KR100966974B1 - Method and apparatus for measuring deformation of laminated body - Google Patents

Abstract

One side of the present invention, one side of the present invention, the step of forming a laminate in a state where a plurality of individual chips are arranged by pressing a plurality of green sheets having a plurality of internal electrodes arranged in a stack, the XY plane of the laminate Marking position information of each of the plurality of individual chips on a surface of each of the plurality of individual chips, separating the stacked body into a plurality of individual chips, and modifying the separated individual chips. It may provide a laminate deformation measuring method comprising the step of measuring the degree, and the step of storing the deformation degree measured in each of the separated individual chips corresponding to the position information of each individual chip.

Laminated body, deformation, measuring

Description

METHOD AND APPARATUS FOR MEASURING DEFORMATION OF LAMINATED BODY

The present invention relates to a method and apparatus for measuring the deformation of a laminate, and more particularly, in the laminate in which the individual chips are arranged, the deformation of the laminate is measured by data by measuring the degree of deformation generated at each individual chip during stack pressing. It relates to a measuring method and a measuring device.

In general, multilayer ceramic capacitors are chip-type capacitors that play an important role in charging or discharging electricity when mounted on printed circuit boards of various electronic products such as mobile communication terminals, notebook computers, computers, and personal portable terminals. Therefore, it takes various sizes and laminated forms.

In order to manufacture a ceramic laminate in which a plurality of laminated ceramic capacitors are simultaneously manufactured, the ceramics in slurry form are continuously coated on a continuous PET film in a thin thickness of several to several tens of micrometers, dried and cut to form a green sheet. After forming, a predetermined pattern is printed on the surface of the green sheet, a plurality of green sheets on which the pattern is printed are laminated, and the laminate is pressed through a pressing process at a predetermined pressure.

1 is an exploded perspective view of a ceramic laminate for producing a multilayer ceramic capacitor according to the prior art.

Referring to FIG. 1, the ceramic laminate 100 may be formed by stacking a plurality of ceramic green sheets 111, 112, 113, 114, and 115.

Conductor patterns 121 and 131 for forming internal electrodes may be formed on the ceramic green sheets. Herein, internal electrodes for forming the multilayer ceramic capacitor (MLCC) are formed in each ceramic green sheet.

In order to form a multilayer ceramic capacitor, the laminate may be separated into individual chips and baked. When the laminate is cut along the dotted line illustrated in the drawing, a plurality of multilayer ceramic capacitor chips having internal electrodes exposed on one side thereof may be formed.

When the ceramic laminate is formed, a process of pressurizing at a predetermined temperature and pressure is performed, and the shape of the ceramic laminate may be deformed by the pressure during the pressing process. Accordingly, the position of the internal electrode formed on the green sheet is changed, and when such deformation occurs, a difference may occur between a design value of the ceramic laminate and a measurement value of the ceramic laminate actually formed.

In order to solve the above problems, the present invention is to store the deformation degree of the laminate produced according to the pressurized state during the formation of the ceramic laminate as data so that the data can be referenced later when forming the laminate laminate measurement method And a laminate deformation measuring apparatus.

According to an aspect of the present invention, forming a laminate in a state where a plurality of individual chips are arranged by stacking and pressing a plurality of green sheets having a plurality of internal electrodes arranged thereon, and the plurality of individual chips on the XY plane of the laminate. Marking position information on the surface of each of the plurality of individual chips, cutting the laminate into a plurality of individual chips, measuring the degree of deformation of each separated individual chip, and It is possible to provide a laminate deformation measuring method comprising storing the deformation degree measured in each of the separated individual chips corresponding to the position information of each individual chip.

The marking may be laser printing or inkjet printing.

The marking may include printing a bar code indicating position information of the individual chip.

The step of measuring the degree of deformation may be to photograph each of the six sides of the cut individual chip.

The storing of the degree of deformation may include storing data of the difference between the design value and the measured value of the individual chip.

The individual chip may be a multilayer ceramic capacitor (MLCC).

Another aspect of the present invention, the marking portion for marking the position information of the individual chip on the surface of each of the individual chip on the XY plane of the stack in which the plurality of individual chips are arranged, and separating the marked stack into individual chips According to the present invention, there is provided a laminate deformation measuring apparatus including a cutting unit, a measuring unit measuring a deformation degree of the separated individual chip, and a storage unit storing the measured deformation degree corresponding to the position information.

