KR100954363B1 - Probe and making method of probe - Google Patents

Abstract

Provided are probes and methods for manufacturing probes for use in probe cards with reduced manufacturing costs and improved inspection reliability.

A method of manufacturing a probe includes providing a flexible plate, forming a photoresist layer on the flexible plate, exposing and developing the photoresist layer to open a probe region corresponding to the plate surface of the probe. Forming a pattern, filling the probe region with a conductive material to form the probe, and bending the flexible plate to separate the probe from the flexible plate.

Probe card, probe, flexible plate

Description

PROBE AND MAKING METHOD OF PROBE

The present invention relates to a probe and a method of manufacturing a probe for use in a probe card including a printed circuit board, and more particularly, to a probe and a method for manufacturing a probe for a probe card in which a spatial transformation is performed.

In general, semiconductor devices have a fabrication process of forming contact pads for circuit patterns and inspections on a wafer, and an assembly process of assembling wafers having circuit patterns and contact pads into respective semiconductor chips. It is manufactured through.

An inspection process is performed between the fabrication process and the assembly process to inspect the electrical characteristics of the wafer by applying an electrical signal to the contact pads formed on the wafer. This inspection process is performed to inspect a defect of a wafer and to remove a portion of a wafer in which a defect occurs during an assembly process.

In the inspection process, inspection equipment called a tester for applying an electrical signal to a wafer and probe equipment for performing an interface function between the wafer and the tester are mainly used. Among them, the probe card includes a printed circuit board that receives an electrical signal applied from a tester and a plurality of probes in contact with contact pads formed on the wafer.

Hereinafter, a conventional probe card will be described with reference to FIG. 1.

1 is a cross-sectional view showing a conventional probe card.

As shown in FIG. 1, a conventional probe card 10 includes a printed circuit board 11, an interposer 12, a space converter 13, and a probe 14.

The printed circuit board 11 includes a probe circuit pattern (not shown) and a substrate pad 11a formed for an inspection process, and receives and transmits an electrical signal applied from a tester (not shown) to the probe 14. Do this.

The interposer 12 is connected to the probe circuit pattern of the printed circuit board 11 to electrically connect between the printed circuit board 11 and the probe 14.

The space transducer 13 is formed on the upper surface and includes a first pad 13a connected to the interposer 12 and a second pad 13b formed on the lower surface and connected to the probe 14. The distance between the second pads 13b facing each other is formed to be narrower than the distance between the first pads 13a facing each other, so that the spatial transducer 13 performs a function of spatial transformation from the interposer 12 to the probe 14. do.

The probe 14 contacts the contact pads formed on the inspected object, such as a wafer, during the inspection process, and passes through the printed circuit board 11, the interposer 12, and the space transducer 13 from a tester (not shown). The electrical signal delivered to the probe 14 is delivered to the contact pads.

As described above, the conventional probe card 10 essentially uses a space transducer 13 that performs a function of spatial conversion in order to contact a contact pad formed at a fine pitch on the inspected object.

By the way, since the conventional probe card 10 uses expensive materials, such as a multilayer ceramic substrate (MLC), as a space converter 13, there existed a problem that manufacturing cost rose.

In addition, since the entire probe 14 is exposed to the outside of the conventional probe card 10, the probe pad 10 may be caused by interference such as contact pads formed on the object under test or particles that may be located on the contact pads. There was a problem that the probe 14 is spaced apart from the initially set position and the inspection reliability is degraded in the next inspection process.

One embodiment of the present invention is to solve the above-described problems, an object of the present invention is to provide a probe and a method for manufacturing a probe used in a probe card that can reduce the manufacturing cost and improve the inspection reliability.

As a technical means for achieving the above-described technical problem, the first aspect of the present invention is a method for manufacturing a plate-shaped probe used for a probe card, comprising the steps of: providing a flexible plate, a photoresist layer on the flexible plate Forming a photoresist pattern, exposing and developing the photoresist layer to open a probe region corresponding to the plate surface of the probe, filling the probe region with a conductive material to form the probe, and A method of making a probe is provided that includes bending a flexible plate to separate the probe from the flexible plate.

