangement state of the upper table 2100 and the lower table 4100 as normal or abnormal.

At this time, when the calculated displacement difference is included in the displacement reference range, the table monitoring unit 5100 determines that the arrangement state of the upper table 2100 and the lower table 4100 is normal, which is transmitted to the driving control unit 5300 . do. The driving controller 5300 does not operate the first to fourth lower driving sources 4240a to 4240d. Accordingly, the arrangement state of the upper table 2100 and the lower table 4100, that is, the inclination is maintained in the current state.

However, when the calculated displacement difference is out of the displacement reference range, the table monitoring unit 5100 determines that the arrangement state of the upper table 2100 and the lower table 4100 is abnormal, and this is transmitted to the driving control unit 5300 .

In this case, the driving controller 5300 operates at least one of the first to fourth lower driving sources 4240a to 4240d. To this end, it is preferable to first operate the upper driving unit 1200 to raise the upper chamber 1110 and the upper table 2100 to separate the upper table 2100 and the lower table 4100 .

Hereinafter, for a more detailed description, it is assumed as follows.

For example, among the first to fourth displacement amounts, the first and second displacement amounts are the same, and the third and fourth displacement amounts are the same as the fourth displacement amount. And, the third and fourth displacement amounts are smaller than the first and second displacement amounts. In this case, the first displacement amount or the second displacement amount becomes the minimum displacement amount, and the third displacement amount or the fourth displacement amount becomes the maximum displacement amount. In addition, the table monitoring unit 5100 determines that the arrangement state of the upper table 2100 and the lower table 4100 is abnormal because the difference between the maximum displacement amount and the minimum displacement amount, that is, the displacement amount difference is out of the displacement reference range.

Since the table monitoring unit 5100 determines that the arrangement state of the upper table 2100 and the lower table 4100 is abnormal, the driving control unit 5300 operates at least one of the first to fourth lower driving sources 4240a to 4240d. to adjust the arrangement state of the lower table 4100, that is, the inclination.

At this time, since the third and fourth displacement amounts are smaller than the first and second displacement amounts, the driving control unit 5300 raises the lower table 4100 in which the third and fourth displacement sensors 3200c and 3200d are installed. To this end, the lower control unit 5000 operates the third and fourth lower driving sources 4240c and 4240d to raise the third and fourth driving units 4230c and 4230d as shown in FIG. 9 . Accordingly, the heights of the third and fourth lower support members 42210c and 42310d among the first to fourth lower support members 4210a to 4210d installed on the lower support 4220 are increased. Accordingly, the height of the lower table 4100 supported by the third and fourth lower support members 42210c and 42310d increases.

Alternatively, the driving control unit 5300 may lower the lower table 4100 in which the first and second displacement sensors 3200a and 3200b facing the third and fourth displacement sensors 3200c and 3200d are located. there is. To this end, the driving control unit 5300 operates the first and second lower driving sources 4240a and 4240b to lower the first and second lower driving bodies 4230a and 4230b. Accordingly, the heights of the first and second lower support members 4210a and 4210b among the first to fourth lower support members 4210a to 4210d installed on the lower supports are lowered. Accordingly, the height of the area of the lower table 4100 supported by the first and second lower support members 4210a and 4210b decreases.

When the operation of adjusting the inclination of the lower table 4100 is finished, the arrangement state between the upper table 2100 and the lower table 4100 is checked again.

To this end, the upper chamber 1110 and the upper table 2100 are lowered again to measure the first to fourth displacement amounts from the first to fourth displacement sensors 3200a to 3200d, the process for calculating the displacement amount difference, and calculation The process of determining whether the arrangement between the upper table and the lower table is normal or abnormal is performed by comparing the difference in the displacement amount with the displacement reference range. Then, the above process is repeated until the difference in the amount of displacement is included in the reference range of the amount of displacement.

In the method as described above, when the displacement amount difference is included in the displacement reference range, the arrangement state of the upper table 2100 and the lower table 4100 is maintained in the current state. Accordingly, the upper table 2100 and the lower table 4100 may be disposed in a normal state or parallel to each other. Accordingly, during the bonding process, the upper substrate S1 and the lower substrate S2 may be bonded to each other with a uniform pressing force.

In the above description, the arrangement state measuring unit 3000 has been described as including the pressing member 3100 and the displacement sensor 3200 . However, the present invention is not limited thereto, and the arrangement state measuring unit 3000 may be a means including a plurality of distance sensors (not shown) for measuring the separation distance between the upper support surface 2100a and the lower support surface 4100a. .

The plurality of distance sensors may be installed on any one of the upper table 2100 and the lower table 4100 , for example, the lower table 4100 . In addition, the plurality of distance sensors are installed at different positions to measure the separation distance between the upper support surface 2100a and the lower support surface 4100a. That is, the distance between the upper support surface 2100a and the lower support surface 4100a measured by the plurality of distance sensors is a separation distance measured at different positions. In this case, the number of distance sensors corresponding to the plurality of lower support members 4210a to 4230d is preferably provided, for example, four (hereinafter, first to fourth distance sensors). In addition, the first to fourth distance sensors include, among the lower support surfaces 4100a, a distance between an area facing each of the first to fourth lower support members 4210a to 4230d and an upper supporting surface facing the area, respectively. is prepared to measure.

Then, the table monitoring unit 5100 of the lower control unit 5000 determines whether the arrangement state of the upper table 2100 and the lower table 4100 is normal or abnormal using the distance values measured from each of the plurality of distance sensors. .

Hereinafter, a method of controlling the operation of the lower driving unit by the arrangement state measuring unit including a plurality of distance sensors and the lower controlling unit will be described.

First, in a state in which the upper chamber 1110 and the lower chamber 1120 are separated from each other, the upper table 2100 into the upper chamber 1110 and the lower table 4100 into the lower chamber 1120 are respectively loaded and fixed make it Then, the distance between the upper support surface and the lower support surface is measured using each of the plurality of distance sensors.

Each of the plurality of distance sensors transmits the measured first to fourth distance values to the table monitoring unit 5100 of the lower control unit 5000 . Then, the table monitoring unit 5100 calculates a difference between the maximum distance value and the minimum distance value, that is, a distance difference among the first to fourth distance values. Thereafter, the table monitoring unit 5100 compares the calculated distance difference with a preset distance reference range, and determines the arrangement state of the upper table 2100 and the lower table 4100 as normal or abnormal.

