KR100970607B1 - Organic el display apparatus and method of manufacturing the same - Google Patents

Abstract

Board; A plurality of organic electroluminescent devices formed on the substrate, the organic electroluminescent devices each including a first electrode, an organic layer including at least a light emitting layer, and a second electrode sequentially from the substrate side; A plurality of pixel defining films, each of which is an insulating film formed between the first electrodes disposed adjacent to each other; A plurality of auxiliary wirings formed on the pixel defining film and including a conductive material; And a plurality of barrier ribs formed on the auxiliary wiring and including one of an insulator and a conductor which are reverse tapered to have an inverse tapered portion, wherein the plurality of barrier ribs And the auxiliary wiring and the second electrode of the organic EL element are electrically connected to each other.

Description

TECHNICAL FIELD [0001] The present invention relates to an organic EL display device and an organic EL display device,

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic electroluminescence (EL) display device and a method of manufacturing the organic EL device.

2. Description of the Related Art Recently, organic EL display devices using organic EL devices made of a light emitting material have been actively developed and developed as display devices having advantages such as high-speed response and wide viewing angle.

When an organic EL display device having a plurality of organic EL elements is driven by using an active matrix circuit, it is necessary to connect one thin film transistor (TFT) for controlling the current flowing to each organic EL element .

In an active matrix type organic EL display device, fine transistors and capacitors are arranged on a substrate. Therefore, it is preferable to use a so-called top emission type in which the light emission from each pixel is drawn out from the direction opposite to the substrate as shown in Fig. 3, in order to improve the aperture ratio.

Here, a conventional active matrix type top-emission type organic EL display device will be described with reference to Figs. 3 and 4. Fig.

Each pixel includes a TFT and an organic EL element stacked on a glass substrate 500.

On the glass substrate 500, a TFT portion 501 for driving the organic EL element is formed. 3 shows a source region 510, a poly-Si layer (polycrystalline silicon layer) 511, a drain region 512, a gate insulating film 513, a gate electrode 514 and an interlayer insulating film 515.

The TFT portion 501 is covered with an inorganic insulating film 517 and covered with a planarization film 518 to planarize the surface of the substrate 500. [ A reflective electrode (first electrode) 520 is formed on the planarization film 518.

The reflective electrode 520 is formed by patterning for each pixel. The reflective electrode 520 is electrically connected to the drain electrode 516 of one of the TFTs included in the TFT portion 501 through the contact hole formed in the inorganic insulating film 517 and the planarization film 518 .

The pixel defining layer 530 is an insulating layer formed between adjacent pixels and is disposed so as to cover the peripheral portion of the reflective electrode 520. [

An organic layer 525 is formed on a reflective electrode (first electrode) 520 serving as an anode. The organic layer 525 includes a hole transporting layer 523, a light emitting layer 522, and an electron transporting layer 524. On the organic layer 525, a transparent electrode (second electrode) 521 functioning as a cathode (common electrode) is formed.

In order to protect the organic EL device from moisture, a sealing glass material 540 is bonded to the glass substrate 500 obtained above by a UV curing epoxy resin. An inert gas 541 is filled in a clearance between the glass substrate 500 and the sealing glass material 540.

As described above, a thin film made of a transparent conductive material such as ITO (indium tin oxide) or IZO (indium zinc oxide) is used for the second electrode in the case of the top emission type in which light is extracted from the side opposite to the substrate, The transparent conductive material has a higher resistance than the resistance of the metal material.

Therefore, a voltage drop is more easily generated in the second electrode, and a different voltage is applied to each organic EL element formed on the display surface. Therefore, there is a problem that display performance is deteriorated due to a voltage gradient (inclination) such as a decrease in light emission intensity in the central region of the display surface.

Therefore, in order to suppress the voltage gradient, it is preferable to form the low resistance auxiliary wiring. It is necessary to form the auxiliary wiring in a non-display region such as a region between pixels in order to secure the opening of each pixel.

