KR100958022B1 - Pulse Width Modulation Control Type High Capacity PTC Heater - Google Patents

Abstract

The present invention relates to a PWM control high-capacity PTC heater, by forming a plurality of heat dissipation holes for heat dissipation in the PCB board mounted inside the upper housing coupled to the PTC rod and to form the structure of the upper housing for ventilation It prevents heat generation inside the PCB and the upper housing, expands the conduction volume of the positive power supply terminal into which high current flows, and forms the negative terminal of the PTC rod as a heat dissipation structure to prevent electrical resistance and heat generation. It does not increase the temperature inside the upper housing and prevents damage and malfunction of various parts, and provides PWM control high capacity PTC heater with excellent heat dissipation efficiency, durability and easy manufacturing without the size expansion by separate ventilation device. do.

High capacity, PTC, heater, heat dissipation hole, anode power terminal

Description

Pulse Width Modulation Control Type High Capacity PTC Heater

The present invention relates to a PWM controlled high capacity PTC heater. More specifically, a plurality of heat dissipation holes for heat dissipation are formed in the PCB board mounted inside the upper housing coupled to the PTC rod, and the upper housing structure is formed for the ventilation to generate heat inside the PCB board and the upper housing. Prevents electrical resistance and heat generation by expanding the conduction volume of the positive power terminal into which high current is drawn and forming the heat dissipating terminal of the PTC rod in order to prevent electrical resistance and heat generation. Without damaging and malfunctioning of the various parts according to this, the present invention relates to a PWM control high-capacity PTC heater that has excellent heat dissipation efficiency, durability and ease of manufacture even without the size expansion by a separate ventilation device.

The vehicle is provided with an air conditioning system for selectively supplying cold and warm air to each part of the room. In summer, the air conditioner is operated to supply cold air, and in winter, the heater is operated to supply warm air.

In general, the operating method of the heater is to circulate the inside of the engine, and the heated coolant and the air introduced by the blower exchange heat to supply the warm air to the interior of the vehicle and heat the heat. Energy efficient heating system.

In winter, however, a certain time is required before the engine heats up after starting, so heating does not occur immediately after starting. Therefore, the engine is heated for heating and the engine is idled for a predetermined time before driving until the temperature of the coolant becomes high, resulting in energy waste and environmental pollution.

In order to prevent such a problem, a method of heating a vehicle interior using a separate pre-heater during a predetermined time during which the engine is heated has been used. A heater using a conventional heating coil has a high heat generation and thus heating is effectively performed. Excessively high risk of fire and short life of electric wires caused frequent repair and replacement of parts.

Therefore, recently, a heater using a positive temperature coefficient (PTC) device has been developed, which has the advantage of having a low risk of fire and a long life, which can be used semi-permanently. The PitiC heater is mainly used a relatively small capacity heater, the recent trend has been developed to require a high capacity PitiC heater according to the needs of various models and users.

1 is a front view for briefly showing the structure of a conventional PWM control high capacity PTC heater according to the prior art.

In the conventional PWM control high capacity PTC heater according to the prior art, as shown in FIG. 1, a plurality of PTC rods 10, in which a PTC element is inserted therein and generates heat, are arranged in parallel and arranged. On both sides of the heat dissipation fin 20 for heat exchange with the air is arranged to contact the PTC rod 10, the pin guide 30 is mounted between the adjacent heat dissipation fins 20, the position of the heat dissipation fin 20 Is guided. The upper housing 50 and the lower housing 60 are respectively coupled to upper and lower end portions of the PTC rod 10 arranged as described above, and the PTC rods coupled between the upper housing 50 and the lower housing 60 ( 10) and the left and right sides of the heat dissipation fins 20 are mounted to the upper housing 50 and the lower housing 60 to elastically support inward direction so that they can be tightly coupled to each other.

The upper housing 50 is provided with positive and negative power supply terminals 80a and 80b for supplying current to the PTC rod 10, and the current is supplied to the PTC rod 10 through the positive power supply terminal 80a. Then, the heating function is performed while passing through the PTC element of the PTC rod 10 and operates in such a manner that a current flows through the cathode power terminal 80b. At this time, in the case of the high-capacity PTC heater, since the high capacity is exhibited by controlling the operation of the PTC rod 10, for example, operation control of the PTC rod 10, such as a pulse width modulation (PWM) control method, is performed. The PCB substrate 70 is mounted inside the upper housing 50. The PCB substrate 70 is mounted with a power transistor (not shown) to control the operation of the PTC rod 10, and is also equipped with a positive and negative power supply terminal 80b and the PTC rod 10, respectively. Then, current is supplied and controlled from the positive and negative power supply terminals 80a and 80b to the PTC rod 10.

