CN114774920B - Processing technology for ensuring etching speed - Google Patents

Processing technology for ensuring etching speed Download PDF

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Publication number
CN114774920B
CN114774920B CN202210377701.1A CN202210377701A CN114774920B CN 114774920 B CN114774920 B CN 114774920B CN 202210377701 A CN202210377701 A CN 202210377701A CN 114774920 B CN114774920 B CN 114774920B
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Prior art keywords
etching
ensuring
tank
groove
stock solution
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CN114774920A (en
Inventor
任忠平
尹国钦
陈绍文
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Ningbo Fuji New Materials Co ltd
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Ningbo Fuji New Materials Co ltd
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/08Apparatus, e.g. for photomechanical printing surfaces
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23FNON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00Etching metallic material by chemical means
    • C23F1/10Etching compositions
    • C23F1/14Aqueous compositions
    • C23F1/16Acidic compositions
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • ing And Chemical Polishing (AREA)

Abstract

The invention relates to a processing technology for ensuring etching speed, which comprises an etching base, an etching groove and an electric cabinet, wherein the etching groove is arranged on the etching base, a sliding rail is arranged above the etching groove, a mobile manipulator is arranged on the sliding rail, a clamping platform is arranged at the lower end of the mobile manipulator, an induction bracket is arranged on the left side of a groove body of the etching groove, a Baume densimeter sliding up and down is vertically arranged in the induction bracket, a sleeve bracket sliding relative to the induction bracket is sleeved on the Baume densimeter, a first liquid storage tank and a second liquid storage tank are arranged at the lower part of the etching groove, and micropump brackets are vertically arranged on the first liquid storage tank and the second liquid storage tank. The invention has the characteristics of improving production efficiency, saving labor cost, ensuring winning of workers and etching pools by full-automatic production, protecting the health of the workers and the like.

Description

Processing technology for ensuring etching speed
Technical Field
The invention relates to the technical field of etching, in particular to a processing technology for ensuring etching speed.
Background
In the conventional etching process, etching liquid is directly poured into an etching tank, then a worker puts a product into the tank for etching operation once, the process consumes long time, has high labor cost and low production efficiency, and is easy to cause physical injury to the worker, so that a full-automatic production device is required to be designed for solving the problems, and automatic production is realized.
Disclosure of Invention
The invention aims to solve the technical problem of providing a processing technology for ensuring the etching speed, which has the characteristics of improving the production efficiency, saving the labor cost, ensuring the winning of workers and etching pools in full-automatic production, protecting the health of the workers and the like.
The technical scheme adopted for solving the technical problems is as follows: the utility model provides a ensure etching rate's processing technology, including full-automatic etching device, full-automatic etching device includes etching base, etching groove and electric cabinet, etching base on install the etching groove, etching groove top be provided with the slip track, install the mobile manipulator on the slip track, the centre gripping platform is installed to the mobile manipulator lower extreme, etching groove's cell body left side install the response support, vertically install upper and lower gliding baume meter in the response support, baume meter on cup joint with the relative gliding sleeve pipe support of response support, etching groove lower part be provided with first liquid reserve tank and second liquid reserve tank, first liquid reserve tank and second liquid reserve tank are all on vertically install the micropump support, the micropump support on install the micropump, the inlet pipe of micropump link to each other with first liquid reserve tank, the outlet pipe of micropump support extends to in the etching groove, etching groove front side is provided with the electric cabinet, the electric cabinet starts and closes according to baume meter detection data, the PH value that detects in the PH meter is installed to the PH value and is continuous with the electric cabinet.
The specific steps of the process are as follows: step one: selecting optimal data for improving etching speed to the greatest extent according to each reference parameter in the original process, wherein the optimal data comprises ferrous chloride concentration parameters, PH value and temperature as theoretical parameters, inputting the theoretical parameters into a data input panel, and storing the theoretical parameters in a control panel; step two: pouring the prepared etching liquid into an etching groove, and then carrying out etching operation on the product by an automatic manipulator; step three: the Baume densitometer, the temperature sensor and the PH value detector monitor etching liquid in the etching tank in real time, and transmit measured data into the control panel, and the control panel is used for comparing the measured data with theoretical parameters; step four: the control panel controls the ammonia chloride transfusion arm and the hydrochloric acid transfusion arm, thereby ensuring that the concentration parameter, the PH value and the temperature of ferrous chloride are in a constant state.
