KR100943352B1 - Etching system for auto control of etchant concentration - Google Patents

Abstract

The present invention relates to an etching system capable of automatically controlling the concentration of the etchant, wherein the stabilizer, the fruit water and the sulfuric acid stored in the stabilizer tank, the fruit tank and the sulfuric acid tank are mixed at a predetermined concentration and stored in the etchant storage tank, and the etchant storage tank An etching system capable of automatic control of an etchant for spraying an etchant stored in a copper plate, which is an object to be etched through an etching chamber, to etch the copper plate at a predetermined thickness, wherein the etching solution is sprayed onto the copper plate and dropped into the etching chamber, and the etchant circulating pump An etching controller pumped by the etching solution delivered through the etching solution circulation line to measure sulfuric acid, fruit water, and copper concentrations included in the etching solution, and outputting sulfuric acid, fruit water, and copper concentration correction signals; Sulfuric acid, fruit water and etching solution control lines for transmitting sulfuric acid, fruit water and copper concentration correction signals output from the etching controller, respectively; Sulfuric acid correction pump and fruit correction pump for receiving sulfuric acid, fruit and copper concentration correction signals through the sulfuric acid, fruit water and etching liquid control lines to pump sulfuric acid, fruit and etching liquid stored in the sulfuric acid tank, fruit water tank and etching liquid storage tank. And etching liquid input pump; And a sulfuric acid correction line, a fruit correction line, and an etching solution input line configured to transfer sulfuric acid, fruit water, and etching solution pumped from the sulfuric acid correction pump, the fruit water correction pump, and the etching solution input pump to the etching chamber, respectively.

 Etching, sulfuric acid, hydrogen peroxide, copper, concentration

Description

Etching system for automatic control of etchant concentration {ETCHING SYSTEM FOR AUTO CONTROL OF ETCHANT CONCENTRATION}

The present invention relates to an etching system capable of automatically controlling the etching liquid concentration, and more particularly, to detect the etching liquid concentration in the etching chamber in real time, so that the concentration of the etching liquid in the etching chamber is always kept constant so that the copper plate is etched to a constant thickness. The present invention relates to an etching system capable of automatic control of etchant concentration.

The conventional etching system sprays the etching liquid formed by mixing sulfuric acid, hydrogen peroxide and a stabilizer in an appropriate ratio onto a copper plate moved by a conveyor to etch the copper plate to a desired thickness.

A conventional etching system is shown in FIG. 1 in which an etching solution is sprayed onto a copper plate moved by a conveyor to etch the copper plate.

Referring to FIG. 1, a conventional etching system includes an etching chamber 10, an etching liquid storage tank 20, a stabilizer tank 30, and a hydrogen peroxide (hereinafter referred to as fruit tree) tank 40. Sulfuric acid tank 50 is included.

In the etchant storage tank 20, the stabilizer, the fruit water and the sulfuric acid in the stabilizer tank 30, the fruit water tank 40 and the sulfuric acid tank 50 are respectively stabilized pump 32, fruit water input pump 42 and sulfuric acid input. Pumped by the pump 52, is moved along the stabilizer input line 31, fruit water input line 41 and sulfuric acid input line 51 is mixed at a specific ratio.

At this time, the concentration control unit 60 is installed between the stabilizer tank 30, the fruit water tank 40 and the sulfuric acid tank 50 and the etching liquid storage tank 20, the concentration control unit 60 is a copper plate ( Stabilizer introduced into the etchant storage tank 20 from the stabilizer tank 30, the fruit water tank 40 and the sulfuric acid tank 50 so that the etchant may be mixed to a predetermined concentration to etch 12) to a specific thickness. The amount of fruit, fruit and sulfuric acid will be controlled.

The etchant stored in the etchant storage tank 20 is pumped by the etchant input pump 22 and introduced into the etchant chamber 10 along the etchant input line 21.

The etchant injected into the etching chamber 10 is again pumped by the injection pump 14 to be delivered to the injector 15 through the injection line 13 and then injected into the copper plate 12 by the corresponding injector 15. .

At this time, the etching liquid injected from the injector 15 is sprayed on the copper plate 12 and then etched and dropped together with the molten copper to be dropped back into the etching chamber 10 to be reused.

Therefore, the concentration of the etchant in the etching chamber 10 is inevitably changed as the molten copper is etched and mixed, that is, the concentration of the etchant is lowered and, conversely, the copper concentration is increased.