Since the PWM control high capacity PTC heater having such a structure exerts a large amount of heat through a high current, unnecessary heat is generated from the PTC rod 10 and the PCB substrate 70 controlling the same during operation, thereby causing an internal space in the upper housing 50. The temperature is increased and each component mounted on the PCB substrate 70 has a problem such as damage or malfunction by this heat. In order to solve this problem, as shown in FIG. 1, the upper housing 50 has a separate vent 51 formed at a portion coupled to the PTC rod 10 so that the heat in the inner space of the upper housing 50 is vented. It is configured to be discharged to the outside through the 51.

However, the vent 51 may not have a great heat dissipation effect and thus may not sufficiently prevent a temperature rise in the inner space of the upper housing 50. Accordingly, the vent hole 51 may be damaged or malfunction. In order to form the size of the upper housing 50 has to be increased by the size of the vent opening 51, there is a problem such as the size of the PTC heater increases.

Therefore, the present invention has been invented to solve such a problem, forming a plurality of heat dissipation holes for heat dissipation in the PCB board mounted inside the upper housing coupled to the PTC rod and advantageously formed the structure of the upper housing for ventilation Prevents heat generation inside the PCB and upper housing, expands the conduction volume of the positive power supply terminal into which high current flows, and forms the negative terminal of the PTC rod as a heat dissipation structure to prevent electrical resistance and heat generation. And prevents damage and malfunction of various parts according to the temperature of the upper housing, and prevents damages and malfunctions.It also provides excellent heat dissipation efficiency, durability and easy manufacturing without the need for size expansion by a separate ventilation device. The purpose is to provide.

In the present invention, the upper housing 500 and the lower housing 600 are coupled to both side ends of the plurality of PTC rods 100, respectively, and the positive and negative power supply terminals 810 and 820 are provided inside the upper housing 500. The PCB substrate 700 is mounted, and the PCB substrate 700 includes the plurality of power transistors 750 and the anode terminal 110 of the PTC rod 100 that are supplied with current through the anode power terminal 810. PWM control high capacity PTC heater having a), PWM control high capacity, characterized in that a plurality of heat dissipation holes 710 are formed so that air passes through the PCB substrate 700 and the PCB substrate 700 is radiated. Provide PTC heater.

In this case, the anode power terminal 810 is mounted to protrude on the component mounting surface of the PCB substrate 700 so that heat generated from the PCB substrate 700 is conducted and radiated, and electrical resistance and heat caused by current It is preferable that the conduction volume is formed in an expanded form so as not to exceed the threshold value.

According to the present invention, a plurality of heat dissipation holes for heat dissipation are formed in the PCB board mounted inside the upper housing coupled to the PTC rod, and the upper housing structure is advantageously formed for ventilation to heat the inside of the PCB board and the upper housing. It prevents occurrence, expands the conduction volume of the positive power supply terminal into which high current flows, and forms the heat dissipating structure of the negative terminal of the PTC rod to prevent electrical resistance and heat generation, thereby increasing the temperature of the PCB substrate and the inner space of the upper housing. Accordingly, damage and malfunction of various components are prevented, and heat dissipation efficiency is excellent, durability, and manufacturing are easy without the size expansion by a separate ventilation device.

In the present invention, the upper housing 500 and the lower housing 600 are coupled to both side ends of the plurality of PTC rods 100, respectively, and the positive and negative power supply terminals 810 and 820 are provided inside the upper housing 500. The PCB substrate 700 is mounted, and the PCB substrate 700 includes the plurality of power transistors 750 and the anode terminal 110 of the PTC rod 100 that are supplied with current through the anode power terminal 810. PWM control high capacity PTC heater having a), PWM control high capacity, characterized in that a plurality of heat dissipation holes 710 are formed so that air passes through the PCB substrate 700 and the PCB substrate 700 is radiated. Provide a PTC heater.

In this case, the anode power terminal 810 is mounted to protrude on the component mounting surface of the PCB substrate 700 so that heat generated from the PCB substrate 700 is conducted and radiated, and electrical resistance and heat caused by current It is preferable that the conduction volume is formed in an expanded form so as not to exceed the threshold value.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings. First of all, in adding reference numerals to the components of each drawing, it should be noted that the same reference numerals are used as much as possible even if displayed on different drawings. In the following description of the present invention, a detailed description of known functions and configurations incorporated herein will be omitted when it may make the subject matter of the present invention rather unclear.

