KR100963603B1 - Apparatus for inspecting wafer using a linear robot - Google Patents

Apparatus for inspecting wafer using a linear robot Download PDF

Info

Publication number
KR100963603B1
KR100963603B1 KR1020090065496A KR20090065496A KR100963603B1 KR 100963603 B1 KR100963603 B1 KR 100963603B1 KR 1020090065496 A KR1020090065496 A KR 1020090065496A KR 20090065496 A KR20090065496 A KR 20090065496A KR 100963603 B1 KR100963603 B1 KR 100963603B1
Authority
KR
South Korea
Prior art keywords
wafer
conveyor
inspection
conveying direction
vision module
Prior art date
Application number
KR1020090065496A
Other languages
Korean (ko)
Inventor
이의용
임중재
Original Assignee
주식회사 창성에이스산업
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 창성에이스산업 filed Critical 주식회사 창성에이스산업
Priority to KR1020090065496A priority Critical patent/KR100963603B1/en
Application granted granted Critical
Publication of KR100963603B1 publication Critical patent/KR100963603B1/en
Priority to US12/837,279 priority patent/US8415967B2/en

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G01N21/9505—Wafer internal defects, e.g. microcracks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Abstract

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer inspection apparatus using a linear robot that can perform surface inspection and internal inspection of a wafer continuously in one device, and can inspect a large amount of wafers at one time.

A conveyor configured to transfer a plurality of wafers loaded on the upper surface while being rotated at a constant speed by receiving power of a motor; A surface inspection unit in which a first vision module is installed to reciprocate in a direction orthogonal to a conveying direction of the conveyor and inspects a surface of the wafer; An inner inspection unit installed spaced apart from the surface inspection unit in a conveying direction of the conveyor and configured to reciprocate in a direction perpendicular to a conveying direction of the conveyor so as to inspect the inside of the wafer; And a controller configured to control the series of wafer inspection processes according to sequential control programming.

Description

Apparatus for inspecting wafer using a linear robot}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wafer inspection apparatus using a linear robot, and more particularly, to a wafer inspection apparatus using a linear robot that can continuously perform surface inspection and internal inspection of a wafer in one apparatus.

In general, solar cells are devices that convert solar light into electrical energy using semiconductor properties. Recently, it is used for the production of auxiliary power of portable information devices such as mobile phones and PDAs, driving power of mobile means such as automobiles, power generation, and hot water. The solar cell module that generates the miniaturization and high output by connecting to the current situation is being actively researched.

The solar cell (hereinafter referred to as a "wafer") is a surface and internal inspection during the manufacturing process, that is, the essential inspection such as uniformity, hot spots, unevenness of the surface and surface contamination degree sequentially proceeds, such surface and Internal inspections are carried out in separate inspection units. In other words, after the surface inspection of the wafer is completed in the surface inspection apparatus, the operator moves the wafer cassette to another inspection apparatus and performs the wafer internal inspection.

1 is a plan view showing the structure of a conventional wafer inspection apparatus.

Referring to FIG. 1, a conventional wafer inspection apparatus 1 includes a plurality of wafers W on a top surface of a conveyor 10 that is rotated by a power of a motor (not shown) by a wafer transfer robot (not shown). Loading and conveying, by suction-transferring one by one of the wafer (W) to be transported by the articulated robot (13) installed on the conveyor 10 put on the stage (21) of the inspection device 20 provided on one side to inspect Then, the inspection is completed, the wafer (W) is made by placing on the conveyor 10 again.

These inspection devices (1) are independently separated from the main production line, so the connection of the process is lowered, and a plurality of wafers (W) are transported one by one for inspection, which is a great way to inspect the wafers (W) in this way. There is a problem that takes time.

In addition, in order to proceed with the inspection process, a worker has to manually carry and move a cassette (not shown) on which a wafer is loaded. ) Is a problem that occurs when the particles are contaminated.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and a wafer inspection apparatus using a linear robot capable of continuously performing a surface inspection and an internal inspection of a wafer in one apparatus and inspecting a large amount of wafers at one time. The purpose is to provide.