Accordingly, in the conventional etching system, the stabilizer, the fruit water, and the sulfuric acid are mixed at a specific ratio so that the etching liquid stored in the etching liquid storage tank 20 is further introduced into the etching chamber 10, thereby etching liquid in the etching chamber 10. By lowering the copper concentration contained therein, the etching liquid is injected into the copper plate 12, so that the copper plate 12 is always etched to a constant thickness.

However, the conventional etching system described above has a problem that, after a long time of operation, the concentration of the etching solution composed of sulfuric acid, hydrogen peroxide and stabilizer is lowered while the copper concentration is increased, so that the copper plate moved by the conveyor line cannot be etched to a certain thickness. There is this.

In addition, in order to lower the copper concentration, the etchant injected into the etching chamber in the etchant storage tank has a problem in that only certain chemicals having a low concentration cannot be added as sulfuric acid, fruit water and a stabilizer are mixed at a predetermined ratio.

In order to solve the above problems, stabilizers, fruit water and sulfuric acid stored in the stabilizer tank, the fruit water tank and the sulfuric acid tank are mixed at a predetermined concentration and stored in the etching liquid storage tank, and the etching liquid stored in the etching liquid storage tank passes through the etching chamber. An etching system capable of automatically controlling an etching solution for spraying a copper plate to a predetermined thickness by etching the copper plate, wherein the etching plate is sprayed onto the copper plate and dropped into an etching chamber, pumped by an etching solution circulation pump, and then, through an etching solution circulation line. An etching controller which receives the delivered etching solution, measures concentrations of sulfuric acid, fruit water, and copper contained in the etching solution, and outputs sulfuric acid, fruit water, and copper concentration correction signals; Sulfuric acid, fruit water, and etching liquid control lines for transmitting sulfuric acid, fruit water, and copper concentration correction signals output from the etching controller 100; Sulfuric acid correction pump and fruit correction pump for receiving sulfuric acid, fruit and copper concentration correction signals through the sulfuric acid, fruit water and etching liquid control lines to pump sulfuric acid, fruit and etching liquid stored in the sulfuric acid tank, fruit water tank and etching liquid storage tank. And etching liquid input pump; And a sulfuric acid correction line, a fruit water correction line, and an etching solution input line for delivering sulfuric acid, fruit water, and etching solution pumped from the sulfuric acid correction pump, the fruit water correction pump, and the etching solution input pump to the etching chamber, respectively. It is to provide an etching system that can be automatically controlled.

Preferably, the etching controller includes a reservoir containing sulfuric acid, fruit water and copper concentration sensors for receiving the etching liquid delivered from the etching chamber and for detecting sulfuric acid, fruit water and copper concentration values from the received etching liquid; Sulfuric acid, fruit water and copper sensor boards for converting sulfuric acid, fruit water and copper concentration values detected by the magnitude of current or voltage by the sulfuric acid, fruit water and copper concentration sensors into average concentration values; And a control board which receives the concentration signals averaged from the sulfuric acid, fruit water, and copper sensor boards and outputs a correction signal for correcting the concentration of the changed etchant in the etching chamber to a predetermined value concentration. It is to provide an etching system capable of automatic control.

More preferably, the sulfuric acid sensor board is a concentration sensor current loop receiving unit for converting the sulfuric acid concentration value measured as a signal in the form of current by the sulfuric acid concentration sensor into a signal in the form of voltage; An isolation amplifier converter electrically insulating the sulfuric acid concentration value received from the concentration sensor current loop receiver; And an integration and output limiting unit configured to receive the sulfuric acid concentration value insulated from the insulation amplifier converter, remove the noise signal included in the sulfuric acid concentration value, and calculate an average value for the sulfuric acid concentration value. It is to provide an etching system that can be automatically controlled.

More preferably, the fruit sensor board comprises: a high impedance voltage receiver for receiving the fruit juice concentration value detected as the magnitude of the voltage from the fruit juice concentration sensor and amplifying the fruit juice concentration value of a weak magnitude; An isolation amplifier converter electrically insulating the overconcentration value received from the high impedance voltage receiver; And an integrator and an output limiter configured to receive the insulated overconcentration value from the insulated amplifier converter, remove an noise signal included in the overconcentration value, and calculate an average value for the overconcentration value. It is to provide an etching system capable of automatic control of etchant concentration.