2 is a front view briefly showing a PWM control high capacity PTC heater according to an embodiment of the present invention, Figure 3 is a simplified decomposition of the structure of the PWM control high capacity PTC heater in accordance with an embodiment of the present invention 4 is a perspective view of a top housing internal structure of a PWM control high capacity PTC heater according to an exemplary embodiment of the present invention.

PWM control high capacity PTC heater according to an embodiment of the present invention, as shown in Figs. Arranged in line, the heat dissipation fins 200 for heat exchange with air are disposed on both sides of the PTC rod 100 in contact with the PTC rods 100, and the pin guides 300 are disposed between the heat dissipation fins 200 adjacent to each other. ) Is mounted so that the heat dissipation fins 200 are separated from each other. The upper and lower housings 500 and the lower housing 600 are respectively coupled to upper and lower ends of the PTC rod 100 disposed as described above, and the upper housing together with the upper and lower housings 500 and 600 to form a frame structure of the PTC heater. Side frames 400 are mounted on both left and right sides of the 500 and the lower housing 600.

The inner space of the upper housing 500 is equipped with a PCB substrate 700 for controlling the operation of the PTC rod 100 to exhibit a high capacity performance, the PCB substrate 700 is a power transistor for control (750) ) And the positive terminal 110 of the PTC rod 100 is mounted through the clip 740 and electrically connected. That is, the PCB substrate 700 is separately equipped with a power terminal 800 consisting of a positive power terminal 810 and a negative power terminal 820 for power supply, the current supplied from the positive power terminal 810 is a PCB substrate It is controlled through the power transistor 750 along the circuit of 700 and is transmitted to the positive terminal 110 of the PTC rod 100. As such, the current is transferred to the positive terminal 110 of the PTC rod 100 so that the PTC element inside the PTC rod 100 generates heat, which is again supplied through the outer cover of the PTC rod 100. It is configured in such a way that it flows out to the terminal 820. At this time, the cathode terminal 900 is in electrical contact with the outer surface of the one end end cover of the PTC rod 100 is configured to flow the current through the cathode terminal 900 to the cathode power terminal 820. In addition, the PCB substrate 700 according to an embodiment of the present invention in order to receive information about the vehicle state from the ECU of the vehicle to control the operation of the PTC load 100 accordingly according to Figures 3 and 4 As shown in FIG. 2, a communication port 730 for communicating with the vehicle ECU may be separately installed.

Here, a brief look at the configuration of the PTC rod 100, the tube-shaped cover forming the outer shape of the PTC rod 100 according to an embodiment of the present invention, the inside of the cover to protrude to one end of the cover It may be configured to include a positive terminal 110 to be inserted, the PTC element which is installed in contact with the positive terminal 110 to be located inside the cover, and an insulator for insulating the positive terminal 110 and the cover. Therefore, when the current is supplied through the anode terminal 110, the current flows through the cover through the PTC device, and in this process, the PTC device generates heat. Such a configuration of the PTC rod 100 may be variously modified in other forms.

PWM controlled high-capacity PTC heater according to an embodiment of the present invention is capable of outputting 2000W for a vehicle, the current of 80A to 200A is used for this output and the voltage is manufactured to be used for both 12V or 24V. Therefore, the PCB substrate 700 of the PWM control high capacity PTC heater according to an embodiment of the present invention to minimize the electrical resistance or heat generated by the power terminal 800 or the PCB substrate 700 by the high current. ), A plurality of heat dissipation holes 710 are formed to allow air to pass through and to dissipate the PCB substrate 700.

The plurality of heat dissipation holes 710 are preferably formed around a part where a large heat generation component is mounted among various components mounted on the PCB 700, and thus the anode terminal of the PTC rod 100 is mounted. It may be formed in the adjacent portion, in addition to the power transistor 750 may be formed in the adjacent portion to mount a variety of other electronic components are mounted on the PCB substrate 700 and generates heat. In addition, the plurality of heat dissipation holes 710 may be formed in an adjacent portion where the positive power terminal 810 is electrically connected to the power transistor 750.

At this time, the diameter of the heat dissipation hole 710 is preferably formed to 1mm or less in accordance with an embodiment of the present invention. Accordingly, the contact area for substantially heat exchange and heat exchange may increase, thereby increasing heat dissipation efficiency.

