KR100951300B1 - Camera module and manufacturing method of the same - Google Patents

Abstract

Camera module according to the present invention, the housing housing the lens module and the actuator for transporting the lens module; A connection board electrically connected to the actuator and having at least one connection pad for external connection; A substrate having at least one connection terminal bonded to the housing and electrically connected to the connection pad; And a cavity recessed in a predetermined depth in the substrate and having the connection terminal therein, and accommodating an end portion of the connection pad to be connected to the connection terminal.

Description

Camera module and manufacturing method thereof {CAMERA MODULE AND MANUFACTURING METHOD OF THE SAME}

The present invention relates to a camera module and a method of manufacturing the same, and more particularly, to a camera module mounted on a camera device such as a small electronic device and a method of manufacturing the same.

In general, the camera module is small and is applied to portable mobile communication devices such as camera phones, PDAs, and smart phones, and various IT devices. Recently, as these devices become smaller and slimmer, the size of the camera module itself becomes smaller and smaller. to be.

Such a camera module is manufactured by using an image sensor such as a charge coupled device (CCD) or a complementary metal-oxide semiconductor (CMOS) as a main component, and collects an image of an object through the image sensor to store data on a memory in the device. The stored data is output as an image through a display medium such as an LCD or a PC monitor in the device.

Such a camera module may be assembled and completed to fix the focus of the lens module mounted therein, but in recent years, a camera module that performs an auto-focusing or zooming function has been made. .

The camera module performing the auto focusing or zooming function is provided with an actuator to move the lens barrel containing the lens module along the optical axis direction.

That is, the camera module includes a lens barrel accommodating a lens module and an actuator provided to move the lens barrel, and the housing is attached to the substrate while the housing is accommodated therein.

An image sensor is bonded and electrically connected to the substrate, and the actuator and the substrate are connected to each other by a predetermined member so as to be in electrical communication with each other.

However, in accordance with the trend of miniaturization of small devices such as mobile communication terminals, the camera module embedded therein has to be very small and slim. However, when the camera module is made small and slim, the actuator and the board are electrically connected. Short may be easily generated, which adversely affects product defects and reliability of operation.

The present invention provides a camera module and a method of manufacturing the same by improving the electrical connection structure between the substrate and the actuator to provide a structure that can prevent the occurrence of short to reduce product defects and improve the reliability of the operation.

Camera module according to the present invention, the housing housing the lens module and the actuator for transporting the lens module; A connection board electrically connected to the actuator and having at least one connection pad for external connection; A substrate having at least one connection terminal bonded to the housing and electrically connected to the connection pad; And a cavity recessed in a predetermined depth in the substrate and having the connection terminal therein, and accommodating an end portion of the connection pad to be connected to the connection terminal.

In addition, the connection pad, characterized in that it comprises a protrusion protruding toward the side of the connection substrate is received in the cavity.

In addition, the cavity is characterized in that it is provided on the side upper end portion that is the outer upper end portion of the portion bonded to the housing of the substrate.

In addition, the connection board is characterized in that it comprises a flexible printed circuit board provided to surround one side of the housing.

In addition, the substrate is formed of a plurality of layers, characterized in that the cavity is formed for at least one layer of the plurality of layers.

In addition, it is characterized in that it comprises a conductive adhesive is filled in the cavity so that the protrusion is received and fixed in the cavity and the connection terminal and the connection pad electrically connected.

On the other hand, the manufacturing method of the camera module according to the present invention, forming a cavity in the upper side end of the substrate and having a connection terminal provided therein; Bonding a housing containing a lens module and an actuator for transferring the lens module to the substrate; And electrically connecting the actuator and the connection board and allowing the protrusion of the connection pad of the connection board to be received in the cavity.

The method may further include filling the cavity with a conductive adhesive so that the protrusion and the connection terminal are electrically connected to each other.

The camera module and its manufacturing method according to the present invention have an effect of reducing product defects and improving the reliability of operation by providing a structure that can prevent the occurrence of short by improving the electrical connection structure between the substrate and the actuator. .