More preferably, the copper sensor board includes a light source constant current driver for generating a light source irradiated to the etchant by the light source irradiation probe of the copper concentration sensor; A light quantity measuring receiver configured to receive a light source irradiated to the etchant from the light source irradiation probe and detect a dynamic concentration value with a change value of the light quantity transmitted from the light quantity receiving probe that calculates the changed light quantity of the received light source; An integration and output limiting unit for receiving the copper concentration value from the light quantity measuring receiver and calculating a mean value for the copper concentration value after removing the noise signal included in the corresponding copper concentration value; It is to provide an etching system capable of automatic control.

More preferably, the control board further comprises: an analog multiplexer for selectively receiving sulfuric acid, fruit water, and copper concentration values delivered from the integration and output limitations of the sulfuric acid, fruit water, and copper sensor boards, respectively; An A / D conversion unit for digitizing the sulfuric acid, fruit tree, and copper concentration values of the analog form received from the analog multiplexer; g / L for the operator to know the sulfuric acid, fruit tree, and copper concentration values digitized by the A / D converter a microcontroller for performing an operation for converting in mol / L or% units; An LCD module for displaying sulfuric acid, fruit water, and copper concentration values converted by the microcontroller; An insulated output 5-channel relay for receiving the correction data calculated by the touch screen computer and converting the sulfuric acid correction pump, the fruit water correction pump, and the etching liquid input pump into correction signals for controlling the sulfuric acid correction pump; A surge protection RS-422 positioned between the microcontroller and the touch screen computer to block surge voltages generated when signals are transmitted to each other; And an etching solution correction signal, a fruit correction signal, and a sulfuric acid correction signal output unit which directly receive the correction signal from the insulation output 5-channel relay and directly control the sulfuric acid correction pump, the fruit water correction pump, and the etching solution input pump. It is to provide an etching system capable of automatic control of etchant concentration.

More preferably, the stabilizer contained in the stabilizer tank is driven in the etching chamber through the stabilizer correction line in proportion to the concentration of the fruit that needs to be corrected as the stabilizer correction pump is driven by the fruit correction signal output from the fruit correction signal output unit. It is to provide an etching system capable of automatic control of the etchant concentration, characterized in that the transfer.

Etching system capable of automatic control of the concentration of the etching solution according to the present invention has the effect that can be supplied separately only the chemicals of the concentration changed in the etching chamber by individually controlling the etching tank, stabilizer tank, fruit tree and sulfuric acid tank.

In addition, by measuring the concentration of the etching solution in the etching chamber in real time, as only the chemicals in which the concentration is changed immediately, there is an effect that the thickness of the etching target to the end to a predetermined thickness.

In order to achieve the above-described effects, an etching system equipped with an automatic etching solution concentration controller according to the present invention will be described in detail with reference to the accompanying drawings.

Figure 2 shows an etching system with an automatic etching solution concentration controller according to the present invention.

As shown in FIG. 2, the etching system equipped with the automatic etching solution concentration controller according to the present invention includes the stabilizer tank 30, the fruit water tank 40, the sulfuric acid tank 50, the etching controller 100, and the etching of the object. The etching chamber 10 includes at least one etchant tank 20 in which an etchant formed by mixing at least one chemical agent is stored.

As described above, the operation of an etching system equipped with an automatic etching solution concentration controller having the following configurations will be described.

In order to etch the copper plate 12 to be etched to a desired thickness, an etching solution is required, and the etching solution includes a stabilizer stored in the stabilizer tank 30, a fruit water stored in the fruit tank 40, and the sulfuric acid tank 50. Sulfuric acid stored in is mixed with a specific concentration to form.

The stabilizer stored in the stabilizer tank 30 is pumped by a stabilizer input pump 32 to store the etchant along the stabilizer input line 31 connecting the etching solution storage tank 20 and the stabilizer tank 30. It is put into the tank 20.

On the other hand, the fruit water stored in the fruit tank 40 is pumped by the fruit feed pump 42, along the fruit feed line 41 for connecting the etching liquid storage tank 20 and the fruit tank 40; It is injected into the etchant storage tank 20.

Finally, the sulfuric acid stored in the sulfuric acid tank 50 is pumped by the sulfuric acid input pump 52, along the sulfuric acid input line 51 connecting the etching liquid storage tank 20 and the sulfuric acid tank 50. Into the etchant storage tank 20.

The etchant storage tank 20 forms an etchant by mixing the stabilizer, fruit tree, and sulfuric acid introduced at a specific concentration with each other.