The method may further include forming a conductive layer to be positioned between the flexible plate and the photoresist layer.

The forming of the probe may be formed by a plating process using the conductive layer.

The method may further include etching the conductive layer using the probe.

The method may further include forming an adhesive layer to be positioned between the flexible plate and the conductive layer.

The method may further include etching the conductive layer and the adhesive layer using the probe.

The flexible plate may be made of a conductive material.

Forming the probe may be formed by a plating process using the flexible plate.

The method may further include removing the photoresist pattern.

In addition, a second aspect of the present invention is a plate-shaped probe supported by a slit formed on a probe card including a printed circuit board, which is formed integrally with the main body portion and the main body portion, and is connected to the printed circuit board. And a main body portion, including a cantilever portion, a cantilever rotating space portion, a contact guide portion formed at an upper end of the cantilever portion, and a contact pin portion formed at an end portion of the cantilever portion, wherein the cantilever portion and the cantilever rotating space are included. Part and the contact guide provides a probe that is inserted into the slit and positioned.

The probe card may further include a horizontal support accommodating groove, and the main body may further include a horizontal support protruding in the horizontal direction and fixed to the horizontal support accommodating groove.

The body part may further include a sidewall support part inserted into the slit when elastically supporting the sidewall of the slit.

According to one of the embodiments of the above-described problem solving means of the present invention, there is an effect of improving the structure to reduce the manufacturing cost and improve the inspection reliability.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

Throughout the specification, when a member is located “on” another member, this includes not only when one member is in contact with another member but also when another member exists between the two members. In addition, when a part is said to "include" a certain component, it means that it can further include other components, without excluding other components unless otherwise stated.

Hereinafter, the probe card 1000 according to the first embodiment of the present invention will be described with reference to FIGS. 2 to 4.

2 is a cross-sectional view of a probe card according to a first embodiment of the present invention.

As shown in FIG. 2, the probe card 1000 may include a printed circuit board 100, a lower reinforcement plate 200, a coupling screw 300, a probe support substrate 400, a probe guide substrate 500, and a probe ( 600 and protective cover 700.

The printed circuit board 100 includes a printed circuit board main body 110, a first terminal portion 120, a second terminal portion 130, and a first hollow portion 140.

The printed circuit board main body 110 is formed in a substantially disk shape, and a circuit pattern for an inspection process is formed. The space conversion wiring 111 that performs space conversion is formed in the printed circuit board main body 110. The printed circuit board body 110 includes an upper surface 112 and a lower surface 113 opposite the upper surface 112.

The first terminal part 120 is formed on an inner circumferential part of the upper surface 112 of the printed circuit board main body part 110, and the lead part 620 of the probe 600, which will be described later, is connected.

The second terminal unit 130 is formed at an outer circumference of the upper surface 112 of the printed circuit board main body unit 110 and may be connected to a tester for an inspection process.

The first terminal portion 120 and the second terminal portion 130 are connected to the space conversion wiring 111, and the space between the first terminal portion 120 and the second terminal portion 130 is printed due to the space conversion wiring 111. The space is converted inside the circuit board main body 110.

The first hollow part 140 is positioned in the central region of the printed circuit board main body 110 and is formed through the printed circuit board main body 110. The lead part 620 of the probe 600 is positioned in the first hollow part 140.

The lower reinforcement plate 200 is positioned below the printed circuit board 100.

The lower reinforcement plate 200 is positioned between the printed circuit board 100 and the probe support substrate 400 and the probe guide substrate 500 to be described later. The second hollow part 210 is formed in the central region of the lower reinforcing plate 200, and the lead part 620 of the probe 600 is located in the second hollow part 210. The lower reinforcing plate 200 is coupled to the lower surface 113 of the printed circuit board main body 110, and serves to protect the printed circuit board 100 from external impacts. The lower reinforcement plate 200 is screw-coupled with the printed circuit board 100, the probe support board 400, and the probe guide board 500 by the coupling screw 300 to be described later. In detail, the lower reinforcing plate 200 serves to couple the printed circuit board 100, the probe support substrate 400, and the probe guide substrate 500 to each other. The probe support substrate 400 and the probe guide substrate 500 are protected.