In order to ensure the normal operation of the automatic etching device, the ferrous chloride needs to be continuously supplemented, and in order to solve the problem, a structure capable of sensing the concentration of the ferrous chloride in the etching solution needs to be designed, and meanwhile, the chloride ion concentration of the etching solution needs to be continuously supplemented through an automatic control system.
Through setting up mobile manipulator in this technical scheme, be used for realizing the full-automatic transportation of metal sheet, be used for testing the concentration of ferrous chloride in the etching bath through setting up the baume weight meter simultaneously, through the data of detecting, come with the parameter of electric cabinet in record contrast, start-stop through the contrast realization micropump, the micropump is carried to the ammonia chloride in the etching bath, the ammonia chloride can be with ferric chloride reduction back ferrous chloride, be provided with the inductor in the response support, the inductor is connected with the electric cabinet, install the sleeve pipe support on the baume weight meter, be provided with a plurality of sensing nodes on the sleeve pipe support, when the baume weight meter rose down, the sensing node and the inductor of sleeve pipe support produce contact signal, the concentration of ferrous chloride of etching solution can be judged to the signal.
As a supplement to the technical scheme, the two ends of the upper part of the etching tank are provided with mounting panels, the mounting panels are provided with compression pump components, and the output ends of the compression pump components are provided with infusion arms extending into the etching tank.
Through setting up the compression pump subassembly, make the outside air constantly roll the operation to the etching solution for the etching solution turns in the etching groove, turns the in-process, and the etching solution can clear away the etching erosion bits on the metal sheet, improves the process velocity of metal sheet.
As a supplement to the technical scheme, the infusion arm comprises a liquid collecting part, an extension arm and a diffusion head, wherein the extension arm which is L-shaped is arranged at the lower end of the liquid collecting part, and the diffusion head is arranged at the tail end of the extension arm.
The infusion arm is used for concentrating the supplementary liquid and air, the supplementary liquid is stored in the middle in the liquid collecting part, and then the liquid is extruded into the whole etching groove through gas.
As a supplement to the technical scheme, the liquid collecting part is internally provided with a liquid storage cavity, the side part of the liquid storage cavity is provided with a liquid inlet connector which is in butt joint with the outlet of the micropump, the upper end of the liquid storage cavity is provided with an air inlet connector which is in butt joint with the air outlet of the compression pump assembly, the extension arm is internally provided with a conveying pipe, one end of the conveying pipe is connected with the liquid outlet at the lower end of the liquid storage cavity, and the other end of the conveying pipe is in butt joint with the valve core in the diffusion head.
As a supplement to the technical scheme, a downward moving cylinder with a vertically downward main shaft is arranged in the moving manipulator, a clamping bottom plate which is horizontally arranged is arranged on the main shaft of the downward moving cylinder, and a plurality of clamping cylinders which are longitudinally arranged are arranged on the lower end face of the clamping bottom plate side by side.
As a supplement to the technical scheme, the clamping shaft of the clamping cylinder is provided with a vertically downward clamping block, the outer side of the lower end of the clamping block adopts a vamp structure, and the inner side of the lower end of the clamping block is provided with a clamping groove.
As a supplement to the technical scheme, a circle of temperature sensor is arranged in the middle of the outer ring of the etching tank, the temperature sensor comprises two butted shells, a temperature sensor is arranged between the shells, a plurality of induction nodes inserted into the etching tank are arranged on the temperature sensor, and the temperature sensor is butted with the electric cabinet.
In order to ensure the reaction speed of the etching solution, the temperature of the etching solution needs to be ensured to be within a reasonable range, so the etching solution needs to be ensured to be in a constant temperature state by designing a temperature control system, the temperature of different areas of the etching solution is tested by arranging a plurality of sensing nodes in the temperature control system, the temperature parameters are counted in a concentrated manner to ensure the temperature of the etching solution, and meanwhile, whether the etching solution needs to be heated or not is judged by the electric control box through a control system in the electric control box.