When the low resistance auxiliary wiring is formed after the organic layer is formed, the organic material in the organic layer is deteriorated by water, an organic solvent or ultraviolet rays. Therefore, it is difficult to pattern the auxiliary wiring formed by photolithography, and therefore, it is necessary to pattern the auxiliary wiring by using a metal mask during its film formation.

When the film is patterned using a metal mask while forming a film by a vacuum deposition method with a low resistance material such as a metal material, the evaporation temperature of the metal material is high and the metal mask is stretched by the radiation heat, It is difficult to maintain high patterning accuracy. Particularly, in the case of the high-resolution display panel, since the pixel interval is small, it becomes more difficult to perform the patterning.

Therefore, a countermeasure has been proposed in which an auxiliary wiring (electrically connected to the second electrode) is provided between pixels before the organic layer is formed (Japanese Patent Application Laid-Open Nos. 2001-195008, 2002-318553, 2001 -230086).

Japanese Patent Application Laid-Open No. 2001-230086 discloses that an auxiliary electrode including an upper auxiliary electrode and a lower auxiliary electrode and having an overhanging cross-sectional shape is formed before the formation of an organic layer 13 to 16 of JP-A-2001-230086). Then, the auxiliary electrode can be reliably and electrically connected to the upper electrode (corresponding to the second electrode) using a portion located under the protruding upper portion of the auxiliary electrode.

However, the organic layer is made of an organic semiconductor material having a mobility of about 10 ^-3 cm 2 / V · s to about 10 ^-6 cm 2 / V · s and a very high resistance. It is difficult to electrically connect the auxiliary wiring with the second electrode when the organic layer is disposed between the auxiliary wiring provided between the pixels and the second electrode. Therefore, in the case of the configuration disclosed in Japanese Patent Application Laid-Open No. 2001-195008 or Japanese Patent Application Laid-Open No. 2002-318553, all of the organic layers for the organic EL element, as shown in Fig. 2, It is necessary to perform patterning so as to form a region where no organic layer is formed.

 In order to pattern all the organic layers for the organic EL device so that a region where no organic layer is formed on the auxiliary wiring, the number of necessary processes including alignment is equal to the number of organic layers. The device cost required for patterning all the organic layers becomes higher than the cost of the device required when patterning only a part of the organic layer such as the case where only the light emitting layer is patterned for each pixel. In addition, there is a problem in that the use efficiency of the expensive organic material used for the organic EL element caused by the prolonged working time required for film formation is lowered, and the yield is lowered due to patterning deviation in the patterning step.

Further, in the structure disclosed in Japanese Patent Application Laid-Open No. 2001-230086, a region in which the auxiliary electrode is exposed can be obtained without being covered with the organic layer without patterning the organic layer for each pixel.

However, the areas where the auxiliary electrodes are exposed are the side surfaces of the back surface of the upper auxiliary electrode and the lower auxiliary electrode. Therefore, in order to bring the second electrode (upper electrode) into contact with this region, it is necessary to make the second electrode thicker than necessary. However, in the case of an organic EL display device using a top-emission type organic EL element that draws light from the side opposite to the substrate, it is difficult to obtain high light-receiving efficiency due to a decrease in light transmittance.

It is an object of the present invention to provide an organic EL display device capable of connecting an auxiliary wiring and a second electrode functioning as a cathode to each other without patterning the organic layer for each pixel or without making the second electrode thicker than necessary.

As means for solving the above problems, an organic EL display device of the present invention comprises: a substrate; A plurality of organic EL elements formed on the substrate, the organic EL elements each including a first electrode, an organic layer including at least a light emitting layer, and a second electrode sequentially from the substrate side; A plurality of pixel defining films, each of which is an insulating film formed between the first electrodes disposed adjacent to each other; A plurality of auxiliary wirings formed on the pixel defining film and including a conductive material; And a plurality of barrier ribs formed on the auxiliary wiring and including one of an insulator and a conductor which are reverse tapered to have an inverse tapered portion, wherein the plurality of barrier ribs The auxiliary wiring and the second electrode are electrically connected to each other.