The marking unit may be a laser printer or an inkjet printer.

The measuring unit may be a photographing apparatus for photographing each of the cut six-sided surface of the individual chip.

According to the present invention, the degree of deformation of the laminate generated according to the pressurized state during the formation of the ceramic laminate can be stored as data, so that the data can be referred to later when forming another laminate, thereby enabling quantitative measurement of laminate deformation. .

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 (a) to 2 (e) are flowcharts showing the procedure of the laminate deformation measuring method according to the embodiment of the present invention.

Referring to (a) to (e) of Figure 2, the laminate deformation measuring method according to the present embodiment, forming a laminate (a), marking (b), the step of separating into individual chips ( c) measuring the deformation degree of the individual chip (d), and storing the deformation degree (e).

2A is a step of forming a laminate.

In the present embodiment, the laminate may be formed by stacking a plurality of green sheets. A plurality of internal electrode conductive patterns may be arranged in the plurality of green sheets, and the laminate in which a plurality of internal electrodes are stacked may be divided into a plurality of individual chips by the shape of the conductive pattern for the internal electrodes. .

In order to form the laminate, a plurality of green sheets may be laminated and then subjected to a pressing process at a predetermined temperature and pressure. At this time, the shape of the conductive pattern for the internal electrodes formed inside the laminate by the pressing process may cause deformation. In the drawings, the form in which the deformation occurs in the laminate is not clearly shown, but the actual measurement in the laminate is regarded as having a predetermined difference from the design value of the laminate.

In this embodiment, individual chips on the laminate are divided by dotted lines. The dotted line is not a line formed on the actual stack, but an arbitrary line for distinguishing individual chips of the stack.

2B is a step of marking the position information on the XY plane of each individual chip on each individual chip in the stack.

Each individual chip on the stack may have location information on the XY plane. In this embodiment, the stack may be divided into 4 × 3 individual chips, and each individual chip may be represented by XY coordinates. The location information formed on each individual chip may indicate the number of rows and columns of the individual chips in the stack.

In the present embodiment, the marking of the location information may use a method of marking the barcode 241. The bar code can store two columns of 8-bit information to store the row and column positions of each individual chip. The process of marking the location information may be implemented in various ways.

The marking of the location information may be performed by a laser printing process or an inkjet printing process. When the mark indicating the location information is displayed by a barcode, the barcode may be printed on a designated marking area by laser printing or inkjet printing.

2C is a step of separating the laminate into individual chips.

In the separating of the laminate into individual chips, the laminate may be cut by using a cutter. In order to facilitate this cutting process, an index may be formed on the side surface of the laminate to indicate where to cut. In this step, the cutter may be photographed to position the cutter at a position where the index is formed and the cutting process may be performed.

Here, in order to cut the exact position of the index displayed on the stack, the cutter may finely rotate the stack from side to side to adjust the exact position.

By this process, the stack can be separated into a plurality of individual chips 201, where the position information on the XY plane in the stack is marked 241 on the surface of each of the separated individual chips.

2 (d) is a step of measuring the degree of deformation of the separated individual chip.

In the present embodiment, the step of measuring the degree of deformation of the individual chip, it may be to photograph each of the six sides of the separated individual chip.

By photographing the six-sided surface of the separated individual chip 201, it is possible to observe the deformation of the internal electrode formed between the stacked green sheets. That is, when photographing each side of the separated individual chip, the difference in contrast occurs due to the conductive pattern for the internal electrode formed between the stacked green sheets. Since the shape of the internal electrode conductive pattern formed inside the laminate can be measured by the difference in contrast, the internal electrode conductive pattern formed on the green sheet before the lamination process and the internal electrode conductive pattern deformed after the lamination process can be measured. The forms can be compared.

2E is a step of storing the measured deformation degree corresponding to the location information marked on the individual chip.

In this embodiment, the deformation degree of each individual chip measured in the measuring step can be stored in the position information of each individual chip. The data stored in this way may be data indicating the degree of deformation during lamination according to the position on the XY plane of the laminate through simulation.