As a supplement to the technical scheme, a heating plate is arranged in the bottom of the etching tank, and a plurality of heating wires extending to the bottom surface of the tank body of the etching tank are arranged on the heating plate.
Be provided with a plurality of vertical and be the heater strip of burr form on the heating plate, this structure can reduce the heating area, ensures when heating that the temperature with the contact portion of etching solution can not be too high.
As a supplement to the technical scheme, the first liquid storage tank and the second liquid storage tank are arranged in a front-back staggered way, the two infusion arms are also arranged in a staggered way, when the lower end of the mobile manipulator stretches into the etching groove, interference with the two infusion arms cannot occur, and the first liquid storage tank and the second liquid storage tank respectively store ammonia chloride and hydrochloric acid.
The beneficial effects are that: the invention relates to a processing technology for ensuring etching speed, which is characterized in that a mobile manipulator is arranged to realize full-automatic transportation of a metal plate, a baume weight meter is arranged to test the concentration of ferrous chloride in an etching tank, detected data are compared with parameters recorded in an electric cabinet, starting and stopping of a micropump are realized through comparison, the micropump is conveyed into the etching tank to ammonia chloride, the ammonia chloride can reduce ferric trichloride back to ferrous chloride, an inductor is arranged in an induction bracket, the inductor is connected with an electric cabinet, a sleeve bracket is arranged on the baume weight meter, a plurality of induction nodes are arranged on the sleeve bracket, when the baume weight meter is lifted and lowered, the induction nodes and the inductor of the sleeve bracket generate contact signals, and the signals can judge the concentration of ferrous chloride of etching liquid.
Drawings
FIG. 1 is a front view of the present invention;
FIG. 2 is a plan view of the etching bath according to the present invention;
FIG. 3 is a sectional view of an etch bath according to the present invention;
FIG. 4 is a structural view of an infusion arm according to the present invention;
FIG. 5 is a schematic view of the liquid collecting portion according to the present invention;
FIG. 6 is a schematic view of a mobile robot according to the present invention;
FIG. 7 is a view showing the structure of the clamping cylinder according to the present invention;
fig. 8 is a process flow diagram of the present invention.
The diagram is: 1. the device comprises a sliding track, 2, a mobile manipulator, 3, a clamping platform, 4, an etching base, 5, an electric cabinet, 6, an etching tank, 7, a first liquid storage tank, 8, a second liquid storage tank, 9, a micro pump support, 10, a temperature sensor, 11, a temperature sensor, 12, a micro pump, 13, an infusion arm, 14, a compression pump assembly, 15, a shell, 16, an induction node, 17, a mounting panel, 18, an induction support, 19, a baume meter, 20, a sleeve support, 21, a liquid collecting part, 22, an extension arm, 23, a diffusion head, 24, a liquid storage cavity, 25, an air inlet connector, 26, an liquid inlet connector, 27, a liquid outlet, 28, a downward moving cylinder, 29, a main shaft, 30, a clamping bottom plate, 31, a clamping cylinder, 32, a clamping block, 33, a clamping groove, 34 and a heating plate.
Detailed Description
The invention will be further illustrated with reference to specific examples. It is to be understood that these examples are illustrative of the present invention and are not intended to limit the scope of the present invention. Further, it is understood that various changes and modifications may be made by those skilled in the art after reading the teachings of the present invention, and such equivalents are intended to fall within the scope of the claims appended hereto.
The embodiment of the invention relates to a processing technology for ensuring etching speed, as shown in fig. 1, a plurality of mobile manipulators 2 are needed on one sliding rail 1, and the mobile manipulators 2 can be repeatedly moved back and forth to ensure that an etched metal plate can be provided with a given station to move forward step by step, so that full-automatic assembly line production is formed, the production efficiency is improved, the labor cost is reduced, indirect production is ensured, and chemical reagents are prevented from invading the body of workers.