In addition to the heat dissipation structure, the PWM control high capacity PTC heater according to an embodiment of the present invention has a flow hole to allow air to flow into one side of the upper housing 500 for heat dissipation of the inner space of the upper housing 500. () May be formed, and the structure of the upper housing 500 may include a housing main body 510 whose one side is open to accommodate the PCB substrate 700 in the inner space, and an open side of the housing main body 510. It includes a housing cover 520 is coupled to cover, it is preferable that the housing cover 520 is configured to be formed with a vent 521 for the ventilation of the internal space. At this time, according to an embodiment of the present invention, the upper housing 500 does not have a separate vent hole 521, and the inner space of the upper housing 500 is formed by various holes for assembling various parts and minute gaps during assembly. It may be formed to be ventilated.

On the other hand, the PWM control high capacity PTC heater according to an embodiment of the present invention preferably has a structure in which the power supply terminal does not generate heat in addition to the heat dissipation structure. Looking at this, the anode power terminal 810 of the PWM control high capacity PTC heater according to an embodiment of the present invention is formed in a flat form of an extended current flow volume so that the electrical resistance and heat caused by the current does not exceed the threshold value And protrudes to the component mounting surface of the PCB substrate 700. That is, the positive electrode power terminal 810 coupled to the PCB substrate 700 is formed to have an effective conduction volume suitable for the allowable current required for maximum output.

Therefore, as the energization volume of the positive electrode power terminal 810 is expanded, the electrical resistance to current decreases in the positive electrode power terminal 810, and thus heat generated by the electrical resistance is also significantly reduced. In addition, the cathode power terminal 810 formed as described above has a structure in which heat generation is reduced in itself, and also a heat dissipation function for conducting heat by conducting heat from the PCB substrate 700. That is, since it is mounted to protrude on the component mounting surface of the PCB substrate 700 in a flat plate shape so that the contact area with air is extended, the heat generated by various components and circuits mounted on the PCB substrate 700 is positively connected to the anode power terminal 810. ) Is conducted and radiated heat.

Therefore, in the PWM control high capacity PTC heater according to the embodiment of the present invention, since the heat of the PCB substrate 700 is reduced and thus the temperature in the space inside the upper housing 500 does not increase, a separate heat dissipation device and a vent hole Is unnecessary and can be miniaturized, and also prevents thermal damage of each component mounted on the PCB 700 and prevents malfunction.

According to this structure, the size of the expanded cross-sectional area of the positive electrode power terminal 810 may be selected so that heat above a threshold selected according to a user's needs is not generated, and this threshold may be omitted without a separate heat dissipation device and a vent as described above. The PCB substrate 700 may be freely selected to be less than the amount of heat generated to prevent thermal damage and malfunction.

On the other hand, the plurality of power transistors 750 mounted on the PCB 700 is preferably configured to supply current from the anode power terminal 810 independently of each other according to an embodiment of the present invention. That is, the cathode power terminal 810 and the plurality of power transistors 750 are configured in such a manner that each is connected to each other through a circuit on an independent PCB substrate 700. According to this structure, the length of the pattern circuit on the PCB substrate 700 is shortened, and the pattern circuits are formed independently of each other so that the flow of current supplied to the plurality of power transistors 750 is distributed and supplied through each pattern circuit. As a result, the heat generated by the electrical resistance through the pattern circuit is significantly reduced, so that the heat in the PCB substrate 700 is reduced.

In addition, the positive electrode power terminal 810 according to an embodiment of the present invention, as shown in Figures 3 and 4 to increase the heat dissipation area to perform the above-described heat dissipation function of the PCB substrate 700 It is preferably extended along the periphery of the edge. In addition, the cathode power terminal 820 is also formed to extend in a flat shape so that heat can be conducted and radiated from the PCB substrate 700 so as to protrude to the component mounting surface of the PCB substrate 700, the heat dissipation area is It may be desirable to be formed to extend along the periphery of the edge of the PCB substrate 700 in at least some section to increase.

In addition, the PWM controlled high-capacity PTC heater according to an embodiment of the present invention is a cathode so that heat generated from the PTC rod 100 can be radiated to the outside without being transferred to the PCB substrate 700 and the upper housing 500 The terminal 900 may be mounted, and the cathode terminal 900 may have a hook (not shown) to be coupled to the upper housing 500. Therefore, the negative electrode terminal 900 is mounted to be in contact with one end of the outer surface of the PTC rod 100 is configured to conduct heat to the negative terminal 900 at one end of the PTC rod 100, and also the upper housing It is mounted to surround a portion of the outer surface of the 500 and positioned outside the upper housing 500 so that the heat conducted to the negative electrode terminal 900 can be easily radiated to the outside. Therefore, since the cathode terminal 900 is also formed to surround the outer surface of the upper housing 500, a separate mounting space is unnecessary, so that the PTC heater can be miniaturized and has excellent heat dissipation effect.