According to the present invention, the auxiliary wiring and the second electrode can be connected to each other without patterning the organic layer for each pixel, or without making the second electrode thicker than necessary. In addition, it is possible to provide an organic EL display device in which the number of patterning steps is manufactured by a small manufacturing process and the light acquisition efficiency is higher.

Further features of the present invention will become apparent from the following description of exemplary embodiments with reference to the accompanying drawings.

Hereinafter, exemplary embodiments for carrying out the present invention will be described with reference to the accompanying drawings, but the present invention is not limited to these embodiments.

1 is a schematic diagram showing an organic EL display device according to the present embodiment. This organic EL display device includes a plurality of organic EL elements each having a first electrode 300, an organic layer 310 and a second electrode 320 provided on a substrate 101, respectively. The organic layer 310 includes at least a light emitting layer. The organic EL light emitted from the light emitting layer is drawn out through the second electrode 320. The organic EL display device further includes an insulating pixel separating film (330) provided between the first electrodes disposed adjacent to each other; And an auxiliary wiring 340 formed on the pixel defining layer 330 and made of a conductive material.

In the organic EL display device according to the present embodiment, a partition 350 made of an inversely tapered insulator or a conductor is formed on the auxiliary wiring 340. The auxiliary wiring 340 and the second electrode 320 are electrically connected to each other at a position immediately below the inverse taper portion of the barrier rib 350. [

Hereinafter, the structure of the organic EL display device according to the present embodiment will be described in detail with reference to its manufacturing method.

A TFT portion 200 for driving each organic EL element is formed on a substrate 101 made of glass. The substrate 101 may be transparent or opaque. The substrate 101 may be an insulating substrate made of a synthetic resin or the like, a conductive substrate, or a semiconductor substrate. It goes without saying that an insulating film such as a silicon oxide film or a silicon nitride film may be formed on each surface of the conductive substrate and the semiconductor substrate. The active layer of each TFT included in the TFT section 200 is formed of a poly-Si layer 104. However, the material of the active layer is not limited to polycrystalline silicon. For example, amorphous silicon, microcrystalline silicon, or the like may be used. 1 shows a source region 102, a drain region 103, a gate electrode 105, a gate insulating film 106 and an interlayer insulating film 107. [

The TFT section 200 is covered with an inorganic insulating film 109 made of silicon nitride and is covered with a planarizing film 110 made of acrylic resin in order to planarize the concave and convex portions of the TFT section 200. The inorganic insulating film 109 may be an inorganic insulating film made of a silicon oxynitride film, a silicon oxide film or the like. The planarization film 110 may be a polyimide resin, a norbornene resin, a fluorine resin, or the like.

A first electrode (reflective electrode in the present embodiment) 300 is formed by patterning at a position corresponding to each pixel. The first electrode 300 is electrically connected to the drain electrode 108 of one of the TFTs included in the TFT section 200 through the contact hole formed in the inorganic insulating film 109 and the planarization film 110 Respectively. At this time, the first electrode 300 and the drain electrode 108 may be directly connected to each other, but they may be connected to each other through a metal film such as an aluminum film or a conductive oxide film such as an ITO film.

As the first electrode 300, a chromium film is used, but a silver film including a silver film or an additive, an aluminum film, an aluminum film including an additive, or an aluminum alloy film may be used. Further, a transparent conductive oxide film such as an ITO film or an IZO film may be used.

On the first electrode 300, an electrode having a high work function, for example, a transparent conductive oxide film such as an ITO film or an IZO film may be further formed to improve the carrier injection property into the organic layer.

The pixel defining layer 330 is formed to cover the periphery of the first electrode 300 and to partition the first electrodes 300. The pixel defining layer 330 may be made of an inorganic material such as a silicon oxynitride film or a silicon oxide film, or may be an acrylic resin, a polyimide resin, or a novolac resin.