Meanwhile, in order to ensure full-automatic production, the etching solution in the etching tank needs to be continuously supplemented, ferrous chloride is usually used for working the metal plate at the present stage of the etching reaction, the ferrous chloride is oxidized to form ferric trichloride after the completion, and in order to ensure the chloride ion concentration of the etching solution, the chloride ion needs to be supplemented by supplementing a reducing solution such as ammonia chloride and the like, the device is provided with a first liquid storage tank 7 and a second liquid storage tank 8, and the reducing solution is input into the etching tank 6 through a micropump 12.
As shown in fig. 2, in order to ensure the etching speed of the etching solution, the content of ferrous chloride in the etching solution needs to be ensured, the concentration of ferrous chloride is tested by setting a baume meter 19, meanwhile, reasonable parameters are input into a control panel through keys of an electric cabinet 5, the control panel compares actual parameters with theoretical parameters, when the concentration of chloride ions is too low, the electric cabinet 5 can automatically start a micro pump 12, and the micro pump 12 can supplement a reducing agent into the etching solution, so that continuous constant supplement is realized, and the operation speed of etching is ensured.
As shown in fig. 3, in order to ensure that the baume meter 19 can convert the actual concentration parameter into the electronic parameter, the induction bracket 18 is shown to be arranged, then the sleeve bracket 20 sleeved on the baume meter 19 is arranged, the sleeve bracket 20 can be lifted and lowered along with the lifting of the baume meter 19, and the induction bracket 18 can sense the induction point of the sleeve bracket 20 and give a parameter signal to the electric cabinet 5 through the induction point.
In the etching operation process, the scraps etched out can be deposited on the surface of the etching position, so that the etching efficiency can be influenced, and in order to solve the problem, the compression pump assembly 14 is arranged, the compression pump assembly 14 sends external air into etching liquid, bubbles are generated, the etching liquid can be caused to roll through the bubbles, and therefore the scraps on the metal plate can be clearly seen through liquid vibration.
In actual operation, the frequency input by the compression pump assembly 14 is controlled in the control panel of the electric cabinet 5, and the frequency control can ensure that the liquid level vibration does not cause too much influence on the Baume weight meter 19.
As shown in fig. 4 and 5, the compression pump assembly 14 can also mix the reducing agent with the etching solution rapidly, a liquid collecting portion 21 is disposed in the infusion arm 13, the reducing agent is input into the liquid collecting portion 21 through the micropump 12, then the reducing agent is extruded from the liquid collecting portion 21 through the compression pump assembly 14, and the reducing agent is diffused through a valve core in the diffusion head 23 during extrusion, so that the reducing agent reacts with the etching solution rapidly, the mixing speed of the reducing agent and the etching solution is further increased, and the production efficiency is improved.
As shown in fig. 6 and 7, the moving manipulator 2 can clamp a plurality of metal plates, during operation, the clamping shaft of the clamping cylinder 31 is extended, then the main shaft 29 of the downward moving cylinder 28 moves downwards, so that the clamping bottom plate 30 can move downwards with the clamping cylinder 31, the lower end of the clamping block 32 is inserted into the butt joint lug of the metal plates, then the clamping shaft is controlled to shrink, the clamping groove 33 can form clamping connection with the edges of the metal plates, then the main shaft 29 moves upwards, the moving manipulator 2 moves, when moving to the upper side of the etching groove 6, the downward moving cylinder 28 is controlled to move downwards, the metal plates can be immersed in etching liquid of the etching groove 6 for etching, after etching is completed, the downward moving cylinder 28 resets, and products are sent out.
To ensure that the clamping block 32 is not corroded, the lower end of its surface is provided with a ceramic housing.
As shown in fig. 3, as a supplement to the technical scheme, a circle of temperature sensor 10 is arranged in the middle of the outer ring of the etching bath 6, the temperature sensor 10 comprises two butted shells 15, a temperature sensor 11 is arranged between the shells 15, a plurality of sensing nodes 16 inserted into the etching bath 6 are arranged on the temperature sensor 11, and the temperature sensor 11 is butted with the electric cabinet 5.