At this time, when the calculated distance difference is included in the distance reference range, the table monitoring unit 5100 determines that the arrangement state of the upper table 2100 and the lower table 4100 is normal, which is transmitted to the driving control unit 5300 . do. The driving controller 5300 does not operate the first to fourth lower driving sources 4240a to 4240d. Accordingly, the arrangement state of the upper table 2100 and the lower table 4100, that is, the inclination is maintained in the current state.

However, when the calculated distance difference is out of the distance reference range, the table monitoring unit 5100 determines that the arrangement state of the upper table 2100 and the lower table 4100 is abnormal, and this is transmitted to the driving control unit 5300 . . In this case, the driving controller 5300 operates at least one of the first to fourth lower driving sources 4240a to 4240d to adjust the inclination of the lower table 4100 .

10 is an enlarged view conceptually illustrating a state in which an upper support surface and a lower support surface are not parallel. Here, FIG. 10 is an extreme view to explain a state in which the upper support surface and the lower support surface are not parallel.

On the other hand, although the upper table 2100 and the lower table 4100 are normally arranged to be parallel to each other, the upper support surface 2100a of the upper table 2100 and the lower part of the lower table 4100 as shown in FIG. 10 . The support surface 4100a may not be parallel. In other words, among the first to fourth displacement amounts measured by the first to fourth displacement sensors 3200a to 3200d, the displacement amount difference is included in the displacement reference range, so that the upper table 2100 and the lower table 4100 are arranged Although the state is normal, the upper support surface 2100a and the lower support surface 4100a may not be parallel. This may be due to the reason that at least one support surface is provided in a non-horizontal state when the upper table 2100 and the lower table 4100 are provided. That is, at least one of the upper support surface 2100a of the upper table 2100 and the lower support surface 4100a of the lower table 4100 may be provided in a non-horizontal state.

For a more detailed description, a line extending parallel to the upper support surface 2100a of the upper table 2100 is defined as an upper extension line Lu, and a line extending parallel to the lower support surface 4100a of the lower table 4100 is defined as a line extending parallel to the upper support surface 2100a of the upper table 2100. It is defined as the lower extension line Ll.

Reflecting this and describing again, the upper extension line Lu of the upper table 2100 and the lower extension line Ll of the lower table 4100 facing each other inside the chamber unit 1100 may be in a parallel state. Here, when the upper extension line Lu and the lower extension line Ll are parallel, it may mean that the angle between the upper extension line Lu and the lower extension line Ll is 0°. In addition, when the upper extension line Lu and the lower extension line Ll are parallel or the angle between the upper extension line and the upper extension line Lu is 0°, the upper support surface 2100a and the lower support surface 4100a are arranged in parallel means a state of being

Conversely, the upper extension line Lu of the upper table 2100 and the lower extension line Ll of the lower table 4100 facing each other inside the chamber unit 1100 may be in a non-parallel state as shown in FIG. 10 . . When the upper extension line Lu and the lower extension line Ll are not parallel, it may mean that the angle between the upper extension line Lu and the lower extension line Ll exceeds 0°. In addition, if the upper extension line Lu and the lower extension line Ll are not parallel or the angle between the upper extension line and the lower extension line Ll exceeds 0°, the upper support surface 2100a and the lower support surface 4100a) This refers to the non-parallel arrangement.

When the angle between the upper extension line Lu and the lower extension line Ll exceeds 0°, the smaller the angle between the upper extension line Lu and the lower extension line Ll, the smaller the angle between the upper extension line Lu and the lower extension line Ll. ) may mean that it is close to parallel. Accordingly, as the angle between the upper extension line Lu and the lower extension line Ll is smaller, it may mean a state in which the upper support surface 2100a and the lower support surface 4100a are arranged to be close to each other in parallel. Conversely, as the angle between the upper extension line Lu and the lower extension line Ll increases, it may mean that the upper extension line Lu and the lower extension line Ll are parallel and farther away from each other. Accordingly, as the angle between the upper extension line Lu and the lower extension line Ll increases, it may mean that the upper support surface 2100a and the lower support surface 4100a are parallel and farther apart.

Meanwhile, when the upper substrate S1 and the lower substrate S2 are bonded together in a state where the upper support surface 2100a and the lower support surface 4100a are not parallel, a non-uniform pressing force is applied. Accordingly, the spacing between the upper substrate S1 and the lower substrate S2 varies depending on the location, or some of the regions between the upper substrate S1 and the lower substrate S2 are subjected to more pressure than necessary, A bonding defect such as not being applied as much pressure as necessary occurs.

Therefore, during the bonding process between the upper substrate S1 and the lower substrate S2 or before the final pressing, the upper support surface 2100a and the lower support surface 4100a are in a state in which they are arranged parallel to each other or not. It is necessary to inspect or confirm that it is in a deployed state. In other words, it is necessary to inspect or confirm whether the arrangement state of the upper support surface 2100a and the lower support surface 4100a is normal or abnormal.

When the arrangement state of the upper support surface 2100a and the lower support surface 4100a is normal, it may mean that the angle between the upper extension line Lu and the lower extension line Ll is less than or equal to a predetermined angle (more than 0°). Conversely, the abnormal arrangement of the upper support surface 2100a and the lower support surface 4100a means that the angle between the upper extension line Lu and the lower extension line Ll exceeds the predetermined angle (more than 0°). can be

Here, the arrangement state of the upper support surface 2100a and the lower support surface 4100a not only when the angle between the upper extension line Lu and the lower extension line Ll is 0°, but also in the range of O° or more and a predetermined angle or less. Determining that is normal is because it may be practically difficult for the upper extension line Lu and the lower extension line Ll to be perfectly parallel and the angle to be 0°.

Accordingly, the upper support surface 2100a and the lower support surface 4100a are not perfectly parallel (the angle between the upper extension line and the lower extension line is 0°), and even if the angle exceeds 0°, a normal cemented product is produced or The highest angle at which a defective cemented product is not produced may be set as the 'predetermined angle'.