The etchant formed and stored in the etchant storage tank 20 is pumped by the etchant input pump 22, and then is injected into the etchant chamber 10 along the etchant input line 21.

The etching chamber 10 is composed of an injector 15 for injecting the etching liquid from the etching liquid storage tank 20 to the copper plate 12 which is an etching target, such an injector 15 is injected from the etching chamber 10 The etchant supplied by the pump 14 is supplied through the injection line 13.

At this time, the etching liquid sprayed from the injector 15 is sprayed on the copper plate 12 which is the etching target object, and then falls back to the etching chamber 10 to be reused. Therefore, the concentration of the etchant in the etching chamber 10 is inevitably changed, and the current concentration of various chemical liquids contained in the etchant in the etching chamber 10 is measured by the etching controller 100.

That is, the etching solution of the etching chamber 10 is pumped by the etching solution circulation pump 16, and the etching controller (along the etching solution circulation line 17 provided between the etching chamber 10 and the etching controller 100). 100 is delivered to the reservoir 110.

The etchant delivered to the reservoir 110 is re-introduced into the etching chamber 10 without separate power from the reservoir 110 located at a physically high position after sulfuric acid, fruit water and copper concentration are measured.

As described above, the etching liquid injected into the copper plate 12 and dropped into the etching chamber 10 may continuously measure sulfuric acid, fruit water, and copper concentrations in the reservoir 110 in real time. ) And the reservoir 110 is circulated.

More specifically, the etchant delivered to the etching controller 100 is a reservoir 110 including the sulfuric acid concentration sensor 111, the fruit water concentration sensor 112 and the copper concentration sensor 113 as shown in FIG. Flows into).

 As shown in FIG. 3, the reservoir 110 includes a first reservoir 114, a second reservoir 115, and a third reservoir 116, which is etched through the etching solution circulation line 17. The etchant delivered from the chamber 10 to the reservoir 110 flows into the first reservoir 114 first, and when the first reservoir 114 reaches the full level, the etchant flows into the second reservoir 115 and again. When the second reservoir 116 becomes the full water level, the second reservoir 116 is introduced into the third reservoir 116.

At this time, each of the sulfuric acid concentration sensor 111, the fruit water concentration sensor 112 and the dynamics sensor 113 included in the first reservoir 114, the second reservoir 115 and the third reservoir 116 is Sulfuric acid, fruit water, and copper concentrations of the etching solution flowing from the etching chamber 10 are measured through the etching solution circulation line 17.

The sulfuric acid concentration, the fruit water, and the copper concentration measured by the sulfuric acid concentration sensor 111, the fruit water concentration sensor 112, and the copper concentration sensor 113 of the reservoir 110 are respectively sulfuric acid concentration sensor board 120, fruit tree sensor board ( 130 and the sensor board 140 is transferred to the control board 160.

Thereafter, the control board 160 is mounted on the stabilizer tank 30, the fruit water tank 40, and the sulfuric acid tank 50 to increase the concentrations of the stabilizer, fruit water, and sulfuric acid, which are relatively low as the copper concentration increases. The stabilizer correction pump 33, the fruit water correction pump 43, and the sulfuric acid correction pump 53 are directly controlled so that chemicals requiring concentration correction are introduced into the etching chamber 10.

The above description will be described in more detail with reference to FIG. 4.

4, various sulfuric acid sensor boards 120, fruit tree sensor boards 130, copper sensor boards 140, temperature sensor boards 150, and control boards 160 included in the etching controller 100 are illustrated.

The sulfuric acid sensor board 120 includes a concentration sensor current loop receiver 121, an isolation amplifier converter 122, and an integral and output limiter 123, and the fruit sensor board 130 includes a high impedance voltage receiver ( 131, an isolation amplifier converter 132, and an integral and output limiter 133, wherein the copper sensor board 140 includes a light source constant current driver 141, a photometric receiver 142, and an integral and output limiter. 143, and the temperature sensor board 150 includes a temperature sensor receiver 151 and an integral and output limiter 152.

The control board 160 includes an analog multiplexer 161, an A / D converter 162, a microcontroller 163, an LCD module 164, an isolated output 5-channel relay 165, and a surge protection RS-. 422 (166), stabilizer correction signal output unit 167, fruit correction signal output unit 168 and sulfuric acid correction signal output unit 169.