The negative electrode terminal 900 performs a heat dissipation function and a function as a grounding terminal at the same time according to an embodiment of the present invention. Accordingly, the negative electrode terminal 900 is formed of an electrical conductor material and penetrates the PCB substrate 700. It is configured in such a way that the negative power supply terminal 820 is in contact with. At this time, a through slit 720 through which the negative electrode terminal 900 does not come into contact with the PCB substrate 700 is formed, and the negative electrode terminal 900 contacts the PCB substrate 700 through the through slit 720. It may be connected to the cathode power terminal 820 and the electric and heat conduction without being. Through this, a small amount of heat transferred from the PTC rod 100 may also be prevented from being transferred to the PCB substrate 700, thereby further preventing heat generation from the PCB substrate 700.

The negative electrode terminal 900 and the negative electrode power terminal 820 are electrically connected to each other, and the connecting means 830 for electrically connecting them is welded or soldered as shown in FIG. 4 according to an embodiment of the present invention. A coupling method such as may be used, or a bolting coupling method using a bolt formed of a conductor may be used.

On the other hand, since the negative electrode terminal 900 is formed to surround a portion of the outer surface of the upper housing 500 and to contact one end of the PTC rod 100, the upper housing 500 as shown in Figs. Corresponding to the outer surface shape of the upper housing 500 in accordance with an embodiment of the present invention so as to cover the outer surface of the) is formed in the form of, for example, "U" channel and one side portion penetrates the PCB substrate 700 It is extended to be connected to the negative electrode power terminal 820. In addition, a coupling slit 910 through which the PTC rod 100 contacts and penetrates is formed at a bottom portion of the “U” channel so as to contact one end of the PTC rod 100. At both ends of the coupling slit 910, an expansion slit 920 having a wider width than that of the coupling slit 910 is preferably formed as shown in FIG. 3, and air passes through the expansion slit 920. And the negative electrode terminal 900 is more smoothly heat exchange with the air improves the overall heat dissipation effect.

In addition, a through hole 930 through which air may flow may be formed in a portion of the cathode terminal 900 that surrounds the upper housing 500, for example, in a bottom portion of the “U” channel. Air flows through the 930 may likewise improve the overall heat dissipation effect. In addition, a flow hole 511 may be formed at one side of the upper housing 500 such that air passing through the through hole 930 may be introduced into the upper housing 500.

On the other hand, looking at the structure of the upper housing 500 in more detail, the upper housing 500 is configured to include a housing body 510 and the housing cover 520, as described above, such a housing body 510 and the housing The cover 520 is formed with a fixing protrusion 513 and a fixing hole 524 corresponding to each other in accordance with an embodiment of the present invention, respectively, through the fixing protrusion 513 and the fixing hole 524 Without the fixing means of the housing body 510 and the housing cover 520 may be detachably coupled.

In addition, two power holes 522 may be formed in the housing cover 520 such that the above-described positive power terminal 810 and the negative power terminal 820 may be inserted and protrude to the outside. 522 is preferably formed to be separated from each other and located adjacent to each other. According to this structure, the positive and negative power supply terminals 810 and 820 may be connected to the power supply from the housing cover 520 in the same direction, thereby facilitating the miniaturization of the PTC heater and the wiring for the power supply connection. At this time, between the two power holes 522 so that the positive power terminal 810 and the negative power terminal 820 protruding to the outside through the two power holes 522 formed in the adjacent position are in contact with each other so that a short circuit accident does not occur. It is preferable that the separation plate 523 is formed in FIG. 3.

On the other hand, the lower housing 600 according to an embodiment of the present invention is preferably formed with a protrusion groove 610 protruding in the width direction so that the PTC rod 100 is inserted. As a result, the width of the lower housing 600 may be reduced, thereby minimizing the size of the PTC heater, and when the PTC heater is mounted on the vehicle, it may be more smoothly detachable.