The coupling screw 300 includes a first screw 310, a second screw 320 and a third screw 330. The first screw 310 is inserted into the lower reinforcement plate 200 through the printed circuit board 100, and the second screw 320 penetrates the probe support substrate 400 to the lower reinforcement plate 200. The third screw 330 is inserted into the lower reinforcing plate 200 through the probe guide substrate 500.

The probe support substrate 400 is coupled to the upper portion of the probe guide substrate 500 and is located between the lower reinforcement plate 200 and the probe guide substrate 500. The probe support substrate 400 is formed of ceramic or silicon, such as glass, and includes a through hole 410 and a horizontal support portion receiving groove 420.

The through holes 410 are formed in plural to communicate with the slits 510 of the probe guide substrate 500 to be described later, and correspond to the first hollow part 140 and the second hollow part 210. The lead part 620 of the probe 600 is located in the through hole 410.

The horizontal support accommodating groove 420 is formed on the lower surface of the probe support substrate 400 corresponding to the probe support substrate 400 and the probe guide substrate 500. The horizontal support 615 of the probe 600 to be described later is located inside the horizontal support accommodating groove 420. In detail, the horizontal support accommodating groove 420 fixes the horizontal support 615 of the probe 600 to the probe guide substrate 500.

In another embodiment, the through hole 410 may be formed to be in communication with the slit 510 of the probe guide substrate 500 in the central region of the probe support substrate 400.

The probe guide substrate 500 is positioned under the probe support substrate 400.

The probe guide substrate 500 includes a plurality of probe fixing slits 510. Each of the slits 510 is spaced apart from each other to communicate with the through hole 410, and a probe 600 is inserted into each of the slits 510.

3 is an enlarged view of a portion A of FIG. 2, and FIG. 4 is a perspective view of a probe included in the probe card according to the first embodiment of the present invention.

As shown in FIGS. 3 and 4, the probe 600 has a plate shape and includes a main body 610 and a lead 620 integrally formed with each other.

The main body 610 includes a cantilever 611, a cantilever rotating space 612, a contact pin 613, a contact guide 614, a horizontal support 615, and a sidewall support 616.

The cantilever portion 611 is formed in a cantilever shape and allows the contact pin portion 613 to elastically correspond to the contact pad formed on the inspected object during the inspection process. The cantilever part 611 is located inside the slit 510, and the cantilever rotating space part 612 is positioned above the cantilever part 611.

The cantilever rotating space 612 forms an upper space of the cantilever 611 so that the cantilever 611 has elasticity. The cantilever rotating space part 612 is located inside the slit 510, and the contact pin part 613 is disposed at the lower end of the cantilever part 611 facing the cantilever rotating space part 611 with the cantilever part 611 interposed therebetween. Is located.

The contact pin part 613 is located outside the slit 510 and serves to transmit a test signal to the contact pad by contacting a contact pad formed on a test object such as a semiconductor device during a test process. The contact guide part 614 is located in the upper end of the cantilever part 611 facing the contact pin part 613 with the cantilever part 611 interposed therebetween.

The contact guide part 614 is located inside the slit 510 and faces the cantilever rotation space part 612. The contact guide part 614 may be connected to B (shown in FIG. 3) when the contact pin part 613 contacts the contact pad formed on the object under test and a pressure is applied to the contact pin part 613 above a proper pressure during the inspection process. As described above, contact with the main body 610 is suppressed from applying a pressure higher than the elastic limit to the cantilever 611.

In addition, the contact guide part 614 may be formed when the contact pin part 613 moves downward due to interference such as a contact pad formed on the inspected object or particles that may be located on the contact pad during the inspection process. As shown in FIG. 3, the cantilever part 611 and the contact pin part 613 are restrained from slit out of the slit 510.

The horizontal support part 615 is formed to protrude in the horizontal direction from the main body part 610 and is located between the probe support substrate 400 and the probe guide substrate 500. The horizontal support 615 is inserted into the horizontal support accommodating groove 420 of the probe support substrate 400 and fixed to the probe guide substrate 500.