In order to ensure the reaction speed of the etching solution, the temperature of the etching solution needs to be ensured to be within a reasonable range, so the etching solution needs to be ensured to be in a constant temperature state by designing a temperature control system, the temperature of different areas of the etching solution is tested by arranging a plurality of sensing nodes 16 in the temperature control system, the temperature parameters are counted in a concentrated manner to ensure the temperature of the etching solution, and meanwhile, whether the etching solution needs to be heated or not is judged by the electric control box through a control system in the electric control box 5.
As a supplement to the technical proposal, a heating plate 34 is arranged in the bottom of the etching tank 6, and a plurality of heating wires extending to the bottom surface of the tank body of the etching tank 6 are arranged on the heating plate 34.
Be provided with a plurality of vertical and be the heater strip of burr form on the heating plate, this structure can reduce the heating area, ensures when heating that the temperature with the contact portion of etching solution can not be too high.
As a supplement to the technical scheme, the first liquid storage tank 7 and the second liquid storage tank 8 are arranged in a front-back staggered way, the two infusion arms 13 are also arranged in a staggered way, when the lower end of the mobile manipulator 2 stretches into the etching groove 6, interference with the two infusion arms 13 cannot be generated, and the first liquid storage tank 7 and the second liquid storage tank 8 respectively store ammonia chloride and hydrochloric acid.
As shown in fig. 8, a process for ensuring etching rate comprises the following specific steps: selecting optimal data for improving etching speed to the greatest extent according to each reference parameter in the original process, wherein the optimal data comprises ferrous chloride concentration parameters, PH value and temperature as theoretical parameters, inputting the theoretical parameters into a data input panel, and storing the theoretical parameters in a control panel; pouring the prepared etching liquid into an etching groove, and then carrying out etching operation on the product by an automatic manipulator; the Baume densitometer, the temperature sensor and the PH value detector monitor etching liquid in the etching tank in real time, and transmit measured data into the control panel, and the control panel is used for comparing the measured data with theoretical parameters; the control panel controls the ammonia chloride transfusion arm and the hydrochloric acid transfusion arm, thereby ensuring that the concentration parameter, the PH value and the temperature of ferrous chloride are in a constant state.
The ammonia chloride solution may also use phosphoric acid, sodium chlorite, hydrogen iodide, etc. as reducing agents.
In this technical scheme, the right side of etching bath 6 is removable, be used for making things convenient for the whole washing of etching bath 6, etching production's time course, the impurity is piled up can appear in etching bath 6 inside, conventional pump formula is taken out and is washd, can't wash the impurity that adheres to, in order to ensure production in-process, the accuracy of data, every worship just needs to carry out whole washing to the device, during the washing, at first dismantle the temperature sensor 10 that winds around etching bath 6 outer lane outward, then dismantle second liquid reserve tank 8 that is located the right-hand member, micropump support 9, micropump 12, infusion arm 13 and compression pump subassembly 14, then dismantle the right lateral wall of etching bath 6, and place the basin below right side opening, later wash etching bath 6 inner wall through the high-pressure squirt, and discharge the sewage that will wash out, this kind of operation can guarantee the inside cleanliness of device greatly, ensure equipment accurate operation.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.
The relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless it is specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective parts shown in the drawings are not drawn in actual scale for convenience of description. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but should be considered part of the specification where appropriate. In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.
In the description of the present invention, it should be understood that the azimuth or positional relationships indicated by the azimuth terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal", and "top, bottom", etc., are generally based on the azimuth or positional relationships shown in the drawings, merely to facilitate description of the present invention and simplify the description, and these azimuth terms do not indicate and imply that the apparatus or elements referred to must have a specific azimuth or be constructed and operated in a specific azimuth, and thus should not be construed as limiting the scope of protection of the present invention; the orientation word "inner and outer" refers to inner and outer relative to the contour of the respective component itself.