An embodiment of a camera module and a method of manufacturing the same according to the present invention will be described in more detail with reference to the accompanying drawings.

First, an overall configuration of a camera module according to an exemplary embodiment of the present invention will be described with reference to FIG. 1. 1 is a perspective view schematically showing a camera module according to an embodiment of the present invention.

As shown in FIG. 1, the camera module according to the exemplary embodiment includes a housing 10 and a substrate 30 to which the housing 10 is bonded.

Although not shown in the drawing inside the housing 10, a lens module (not shown) formed with one or more lenses, a lens barrel (not shown) for accommodating the lens module, and the lens barrel are moved. Actuator (not shown) and the like is provided so that the focus or zoom function is achieved.

In addition, as shown in FIG. 1, the connecting board 20 is provided to surround a partial area around the housing 10, and the connecting board 20 includes an actuator (not shown) provided in the housing 10. It is a member electrically connected to 30.

The connection board 20 may be formed as various substrates, and may be made of a flexible printed circuit board (FPCB).

On the other hand, the side of the substrate 30 is provided with an external connection terminal 34 is mounted on the main PCB of the electronic device, such as a mobile communication terminal or other sockets connected to the main PCB to be electrically connected to the main PCB. .

On the other hand, with reference to Figures 2 and 3 and 4 will be described in more detail with respect to the connection structure of the connecting substrate and the substrate of the camera module according to the embodiment shown in FIG.

2 is an enlarged view of portion A shown in FIG. 1, and FIGS. 3 and 4 respectively show a side view of the camera module shown in FIG. 2.

2 to 4, the connection board 20 of the camera module according to the exemplary embodiment of the present invention includes a plurality of connection pads 22 for electrical connection with the substrate 30.

An external connection terminal 34 is provided on the side surface 32 of the substrate 30 at predetermined intervals, and the upper end portion 31, which is an outer upper end portion of the portion joined to the housing 10 of the substrate 30, is provided. A plurality of connection terminals 33 are provided in correspondence with the connection pads 22.

That is, as shown in FIG. 2, the connecting substrate 20 is disposed in a direction substantially perpendicular to the side upper end 31 of the substrate 30, and the connecting pad 22 of the connecting substrate 20 is formed of a substrate ( It is arrange | positioned so that it may adjoin the connection terminal 33 of the side upper part 31 of 30).

As shown in FIG. 2, the connection board 20 according to the embodiment of the present invention has a protrusion protruding from the side of the connection pad 22 (to the connection terminal 33 of the substrate 30). 24 is provided, and the cavity 35 which is formed to be recessed to a predetermined depth is provided at a portion where the connection terminal 33 of the upper end portion 31 of the substrate 30 is provided.

Here, the connection terminal 33 is provided at the bottom of the cavity 35, and the connection substrate 20 is mounted such that the connection pads 22 are disposed in correspondence to the portions where the connection terminals 33 are provided.

In addition, as the connection substrate 20 is disposed at the side upper end 31 of the substrate 30, the protrusion 24 of the connection pad 22 of the connection substrate 20 is the side upper end 31 of the substrate 30. The end of the protrusion 24 is in contact with the connection terminal 33 provided on the bottom of the cavity 35 by being accommodated in the cavity 35 of the ().

As shown in FIG. 4, each of the cavities 35 is filled with a conductive adhesive 36 so that the connection pads 22 and the connection terminals 33 are electrically connected to each other.

That is, the end of the protruding portion 24 of the connection pad 22 may be electrically connected to the connection terminal 33 at the bottom of the cavity 35 in the absence of the conductive adhesive 36. The conductive adhesive 36 is provided in the cavity so as to keep the protrusion 24 in contact with the connecting terminal 33 and to prevent the occurrence of a short circuit due to play between the protrusion 24 and the connecting terminal 33. (35) is to be filled.