Accordingly, when the angle between the upper extension line Lu and the lower extension line Ll is equal to or less than a predetermined angle (more than 0°), the arrangement state of the upper support surface 2100a and the lower support surface 4100a is determined to be normal. In this case, when the angle formed by the upper extension line Lu and the lower extension line Ll exceeds 0°, but is less than a predetermined angle, the upper extension line Lu and the lower extension line Ll may be considered to be parallel.

Conversely, when the angle formed by the upper extension line Lu and the lower extension line Ll exceeds a predetermined angle, the arrangement state of the upper support surface 2100a and the lower support surface 4100a is determined to be abnormal. And, when the arrangement state of the upper support surface 2100a and the lower support surface 4100a is determined to be abnormal, the upper table 2100 so that the arrangement state of the upper support surface 2100a and the lower support surface 4100a becomes normal. And it is necessary to adjust the arrangement state of at least one of the lower table 4100.

Here, the operation of adjusting the arrangement state of at least one of the upper table 2100 and the lower table 4100 may include an operation of adjusting the height of at least one edge of the upper table 2100 and the lower table 4100 . there is. And, when the height of at least one edge of the upper table 2100 and the lower table 4100 is adjusted, the inclination of the height-adjusted table and the inclination of the support surface change. Accordingly, adjusting the arrangement state of at least one of the upper table 2100 and the lower table 4100 means that the height of the table support surface (at least one of the upper support surface 2100a and the lower support surface 4100a) is adjusted. It may include the meaning of adjusting the slope.

In an embodiment of the present invention, the load cells 6000 (6000a to 6000d) for inspecting the arrangement state between the upper support surface 2100a and the lower support surface 4100a are provided. In addition, the driving control unit 5300 controls the operation of the lower driving unit 4200 according to the load (hereinafter, the load value) measured by the load cell 6000 .

The load cell 6000 measures the load or weight of the lower support member supporting the lower table. The load cell 6000 may be provided in the same or corresponding number as the lower support member 4210, for example, four. In addition, the four load cells (hereinafter, first to fourth load cells 6000a to 6000d) may be installed to be positioned between the lower table 4100 and the lower support 4220 .

More specifically, the load cell 6000 may be installed between the upper shaft 4211 and the lower shaft 4212 of each of the first to fourth lower support members 4210a to 4210d. More specifically, the first load cell 6000a is installed between the upper shaft 4211 and the lower shaft 4212 of the first lower support member 4210a, and the upper shaft of the second lower support member 4210b and The second load cell 6000b is installed between the lower shafts, the third load cell 6000c is installed between the upper shaft and the lower shaft of the third lower support member 4210c, and the upper part of the fourth lower support member 4210d A fourth load cell 6000d may be installed between the shaft and the lower shaft.

Since the first to fourth load cells 6000a to 6000d are installed to be connected to the first to fourth lower support members 4210a to 4210d connected to the lower table 4100 as described above, the upper table 2100 and When the lower table 4100 comes into contact, the load value measured in at least one of the first to fourth load cells 6000a to 6000d is changed by the load applied to the lower table 4100 from the upper table 2100 .

Hereinafter, for convenience of description, the loads measured in each of the first to fourth load cells 6000a to 6000d are referred to as first to fourth load values.

The first to fourth load values may vary depending on an arrangement state between the upper support surface 2100a and the lower support surface 4100a.

For example, as the angle between the upper extension line Lu and the lower extension line Ll is smaller, the difference value between the maximum value (hereinafter, the maximum load value) and the minimum value (hereinafter, the minimum load value) among the first to fourth load values ( Hereinafter, the load difference) may be small. In addition, as the angle between the upper extension line Lu and the lower extension line Ll increases, a load difference, which is a difference value between the maximum load value and the minimum load value among the first to fourth load values, may increase. Accordingly, it can be determined that the arrangement state of the upper support surface 2100a and the lower support surface 4100a is close to parallel as the load difference that is the difference between the maximum load value and the minimum load value among the first to fourth load values is smaller. . Conversely, as the load difference among the first to fourth load values increases, the arrangement state of the upper support surface 2100a and the lower support surface 4100a may be determined to be far from parallel.

Accordingly, by analyzing the first to fourth load values measured by the first to fourth load cells 6000a to 6000d, the arrangement state between the upper support surface 2100a and the lower support surface 4100a may be determined. That is, in the embodiment, when the load difference, which is the difference between the maximum load value and the minimum load value among the first to fourth load values, is included in the preset reference range (hereinafter, the load reference range), the upper support surface 2100a and the lower It is determined that the arrangement state between the support surfaces 4100a is normal. Conversely, when the load difference is out of the load reference range, the arrangement state between the upper support surface 2100a and the lower support surface 4100a is determined to be abnormal.

In the embodiment of the present invention, the lower driving unit 4200 is automatically controlled using the lower control unit 5000 to arrange the upper support surface 2100a of the upper table 2100 and the lower support surface 4100a of the lower table 4100 . Let the status be normal.

To this end, the lower control unit 5000 according to the embodiment includes the upper support surface 2100a and the lower support surface 4100a according to the first to fourth load values measured from the first to fourth load cells 6000a to 6000d. and a support surface monitoring unit 5200 that determines the arrangement state of the liver as normal or abnormal.

The support surface monitoring unit 5200 calculates a difference between a maximum load value and a minimum load value among the first to fourth load values transmitted from the first to fourth load cells 6000a to 6000d. Then, the support surface monitoring unit 5200 compares the calculated load difference with a preset load reference range. In addition, when the calculated load difference is included in the load reference range, the support surface monitoring unit 5200 determines that the arrangement state between the upper support surface 2100a and the lower support surface 4100a is normal. Conversely, when the calculated load difference is out of the load reference range, the support surface monitoring unit 5200 determines that the arrangement state between the upper support surface 2100a and the lower support surface 4100a is abnormal.

The driving control unit 5300 is connected to the plurality of load cells 6000 and the support surface monitoring unit 5200 to control the operation of the lower driving unit 4200 . That is, when the driving control unit 5300 determines that the arrangement state between the upper support surface 2100a and the lower support surface 4100a in the support surface monitoring unit 5200 is abnormal, the first to fourth lower driving sources 4240a to 4240d) operates at least one.

11 and 12 are diagrams for explaining a method of controlling an operation of a lower driving unit by a plurality of load cells and a lower control unit according to an embodiment of the present invention.