Wafer inspection apparatus using the linear robot of the present invention for realizing the object as described above, the conveyor for transporting a plurality of wafers loaded on the upper surface while being rotated at a constant speed by receiving the power of the motor; A surface inspection unit in which a first vision module is installed to reciprocate in a direction orthogonal to a conveying direction of the conveyor and inspects a surface of the wafer; An inner inspection unit installed spaced apart from the surface inspection unit in a conveying direction of the conveyor and configured to reciprocate in a direction perpendicular to a conveying direction of the conveyor so as to inspect the inside of the wafer; And a controller configured to control the series of wafer inspection processes according to sequential control programming.

In this case, the surface inspection unit, the base frame is installed in a direction orthogonal to the conveying direction of the conveyor, the lead screw inside the base frame is coupled to the motor and the other end is coupled to the bearing rotatably, the lead A linear robot consisting of a transfer table screwed to the screw and reciprocated; And a first vision module comprising a camera fixed to the transfer table and surface inspection lights installed at both sides thereof.

In addition, the internal inspection unit, the base frame is installed in a direction orthogonal to the conveying direction of the conveyor, the lead screw inside the base frame is coupled to the motor and the other end is rotatably coupled to the bearing, and the lead screw A linear robot consisting of a transfer table screwed to and reciprocated; And a second vision module comprising a camera fixed to the transfer table and an internal inspection light positioned to correspond to the camera at a lower side of the conveyor.

In addition, the conveyor in which the second vision module is installed is characterized in that a predetermined spaced space is formed to allow the camera and the internal inspection light to see the inside of the wafer.

In addition, the conveying robot is provided on the upper side or one side of the conveyor so as to absorb the wafer determined to be defective according to the surface or internal inspection result of the wafer and transport the wafer to the outside.

In the wafer inspection apparatus using the linear robot according to the present invention having the above-described configuration, the surface inspection and the internal inspection of the wafer can be carried out continuously in a single device, and as a result, a plurality of wafers can be processed at once. This has the advantage of being improved.

Hereinafter, the configuration and operation of the preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.

Here, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are denoted by the same reference numerals as much as possible even if displayed on the other drawings.

2 is a perspective view of a wafer inspection apparatus using a linear robot according to the present invention, FIG. 3 is a plan view of the wafer inspection apparatus, and FIG. 4 is an overall configuration diagram of the wafer inspection apparatus.

2 to 4, the wafer inspection apparatus 100 using the linear robot according to the present invention includes a conveyor 110, a surface inspection unit 200, an internal inspection unit 300, and a controller 500. .

Referring to the configuration of the present invention in detail as follows.

The conveyor 110 is rotated at a constant speed by receiving the power of a motor (not shown), the conveyor 110 transfers a plurality of wafers (W) loaded on the upper surface by a wafer transfer robot (not shown). I will let you.

The surface inspection unit 200 sequentially inspects the surface of the wafer W transferred by the conveyor 110, and the surface inspection unit 200 includes a linear robot 210 and a first vision module 230. .

In this case, the linear robot 210 is a base frame 211 is installed in a direction orthogonal to the conveying direction of the conveyor 110, one end is coupled to the motor 213 in the base frame 211 and the other end bearing Lead screw 215 is coupled and rotatably installed, and the transfer table 217 is screwed to the lead screw 215 is reciprocated.

In addition, as shown in FIG. 5, the first vision module 230 includes a camera 231 fixed to the transfer table 217 and a surface inspection light (LED light) 233 installed at both sides thereof. In addition, the surface of the wafer W transported by the conveyor 110 may be inspected for scratches, cracks, and contamination.

The internal inspection unit 300 is installed at a rear of the surface inspection unit 200, that is, spaced apart from the surface inspection unit 200 by a predetermined distance in the conveying direction of the conveyor 110, and then transferred to the wafer after the inspection is completed by the surface inspection unit 200 ( In order to inspect the interior of the W), the internal inspection unit 300 is composed of a linear robot 310 and the second vision module 330.

In this case, the linear robot 310 is a base frame 311 is installed in a direction orthogonal to the conveying direction of the conveyor 110, one end is coupled to the motor 313 in the base frame 311 and the other end is a bearing Lead screw 315 is coupled and rotatably installed, and the transfer table 317 is screwed to the lead screw 315 is reciprocated.

