KR100946918B1 - 웨이퍼 스윙유닛 및 이를 포함하는 웨이퍼 세정장치 - Google Patents
웨이퍼 스윙유닛 및 이를 포함하는 웨이퍼 세정장치 Download PDFInfo
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- KR100946918B1 KR100946918B1 KR1020070115588A KR20070115588A KR100946918B1 KR 100946918 B1 KR100946918 B1 KR 100946918B1 KR 1020070115588 A KR1020070115588 A KR 1020070115588A KR 20070115588 A KR20070115588 A KR 20070115588A KR 100946918 B1 KR100946918 B1 KR 100946918B1
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- cleaning apparatus
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
Claims (11)
- 웨이퍼의 세정장치에 장착되어 상기 웨이퍼를 스윙하는 웨이퍼 세정스윙 유닛에 있어서,다수의 웨이퍼를 수납하는 수납유닛;상기 수납유닛 일측에 연결되어 상기 수납유닛을 스윙 운동시키는 스윙축;상기 수납유닛의 일측에 연결된 연결유닛; 및상기 연결유닛의 타측에 결합되어 상기 연결유닛을 직선 왕복 운동시킴에 따라 상기 수납유닛을 스윙 운동시키는 구동유닛;를 포함하는 웨이퍼 스윙유닛.
- 제1항에 있어서,상기 수납유닛에는 일방향으로 길이가 긴 타원 형태의 홀 형상을 갖는 장공부가 형성되고,상기 연결유닛은 상기 장공부에 결합되어 상기 연결유닛이 직선 왕복 운동을 함에 따라 상기 장공부 내부에서 왕복 운동하는 것을 특징으로 하는 웨이퍼 스윙유닛.
- 제1항에 있어서,상기 수납유닛의 하부는 호(arc) 형태로 형성된 것을 특징으로 하는 웨이퍼 스윙유닛.
- 제1항에 있어서,상기 연결유닛은 바(bar) 형태로 형성된 것을 특징으로 하는 웨이퍼 스윙유닛.
- 제1항에 있어서,상기 구동유닛은 상기 연결유닛을 직선 왕복 운동시키는 리니어 모터인 것을 특징으로 하는 웨이퍼 스윙유닛.
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070115588A KR100946918B1 (ko) | 2007-11-13 | 2007-11-13 | 웨이퍼 스윙유닛 및 이를 포함하는 웨이퍼 세정장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070115588A KR100946918B1 (ko) | 2007-11-13 | 2007-11-13 | 웨이퍼 스윙유닛 및 이를 포함하는 웨이퍼 세정장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090049360A KR20090049360A (ko) | 2009-05-18 |
KR100946918B1 true KR100946918B1 (ko) | 2010-03-09 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR1020070115588A KR100946918B1 (ko) | 2007-11-13 | 2007-11-13 | 웨이퍼 스윙유닛 및 이를 포함하는 웨이퍼 세정장치 |
Country Status (1)
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KR (1) | KR100946918B1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102598146B1 (ko) * | 2022-11-15 | 2023-11-06 | 에스케이실트론 주식회사 | 웨이퍼 세정 장치 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08299918A (ja) * | 1995-05-11 | 1996-11-19 | Dainippon Screen Mfg Co Ltd | 回転式基板洗浄装置 |
JP2001239199A (ja) | 1999-12-20 | 2001-09-04 | Tokyo Electron Ltd | 塗布膜形成装置及び塗布膜形成方法 |
KR20050068800A (ko) * | 2003-12-30 | 2005-07-05 | 동부아남반도체 주식회사 | 씨엠피 장비의 웨이퍼 건조 장치 |
KR20060075176A (ko) * | 2004-12-28 | 2006-07-04 | 삼성전자주식회사 | 웨이퍼 세정 방법 및 장치 |
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2007
- 2007-11-13 KR KR1020070115588A patent/KR100946918B1/ko not_active IP Right Cessation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08299918A (ja) * | 1995-05-11 | 1996-11-19 | Dainippon Screen Mfg Co Ltd | 回転式基板洗浄装置 |
JP2001239199A (ja) | 1999-12-20 | 2001-09-04 | Tokyo Electron Ltd | 塗布膜形成装置及び塗布膜形成方法 |
KR20050068800A (ko) * | 2003-12-30 | 2005-07-05 | 동부아남반도체 주식회사 | 씨엠피 장비의 웨이퍼 건조 장치 |
KR20060075176A (ko) * | 2004-12-28 | 2006-07-04 | 삼성전자주식회사 | 웨이퍼 세정 방법 및 장치 |
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KR20090049360A (ko) | 2009-05-18 |
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