An auxiliary wiring 340 is formed on the pixel defining layer 330 to contact the pixel defining layer. As the auxiliary wiring 340, an aluminum film is used, but other metal films, an aluminum film including an additive, or another metal film including an additive may be used. Further, it is preferable that the auxiliary wiring 340 has a surface parallel to the substrate surface so that the second electrode material to be formed thereafter can more reliably deposit. The film for the auxiliary wiring 340 is formed by a sputtering method, and is formed on the pixel defining film 330 formed between pixels, for example, by patterning by photolithography. A film for the auxiliary wiring 340 may be formed by a vapor deposition method or a CVD method.

Barrier ribs 350 composed of an inversely tapered insulator or conductor are formed on the auxiliary wiring 340. The partition wall 350 is obtained as follows. A negative type photosensitive material in which a UV absorber is mixed is applied by a spin coat method and is prebaked. Thereafter, UV exposure using a photomask of a predetermined pattern and development are performed. Then, the obtained material is cured by heating. When the partition 350 is formed of an insulator, an acrylic resin, a polyimide resin, a novolac resin, or the like may be used as the insulator. When the barrier rib 350 is formed of a conductor, it is preferable to use a molybdenum material, a tungsten material, an aluminum material, a titanium material, a chromium material, a silver material, an additive added thereto, or an alloy thereof, as the conductor. When the metallic material is used for the barrier rib 350, since the auxiliary wiring 340 and the barrier rib 350 are electrically connected to each other, it is expected that the wiring resistance of the auxiliary wiring 340 is lowered.

The barrier ribs 350 may include a plurality of layers. At least one of the plurality of layers may be an inorganic film such as a silicon oxide film, a silicon nitride film, or a silicon oxynitride film.

The shape of the partition 350 will be described with reference to Figs. 1, 5, 6, 7, 8 and 9A to 9N.

The reverse taper shape means a shape having an upper side width L ₃ and a lower side width L ₄ in a relationship of L ₃ <L ₄ . Therefore, as shown in Figs. 1, 5, 6, and 7, a shape in which the inclined plane is formed flat and the width is monotonously decreased toward the substrate can also be used. Also, as shown in Figs. 9A to 9N, a shape in which the inclined surface is curved, or a shape in which the width is gradually decreased can also be used. That is, the shape of the barrier ribs of the present invention is a shape in which shadows (portions where organic layers are not formed) are formed on the auxiliary wirings 340 when the organic layer is formed.

When the organic layer 310 is formed by vacuum evaporation using a point vapor source, a partition 350 is formed as follows. That is, the partition 350 is formed such that the angle? ₁ and the angle? ₂ satisfy? ₁ ?? ₂ . Here, the angle? ₁ is an angle formed by a straight line connecting the upper end portion and the lower end portion of the partition 350 and the normal line of the substrate. The angle? ₂ is an angle formed by a straight line connecting the point vapor source and the upper end positioned at the center of the substrate of the partition 350 formed at the outermost end of the substrate and the normal line of the substrate. Therefore, a shadow (a portion where the organic layer 310 is not formed) can be formed on the auxiliary wiring 340.

When the organic layer 310 is not formed on the first electrode by the barrier rib 350, the first electrode and the second electrode are short-circuited. In order to prevent this, it is preferable that the width L ₄ of the barrier rib 350 is not larger than the width L ₅ of the pixel defining film 330. That is, it is preferable that the partition 350 is formed so as to satisfy L ₄ ? L ₅ .

If the width L ₇ of the auxiliary wiring 340 is smaller than the width L _{4 of the} barrier rib 350, the second electrode 320 formed on the shadow created by the barrier rib 350 is electrically connected to the auxiliary wiring 340 is narrowed. Therefore, it is preferable that the width L ₇ of the auxiliary wiring 340 is not made smaller than the width L ₄ of the partition 350. That is, the partition 350 is preferably formed to satisfy L ₄ ? L ₇ .