Hereinafter, a method of controlling the operation of the lower driving unit by the plurality of load cells and the lower control unit will be described with reference to FIGS. 11 and 12 .

When the upper substrate S1 is supported in contact with the upper support surface 2100a of the upper table 2100 and the lower substrate S2 is supported in contact with the lower support surface 4100a of the lower table 4100, the lower table 4100 ) is raised to narrow the gap with the upper table 2100 . At this time, by operating all of the first to fourth driving sources 4240a to 4240d of the lower driving unit 4200 to raise the lower support 4220 and the first to fourth lower supporting members 4210a to 4210d, the lower table 4100 is ) can be increased.

When the lower table 4100 is raised, at least a portion of the lower substrate S2 comes into contact with the upper substrate S1 as shown in FIG. 11 . Accordingly, a load or weight applied from the upper table 2100 and the upper substrate S1 is transferred to the lower substrate S2 and the lower table 4100 . Accordingly, in the embodiment, when the lower table 4100 is raised, at least one of the load values measured from each of the first to fourth load cells 6000a to 6000d starts to change until the lower table 4100 starts to change. ) is raised. In other words, in raising the lower table 4100, when a change in at least one of the load values measured from each of the first to fourth load cells 6000a to 6000d starts, the lower table 4100 stop the ascent.

When the lower table 4100 stops rising, the first to fourth load values measured from each of the first to fourth load cells 6000a to 6000d are transmitted to the support surface monitoring unit 5200 . And the support surface monitoring unit 5200 calculates a difference between the maximum load value and the minimum load value among the first to fourth load values, that is, the load difference. Thereafter, the support surface monitoring unit 5200 compares the calculated load difference with a preset load reference range, and determines the arrangement state of the upper support surface 2100a and the lower support surface 4100a as normal or abnormal.

The support surface monitoring unit 5200 determines that the arrangement state of the upper support surface 2100a and the lower support surface 4100a is normal when the calculated load difference is included in the load reference range. In this case, in the current state, the lower table 4100 is raised to press the upper substrate S1 and the lower substrate S2 , thereby bonding the upper substrate S1 and the lower substrate S2 to each other. To this end, the driving controller 5300 operates the first to fourth lower driving sources 4240a to 4240d under the same conditions or in the same amount. Accordingly, the first to fourth lower support members 4210a to 4210d rise by the same amount. At this time, by monitoring a load value measured by each of the plurality of weight sensors 6000a to 6000d, it is possible to monitor whether the upper substrate S1 and the lower substrate S2 are in contact or pressurized.

In addition, a method of bonding the upper substrate S1 and the lower substrate S2 to each other is not limited to a method of lowering the lower table 4100 . That is, in a state in which the upper substrate S1 and the lower substrate S2 are separated by a predetermined distance, the upper substrate S1 is separated from the upper table 2100 , and the upper substrate S1 is placed on the lower substrate S2 . The upper substrate S1 and the lower substrate S2 are attached to each other.

Here, when separating the upper substrate S1 from the upper table 2100 , in the embodiment, the adhesive pin 2300 is raised or moved backward to press the rear surface of the upper substrate S1 to the upper support surface 2100a. separated by

On the other hand, when the calculated load difference is out of the load reference range, the support surface monitoring unit 5200 determines that the arrangement state of the upper support surface 2100a and the lower support surface 4100a is abnormal, and this signal is 5300). In this case, the driving controller 5300 operates at least one of the first to fourth lower driving sources 4240a to 4240d to adjust the arrangement state of the lower table 4100 , that is, the inclination thereof.

Hereinafter, for a more detailed description, it is assumed and described as follows.

Among the first to fourth load values, the first and second load values are the same, and the third and fourth load values are the same as the fourth load value. In addition, the third and fourth load values are smaller than the first and second load values. In this case, the first load value or the second load value becomes the minimum load value, and the third load value or the fourth load value becomes the maximum load value. And, when the difference (load difference) between the maximum load value and the minimum load value is out of the load reference range, the support surface monitoring unit 5200 determines that the arrangement state of the upper support surface 2100a and the lower support surface 4100a is abnormal. assume that

The signal that the support surface monitoring unit 5200 determines that the arrangement state of the upper support surface and the lower support surface 4100a is abnormal is transmitted to the driving control unit, and the driving control unit 5300 includes the first to fourth lower driving sources 4240a to 4240d. ) to adjust the inclination of the lower table 4100 by operating at least one.

At this time, since the third and fourth load values are smaller than the first and second load values, the driving control unit 5300 operates the third and fourth lower driving sources 4240c and 4240d to operate the third and fourth load values as shown in FIG. 12 . The fourth lower actuators 4230c and 4230d are raised. Accordingly, the third and fourth lower support members 4210c and 4210d connected to the third and fourth lower actuators 4230c and 4230d through the lower support 4220 rise. Due to this, the portion of the lower table 4100 on which at least the third and fourth lower support members 4210c and 4210d is supported rises, and accordingly, the height of the lower support surface 4100a at the corresponding position rises. By this operation, the inclination of the lower table 4100 and the lower support surface 4100a is changed or adjusted.

Alternatively, the first and second lower driving sources 4240a and 4240b are operated to lower the first and second lower driving bodies 4230a and 4230b. Accordingly, the first and second lower support members 4210a and 4210b connected to the first and second lower actuators 4230a and 4230b through the lower support 4220 rise. Due to this, the area of the lower table 4100 in which at least the first and second lower support members 4210a and 4210b are supported is lowered, and accordingly, the height of the lower support surface 4100a at the corresponding position is increased. By this operation, the inclination of the lower table 4100 and the lower support surface 4100a is changed or adjusted.

The operation of adjusting the inclination of the lower table 4100 or the lower support surface 4100a as described above is repeatedly performed until the load difference is included within the reference range. That is, while at least one of the first to fourth lower support members 4210a to 4210d is raised or lowered to adjust the inclination of the lower support surface 4100a, the difference between the maximum load value and the minimum load value is within the load reference range. At least one of the first to fourth lower driving sources 4240a to 4240d is operated until included in the .

Accordingly, the upper support surface 2100a and the lower support surface 4100a may be disposed in a normal state or parallel to each other. Accordingly, during the bonding process, the upper substrate S1 and the lower substrate S2 may be bonded to each other with a uniform pressing force.