When the deformation degree data is stored in the position information of each individual chip as in the present embodiment, the deformation degree according to the position in the stack of each individual chip can be easily calculated using the stored deformation degree data. . That is, using such data, when forming another laminate later, it is possible to easily estimate the degree of deformation during lamination.

3 is a process chart of the step of measuring the degree of deformation of the individual chip according to another embodiment of the present invention.

Referring to FIG. 3, in the present embodiment, the individual chips 301 may include a plurality of green sheets 311, 312, 313, 314, and 315, and may include conductive patterns for internal electrodes between the stacked green sheets. 321, 322, 331, and 332 may be formed. In the present embodiment, the individual chip may be a chip for MLCC (Multi Layer Ceramic Capacitor). A first external electrode connected to the internal electrodes 321 and 322 exposed on one side of the internal electrodes formed between the green sheets, and a second external electrode connected to the internal electrodes 331 and 332 exposed to the other side thereof. By forming MLCCs can be formed.

The individual chips 301 of the present embodiment can be obtained by cutting a laminate in which a plurality of individual chips are arranged. The laminate may be formed by stacking a plurality of green sheets in which a plurality of conductive patterns for internal electrodes are arranged. At this time, in order to form the laminate may be subjected to a step of pressing at a predetermined temperature and pressure. In this pressing process, the shape of the conductive pattern for the internal electrodes in the laminate may be different from that of the conductive pattern for the internal electrodes formed on the green sheet. In the individual chips shown in this drawing, the shape of the internal electrodes formed between the green sheets is regarded as different from that in the initial design.

In this embodiment, measuring the degree of deformation of the individual chips can proceed to the process of photographing the six sides of the individual chips. 3 is a view taken from the front (a), the back (b), the left (c), the right (d), the plane (e), and the back (f) of the individual chip, respectively.

When photographed from the front and rear of the individual chip (a and b), the internal electrodes formed between the stacked green sheets are not directly exposed to the surface, but the internal electrodes formed between the green sheets are separated from the surface of the individual chips. The shade of may vary. In the present embodiment, the shape and position of the internal electrodes in the individual chips can be measured by the shadows obtained by photographing the front surface of the individual chips.

When photographing from the left side and the right side of the individual chip (c and d), the second internal electrodes 331 and 332 are exposed on the left side of the individual chip, and the first internal electrodes 321 and 322 are exposed on the right side. May be exposed. In the case of forming the MLCC with the individual chip of the present embodiment, the first internal electrodes 321 and 322 and the second internal electrodes 331 and 332 may be connected to the first external electrode and the second external electrode, respectively. In this embodiment, the shapes and positions of the internal electrodes exposed on the left and right sides of the individual chips can be photographed.

When the plane and the back surface of the individual chip are photographed (e and f), the internal electrodes formed between the stacked green sheets are not directly exposed to the surface, but the internal electrodes formed between the green sheets are not exposed on the surface of the individual chips. The shade of may vary. In the present embodiment, the shape and position of the internal electrodes in the individual chips can be measured by the shadows obtained by photographing the front surface of the individual chips. In addition, when photographing the plane of the individual chip, a marking for displaying the position information of the individual chip may be displayed.

As such, the difference between the dimensions of the internal electrode at the time of designing the individual chip and the dimension after the actual stacking may be data by using the screen photographing the separated surface of the individual chip. The data indicating the degree of deformation according to the position of the individual chips can be used as useful data in the process of forming another laminate later.

4 is a configuration diagram of a laminate deformation measuring apparatus according to an embodiment of another aspect of the present invention.

Referring to FIG. 4, the laminate deformation measuring apparatus 400 according to the present exemplary embodiment may include a marking unit 410, a cutting unit 420, a measuring unit 430, and a storage unit 440.

The marking unit 410 may mark the position information of each individual chip on the surface of the stack in which a plurality of individual chips are arranged.

Each individual chip on the stack may have location information on the XY plane. Each individual chip may be represented by XY coordinates. The location information formed on each individual chip may indicate the number of rows and columns of the individual chips in the stack.

In this embodiment, the marking part can use the method of marking a barcode. The process of marking the location information may be implemented in various ways.