First, the sulfuric acid concentration sensor 111 transmits a current signal generated by a change in dielectric constant according to the concentration of sulfuric acid contained in the etching solution to the concentration sensor current loop receiver 121.

The concentration sensor current loop receiving unit 121 converts the current signal according to the sulfuric acid concentration received from the sulfuric acid concentration sensor 111 into a voltage signal, and transmits it to the isolation amplifier converter 122.

The isolation amplifier converter 122 electrically insulates the voltage signal received from the concentration sensor current loop receiver 121 and transfers the voltage signal to the integration and output limiter 123.

The integral and output limiting unit 123 calculates an average value of the measured values in order to prevent noise signals generated as the measured values of the sulfuric acid concentration change abruptly, and thus the analog multiplexer 161 of the control board 160. To pass.

When the analog multiplexer 161 selectively transmits the sulfuric acid concentration numerical signal received from the integration and output limiter 123 to the A / D converter 162, the A / D converter 162 is analog. The sulfuric acid concentration numerical signal, which is a signal, is converted into a digital signal.

  The digital signal converted by the A / D converter 162 is transmitted to the microcontroller 163. The microcontroller 163 optimizes the sulfuric acid concentration numerical signal converted into a digital signal by averaging and software. The work is converted to a concentration value g / L, mol / L or% units in sulfuric acid that can be known by humans and displayed directly on the LCD module 164.

In addition, the microcontroller 163 is a LAN (Local Area Network) so that the sulfuric acid concentration value in g / L, mol / L or% unit via the surge protection RS-422 (166), wired / wireless communication It is also displayed on the touch screen computer 200 connected.

At this time, the touch screen computer 200 corrects by comparing the sulfuric acid concentration value g / L, mol / L or% in the current etching chamber 10 received from the microcontroller 163 with the set value of the sulfuric acid concentration initially input. Will yield the data.

The correction data is data related to the amount of sulfuric acid that must be replenished from the sulfuric acid tank 50 to the etching chamber 10 in order to maintain the sulfuric acid concentration value of the sulfuric acid concentration initially inputted in the etching chamber 10. .

When correction data calculated from the touch screen computer 200 is transferred to the microcontroller 163 via the surge protection RS-422 166, the microcontroller 163 transmits the correction data to the isolation output 5-channel relay. Forward to 165.

When the 5-channel relay 165 transmits the correction data received from the microcontroller 163 to the sulfuric acid correction signal output unit 169, the sulfuric acid correction signal output unit 169 transmits the correction data to current or voltage. Convert to a correction signal of the form

The sulfuric acid correction signal output unit 169 and the sulfuric acid correction pump 53 are connected to the sulfuric acid control line 55, and the sulfuric acid correction signal output unit 169 sends a correction signal to the sulfuric acid control line 55. By transmitting to the sulfuric acid correction pump 53 through, the sulfuric acid correction pump 53 is controlled.

 That is, the sulfuric acid correction pump 53 receives the sulfuric acid correction signal to pump sulfuric acid stored in the sulfuric acid tank 50, and the sulfuric acid pumped is introduced into the etching chamber 10 through the sulfuric acid correction line 52. Be sure to

Accordingly, the concentration of sulfuric acid in the etching chamber 10 can maintain the concentration value of the sulfuric acid initially set.

In addition, the fruit water concentration sensor 112 detects a voltage generated according to the concentration of fruit water contained in the etchant and transmits the voltage to the high impedance voltage receiver 131.

The high impedance voltage receiver 131 amplifies the weak voltage signal corresponding to the sulfuric acid concentration received from the overwater concentration sensor 113 into a voltage signal of a sufficiently large signal and removes noise.

The voltage signal amplified by the high impedance voltage receiver 131 according to the overconcentration is electrically insulated by the isolation amplifier converter 132 and transferred to the integration and output limiter 133.

In order to prevent the noise signal generated as the measured value of the measured fruit concentration is rapidly changed, the average value of the measured value is calculated and transmitted to the analog multiplexer 161 of the control board 160.

When the analog multiplexer 161 selectively transmits the overconcentration signal received from the integration and output limiting unit 133 to the A / D converter 162, the A / D converter 162 receives an analog signal. Convert the phosphorus concentration signal to a digital signal.

  The digital signal converted by the A / D converter 162 is transmitted to the microcontroller 163, and the microcontroller 163 optimizes the numerical value of the overconcentration numerical value converted into the digital signal by processing and software. The work is performed by converting the concentration of g / L, mol / L, or% of the fruit that the human can know and display the numerical value directly on the LCD module 164.