As described above, when the load difference is included in the load reference range, the arrangement state of the upper table 2100 and the lower table 4100 is maintained in the current state. Accordingly, the upper support surface 2100a and the lower support surface 4100a may be disposed in a normal state or parallel to each other. Accordingly, during the bonding process, the upper substrate and the lower substrate may be bonded to each other with a uniform pressing force.

Hereinafter, a method of bonding an upper substrate and a lower substrate using a substrate bonding apparatus according to an embodiment of the present invention will be described with reference to FIGS. 1 to 5 , 11 and 12 .

As shown in FIG. 1 , the upper chamber 1110 and the lower chamber 1120 are separated, and the upper table 2100 and the lower table 4100 are spaced apart. Then, the upper substrate S1 and the lower substrate S2 are loaded into the chamber unit 1100 , the upper substrate S1 is supported on the upper support surface 2100a of the upper table 2100 , and the lower substrate S2 is supported. ) is supported on the lower support surface 4100a of the lower table 4100 .

First, a method of supporting the upper substrate S1 on the upper table 2100 will be described.

The upper substrate S1 is brought into contact with the upper support surface 2100a of the upper table 2100 and the upper suction driving unit 2200 is operated to control the plurality of suction ports 2130 by vacuum pressure. Accordingly, the upper substrate S1 is supported on the upper support surface 2100a by the vacuum suction force of the plurality of suction ports 2130 .

Thereafter, the adhesive sheet 2320 provided on each of the plurality of adhesive pins 2200 is lowered to be in contact with the back surface of the upper substrate S1, and the adhesive pin suction driving unit 2500 is operated to each of the plurality of adhesive pins 2200. The suction pipe 2330 is controlled by vacuum pressure. Accordingly, the upper substrate S1 is adsorbed and supported by the adhesive sheet 2320 of each of the plurality of adhesive pins 2200 by the vacuum suction force of the suction pipe 2330 of the plurality of adhesive pins 2200 . At this time, the plurality of suction ports 2130 are in a state in which the vacuum suction force is released, that is, the plurality of suction ports 2130 are not in a vacuum pressure state.

Next, the adhesive pin operation unit 2400 is operated to lower the plurality of adhesive pins 2200 . At this time, the tips of the plurality of adhesive pins 2200, that is, the adhesive sheet 2320, are lowered to protrude downward to the upper support surface 2100a, and when the adhesive pins 2200 protrude, the vacuum suction force of the suction pipe 2330, that is, Release the vacuum pressure.

When the adhesive pin 2200 descends so that the adhesive sheet 2320 protrudes downward from the upper support surface, the upper substrate S1 is separated from the upper support surface 2100a. Thereafter, the adhesive pin operation unit 2400 is operated again to raise the plurality of adhesive pins 2200 . At this time, each of the plurality of adhesive pins 2200 is raised until the rear surface of the upper substrate S1 comes into contact with the upper support surface 2100a of the upper table 2100 . Accordingly, the upper substrate S1 is supported in contact with the upper support surface 2100a of the upper table 2100 by the adhesive force of the plurality of adhesive pins 2200 .

Next, the lower substrate S2 is seated on the lower support surface 4100a of the lower table 4100 . To this end, for example, the tip of the support pin installed to pass through the lower table 4100 is raised so as to protrude above the lower support surface 4100a to support the lower substrate S2 at the tip of the support pin. Next, the support pin is lowered so that the tip is located inside the lower table 4100 . Accordingly, the lower substrate S2 on which the support pins are seated is seated on the lower support surface 4100a of the lower table 4100 . In this case, the upper surface of the adhesive member 4120 may be exposed on the lower table 4100 . Accordingly, the lower substrate S2 may be fixedly supported on the lower support surface 4100a by the adhesive force of the adhesive member 4120 .

In this way, when the upper substrate S1 and the lower substrate S2 are respectively supported by the upper table 2100 and the lower table 4100 , the inside of the chamber unit 1100 is controlled by vacuum pressure. To this end, the upper chamber 1110 is lowered by operating the upper driving unit 1200 to seal the space between the upper chamber 1110 and the lower chamber 1120 . Then, the pressure control unit is operated to reduce the pressure inside the chamber unit 1100 to adjust the vacuum pressure.

When the vacuum pressure inside the chamber unit 1100 is applied in this way, no flow occurs in the upper substrate S1 and the lower substrate S2 . This is because the upper substrate S1 and the lower substrate S2 are not supported by the vacuum suction force. In other words, this is because the upper substrate S1 and the lower substrate S2 are supported by adhesive force.

When the upper chamber 1110 is lowered as described above to form the inside of the chamber unit 1100 in a vacuum, the upper table 2100 connected to the upper chamber 1110 descends together. Accordingly, the upper table 2100 and the lower table 4100 are positioned adjacently.

In this state, the upper substrate S1 and the lower substrate S2 are aligned. To this end, the alignment mark formed on the lower substrate S2 is imaged using the imaging unit 4400 . Then, the acquired image image is transferred to the horizontal moving unit 4300 .

The horizontal moving unit 4300 analyzes the position between the lower alignment mark on the image image and the previously stored upper alignment mark, and moves the lower driving unit 4200 so that the position of the lower alignment mark overlaps the position of the upper alignment mark in XY and It moves horizontally in at least one direction among θ. Accordingly, the lower table 4100 is horizontally moved in at least one of X Y and θ.

While the lower table 4100 is horizontal in at least one of X Y and θ, the imaging unit captures an image of the lower alignment mark in real time, and transmits it to the horizontal moving unit 4300 . Then, the horizontal movement unit 4300 analyzes the transferred image image and horizontally moves the lower driving unit 4200 in real time to align the lower alignment mark with the upper alignment mark.

Meanwhile, when the upper and lower substrates S1 and S2 to be bonded are new substrates, a process of presetting the height of the lower table 4100 to be horizontally moved for aligning the upper and lower substrates S1 and S2 may be performed. That is, before aligning the upper and lower substrates S1 and S2 , a process of presetting the height of the lower table 4100 to be horizontally moved for alignment may be performed first.