In addition, as shown in FIG. 6, the second vision module 330 is positioned to correspond to the camera 331 fixed to the transfer table 317 and the lower side of the conveyor 110. It consists of an internal inspection light (IR illumination) 333, and inspects the cracks, voids (Void) and the like inside the wafer (W).

In this case, a predetermined space t is formed in the conveyor 110 in which the wafer W internal inspection is performed by the second vision module 330. That is, when the conveyor 110 is installed in such a way as to intercept the camera 331 and the internal inspection light 333, the internal inspection itself as the camera 331 can not see the inside of the wafer (W) Will not be made. Therefore, the conveyor 110 is installed in a bisected structure so that a predetermined space t is formed between the camera 331 and the internal inspection light 333.

The cameras 231 and 331 used in the first and second vision modules 230 and 330 may be applied to any one of a charge-coupled device camera or a line scan camera.

In this case, when the cameras 231 and 331 are applied to the CCD camera, the conveyor 110 to be transported operates by repeating the operation and the stop. In other words, while the CCD camera repeats the transfer and stop, the conveyor 110 is stopped for a while while the loaded wafer W is inspected. After the inspection of the wafer W is completed, the conveyor 110 operates again to transfer the next loaded wafer W to the inspection position.

In addition, when the cameras 231 and 331 are applied as line scan cameras, the conveyor 110 continues to transfer without stopping at a constant speed. That is, the line scan camera is quickly transferred to match the transfer speed of the wafer (W) to inspect the wafer (W). That is, the conveyor 110 and the line scan camera continuously inspect the wafer W without stopping.

The control unit 500 compares the measured data with the previously input data during the surface and internal inspection of the wafer W, determines whether the wafer W is defective, and transfers the wafer W according to sequential control programming. It will control a series of wafer (W) transfer and inspection process.

On the other hand, a separate wafer transfer robot on the upper side or one side of the conveyor 110 to adsorb the wafer (W) determined to be defective according to the inspection result of the surface inspection unit 200 or the internal inspection unit 300 to be transported to the outside. (R) (see FIG. 7) is provided.

7 is another embodiment of a wafer inspection apparatus according to the present invention.

Referring to FIG. 7, two linear vision modules 230 and two second vision modules 330 are installed in the linear robots 210 and 310, respectively.

Therefore, when performing the surface or internal inspection of the wafer W transferred by the conveyor 110, the first and second vision modules 230 and 330, which are each installed two at a time, are simultaneously moved from one side or both sides to the center. As the inspection is carried out while transferring, it is possible to reduce the inspection time of the wafer (W).

Then, the wafer inspection process using the linear robot according to the present invention having the above configuration will be described.

First, a plurality of wafers (W) loaded on the conveyor 110 and transferred to one side are positioned in the surface inspection unit 200 and the first vision module 230 is in a direction orthogonal to the conveying direction of the conveyor 110. While being transferred, the surface inspection of the wafer W is performed.

The wafer (W) having the surface inspection completed is positioned in the internal inspection unit 300 spaced apart from the rear of the surface inspection unit 200 while being continuously transported by the conveyor 110, and the second vision module 330 is the conveyor ( The internal inspection of the wafer W is performed while being transferred in a direction orthogonal to the conveying direction of 110.

In this case, the controller 500 compares the input data with the measured value to determine whether the wafer W is defective, and the wafer determined as defective by the surface inspection unit 200 or the internal inspection unit 300 ( W) to control the separate wafer transfer robot (R) to pick out to the outside.

The wafer W, which is not found in the surface inspecting unit 200 and the internal inspecting unit 300, is continuously transferred by the conveyor 110 and then loaded into the cassette by the wafer transfer robot.

Meanwhile, the wafer inspection apparatus according to the present invention has been illustrated and described as being used for the surface and internal inspection of a wafer (solar cell). However, the present invention is not limited to the above-described embodiment, but the mobile phone camera lens and the digital camera lens Also, it can be used for the surface and internal inspection of CCTV lens, IR camera lens (irradiation fire), jewelry, etc., by a person having ordinary knowledge in the technical field to which the present invention belongs without departing from the spirit of the present invention. Of course, various changes and modifications are possible.