The sidewall support part 616 is located inside the slit 510 and is formed at the side of the main body part 610. The sidewall support 616 elastically corresponds to the sidewall 511 of the slit 510, and elastically supports the sidewall 511 to suppress the movement of the probe 600.

The lead part 620 extends upwardly from the main body part 610 so that the through hole 410 of the probe support substrate 400, the second hollow part 210 of the lower reinforcing plate 200, and the printed circuit board 100 are provided. Penetration through the first hollow portion 140 of the). An end portion of the lead portion 620 is connected to the first terminal portion 120 of the printed circuit board 100. Since the lead unit 620 is connected to the first terminal unit 120, the lead unit 620 is space-converted by the space conversion wiring 111 in the printed circuit board 100 and connected to the second terminal unit 130. That is, the probe 600 may include a tester (not shown) that may be connected to the printed circuit board 100 by being space-converted by the printed circuit board 100 by connecting the lead unit 620 to the printed circuit board 100. Connected. The surface of the lead portion 620 is coated with an insulation coating, and the insulation coating prevents a short circuit between the lead portions 620 of the neighboring probe 600.

Again, as shown in FIG. 2, the protective cover 700 is positioned above the printed circuit board 100.

The protective cover 700 is coupled to the upper portion of the printed circuit board 100, and serves to protect the printed circuit board 100 and the lead 620 of the probe 600 from an impact from the outside. The protective cover 700 includes a heat radiating part 710 formed therein. The heat dissipation part 710 is a heat dissipation means. The heat dissipation part 710 is a heat dissipation means. The heat dissipation part 710 is a heat dissipation means. 700) It serves to release to the outside.

As described above, since the probe card 1000 according to the first exemplary embodiment of the present invention performs spatial conversion by the printed circuit board 100 and the lead unit 620 of the probe 600, the multi-layer ceramic substrate (multi There is no need to use a spatial transducer separately using expensive materials such as layer ceramic (MLC). As a result, a probe card 1000 having a reduced manufacturing cost is provided.

In addition, since only the contact pin part 613 which contacts the contact pad formed in the object under test is exposed to the outside, and the contact guide part 614 is located inside the slit 510 of the probe guide substrate 500, during the inspection process. The detachment of the probe 600 from the initially set position is suppressed by the interference of the contact pad formed on the object under test or particles that may be located on the contact pad. In addition, since the protective cover 700 emits heat that may be generated in the probe 600 and the printed circuit board 100 to the outside, an inspection error due to heat during the inspection process is suppressed. This provides a probe card 1000 with improved inspection reliability.

Hereinafter, a method of manufacturing the probe 600 according to the second embodiment of the present invention will be described with reference to FIGS. 4 to 13. The probe 600 manufactured by the method of manufacturing the probe 600 according to the second embodiment of the present invention is a probe 600 included in the probe card 1000 according to the first embodiment of the present invention.

5 is a flowchart illustrating a method of manufacturing a probe according to a second embodiment of the present invention. FIGS. 6 to 13 are views illustrating a method of manufacturing a probe according to a second embodiment of the present invention. 7 is a cross-sectional view taken along the line VIII-VIII, and FIG. 12 is a cross-sectional view taken along the line II-XII of FIG.

First, as illustrated in FIGS. 5 and 6, the flexible plate 2000 is provided (S110).

The flexible plate 2000 is made of an insulating material or a conductive material, and has a property that can be bent. In the second embodiment of the present invention, the flexible plate 2000 is preferably made of a conductive material such as a metal foil.

Next, an adhesive layer 2100 and a conductive layer 2200 are formed (S120).

Specifically, the adhesive layer 2100 is formed on the flexible plate 2000 using a sputtering process, and the conductive layer 2200 is sequentially formed on the adhesive layer 2100. The adhesive layer 2100 is a metal material including titanium (Ti), chromium (Cr), or the like, and the conductive layer 2200 is a metal material including gold (Au) or copper (Cu). The adhesive layer 2100 has a higher chemical affinity with the flexible plate 2000 than the conductive layer 2200, and serves to facilitate bonding between the conductive layer 2200 and the flexible plate 2000.