Spatially relative terms, such as "above … …," "above … …," "upper surface at … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial location relative to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the exemplary term "above … …" may include both orientations of "above … …" and "below … …". The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
In addition, the terms "first", "second", etc. are used to define the components, and are only for convenience of distinguishing the corresponding components, and the terms have no special meaning unless otherwise stated, and therefore should not be construed as limiting the scope of the present invention.
The foregoing has outlined a detailed description of a process for ensuring etch rate provided herein, and specific examples have been presented herein to illustrate the principles and embodiments of the present application and to assist in understanding the method and core concepts thereof; meanwhile, as those skilled in the art will have modifications in the specific embodiments and application scope in accordance with the ideas of the present application, the present description should not be construed as limiting the present application in view of the above.

Claims (10)

1. A process for ensuring etching rate, characterized by: including the full-automatic etching device that is used for this technology, full-automatic etching device includes etching base (4), etching groove (6) and electric cabinet (5), etching base (4) on install etching groove (6), etching groove (6) top be provided with slip track (1), install mobile manipulator (2) on slip track (1), mobile manipulator (2) lower extreme installs centre gripping platform (3), the cell body left side of etching groove (6) install induction bracket (18), vertically install upper and lower gliding baume weight gauge (19) in induction bracket (18), baume weight gauge (19) on cup joint with induction bracket (18) relative slip's sleeve pipe support (20), etching groove (6) lower part be provided with first stock solution tank (7) and second stock solution tank (8), first stock solution tank (7) and second stock solution tank (8) all on vertical installation micropump stock solution tank (9), micropump stock solution tank (9) on install pipeline (12), pump (6) in advance the pipeline (6) of pump (12) are connected to the pipeline (6) and are advanced, the pipeline (6) is located and is advanced to the pipeline (6), the electric control box (5) controls the micro pump (12) to be started and closed according to the detection data of the Baume specific gravity meter (19), a PH value detector is arranged in the etching tank (6), the PH value detector is connected with the electric control box (5),
the processing technology comprises the following specific steps:
a. selecting optimal data for improving etching speed to the greatest extent according to each reference parameter in the original process, wherein the optimal data comprises ferrous chloride concentration parameters, PH value and temperature as theoretical parameters, inputting the theoretical parameters into a data input panel, and storing the theoretical parameters in a control panel;
b. pouring the prepared etching solution into an etching groove (6), and then carrying out etching operation on the product by an automatic manipulator;
c. the Baume gravimeter (19), the temperature sensor (11) and the PH value detector monitor etching liquid in the etching tank (6) in real time, and transmit measured data into the control panel, and the control panel is used for comparing the measured data with theoretical parameters;
d. the control panel controls the ammonia chloride transfusion arm and the hydrochloric acid transfusion arm, thereby ensuring that the concentration parameter, the PH value and the temperature of ferrous chloride are in a constant state.
2. A process for ensuring etching rate according to claim 1, characterized in that: the two ends of the upper part of the etching groove (6) are provided with mounting panels (17), the mounting panels (17) are provided with compression pump components (14), and the output end of each compression pump component (14) is provided with a transfusion arm (13) extending into the etching groove (6).
3. A process for ensuring etching rate according to claim 2, characterized in that: the infusion arm (13) comprises a liquid collecting part (21), an extension arm (22) and a diffusion head (23), wherein the L-shaped extension arm (22) is arranged at the lower end of the liquid collecting part (21), and the diffusion head (23) is arranged at the tail end of the extension arm (22).
4. A process for ensuring etching rate according to claim 3, characterized in that: the liquid collecting part (21) in be provided with stock solution chamber (24), the lateral part of stock solution chamber (24) be provided with the feed liquor joint (26) of the export butt joint of micropump (12), stock solution chamber (24) upper end be provided with the air inlet joint (25) of the gas outlet butt joint of compression pump assembly (14), extension arm (22) in be provided with the conveyer pipe, conveyer pipe one end is connected with liquid outlet (27) of stock solution chamber (24) lower extreme, the case butt joint in the other end and diffusion head (23).