1 is a plan view showing the structure of a conventional wafer inspection apparatus;

2 is a perspective view of a wafer inspection apparatus using a linear robot according to the present invention;

3 is a plan view of a wafer inspection apparatus according to the present invention;

4 is an overall configuration diagram of a wafer inspection apparatus according to the present invention;

5 is a cross-sectional view taken along the line A-A of FIG.

6 is a cross-sectional view taken along the line B-B of FIG.

7 is another embodiment of a wafer inspection apparatus according to the present invention.

<Description of the symbols for the main parts of the drawings>

100: wafer inspection device 110: conveyor

200: surface inspection unit 210: linear robot

230: first vision module 300: internal inspection unit

310: linear robot 330: second vision robot

500: control unit

Claims (5)

A conveyor configured to transfer a plurality of wafers loaded on the upper surface while being rotated at a constant speed by receiving power of a motor; A surface inspection unit in which a first vision module is installed to reciprocate in a direction orthogonal to a conveying direction of the conveyor and inspects a surface of the wafer; An inner inspection unit installed spaced apart from the surface inspection unit in a conveying direction of the conveyor and configured to reciprocate in a direction perpendicular to a conveying direction of the conveyor so as to inspect the inside of the wafer; A wafer inspection apparatus using a linear robot comprising a; control unit for controlling the series of wafer inspection process according to the sequential control programming, The surface inspection unit includes a base frame installed in a direction orthogonal to the conveying direction of the conveyor, a lead screw having one end coupled to a motor and the other end bearing coupled to the inside of the base frame and rotatably installed, and a screw on the lead screw. A linear robot consisting of a transfer table coupled and reciprocated; And a first vision module comprising a camera fixed to the transfer table and LED lighting for surface inspection installed at both sides thereof. The inner inspection unit is a base frame installed in a direction orthogonal to the conveying direction of the conveyor, a lead screw inside the base frame is coupled to the motor and the other end is coupled to the bearing rotatably and screwed to the lead screw A linear robot consisting of a transfer table coupled and reciprocated; And a second vision module comprising a camera fixed to the transfer table and an internal inspection infrared (IR) light positioned below the conveyor to correspond to the camera. Inspection device. The method of claim 1, The cameras installed in the first vision module and the second vision module are CCD cameras or line scan cameras, respectively. delete 3. The method according to claim 1 or 2, The conveyor provided with the second vision module is a wafer inspection apparatus using a linear robot, characterized in that a predetermined spaced space is formed so that the camera and the internal inspection infrared (IR) light can see the inside of the wafer. . 3. The method according to claim 1 or 2, Wafer inspection apparatus using a linear robot on the upper side or one side of the conveyor is provided with a wafer transfer robot to absorb and transfer the wafer determined to be defective according to the surface or internal inspection results of the wafer.
KR1020090065496A 2009-07-17 2009-07-17 Apparatus for inspecting wafer using a linear robot KR100963603B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
KR1020090065496A KR100963603B1 (en) 2009-07-17 2009-07-17 Apparatus for inspecting wafer using a linear robot
US12/837,279 US8415967B2 (en) 2009-07-17 2010-07-15 Wafer inspection apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020090065496A KR100963603B1 (en) 2009-07-17 2009-07-17 Apparatus for inspecting wafer using a linear robot

Publications (1)

Publication Number Publication Date
KR100963603B1 true KR100963603B1 (en) 2010-06-15

Family

ID=42370029

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020090065496A KR100963603B1 (en) 2009-07-17 2009-07-17 Apparatus for inspecting wafer using a linear robot

Country Status (1)

Country Link
KR (1) KR100963603B1 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101141720B1 (en) 2010-09-29 2012-05-04 한국에너지기술연구원 Apparatus for measuring adhesive strength of a photovoltaic module
KR101186270B1 (en) 2011-01-14 2012-09-27 엘아이지에이디피 주식회사 Linear actuator and Substrate inspection apparatus using the same
CN104391390A (en) * 2014-12-18 2015-03-04 合肥鑫晟光电科技有限公司 Substrate checking device and method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003065727A (en) * 2001-08-28 2003-03-05 Mitsubishi Heavy Ind Ltd Device for measuring thickness of transmissive film and film producing apparatus employing the same
KR20040067908A (en) * 2003-01-20 2004-07-30 오에누 덴시 가부시키가이샤 Substrate inspecting apparatus
JP2009122036A (en) 2007-11-16 2009-06-04 Sharp Corp Appearance inspecting device of solar cell