The foregoing description is merely illustrative of the technical idea of the present invention, and various changes and modifications may be made by those skilled in the art without departing from the essential characteristics of the present invention. Therefore, the embodiments disclosed in the present invention are not intended to limit the technical idea of the present invention but to describe the present invention, and the scope of the technical idea of the present invention is not limited by these embodiments. The protection scope of the present invention should be interpreted by the following claims, and all technical ideas within the equivalent scope should be interpreted as being included in the scope of the present invention.

1 is a front view for briefly showing a structure of a general high capacity PTC heater according to the prior art;

2 is a front view briefly showing a high capacity PTC heater according to an embodiment of the present invention;

3 is an exploded perspective view briefly showing a structure of a high capacity PTC heater according to an embodiment of the present invention;

FIG. 4 is a plan view briefly illustrating an internal structure of an upper housing of a high capacity PTC heater according to an exemplary embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

100: PTC rod 500: upper housing

510: housing body 520: housing cover

600: lower housing 700: PCB substrate

800: power terminal 810: positive power terminal

820: negative electrode power supply terminal 900: negative electrode terminal

Claims (13)

PCB housings having the upper housing 500 and the lower housing 600 coupled to both side ends of the plurality of PTC rods 100, respectively, and having positive and negative power supply terminals 810 and 820 inside the upper housing 500. 700 is mounted, and the PCB substrate 700 is equipped with a plurality of power transistors 750 and a cathode terminal 110 of the PTC rod 100 that are supplied with current through the anode power terminal 810. PWM controlled high capacity PTC heater PWM control high capacity PTC heater, characterized in that a plurality of heat dissipation holes 710 are formed so that air passes through the PCB substrate 700 and the PCB substrate 700 is radiated. The method of claim 1, The plurality of heat dissipation holes 710 are PWM control high capacity PTC heaters, characterized in that formed in the adjacent portion where the anode terminal 110 of the PTC rod (100) is mounted. The method of claim 2, The plurality of heat dissipation holes 710 are PWM control high capacity PTC heaters, characterized in that formed in the adjacent portion where the electronic component is mounted on the PCB substrate 700, such as the power transistor 750 is generated. The method of claim 2, The plurality of heat dissipation holes 710 are PWM control high capacity PTC heaters, characterized in that formed in the adjacent portion is mounted the anode power terminal 810 electrically connected to the power transistor (750). The method according to any one of claims 1 to 4, The heat dissipation hole 710 is PWM control high capacity PTC heater, characterized in that formed in less than 1mm in diameter. The method according to any one of claims 1 to 4, PWM control high-capacity PTC heater, characterized in that the flow hole 511 is formed on one side of the upper housing 500 so that air is introduced into the interior. The method of claim 6, The upper housing 500 has a housing main body 510 whose one side is opened to accommodate the PCB substrate 700 in an inner space, and a housing cover 520 which is coupled to cover the open side of the housing main body 510. PWM control high capacity PTC heater, characterized in that the housing cover 520 is formed with a vent 521 for ventilation of the internal space. The method according to any one of claims 1 to 4, The anode power terminal 810 is mounted to protrude on the component mounting surface of the PCB substrate 700 so that heat generated from the PCB substrate 700 is conducted and radiated, and electrical resistance and heat caused by current are thresholded. PWM controlled high-capacity PTC heater, characterized in that formed in a flat plate of an extended current flow volume so that no abnormality occurs. The method of claim 8, The plurality of power transistors 750 is PWM control high capacity PTC heater, characterized in that the current is supplied is connected to each of the anode power terminal 810 independently. The method of claim 9, The heat generated from the plurality of PTC rods 100 is in contact with one side end of the outer surface of the plurality of PTC rods 100 so that heat can be radiated to the outside, and a part of the outer surface of the upper housing 500 is PWM control high capacity PTC heater characterized in that it further comprises a cathode terminal 900 is wrapped and coupled in a U-shape. The method of claim 10, The cathode terminal 900 is PWM control high capacity PTC heater, characterized in that connected to the electrical and thermal conduction with the cathode power terminal 820 in a non-contact state with the PCB substrate 700. The method of claim 10, The cathode terminal 900 is formed with a through hole 930 through which air can flow in a portion surrounding the upper housing 500, and passes through the through hole 930 on one side of the upper housing 500. PWM control high capacity PTC heater, characterized in that the flow hole 511 is formed so that one air is introduced into the upper housing (500). The method of claim 10, The cathode terminal 900 is formed with a coupling slit 910 through which the PTC rod 100 contacts and penetrates, and the coupling slit for allowing air to pass through both ends of the coupling slit 910. PWM controlled high capacity PTC heater, characterized in that the wider slit 920 is formed wider than (910).

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