In addition, the microcontroller 163 is a touch screen computer connected to the LAN (Local Area Network) via the surge protection RS-422 (166), the overwater concentration value in g / L, mol / L or% unit (200) so that it can be displayed.

In this case, the touch screen computer 200 compares the set value of the initially input fruit concentration with the fruit concentration value g / L, mol / L or% in the current etching chamber 10 received from the microcontroller 163 and corrects the correction. Will yield the data.

The correction data is data related to the amount of fruit that must be replenished from the fruit tank 40 to the etching chamber 10 in order to maintain the set value of the fruit water concentration initially input to the fruit water concentration value in the current etching chamber 10. .

When correction data calculated from the touch screen computer 200 is transferred to the microcontroller 163 via the surge protection RS-422 166, the microcontroller 163 transmits the correction data to the isolation output 5-channel relay. Forward to 165.

When the 5-channel relay 165 transmits the correction data received from the microcontroller 163 to the fruit correction signal output unit 168, the fruit correction signal output unit 168 transmits the correction data to current or voltage. Convert to a correction signal of the form

The fruit correction signal output unit 168 and the fruit correction pump 43 are connected to the fruit control line 45. The fruit correction signal output unit 168 transmits a correction signal to the fruit control line 45. By transmitting to the fruit correction pump 43 through, the fruit correction pump 43 is controlled.

 That is, the fruit correction pump 43 receives the correction signal to pump the fruit stored in the fruit tank 40, and the pumped fruit water is introduced into the etching chamber 10 through the fruit correction line 42. do.

Accordingly, the fruit water concentration in the etching chamber 10 can maintain the concentration value of the initially set fruit water.

In addition, the fruit correction signal is applied to the stabilizer correction pump 33, pumping the stabilizer stored in the stabilizer tank 30, the stabilizer correction line to a level proportional to the concentration of the fruit to be pumped stabilizer correction required Into the etching chamber 30 along the (34).

Finally, the copper concentration sensor 113 includes a light source irradiation probe 113a, a light receiving probe 113b, and a tube 113c.

The tube 113c is positioned between the light source irradiation probe 113a and the light receiving probe 113b and is filled with the etching solution transferred from the etching chamber 10.

When a constant constant current is generated by the light source constant current driver 141 of the copper concentration sensor board 140 to always generate a constant light source, the light source irradiation probe 113a uses the light source generated by the light source constant current driver 141 as the source. The tube 113c is irradiated.

The light source transmitted through the tube 113c is changed in the light amount of the light source according to the copper concentration of the tube 113c. The light receiving probe 113b detects the light source with the changed light amount and measures the changed light amount. The light quantity measurement receiver 142 is transmitted.

The light quantity measuring receiver 142 detects the copper concentration contained in the etchant with the measured light quantity of the light source and transmits the same to the integration and output limiting unit 143.

More specifically, when copper is melted by the etching solution, the etching solution becomes light blue, and as the copper concentration increases, the etching solution becomes blue.

Therefore, as the transmittance of the light source irradiated onto the tube 113c is lowered, the light amount of the light source measured by the light quantity measuring receiver 142 is reduced.

 That is, the copper concentration is detected by the voltage generated by the copper concentration sensor 113 according to the transmittance of the light source to be irradiated, and the high and low of the copper concentration can be determined through the high and low voltage.

The integral and output limiting unit 143 may convert the averaged copper concentration value into an analog multiplexer 161 of the control board 160 to prevent a noise signal generated as the measured value of the detected copper concentration changes abruptly. To pass on.

When the analog multiplexer 161 selectively transmits the copper concentration signal received from the integration and output limiter 143 to the A / D converter 162, the A / D converter 162 may convert an analog signal. The phosphor concentration signal is converted into a digital signal.

The digital signal converted by the A / D converter 162 is transmitted to the microcontroller 163, and the microcontroller 163 performs an average processing and software optimization operation on the copper concentration signal converted into the digital signal. By converting in the unit of the concentration value of the human knows g / L, mol / L or% unit and displays the numerical value directly on the LCD module (164).

In addition, the microcontroller 163 is a touch screen computer connected to the local area network (LAN) via the surge protection RS-422 166 having a copper concentration value in units of g / L, mol / L or%. (200) so that it can be displayed.