Therefore, the protrusion 24 of the connection pad 22 may not necessarily be in contact with the connection terminal 33. This is because it can be electrically connected by the conductive adhesive 36.

As described above, the cavity 35 is formed on the side end portion 31 of the substrate 30, and the connection terminal 33 is provided therein, and the conductive adhesive 36 is filled in the cavity 35. Since the cavity 35 has a predetermined space, the conductive adhesive 36 may be sufficiently accommodated so that the conductive adhesive 36 does not flow sideways or toward the side external connection terminal 34 of the substrate 30. It can prevent the occurrence of short.

On the other hand, with reference to Figures 3 and 4 will be described with respect to the manufacturing method of the camera module according to an embodiment of the present invention.

First, a lens barrel (not shown), an actuator (not shown), etc., in which the lens module is accommodated, are disposed in the housing 10, and an image sensor (not shown) is bonded onto the substrate 30 to bond the housing 10 to the substrate ( 30) to assemble the camera module.

In addition, the connecting substrate 20 connected to the actuator is disposed to surround one side of the housing 10, where the connecting substrate 20 is substantially perpendicular to the substrate 30 as shown in FIG. 3. It is preferably disposed so that the side surface of the connection substrate 20 can be in contact with the side upper end 31 of the substrate 30.

Of course, before going through the above-described process, that is, in the process of manufacturing the substrate 30, the side of the end portion 31 of the substrate 30 is connected to the cavity 35 and the bottom surface of the cavity 35 at a predetermined interval It is preferable to provide the terminal 33.

As shown in FIG. 3, the actuator and the connection board 20 are electrically connected to each other so that the protrusion 24 of the connection pad 22 of the connection board 20 is accommodated in the cavity 35.

In this case, the protruding portion 24 may be in contact with the connection terminal 33 or may be spaced at a predetermined interval.

On the other hand, after the process as described above, as shown in Figure 4 each of the cavity 35 is filled with a conductive filler 36 by a method such as dispensing (dispensing), respectively.

At this time, since the conductive filler 36 has a somewhat high viscosity, it is possible to prevent the conductive filler 36 from flowing to the side or the side of the substrate 30 by surface tension or the like, thereby preventing short circuits from occurring.

1 is a perspective view schematically showing a camera module according to an embodiment of the present invention.

FIG. 2 is an enlarged view of a portion A shown in FIG. 1.

3 and 4 respectively show a side view of the camera module shown in FIG. 2.

Claims (8)

A housing accommodating a lens module and an actuator for transferring the lens module; A connection board electrically connected to the actuator and having at least one connection pad for external connection; A substrate having at least one connection terminal bonded to the housing and electrically connected to the connection pad; And The camera module is provided with a predetermined depth recessed in the substrate having the connection terminal therein, at least one cavity for receiving the end of the connection pad is connected to the connection terminal. The method of claim 1, wherein the connection pad, And a protrusion which protrudes toward the side of the connecting substrate and is received in the cavity. The method of claim 2, wherein the cavity, The camera module, characterized in that provided in the side upper end portion that is the outer upper end portion of the portion bonded to the housing of the substrate. The method of claim 3, The connecting board is a camera module, characterized in that it comprises a flexible printed circuit board provided to surround one side of the housing. The method of claim 2, The substrate is formed of a plurality of layers, the camera module, characterized in that to form the cavity for at least one layer of the plurality of layers. The method of claim 2, And a conductive adhesive filled in the cavity so that the protrusion is received and fixed in the cavity and the connection terminal and the connection pad are electrically connected to each other. Forming a cavity at a side upper end of the substrate and having a connection terminal provided therein; Bonding a housing containing a lens module and an actuator for transferring the lens module to the substrate; And And electrically connecting the actuator and the connection board to accommodate the protrusion of the connection pad of the connection board in the cavity. The method of claim 7, wherein And filling the cavity with a conductive adhesive so that the protrusion and the connection terminal are electrically connected to each other.

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