To this end, first, the lower driving unit 4200 is operated to raise the lower table 4100 . At this time, by operating all of the first to fourth driving sources 4240a to 4240d of the lower driving unit 4200 under the same conditions to raise the first to fourth lower supporting members 4210a to 4210d, the lower table 4100 is lifted. elevate

When the lower table 4100 is raised in this way, at least a portion of the lower substrate S2 is in contact with the upper substrate S1 . At this time, the load values measured in the first to fourth load cells 6000a to 6000d are changed by the load applied from the upper table 2100 .

In the embodiment, the lower table 4100 is raised until any one of the load values measured from each of the first to fourth load cells 6000a to 6000d starts to change. That is, when at least one of the load values measured from each of the first to fourth load cells 6000a to 6000d starts to change, the lower table 4100 stops rising.

And, among the load values measured from each of the first to fourth load cells 6000a to 6000d, a height lower than a height at which a change in any one load value starts is set as the height of the lower table 4100 for the alignment process. do. In other words, the height immediately before the height at which the change of any one load value starts (in the lower direction) is set as the height of the lower table for the alignment process. When the height of the lower table is set, the lower table 4100 set at the time of aligning the upper and lower substrates is positioned at the set height, and then the alignment is performed.

When the alignment of the upper and lower substrates S1 and S2 is finished, an arrangement state between the upper support surface 2100a of the upper table 2100 and the lower support surface of the lower table 4100 is checked. To this end, by operating all of the first to fourth driving sources 4240a to 4240d of the lower driving unit 4200 under the same conditions to raise the first to fourth lower supporting members 4210a to 4210d, the lower table 4100 raise the

When the lower table 4100 is raised in this way, at least a portion of the lower substrate S2 is in contact with the upper substrate S1 . At this time, the load values measured in the first to fourth load cells 6000a to 6000d are changed by the load applied from the upper table 2100 .

In the embodiment, in raising the lower table 4100 to check the arrangement state between the upper support surface 2100a and the lower support surface 4100a, among the load values measured from each of the first to fourth load cells 6000a to 6000d , the lower table 4100 is raised until a change in at least one of the load values starts. That is, when at least one of the load values measured from each of the first to fourth load cells 6000a to 6000d starts to change, the lower table 4100 stops rising.

When the lower table 4100 stops rising, the first to fourth load values measured from each of the first to fourth load cells 6000a to 6000d are transmitted to the support surface monitoring unit 5200 . And the support surface monitoring unit 5200 calculates a difference between the maximum load value and the minimum load value among the first to fourth load values, that is, the load difference. Thereafter, the support surface monitoring unit 5200 compares the calculated load difference with a preset load reference range, and determines the arrangement state of the upper support surface 2100a and the lower support surface 4100a as normal or abnormal.

The support surface monitoring unit 5200 determines that the arrangement state of the upper support surface 2100a and the lower support surface 4100a is normal when the calculated load difference is included in the load reference range.

However, if the calculated load difference is out of the load reference range, the support surface monitoring unit 5200 determines that the arrangement state of the upper support surface 2100a and the lower support surface 4100a is abnormal, and this signal is 5300). In this case, the driving control unit 5300 operates at least one of the first to fourth lower driving sources 4240a to 4240d to adjust the arrangement state, that is, the inclination of the lower table 4100 , thereby adjusting the lower support surface 4100a. slope is adjusted.

The operation of adjusting the inclination of the lower table 4100 or the lower support surface 4100a is repeatedly performed until the load difference is within the reference range. That is, while at least one of the first to fourth lower support members 4210a to 4210d is raised or lowered to adjust the inclination of the lower support surface 4100a, the load difference between the maximum load value and the minimum load value is the load standard. At least one of the first to fourth lower driving sources 4240a to 4240d is operated until it is included in the range.

When the load difference between the maximum load value and the minimum load value is included in the load reference range by the above-described operation, the lower table 4100 is raised in the current state. At this time, by operating all of the first to fourth driving sources 4240a to 4240d of the lower driving unit 4200 under the same conditions to raise the first to fourth lower supporting members 4210a to 4210d, the lower table 4100 is lifted. elevate Accordingly, the lower substrate S2 seated on the lower support surface 4100a of the lower table 4100 is pressed by the upper substrate S1, whereby the upper substrate S1 and the lower substrate S2 are bonded.

Of course, as described above, in a state in which the upper substrate S1 and the lower substrate S2 are spaced apart by a predetermined distance, the upper substrate S1 is separated from the upper table 2100 to separate the upper substrate S1 from the lower surface. It may be seated on the substrate S2 to bond the upper substrate S1 and the lower substrate S2 together.

When the bonding between the upper substrate S1 and the lower substrate S2 is finished, the plurality of adhesive pins 2200 are separated from the upper substrate S1 . To this end, the plurality of adhesive pins 2200 are raised by operating the adhesive pin operation unit 2400 . At this time, the plurality of adhesive pins 2200 are raised or reversed so that the adhesive sheet 2320 is not exposed to the upper support surface 2100a or the adhesive sheet 2320 is located inside the through hole 2120 . Accordingly, the adhesive sheet 2320 of each of the plurality of adhesive pins 2200 is separated from the rear surface of the upper substrate S1.

When the plurality of adhesive pins 2200 rise in this way, the rear surface of the upper substrate S1 presses the upper support surface 2100a upward, thereby preventing the movement of the upper substrate S1, and by this force The adhesive pin 2200 is separated from the upper substrate.

And, as the plurality of adhesive pins 2200 are operated backward (raised) to distribute the force generated when the plurality of adhesive pins 2200 are separated into the upper substrate to the upper support surface 2100a, the plurality of adhesive pins When the 2200 is separated from the upper substrate S1 , it is possible to prevent or minimize excessive force from being transmitted to a local portion of the upper substrate S1 in contact with the pressure-sensitive adhesive sheet 2320 . Accordingly, damage to the upper substrate S1 may be prevented.

When the plurality of adhesive pins 2200 are separated from the upper substrate S1, the inside of the chamber unit 1100 is returned to atmospheric pressure. Then, when the bonded upper and lower substrates S1 and S2 are transported to the outside of the chamber unit 1100 and the sealant is cured, bonding of the upper and lower substrates S1 and S2 is completed.