In this case, the touch screen computer 200 compares the set value of the initially input copper concentration with the copper concentration value g / L, mol / L or% in the current etching chamber 10 received from the microcontroller 163 and corrects it. Will yield the data.

The correction data refers to the correction chamber 10 in the etching liquid storage tank 20 in which sulfuric acid, fruit water and stabilizer are mixed so that the copper concentration value in the current etching chamber 10 maintains the allowable value of the initially input copper concentration. This data is related to the amount of etchant to be supplemented with).

When correction data calculated from the touch screen computer 200 is transferred to the microcontroller 163 via the surge protection RS-422 166, the microcontroller 163 transmits the correction data to the isolation output 5-channel relay. Forward to 165.

When the 5-channel relay 165 transmits the correction data received from the microcontroller 163 to the etching solution correction signal output unit 167, the etching solution correction signal output unit 167 transmits the correction data to current or voltage. Convert to a correction signal of the form

The etchant correction signal output unit 167 and the etchant pump 22 are connected to an etchant control line 35, and the etchant correction signal output unit 167 transmits a correction signal through the etchant control line 35. By transferring to the etchant pump 22, the etchant pump 22 is controlled.

 That is, the etchant pump 22 receives the correction signal to pump the etchant into the etchant storage tank 20, and allows the etchant to be pumped into the etchant chamber 10 through the etchant input line 21.

Accordingly, the copper concentration in the etching chamber 10 will maintain the copper concentration of the first allowable value.

In this case, an etchant correction pump may be provided separately from the etchant pump 22, and an etchant correction line may be provided separately from the etchant input line 21 to receive the etchant correction signal. When the pumped etching liquid stored in the etching liquid storage tank 20, the etching liquid is introduced into the etching chamber along the etching liquid correction line.

The present invention described above is capable of various substitutions, modifications, and changes without departing from the spirit of the present invention for those skilled in the art to which the present invention pertains. It is not limited to the drawings.

1 shows a conventional etching system.

2 is a view showing an etching system capable of automatic control of the etching solution concentration according to the present invention.

3 is a view showing the structure of the reservoir in the etching system capable of automatic control of the concentration of the etching solution according to the present invention.

Figure 4 is a block diagram of the inside of the etching control controller in the etching system capable of automatic control of the etching liquid concentration in accordance with the present invention.

Claims (7)