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003065727A (en) * 2001-08-28 2003-03-05 Mitsubishi Heavy Ind Ltd Device for measuring thickness of transmissive film and film producing apparatus employing the same
KR20040067908A (en) * 2003-01-20 2004-07-30 오에누 덴시 가부시키가이샤 Substrate inspecting apparatus
JP2009122036A (en) 2007-11-16 2009-06-04 Sharp Corp Appearance inspecting device of solar cell

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101141720B1 (en) 2010-09-29 2012-05-04 한국에너지기술연구원 Apparatus for measuring adhesive strength of a photovoltaic module
KR101186270B1 (en) 2011-01-14 2012-09-27 엘아이지에이디피 주식회사 Linear actuator and Substrate inspection apparatus using the same
CN104391390A (en) * 2014-12-18 2015-03-04 合肥鑫晟光电科技有限公司 Substrate checking device and method
CN104391390B (en) * 2014-12-18 2017-05-10 合肥鑫晟光电科技有限公司 Substrate checking device and method
US9880408B2 (en) 2014-12-18 2018-01-30 Boe Technology Group Co., Ltd. Substrate inspection device and method

Similar Documents

Publication Publication Date Title
US8415967B2 (en) Wafer inspection apparatus
KR100989561B1 (en) Led and wafer inspection apparatus and inspection method of the same
KR100939645B1 (en) Apparatus for inspecting wafer
CN113390889B (en) Bilateral multistation multi-viewpoint outward appearance detection device
JP3143169U (en) Solar cell inspection equipment
KR100963603B1 (en) Apparatus for inspecting wafer using a linear robot
US20100040277A1 (en) Panel inspection device and inspection method of panel
CN109261542B (en) Battery cell detection sorting method
TW201302583A (en) Device for production line and production line thereof
WO2020191919A1 (en) Appearance detection device and appearance detection method for product to be detected
TWI517951B (en) Robot system
JP4767302B2 (en) Double-sided inspection equipment for bare chips
KR101377988B1 (en) Lens assembly, high-speed inspection equipment
KR100915691B1 (en) Inspection apparatus flat display pannel and inspection method thereby
TWI582413B (en) One-sided and two-sided lightning inspection apparatus
JP2007144546A (en) Gripping device for visual inspection
KR101719383B1 (en) Substrate processing apparatus, substrate processing method, and computer-readable recording medium having program for executing the substrate processing method recorded therein
TWI599769B (en) Apparatus and method for appearance inspection
KR20190135498A (en) Article inspection method and article inspection device
CN115643397A (en) Processor for inspecting camera module and apparatus for inspecting camera module
JP2017015421A (en) Appearance inspection device and appearance inspection method
KR20110131016A (en) Inspecting device for solar cell
KR20100071551A (en) Wafer vision inspection apparatus
KR101097939B1 (en) lay-up system for manufacturing solar cell module and aligner used in the system
KR20150142409A (en) Apparatus and Method for inspection display panel

Legal Events

Date Code Title Description
A201 Request for examination
A302 Request for accelerated examination
E902 Notification of reason for refusal
E701 Decision to grant or registration of patent right
GRNT Written decision to grant
FPAY Annual fee payment

Payment date: 20130610

Year of fee payment: 4

FPAY Annual fee payment

Payment date: 20140528

Year of fee payment: 5

FPAY Annual fee payment

Payment date: 20150604

Year of fee payment: 6

FPAY Annual fee payment

Payment date: 20160527

Year of fee payment: 7

FPAY Annual fee payment

Payment date: 20170529

Year of fee payment: 8

FPAY Annual fee payment

Payment date: 20180605

Year of fee payment: 9

FPAY Annual fee payment

Payment date: 20190529

Year of fee payment: 10