In the above, after the upper substrate S1 is supported on the upper support surface 2100a and the lower substrate S2 is supported on the lower support surface 4100a, the inclination of the lower table 4100 is adjusted to adjust the upper support surface 2100a. ) and the arrangement of the lower support surface 4100a has been described. However, the process of supporting the substrate and adjusting the inclination of the lower table 4100 is not limited to the above-described order. For example, before the substrate is supported on each of the upper support surface 2100a and the lower support surface 4100a, the inclination of the lower table 4100 is adjusted to arrange the upper support surface 2100a and the lower support surface 4100a After adjusting the state, the substrate may be supported on each of the upper support surface 2100a and the lower support surface 4100a.

According to the substrate bonding apparatus according to the embodiment, the lower table 4100 is horizontally moved to align the upper substrate S1 and the lower substrate S2, and then the upper substrate S1 and the lower substrate S2 are bonded. . Accordingly, the occurrence of an alignment error between the upper substrate S1 and the lower substrate S2 may be minimized or prevented, and the bonding process may be stably performed.

In addition, before pressing the upper substrate S1 and the lower substrate S2, the arrangement state between the upper support surface 2100a and the lower support surface 4100a is checked, and the arrangement of the upper support surface 2100a and the lower support surface 4100a Adjust so that the state becomes parallel or normal. Accordingly, it is possible to uniformly pressurize between the upper substrate S1 and the lower substrate S2 , and it is possible to prevent adhesion failure due to non-uniform pressurization.

Then, after each of the upper table 2100 and the lower table 4100 is installed inside the chamber unit 1100 or before the bonding process, the arrangement state between the upper table 2100 and the lower table 4100 is checked, and the arrangement state is Adjust to be parallel or normal. Accordingly, it is possible to uniformly pressurize between the upper substrate S1 and the lower substrate S2 , and it is possible to prevent adhesion failure due to non-uniform pressurization. In addition, since the bonding process is not performed in a state in which the upper table 2100 and the lower table 4100 are abnormally arranged, it is possible to reduce the occurrence of product defects and thereby reduce the cost.

S1: upper substrate S2: lower substrate
2100: upper table 2100a: upper support surface
3000: batch status measurement unit
3100a to 3100d: first to fourth pressing members
3200a to 3200d: first to fourth displacement sensors
2300; adhesive pin
4100: lower table 4100a: lower support surface
4200: lower driving unit
4210a to 4210d: first to fourth lower support members
4200: lower support
4230a to 4230d: first to fourth lower actuators
4240a to 4240d: first to fourth lower driving sources
6000a to 6000d: first to fourth load cells

Claims (25)

