KR100980906B1 - 솔라 모듈 구축 장치 및 방법 - Google Patents
솔라 모듈 구축 장치 및 방법 Download PDFInfo
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- KR100980906B1 KR100980906B1 KR1020070111365A KR20070111365A KR100980906B1 KR 100980906 B1 KR100980906 B1 KR 100980906B1 KR 1020070111365 A KR1020070111365 A KR 1020070111365A KR 20070111365 A KR20070111365 A KR 20070111365A KR 100980906 B1 KR100980906 B1 KR 100980906B1
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
- B28D1/225—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising for scoring or breaking, e.g. tiles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0064—Devices for the automatic drive or the program control of the machines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/0445—PV modules or arrays of single PV cells including thin film solar cells, e.g. single thin film a-Si, CIS or CdTe solar cells
- H01L31/046—PV modules composed of a plurality of thin film solar cells deposited on the same substrate
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49004—Electrical device making including measuring or testing of device or component part
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53022—Means to assemble or disassemble with means to test work or product
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
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- Mining & Mineral Resources (AREA)
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- Laser Beam Processing (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
Description
Claims (14)
- 구축 공구(14)에 의해 솔라 모듈에 트랙이 삽입되는 솔라 모듈(12)을 구축하기 위한 방법에 있어서,상기 트랙이 삽입되는 것과 동시에, 삽입된 트랙은 구축 공구(14)를 따르는 센서(16)에 의해 검출되는 것을 특징으로 하는 솔라 모듈 구축 방법.
- 제1항에 있어서, 트랙의 폭 또는 깊이, 또는 트랙의 폭 및 깊이 모두가 검출되는 것을 특징으로 하는 솔라 모듈 구축 방법.
- 제1항 또는 제2항에 있어서, 이미 삽입된 트랙의 위치와 현재 삽입된 트랙의 위치가 검출되는 것을 특징으로 하는 솔라 모듈 구축 방법.
- 제1항 또는 제2항에 있어서, 트랙의 품질을 나타내는 하나 이상의 수량이 결정되거나 검출되며, 이러한 수량은 기준 수량과 비교되며, 설정된 비교 결과일 경우 품질 개선 측정이 시작될 수 있는 것을 특징으로 하는 솔라 모듈 구축 방법.
- 제1항 또는 제2항에 있어서, 솔라 모듈의 구축은 레이저에 의해 실행되고, 레이저 파워, 촛점 위치 및 레이저의 비임 프로필에서 선택된 하나 이상은 검출된 트랙의 폭 또는 깊이, 또는 트랙의 폭 및 깊이 모두에 의존하여 조정되는 것을 특징으로 하는 솔라 모듈 구축 방법.
- 제1항 또는 제2항에 있어서, 솔라 모듈의 구축은 기계적 공구, 특히 첨필에 의해 실행되며; 솔라 모듈(12)에서 기계적 구축 공구의 접촉 압력은 검출된 트랙의 폭 또는 깊이, 또는 트랙의 폭 및 깊이 모두에 의존하여 조정되는 것을 특징으로 하는 솔라 모듈 구축 방법.
- 제1항 또는 제2항에 있어서, 솔라 모듈의 구축은 기계적 공구, 특히 첨필에 의해 실행되며, 기계적 구축 공구(14)는 검출된 트랙의 폭 또는 깊이, 또는 트랙의 폭 및 깊이 모두를 변수로 하여 공구 연삭기(a tool sharpening machine)에 의해 예리해지는 것을 특징으로 하는 솔라 모듈 구축 방법.
- 제1항 또는 제2항에 있어서, 트랙 사이의 단락 회로 또는 솔라 모듈의 파손은 센서 신호에 기초하여 결론지워지는 것을 특징으로 하는 솔라 모듈 구축 방법.
- 구축 공구(14)를 포함하며, 솔라 모듈(12)을 구축하기 위한 구축 장치에 있어서,구축 공구(14)를 따르며, 구축 공구에 의해 삽입된 트랙을 검출하는 센서(16)가 제공되는 것을 특징으로 하는 솔라 모듈 구축 공구.
- 제9항에 있어서, 센서(16)와 데이터-기술 통신되는 평가 장치(17)는 센서 신호를 처리하기 위해 제공되는 것을 특징으로 하는 솔라 모듈 구축 공구.
- 제10항에 있어서, 구축 공구(14)를 조정하기 위해 조정 장치(18)가 제공되며, 상기 조정 장치는 평가 장치(17)에 의해 트리거되는 것을 특징으로 하는 솔라 모듈 구축 공구.