The height L ₁ of the barrier rib 350 from the auxiliary wiring 340 is a height that can be formed using a photosensitive resin, typically a height within a range of 0.5 μm or more to 5 μm or less. The height L ₁ is a thickness (height) at which the first electrode and the second electrode are not short-circuited and an area where the organic layer 310 is not formed on the auxiliary wiring 340, as in the case of (L ₄ ) .

More specifically, if the angle formed by the straight line connecting the point vapor source with the upper end positioned on the end of the substrate of the outermost part of the substrate 350 and the normal line of the substrate is represented by? ₃ , The wiring 340 and the pixel defining film 330 are preferably formed such that their total height L6 satisfies the following formula 1:

<Formula 1>

_{(L 6 × tanθ 3 + L} 4/2) ≤ L 5/2.

However, the barrier ribs 350 may be provided discontinuously or continuously between the pixels. A plurality of barrier ribs or a single barrier rib may be provided between the pixels.

When the barrier ribs are disposed discontinuously, that is, as shown in FIG. 10, when the barrier ribs are intermittently provided, the area of the portion 604 covered by the reverse tapered portions of the barrier ribs increases. Therefore, the auxiliary wiring 602 and the second electrode 603 can be more reliably electrically conducted. In order to increase the area of the covered portion 604, it is preferable that the width D ₁ of the partition wall in the direction intersecting with the direction in which the partition walls are arranged is larger than the partition wall spacing D ₂ between adjacent partition walls, ₁ > D &lt; _{2 &} gt ;.

When the pixels are arranged in the form of an X-Y matrix, the auxiliary wiring 340 and the barrier ribs 350 may be provided in each region between at least one of the X direction and the Y direction, or in a region between arbitrary pixels. When the auxiliary wiring 340 is provided in one of the X direction and the Y direction, a plurality of auxiliary wirings are arranged in parallel in the display area.

Next, the organic layer 310 is formed to cover the entire display region including the first electrode 300, the pixel defining layer 330, and the barrier ribs 350. The organic layer 310 is preferably formed by a vacuum deposition method. When the organic layer 310 is preferably formed by a vacuum evaporation method, the particles of the evaporated material from the evaporation source enter the object at the same angle. Accordingly, since the reverse tapered portion of the barrier rib 350 serves as a supination, a region without the organic layer 310 is formed in the shadow portion of the auxiliary wiring 340.

It is preferable to use a deposition method in which the coverage of the organic layer 310 is lower than that of the second electrode 320. A film forming method other than the vacuum vapor deposition method may also be used. The vacuum evaporation method may be a tilted evaporation method in which a film is formed in an oblique direction with respect to the substrate.

The organic layer 310 includes, for example, three layers of a hole transporting layer, a light emitting layer, and an electron transporting layer. However, the organic layer 310 may include only a light emitting layer, or may include a plurality of layers such as two or four layers. As the hole transport layer, for example, electron donor FLO3 is used, but other materials may be used.

The light emitting layer of the organic layer 310 is separately colored by a metal mask for each luminescent color. For example, CBP doped with Ir (piq) ₃ is used as the red light emitting layer. As the green light emitting layer, for example, Alq ₃ doped with coumarin is used. As the blue light emitting layer, for example, B-Alq ₃ doped with perylene is used, but other materials may be used.

As the electron transporting layer, for example, although it is possible to use other materials such as bazophenanthroline having electron accepting property.

One of the hole transporting layer and the electron transporting layer contained in the organic layer 310 may be separately colored by a metal mask for each emission color.

The following formulas represent the molecular structure of the material forming the organic layer 310.