Here, chemical affinity means the adhesive force of two materials.

Next, the photoresist layer 3000 is formed (S130).

Specifically, a resin including a photoresist material is formed on the conductive layer 2200 to form the photoresist layer 3000.

Next, as shown in FIGS. 7 and 8, the photoresist pattern 3100 is formed (S140).

Specifically, after aligning a mask having a shape corresponding to the plate surface of the probe 600 on the photoresist layer 3000, by irradiating the photoresist layer 3000 with ultraviolet rays through the mask to the photoresist layer 3000 After exposing the photoresist layer 3000, the photoresist layer 3000 is developed using a developer to form a photoresist pattern 3100 that opens the probe region 3500 corresponding to the plate surface of the probe 600. The conductive layer 2200 corresponding to the probe region 3500 is exposed by the photoresist pattern 3100.

Next, as shown in Figure 9, to form a probe 600 (S150).

Specifically, the probe 600 is formed by filling a conductive material such as nickel (Ni) and cobalt (Co) alloy in the probe region 3500 using a plating process such as an electrolytic plating process using the conductive layer 2200. . However, at this time, due to the plating process, the conductive material may protrude onto the photoresist pattern 3100. In this case, the protruding conductive material is polished using a chemical or physical polishing process to form the probe 600.

Next, as shown in FIG. 10, the photoresist pattern 3100 is removed (S160).

Specifically, the photoresist pattern 3100 is removed from the conductive layer 2200 using an ashing process.

Next, as shown in FIGS. 11 and 12, the adhesive layer 2100 and the conductive layer 2200 are etched (S170).

Specifically, the adhesive layer 2100 and the conductive layer 2200 exposed to the outside of the probe 600 are etched by using a wet etching or dry etching process. In the second embodiment of the present invention, it is preferable to use a wet etching process.

Next, as shown in FIG. 13, the probe 600 is separated from the flexible plate 2000 (S180).

Specifically, when the flexible plate 2000 is pressed and bent in the first direction, since the elastic deformation values of the probe 600 and the flexible plate 2000 are different from each other, the flexible plate 2000 is positioned on the flexible plate 2000. The probe 600 is separated from the flexible plate 2000.

Next, an insulating coating is performed on the surface of the lead portion 620 of the probe 600 using a spray process or a dipping process.

By the above method, the probe 600 as shown in FIG. 4 is manufactured.

As a result, a manufacturing method of the probe 600 included in the probe card 1000 which reduces manufacturing costs and improves inspection reliability is provided.

Hereinafter, a method of manufacturing a probe according to a third exemplary embodiment of the present invention will be described with reference to FIGS. 14 to 18.

Hereinafter, only the characteristic parts distinguished from the second embodiment will be described and described, and the descriptions thereof will be omitted according to the second embodiment. In the third embodiment of the present invention, for the convenience of description, the same components will be described with the same reference numerals as in the second embodiment.

14 is a flowchart illustrating a method of manufacturing a probe according to a third exemplary embodiment of the present invention, and FIGS. 15 to 18 are views illustrating a method of manufacturing a probe according to a third exemplary embodiment of the present invention.

First, as shown in FIGS. 14 and 15, a flexible plate 2000 is provided (S210).

The flexible plate 2000 is made of an insulating material or a conductive material, and has a property that can be bent.

Next, a photoresist layer 3000 is formed (S220).

Next, as shown in FIG. 16, a photoresist pattern 3100 is formed (S230).

Specifically, the photoresist layer 3000 is exposed and developed to form a photoresist pattern 3100 that opens the probe region 3500. By the photoresist pattern 3100, the flexible plate 2000 corresponding to the probe region 3500 is exposed.

Next, as shown in FIG. 17, a probe 600 is formed (S240).

Specifically, the formation of the probe 600 is divided into two processes according to the material of the flexible plate 2000.

First, when the flexible plate 2000 is made of an insulating material, the mask is aligned to expose the probe region 3500 on the photoresist pattern 3100, and then a conductive material is applied to the probe region 3500 using a sputtering process. To form the probe 600.