The marking unit may be a laser printer or an inkjet printer. When the mark indicating the location information is displayed by a barcode, the barcode may be printed on a designated marking area by laser printing or inkjet printing.

The cutting unit 420 may cut and separate the stacked body in which the plurality of individual chips are arranged into each individual chip.

The cutting unit 420 may cut the laminate using a cutter to separate the chips into individual chips. In order to facilitate this cutting process, an index may be formed on the side surface of the laminate to indicate where to cut. The cutting unit may photograph the index to position the cutter at the position where the index is formed and proceed with the cutting process.

Here, in order to cut the exact position of the index displayed on the stack, the cutter may finely rotate the stack from side to side to adjust the exact position.

The measuring unit 430 may measure the degree of deformation of the individual chip separated from the cutting unit. In the present embodiment, the measuring unit may be a photographing apparatus for photographing the six surfaces of the separated individual chips.

By photographing the six-sided surface of the separated individual chip in the measurement unit, it is possible to observe the deformed shape of the internal electrode formed between the stacked green sheets. That is, when photographing each side of the separated individual chip, the difference in contrast occurs due to the conductive pattern for the internal electrode formed between the stacked green sheets. Since the shape of the internal electrode conductive pattern formed inside the laminate can be measured by the difference in contrast, the internal electrode conductive pattern formed on the green sheet before the lamination process and the internal electrode conductive pattern deformed after the lamination process can be measured. The forms can be compared.

The storage unit 440 may store the measured deformation degree in correspondence with the location information marked on the individual chip.

In this embodiment, the deformation degree of each individual chip measured by the measuring unit 430 may be stored in the position information of each individual chip. The data stored in this way may be data indicating the degree of deformation during lamination according to the position on the XY plane of the laminate through simulation.

It is intended that the invention not be limited by the foregoing embodiments and the accompanying drawings, but rather by the claims appended hereto. It will be apparent to those skilled in the art that various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims. something to do.

1 is an exploded perspective view of a laminate according to the prior art.

2 is a flowchart of a laminate deformation measuring method according to an embodiment of the present invention.

3 is a schematic diagram of a step of measuring the degree of deformation of individual chips in the laminate deformation measuring method according to another embodiment of the present invention.

4 is a configuration diagram of a laminate deformation measuring apparatus according to another aspect of the present invention.

<Code Description of Main Parts of Drawing>

200: laminated body 241: mark

201: Individual Chip

Claims (9)

Stacking and pressing a plurality of green sheets in which a plurality of internal electrodes are arranged to form a stack in which a plurality of individual chips are arranged; Marking position information of the plurality of individual chips on a surface of each of the plurality of individual chips on the XY plane of the stack; Cutting the laminate to separate the plurality of individual chips; Measuring a degree of deformation of each separated individual chip; And Storing the deformation degree measured in each of the separated individual chips corresponding to the position information of the individual chips, respectively. Laminate deformation measurement method comprising a. The method of claim 1, The marking step, Method for measuring the laminate deformation, characterized in that the laser printing or inkjet printing. The method of claim 1, The marking step, Laminated deformation measurement method characterized in that for printing a bar code indicating the position information of the individual chip. The method of claim 1, Measuring the deformation degree, The laminate deformation measurement method, characterized in that for shooting each of the cut six sides of the individual chip. The method of claim 1, The step of storing the deformation degree, The method of claim 1, wherein the difference between the design value and the measured value of the individual chip is stored as data. The method of claim 1, The individual chip, Multilayer ceramic capacitors (MLCC: Multi Layer Ceramic Capacitor) characterized in that the laminate deformation measurement method. Marking unit for marking the position information of the individual chip on the surface of each individual chip on the XY plane of a stack of a plurality of individual chips are arranged; A cutting unit for separating the marked stack into individual chips; A measuring unit measuring a deformation degree of the separated individual chip; And A storage unit for storing the measured deformation degree corresponding to the location information Laminate deformation measurement device comprising a. The method of claim 7, wherein The marking unit, It is a laser printer or an inkjet printer, The laminated body deformation measuring apparatus characterized by the above-mentioned. The method of claim 7, wherein The measuring unit, Laminated body deformation measuring apparatus characterized in that the photographing device for photographing the six sides of the cut individual chip.

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