A transparent electrode (second electrode) 320 functioning as a cathode is formed on the organic layer 310. A preferable thickness of the second electrode 32 is 20 nm or more and 45 nm or less. If the thickness is larger than 45 nm, the light transmittance is lowered and the light extraction efficiency of the light emitted from the organic layer 310 is lowered. On the other hand, when the thickness is less than 20 nm, the sheet resistance increases. Therefore, even when the auxiliary wiring is used, it is difficult to prevent the luminance unevenness of the display surface.

The second electrode 320 is preferably formed by a sputtering method. When the second electrode 320 is formed by a film forming method which is superior in the coverage performance to the unevenness in comparison with the vacuum evaporation method, the second electrode 320 is formed in a state where the organic layer 310 on the auxiliary wiring 340 is not formed That is, just below the reverse tapered portion of the partition 350. As a result, the auxiliary wiring 340 and the second electrode 320 are electrically connected to each other at a position immediately below the inverse tapered portion of the barrier rib 350. Therefore, the auxiliary wiring 340 and the second electrode 320 can be electrically connected to each other without forming the organic layer 310 by patterning for each pixel using a metal mask. Therefore, the organic EL display device can be provided with a manufacturing process with a small number of patterning processes.

In order to form the second electrode 320, it is preferable to use a film forming method excellent in coverage performance, but it is possible to use a CVD method or the like, and any other film forming method can be used.

As the second electrode 320, an IZO film is used. For example, a transparent conductive oxide film such as ITO may be used, or a semipermeable metal film such as silver, aluminum, or gold may be used.

In the present embodiment, the first electrode functions as the anode and the second electrode functions as the cathode. In some cases, however, they are inverted (JP 2001-203080 A).

Also in this structure, as the second electrode functioning as the anode, for example, a transparent conductive oxide film made of an IZO film or ITO, or a semipermeable metal film made of, for example, silver, aluminum or gold can be used. In order to form the second electrode, it is preferable to use a film forming method having excellent coverage performance such as a sputtering method or a CVD method, and any film forming method having excellent coverage performance can be used.

In order to prevent deterioration of the organic EL display device due to moisture from the outside, the sealing glass material 401 is bonded to the substrate 101 with a UV curable epoxy resin in a nitrogen atmosphere having a dew point of -60 占 폚 or less.

It is preferable that a moisture absorbing film such as a strontium oxide film or a calcium oxide film is provided on the side of the organic EL device of the sealing glass material 401. In this embodiment, the clearance between the obtained glass substrate 101 and the sealing glass material 401 is filled with the dry nitrogen 402.

Although the sealing glass material 401 is used for sealing, an inorganic insulating film such as a silicon nitride film, a silicon oxynitride film, or a silicon oxide film can be used for sealing.

It is preferable that a polarizing plate 341 including a retardation film and a polarizing film be provided on the sealing glass material 401, but the polarizing plate 341 does not necessarily have to be provided. The retardation film and the polarizing film may be bonded to each other by an adhesive material.

The organic EL display device and the manufacturing method thereof according to the present invention can be applied to a display portion of various electric devices. For example, the organic EL display device and the manufacturing method thereof according to the present invention can be applied to an electronic finder section and a lighting apparatus of a digital camera.

While the present invention has been described with reference to exemplary embodiments, it is to be understood that the invention is not limited to the disclosed exemplary embodiments. The scope of the following claims is to be accorded the broadest interpretation so as to encompass all such modifications and equivalent structures and functions.

1 is a schematic cross-sectional view of an organic EL display device according to the present invention;

2 is a schematic cross-sectional view of a conventional active matrix type organic EL display device;

3 is a schematic cross-sectional view showing a conventional active matrix type organic EL display device

4 is a schematic cross-sectional view showing an organic layer;

5 is a schematic cross-sectional view showing a part of an organic EL display device according to the present invention;

6A, 6B, and 6C are schematic views illustrating a manufacturing process of an organic EL display device according to the present invention;

7 is a schematic cross-sectional view showing a part of an organic EL display device according to the present invention;

8 is a schematic cross-sectional view showing a part of an organic EL display device according to the present invention;

9A, 9B, 9C, 9D, 9E, 9F, 9G, 9H, 9I, 9J, 9K, 9L, 9M and 9N show the organic EL display device And Fig.