5. A process for ensuring etching rate according to claim 1, characterized in that: the movable manipulator (2) is internally provided with a downward moving cylinder (28) with a main shaft (29) facing downwards vertically, a clamping bottom plate (30) which is horizontally arranged is arranged on the main shaft of the downward moving cylinder (28), and a plurality of clamping cylinders (31) which are longitudinally arranged are arranged on the lower end face of the clamping bottom plate (30) side by side.
6. A process for ensuring etching rate according to claim 5, wherein: the clamping cylinder is characterized in that a clamping block (32) which faces downwards vertically is arranged on a clamping shaft of the clamping cylinder (31), the outer side of the lower end of the clamping block (32) adopts a vamp structure, and a clamping groove (33) is formed in the inner side of the lower end of the clamping block (32).
7. A process for ensuring etching rate according to claim 1, characterized in that: the middle part of the outer ring of the etching groove (6) is provided with a circle of temperature sensor (10), the temperature sensor (10) comprises two butted shells (15), a temperature sensor (11) is arranged between the shells (15), a plurality of sensing nodes (16) which are inserted into the etching groove (6) are arranged on the temperature sensor (11), and the temperature sensor (11) is butted with the electric cabinet (5).
8. A process for ensuring etching rate according to claim 1, characterized in that: the bottom of the etching tank (6) is internally provided with a heating plate (34), and the heating plate (34) is provided with a plurality of heating wires extending to the bottom surface of the tank body of the etching tank (6).
9. A process for ensuring etching rate according to claim 2, characterized in that: the first liquid storage tank (7) and the second liquid storage tank (8) are arranged in a front-back staggered mode, and the two infusion arms (13) are also arranged in a staggered mode, so that the lower end of the mobile manipulator (2) extends into the etching groove (6) and cannot interfere with the two infusion arms (13).
10. A process for ensuring etching rate according to claim 1, characterized in that: the first liquid storage tank (7) and the second liquid storage tank (8) respectively store ammonia chloride and hydrochloric acid.
CN202210377701.1A 2022-04-12 2022-04-12 Processing technology for ensuring etching speed Active CN114774920B (en)

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JPH08283966A (en) * 1995-04-11 1996-10-29 Dainippon Printing Co Ltd Etching method
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KR101211395B1 (en) * 2012-10-08 2012-12-11 주식회사 지디 Temperature and concentration control device for glass etching process
KR20150024483A (en) * 2013-08-26 2015-03-09 한국표준과학연구원 Automatic etching equioment for large mirror including weight lightening processing unit and method for controlling thereof
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CN215050705U (en) * 2021-06-23 2021-12-07 宁波福至新材料有限公司 Etching bath with temperature control device
CN216093623U (en) * 2021-06-29 2022-03-22 宁波福至新材料有限公司 Chloride ion supplementing device for etching bath

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3496046A (en) * 1964-12-14 1970-02-17 Nationale D Editions Artistiqu Engraving devices for printing cylinders
JPS63241189A (en) * 1987-03-27 1988-10-06 Yamatoya Shokai:Kk Method for controlling and maintaining capacity of etching solution
JPH06116758A (en) * 1992-10-02 1994-04-26 Asahi Denka Kogyo Kk Method for etching metal
JPH0718473A (en) * 1993-07-06 1995-01-20 Nagai Seiyakushiyo:Kk Method for restoring and maintaining liquid etchant capacity
JPH08283966A (en) * 1995-04-11 1996-10-29 Dainippon Printing Co Ltd Etching method
KR20090076497A (en) * 2008-01-09 2009-07-13 변지혜 Etching system for auto control of etchant concentration
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KR20150024483A (en) * 2013-08-26 2015-03-09 한국표준과학연구원 Automatic etching equioment for large mirror including weight lightening processing unit and method for controlling thereof
CN107564809A (en) * 2017-08-04 2018-01-09 深圳市华星光电半导体显示技术有限公司 The etching solution and its engraving method of IGZO film layers
CN215050705U (en) * 2021-06-23 2021-12-07 宁波福至新材料有限公司 Etching bath with temperature control device
CN216093623U (en) * 2021-06-29 2022-03-22 宁波福至新材料有限公司 Chloride ion supplementing device for etching bath

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