- 제9항 내지 제11항중 어느 한 항에 있어서, 센서(16)는 광학 센서 또는 기계적 센서로서 형성되는 것을 특징으로 하는 솔라 모듈 구축 공구.
- 구축 공구(14)에 의해 솔라 모듈에 트랙이 삽입되는 솔라 모듈(12)을 구축하기 위한 방법에 있어서,삽입된 트랙은 구축 공구(14)를 따르는 센서(16)에 의해 동시에 검출되며 상이한 층의 상이한 트랙에서는 상이한 센서가 제공되는 것을 특징으로 하는 솔라 모듈 구축 방법.
- 구축 공구(14)를 포함하며, 솔라 모듈(12)을 구축하기 위한 구축 장치에 있어서,구축 공구(14)를 따르며, 구축 공구에 의해 삽입된 트랙을 검출하는 센서(16)가 제공되며, 상이한 층의 상이한 트랙에서는 상이한 센서가 제공되는 것을 특징으로 하는 솔라 모듈 구축 공구.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102006051556A DE102006051556A1 (de) | 2006-11-02 | 2006-11-02 | Verfahren zum Strukturieren von Solarmodulen und Strukturierungsvorrichtung |
DE102006051556.0 | 2006-11-02 |
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Publication Number | Publication Date |
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KR20080040599A KR20080040599A (ko) | 2008-05-08 |
KR100980906B1 true KR100980906B1 (ko) | 2010-09-07 |
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Application Number | Title | Priority Date | Filing Date |
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KR1020070111365A KR100980906B1 (ko) | 2006-11-02 | 2007-11-02 | 솔라 모듈 구축 장치 및 방법 |
Country Status (6)
Country | Link |
---|---|
US (1) | US20090000108A1 (ko) |
EP (1) | EP1918993A1 (ko) |
KR (1) | KR100980906B1 (ko) |
CN (1) | CN101183695A (ko) |
DE (1) | DE102006051556A1 (ko) |
TW (1) | TW200822382A (ko) |
Families Citing this family (34)
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DE102012223289B4 (de) * | 2012-12-14 | 2021-02-11 | 3D-Micromac Ag | Verfahren und Fertigungsanlage zur Herstellung elektronischer Komponenten |
TWI498990B (zh) * | 2012-12-19 | 2015-09-01 | Genesis Photonics Inc | 劈裂裝置 |
CN103305682B (zh) * | 2013-06-20 | 2014-11-05 | 东北大学 | 一种提高取向硅钢磁导率的装置及方法 |
CN103522434A (zh) * | 2013-10-30 | 2014-01-22 | 华进半导体封装先导技术研发中心有限公司 | 基于红外技术的晶圆切割在线检测系统 |
CN110061095B (zh) * | 2019-04-12 | 2021-04-06 | 大族激光科技产业集团股份有限公司 | 一种电池刻划装置 |
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2006
- 2006-11-02 DE DE102006051556A patent/DE102006051556A1/de not_active Ceased
-
2007
- 2007-10-23 EP EP07020669A patent/EP1918993A1/de not_active Withdrawn
- 2007-10-30 TW TW096140911A patent/TW200822382A/zh unknown
- 2007-11-01 US US11/933,789 patent/US20090000108A1/en not_active Abandoned
- 2007-11-02 KR KR1020070111365A patent/KR100980906B1/ko active IP Right Grant
- 2007-11-02 CN CNA2007101596036A patent/CN101183695A/zh active Pending
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JPH06102480A (ja) * | 1992-09-22 | 1994-04-15 | Nec Kagoshima Ltd | スクライブ装置 |
JP2000219526A (ja) | 1999-01-28 | 2000-08-08 | Hitachi Ltd | スクライブ装置 |
JP2004115356A (ja) * | 2002-09-26 | 2004-04-15 | Honda Motor Co Ltd | メカニカルスクライブ装置 |
KR20060066545A (ko) * | 2004-12-13 | 2006-06-16 | 엘지전자 주식회사 | 스크라이빙 장치 |
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CN101183695A (zh) | 2008-05-21 |
KR20080040599A (ko) | 2008-05-08 |
DE102006051556A1 (de) | 2008-05-08 |
US20090000108A1 (en) | 2009-01-01 |
TW200822382A (en) | 2008-05-16 |
EP1918993A1 (de) | 2008-05-07 |
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