10 is a schematic plan view showing a part of an organic EL display device according to the present invention.

Description of the Related Art

101: glass substrate 102: source region

103: drain region 104: poly-Si layer (polycrystalline silicon layer)

105: gate electrode 106: gate insulating film

107: interlayer insulating film 108: drain electrode

109: inorganic insulating film 110: planarization film

200: TFT portion 300: reflective electrode (first electrode)

310: organic layer 320: transparent electrode (second electrode)

330: pixel isolation film 340: auxiliary wiring

341: Polarizing plate 350:

401: Sealed glass material 402: Dry nitrogen

500: glass substrate 501: TFT portion

510: source region 511: poly-Si layer

512: drain region 513: gate insulating film

514: gate electrode 515: interlayer insulating film

516: drain electrode 517: inorganic insulating film

518: organic flattening film 520: reflective electrode (first electrode)

521: transparent electrode 522: light emitting layer

523: hole transport layer 524: electron transport layer

525: organic layer 530: pixel separator

540: Sealed glass material 541: Inert gas

Claims (9)

Board; A plurality of organic electroluminescent devices formed on the substrate, the organic electroluminescent devices each including a first electrode, an organic layer including at least a light emitting layer, and a second electrode sequentially from the substrate side; A plurality of pixel defining films, each of which is an insulating film formed between the first electrodes disposed adjacent to each other; A plurality of auxiliary wirings formed on the pixel defining film and including a conductive material; And And a plurality of barrier ribs formed on the auxiliary wiring and including one of an insulator and a conductor which are reverse tapered to have an inverse tapered portion, Wherein the plurality of auxiliary wirings and the second electrode are electrically connected to each other at a position immediately below the inverse tapered portion of the plurality of barrier ribs. The organic light emitting display as claimed in claim 1, wherein the organic layer covers the entire display region including the first electrode, the pixel defining layer, and the barrier rib. The organic light emitting display as claimed in claim 1, wherein the second electrode is made of a transparent conductive material, and organic electroluminescence is extracted through the second electrode. The organic light emitting display as claimed in claim 1, wherein the barrier ribs comprise a plurality of layers including at least one of a silicon oxide film, a silicon nitride film, and a silicon oxynitride film. The display device according to claim 1, wherein the plurality of auxiliary wirings are arranged in parallel in a display area; Wherein the barrier ribs are intermittently provided at intervals in a direction in which the auxiliary wirings are arranged. The organic electroluminescent display device according to claim 1, wherein the thickness of the second electrode is 20 nm or more and 45 nm or less. Board; A plurality of organic electroluminescent devices formed on the substrate, each organic electroluminescent device including a first electrode, an organic layer including at least a light emitting layer, and a second electrode; A plurality of pixel defining films, each of which is an insulating film formed between the first electrodes disposed adjacent to each other; A plurality of auxiliary wirings formed on the plurality of pixel defining films and including a conductive material; And A plurality of partition walls A method of manufacturing an organic light emitting display device, Forming a first electrode on a substrate; Forming a pixel defining layer covering the peripheral portion of the first electrode so as to partition each first electrode; Forming an auxiliary wiring on the pixel separation film; Forming, on the auxiliary wiring, a plurality of partitions including one of an insulator and a conductor which are reversely tapered to have a reverse tapered part; Forming an organic layer so as to cover the entire display region including the first electrode, the pixel defining layer, and the barrier rib; And And forming a second electrode on the organic layer, and electrically connecting the auxiliary wiring and the second electrode at a position immediately below the inverse taper portion of the barrier rib. The method according to claim 7, wherein the step of forming the organic layer includes a vacuum evaporation method. 8. The method according to claim 7, wherein the step of forming the second electrode includes a sputtering method.

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