The stabilizer, the fruit water, and the sulfuric acid stored in the stabilizer tank 30, the fruit water tank 40, and the sulfuric acid tank 50 are mixed at a predetermined concentration and stored in the etching liquid storage tank 20, and stored in the etching liquid storage tank 20. In the etching system capable of automatic control of the concentration of the etching solution for spraying the stored etching solution to the copper plate 12 which is the etching target object passing through the etching chamber 10 to etch the copper plate 12 to a predetermined thickness, It is injected into the copper plate 12 and dropped in the etching chamber 10, pumped by the etching solution circulation pump 16 receives the etching solution delivered through the etching solution circulation line 17, sulfuric acid, fruit water contained in the etching solution And an etching controller 100 measuring copper concentration and outputting sulfuric acid, fruit water, and copper concentration correction signals; It is connected to the wired and wireless communication with the etching controller 100, and receives the concentration values of sulfuric acid, fruit water and copper measured by the etching controller 100, the concentration changed based on the sulfuric acid, fruit water and copper concentration values previously input A touch screen computer 200 for calculating correction data by calculating a numerical value; Sulfuric acid, fruit water, and etching solution control lines 55, 45, and 35 for transmitting sulfuric acid, fruit water, and copper concentration correction signals output from the etching controller 100; The sulfuric acid, fruit water, and copper concentration correction signals are received through the sulfuric acid, fruit water, and etchant control lines 55, 45, and 35, and the water is stored in the sulfuric acid tank 50, the fruit water tank 40, and the etching liquid storage tank 20. A sulfuric acid correction pump 53, a fruit water correction pump 43, and an etching solution input pump 22 for pumping the sulfuric acid, fruit water, and etching solution; And Sulfuric acid correction line 54, fruit tree correction line for delivering sulfuric acid, fruit water and etching liquid pumped from the sulfuric acid correction pump 53, the fruit water correction pump 43 and the etching liquid input pump 22 to the etching chamber 10, respectively. (44) and the etching solution input line 21; including, The etching controller 100 A reservoir 110 containing an etching solution delivered from the etching chamber 10 and equipped with sulfuric acid, fruit water, and copper concentration sensors 111, 112, and 113 for detecting sulfuric acid, fruit water, and copper concentration values from the received etching solution; Sulfuric acid, fruit water and copper sensor boards 120, 130, and 140 for converting sulfuric acid, fruit water, and copper concentration values detected by the magnitude of current or voltage by the sulfuric acid, fruit water, and copper concentration sensors 111, 112, and 113 into averaged concentration values; And A control board 160 which receives averaged concentration signals from the sulfuric acid, fruit tree and copper sensor boards 120, 130 and 140 and outputs a correction signal for correcting the concentration of the changed etchant in the etching chamber 10 to a predetermined value concentration; Etching system capable of automatic control of the concentration of the etchant comprising a. delete The method of claim 1, The sulfuric acid sensor board 120 is A concentration sensor current loop receiver 121 for converting the sulfuric acid concentration value measured by the sulfuric acid concentration sensor 111 into a signal in the form of a voltage; An isolation amplifier converter 122 electrically insulating the sulfuric acid concentration value received from the concentration sensor current loop receiver 121; And Receiving the sulfuric acid concentration value insulated from the isolation amplifier converter 122, and removes the noise signal included in the sulfuric acid concentration value and includes an integral and output limiting unit 123 for calculating the average value for the sulfuric acid concentration value Etching system capable of automatic control of the concentration of the etchant, characterized in that. The method of claim 1, The fruit sensor board 130 is A high impedance voltage receiver 131 for receiving the detected overconcentration value from the overconcentration sensor 112 and amplifying the overconcentration value with a weak magnitude; An isolation amplifier converting unit 132 electrically insulating the overconcentration value received from the high impedance voltage receiving unit 131; And An integrator and output limiter 133 which receives the insulated overconcentration value from the isolation amplifier converter 132, removes a noise signal included in the overconcentration value, and calculates an average value for the overconcentration value. Etching system capable of automatic control of the concentration of the etchant, characterized in that. The method of claim 1, The copper sensor board 140 is A light source constant current driver 141 generating a light source irradiated to the etchant by the light source irradiation probe 113a of the copper concentration sensor 113; A light quantity measuring receiver for receiving a light source irradiated to the etchant from the light source irradiation probe 113a and detecting a dynamic concentration value with a change value of the light quantity transmitted from the light quantity receiving probe 113b for calculating the changed light quantity of the received light source. 142; An integration and output limiter 143 which receives the copper concentration value from the light quantity measuring receiver 142 and calculates an average value for the copper concentration value after removing the noise signal included in the corresponding copper concentration value. Etching system capable of automatic control of etchant concentration. The method of claim 1, The control board 160 is An analog multiplexer 161 for selectively receiving sulfuric acid, fruit water, and copper concentration values delivered from the integral and output limiting units 123, 133, and 143 of the sulfuric acid, fruit tree, and copper sensor boards 120, 130, and 140, respectively; An A / D converter 162 for digitizing sulfuric acid, fruit water, and copper concentration values in analog form received from the analog multiplexer 161; A microcontroller 163 for performing an operation for converting the sulfuric acid, fruit water, and copper concentration values digitized by the A / D converter 162 into g / L, mol / L, or% units which can be known by a worker; An LCD module 164 for displaying sulfuric acid, fruit water, and copper concentration values converted in units of the microcontroller 163; Insulation output 5-channel relay which receives correction data calculated by the touch screen computer 200 and converts the sulfuric acid correction pump 53, the fruit water correction pump 43, and the etching liquid input pump 22 into a correction signal for controlling the sulfuric acid correction pump ( 165); A surge protection RS-422 166 positioned between the microcontroller 163 and the touch screen computer 200 to block surge voltages generated when signals are transmitted to each other; And Etch solution correction signal, fruit correction signal and sulfuric acid correction which directly receive the correction signal from the insulation output 5-channel relay 165 and directly control the sulfuric acid correction pump 53, the fruit water correction pump 43, and the etching solution input pump 22. Etching system capable of automatic control of the concentration of the etchant, characterized in that it comprises a signal output unit (167, 168, 169). The method of claim 6, Stabilizer contained in the stabilizer tank 30 stabilizer correction line in proportion to the concentration of the fruit that needs to be corrected as the stabilizer correction pump 33 is driven by the fruit correction signal output from the fruit correction signal output unit 168 Etching system capable of automatic control of the etchant concentration, characterized in that the transfer to the etching chamber (10) through (34).

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