an upper table having an upper support surface on which an upper substrate is supported in contact;
a lower table having a lower support surface on which a lower substrate is supported in contact with the lower table at a position facing the upper support surface; and
A plurality of lower support members and a plurality of lower support members installed to be connected to the lower table so as to support different regions of the lower table and are respectively connected to each other to elevate and descend individually a lower driving unit having a plurality of possible lower actuators; including,
The lower driving unit includes a lower support installed to face the lower table, a plurality of the lower support members mounted on the upper part, and a lower support body on which the plurality of the lower actuators are mounted on the lower part,
By operating the lower driving unit to raise the lower table, the upper table and the lower table are positioned adjacent to each other;
a plurality of load cells installed between an upper shaft and a lower shaft of each of the plurality of lower support members to measure the load of each of the plurality of lower support members supporting the lower table; and
a lower control unit for raising and lowering each of the plurality of lower actuators by using a difference between a plurality of load values measured from the plurality of load cells; A substrate bonding apparatus comprising a. The method according to claim 1,
The plurality of lower support members are installed to support different edge regions under the lower table. delete The method according to claim 1,
The lower drive unit,
a plurality of lower driving sources respectively connected to the plurality of lower actuators to elevate each of the plurality of lower actuators;
further comprising,
The lower support is a substrate bonding apparatus in which the inclination is adjusted according to the elevating operation of each of the plurality of lower actuators. delete 5. The method according to claim 4,
The lower control unit,
a support surface monitoring unit for judging an arrangement state including whether parallelism between the upper support surface and the lower support surface as normal or abnormal by using a difference between a plurality of load values measured from the plurality of load cells; and
a driving control unit connected to each of the plurality of lower driving sources and controlling operations of each of the plurality of lower driving sources according to a determination result of the support surface monitoring unit;
A substrate bonding apparatus comprising a. 7. The method of claim 6,
and a placement state measurement unit installed on at least one of the upper table and the lower table, and configured to perform a measurement for monitoring an arrangement state including whether the upper table and the lower table are parallel. 8. The method of claim 7,
The arrangement state measuring unit,
a plurality of pressing members installed at different positions on the outer surface of the upper table; and
a plurality of displacement sensors installed on the outer surface of the lower table to face the plurality of pressing members, at least one of a length and a shape deformable by an external force, and capable of measuring a displacement;
including,
The lower control unit includes a table monitoring unit that determines whether an arrangement state including parallelism between the upper table and the lower table as normal or abnormal by using a difference between the displacement amounts measured by each of the plurality of displacement sensors; . 9. The method of claim 8
The arrangement state measuring unit includes a plurality of distance sensors installed at different positions to respectively measure the distance between the upper support surface and the lower support surface,
The lower control unit includes a table monitoring unit that determines whether an arrangement state including parallelism between the upper table and the lower table is normal or abnormal by using a difference between distance values measured by each of the plurality of distance sensors. Device. The method according to claim 1,
and a chamber part in which the upper table and the lower table are accommodated,
The chamber part,
an upper chamber having the upper table fixed therein and being able to ascend and descend; and
a lower chamber installed to face the lower side of the upper chamber;
including,
The upper table is a substrate bonding apparatus that elevates and lowers together with the upper chamber. The method according to claim 1,
an imaging unit positioned below the lower table to capture an image image of a lower alignment mark formed on the lower substrate;
It is connected to the lower table to check the position of the lower alignment mark obtained by the imaging unit and the previously stored position of the upper alignment mark of the upper substrate to align the lower alignment mark and the upper alignment mark, a horizontal moving unit for horizontally moving the table;
A substrate bonding apparatus comprising a. 12. The method of claim 11,
The horizontal moving unit is connected to the lower driving unit to horizontally move the lower driving unit. 13. The method according to any one of claims 1, 2, 4, 6 to 12,
A substrate bonding apparatus comprising a plurality of adhesive pins, each of which is installed so as to penetrate the upper table in an up-down direction, is movable up and down, and has an adhesive sheet provided at a tip facing the lower table. 14. The method of claim 13,
The upper table is
an upper body having the upper support surface; and
a plurality of suction ports provided on the upper body so as to be exposed to the upper support surface, respectively, and arranged in an extension direction of the upper support surface to be spaced apart from each other;
a plurality of through-holes installed to penetrate the upper body in a vertical direction and into which a plurality of adhesive pins are respectively inserted;
including,
and an upper suction driving unit connected to the plurality of suction ports to adjust the pressure in the plurality of suction ports to a vacuum pressure. 14. The method of claim 13,
The adhesive pin includes a suction pipe provided to penetrate the adhesive sheet up and down,
and an adhesive pin suction driving unit connected to the suction pipe to adjust the pressure of the suction pipe to a vacuum pressure. adjusting a height of at least one edge region of a lower table having a lower support surface on which a lower substrate is supported to adjust a slope of the lower support surface; and
raising the lower table to narrow a gap between the upper table and the lower table having an upper support surface for supporting the upper substrate;
including,
The process of adjusting the inclination of the lower support surface is,
It has an upper shaft and a lower shaft that are vertically arranged on the upper part of the lower support, and raises a plurality of lower support members installed to be connected to the lower table to support different regions of the lower table, so that at least a portion of the lower substrate and contacting the upper substrate;
measuring loads in a plurality of load cells installed between an upper shaft and a lower shaft of each of the plurality of lower support members;
The step of adjusting the height of at least one edge area of the lower table by raising or lowering some of the plurality of lower support members according to a difference between a plurality of load values measured from the plurality of load cells; method. 17. The method of claim 16,
After narrowing the gap between the upper table and the lower table, comprising the step of bonding the upper substrate and the lower substrate,
In bonding the upper substrate and the lower substrate,
By raising the lower table, the lower substrate is pressed against the upper substrate to bond the upper substrate and the lower substrate;
A substrate bonding method in which an upper substrate supported on the upper support surface is dropped onto an upper portion of the lower substrate for bonding. 18. The method of claim 17,
The process of adjusting the inclination of the lower support surface is,
determining an arrangement state including whether parallelism between the upper support surface and the lower support surface as normal or abnormal according to a difference between a plurality of load values measured from the plurality of load cells; and
When it is determined that the arrangement state between the upper support surface and the lower support surface is abnormal, some of the plurality of lower support members are raised or lowered to adjust the height of at least one edge area of the lower table to become normal. adjusting the inclination of the lower support surface;
including,
A method of bonding the upper substrate and the lower substrate to each other when it is determined that the arrangement state between the upper and lower support surfaces is normal. 19. The method of claim 18,
The process of determining the arrangement state between the upper support surface and the lower support surface as normal or abnormal,
calculating a load difference between a minimum load value and a maximum load value among load values measured from each of the plurality of load cells;
comparing the calculated load difference with a preset load reference range to determine whether the arrangement state between the upper support surface and the lower support surface is normal or abnormal;
including,
When the calculated load difference is included in the load reference range, it is determined that the arrangement state between the upper support surface and the lower support surface is normal,
When the calculated difference in the load is out of the load reference range, a substrate bonding method for determining an arrangement state between the upper support surface and the lower support surface as abnormal. delete 17. The method of claim 16,
a process of supporting the upper substrate on the upper support surface and before supporting the lower substrate on the lower support surface, and determining an arrangement state including whether the upper table and the lower table are parallel to each other as normal or abnormal; and
When it is determined that the arrangement state between the upper table and the lower table is abnormal, the height of the edge area of at least one of the upper table and the lower table is adjusted so that the inclination of at least one of the upper table and the lower table is adjusted to be normal. the process of conditioning;
A substrate bonding method comprising a. 22. The method of claim 21,
The process of determining the arrangement state between the upper table and the lower table as normal or abnormal,
measuring displacement amounts of a plurality of displacement sensors installed at different positions on an outer surface of the lower table by narrowing a distance between the upper table and the lower table so that at least a portion of the upper support surface and the lower support surface come into contact with each other;
calculating a displacement difference between a minimum displacement amount and a maximum displacement amount among displacement amounts measured by each of the plurality of displacement sensors;
determining whether an arrangement state between the upper table and the lower table is normal or abnormal by comparing the calculated displacement amount difference with a preset displacement reference range;
including,
When the calculated displacement amount difference is included in the displacement reference range, it is determined that the arrangement state between the upper table and the lower table is normal;
When the calculated difference in the amount of displacement is out of the reference range of the amount of displacement, the substrate bonding method determines that the arrangement state between the upper table and the lower table is abnormal. 22. The method of claim 21,
The process of determining the arrangement state between the upper table and the lower table as normal or abnormal,
measuring a distance between the upper support surface and the lower support surface at different positions to measure a plurality of distance values;
calculating a distance difference between a minimum distance value and a maximum distance value among a plurality of distance values;
determining whether an arrangement state between the upper table and the lower table is normal or abnormal by comparing the calculated distance difference with a preset distance reference range;
including,
When the calculated distance difference is included in the distance reference range, it is determined that the arrangement state between the upper table and the lower table is normal,
When the calculated distance difference is out of the distance reference range, a substrate bonding method for determining an arrangement state between the upper table and the lower table as abnormal. 17. The method of claim 16,
Each of the upper table and the lower table is installed inside a chamber unit having an upper chamber and a lower chamber configured to be divided,
The upper table is fixedly installed in the upper chamber, and ascends and descends together with the upper chamber,
In narrowing the gap between the upper table and the lower table, the upper table maintains its height. 25. The method according to any one of claims 16 to 19, 21 to 24,
In supporting the upper substrate on the upper support surface of the upper table,
Supporting the upper substrate by adhesive force using a plurality of adhesive pins including an adhesive sheet exposed to the upper support surface,
After raising the lower table and pressing the lower substrate to the upper substrate, a plurality of the adhesive pins are raised to press the upper substrate to the upper support surface, so that a plurality of the adhesive pins are applied to the upper substrate. separation from;
A substrate bonding method comprising a.

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