Next, when the flexible plate 2000 is made of a conductive material, the conductive material is filled in the probe region 3500 using a plating process such as an electrolytic plating process using the flexible plate 2000, and the conductive material protrudes as necessary. The material is polished using a chemical or physical polishing process to form the probe 600.

Next, as shown in FIG. 18, the probe 600 is separated from the flexible plate 2000 (S250).

Specifically, when the flexible plate 2000 is pressed and bent in the first direction, the elastic deformation values of the probe 600, the photoresist pattern 3100, and the flexible plate 2000 are different. The probe 600 positioned on the 2000 may be separated from the flexible plate 2000 and the photoresist pattern 3100.

Next, an insulating coating is applied to the surface of the lead portion 620 of the probe 600 using a spray process or a dipping process.

By the above method, a probe is manufactured.

As described above, the method for manufacturing a probe according to the third embodiment of the present invention is divided into two methods according to the material of the flexible plate 2000, and a simpler process compared to the method for manufacturing the probe according to the second embodiment of the present invention. It can be prepared by. That is, the manufacturing cost of the probe according to the third embodiment of the present invention is reduced.

The foregoing description of the present invention is intended for illustration, and it will be understood by those skilled in the art that the present invention may be easily modified in other specific forms without changing the technical spirit or essential features of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.

The scope of the present invention is shown by the following claims rather than the above description, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included in the scope of the present invention. do.

1 is a cross-sectional view showing a conventional probe card,

2 is a cross-sectional view of a probe card according to a first embodiment of the present invention,

3 is an enlarged view of portion A of FIG. 2,

4 is a perspective view of a probe included in a probe card according to a first embodiment of the present invention;

5 is a flowchart illustrating a method of manufacturing a probe according to a second embodiment of the present invention.

6 to 13 are views for explaining a method for manufacturing a probe according to a second embodiment of the present invention,

8 is a cross-sectional view taken along the line VIII-VIII of FIG. 7,

12 is a cross-sectional view taken along XII-XII of FIG. 11,

14 is a flowchart illustrating a method of manufacturing a probe according to a third embodiment of the present invention.

15 to 18 are diagrams for explaining a method for manufacturing a probe according to a third embodiment of the present invention.

Claims (12)

In the manufacturing method of the plate-shaped probe used for the probe card, Preparing a flexible plate, Forming a photoresist layer on the flexible plate, Exposing and developing the photoresist layer to form a photoresist pattern opening the probe region corresponding to the plate surface of the probe; Filling the probe region with a conductive material to form the probe; and Bending the flexible plate to separate the probe from the flexible plate Method for producing a probe comprising a. The method of claim 1, And forming a conductive layer to be positioned between the flexible plate and the photoresist layer. The method of claim 2, Forming the probe is a method of manufacturing a probe that is formed by a plating process using the conductive layer. The method of claim 2, And etching the conductive layer using the probe. The method of claim 2, And forming an adhesive layer to be positioned between the flexible plate and the conductive layer. The method of claim 5, And etching the conductive layer and the adhesive layer using the probe. The method of claim 1, And the flexible plate is made of a conductive material. The method of claim 7, wherein Forming the probe is a method of manufacturing a probe that is formed by a plating process using the flexible plate. The method of claim 1, And removing the photoresist pattern. In a plate-shaped probe supported by a slit formed on a probe card including a printed circuit board, Main body and A lead portion formed integrally with the main body portion and connected to the printed circuit board. Including; The main body portion, Cantilever, Cantilever rotating space, A contact guide part formed on an upper end of the cantilever part; Including a contact pin formed on the lower end of the cantilever portion, And the cantilever part, the cantilever rotating space part, and the contact guide part are inserted into the slit. The method of claim 10, The probe card further has a horizontal support portion receiving groove, The main body portion, And a horizontal support projecting in a horizontal direction and fixed to the horizontal support receiving groove. The method of claim 10, The main body portion, And a sidewall support portion inserted into the slit to resiliently support the sidewall of the slit.

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