KR100943311B1 - Substrate laminating apparatus and laminateing method using the same - Google Patents

Abstract

The present invention is to adjust the degree of vacuum inside the chamber is equipped with a detachable vacuum pump, a substrate holder is mounted in the chamber, the first substrate is seated on which the seat is provided, is provided in the chamber, the first substrate and Compression roller device for pressing and pressing the second substrate to be bonded to a certain pressure, a moving device for moving the compression roller for pressing the second substrate and when the second substrate is bonded to the first substrate, the last bonded It provides a substrate laminating device, characterized in that it comprises a spacing device for maintaining a side of the second substrate and a predetermined distance from the first substrate, and using the substrate laminating device, two large-area substrates without bubbles It relates to a substrate laminating apparatus that can be bonded and a substrate bonding method using the same.

TFT substrate, scintillator substrate, laminating, bonding, bubble

Description

Substrate laminating apparatus and laminateing method using the same}

The present invention relates to a substrate laminating apparatus, and more particularly, to a substrate laminating apparatus including a chamber, a substrate holder, a compression roller apparatus, a moving apparatus, and a spacing device, and using the substrate laminating apparatus, two large-area substrates The present invention relates to a substrate bonding method capable of bonding without bubbles generated between two large-area substrates when bonding them with an adhesive.

In general, X-ray imaging apparatuses such as computerized tomography (CT) in the medical field and the like to transmit a certain amount of X-ray flux to the body part to be photographed, the X-ray sensor measures the amount of transmitted X-rays and the measured data Is recorded in a memory, and the imaging device obtains the X-ray absorption rate of each point on the body imaging area by a computer and reconstructs it into an image.

Such X-ray imaging apparatuses include an X-ray light source and an X-ray sensor, wherein the X-ray light source includes a generator, and the X-ray sensor includes a scintillator substrate and the scintillator substrate for converting the X-rays into visible light. A TFT substrate is provided to sense the converted visible light and convert it into an electrical signal.

At this time, the scintillator substrate and the TFT substrate are each manufactured by a semiconductor process and then bonded. When the scintillator substrate and the TFT substrate are bonded together, they are bonded together using an adhesive.

In the case where the scintillator substrate and the TFT substrate are bonded to each other using the adhesive, when the area of the substrates is small, bubbles such as bubbles are generated in the adhesive to distort visible light generated in the scintillator substrate. When the area of the substrates is large, problems such as bubbles are generated in the adhesive, resulting in a lot of problems such as distorting visible light generated from the scintillator substrate, thereby deteriorating characteristics of the X-ray sensor.

Accordingly, the present invention is to solve the above-mentioned disadvantages and problems of the prior art, and provides a substrate laminating apparatus including a chamber, a substrate holder, a compression roller device, a moving device and a gap maintaining device, and the substrate laminating device The present invention provides a substrate laminating apparatus and a bonding method using the same, which provide a substrate bonding method capable of bonding two large-area substrates without bonding between two large-area substrates by using an adhesive. There is an object of the invention.

The object of the present invention is to adjust the degree of vacuum inside, the chamber is installed detachable vacuum pump; A substrate holder charged in the chamber, the substrate holder having a mounting portion on which a first substrate is mounted; A compression roller device provided in the chamber and pressing the second substrate bonded to the first substrate at a predetermined pressure; A moving device for moving the compression roller that compresses the second substrate; And a spacing device configured to maintain a predetermined distance from the first substrate when one side of the second substrate is finally bonded to the second substrate when the second substrate is adhered to the first substrate. Achieved by the device.

In addition, the object of the present invention is achieved by the substrate laminating device further comprises an adhesive material injection device for injecting an adhesive material for bonding with the second substrate on the first substrate in the chamber. do.

The above object of the present invention is also achieved by a substrate laminating apparatus, wherein the first substrate is a TFT substrate and the second substrate is a scintillator substrate.

The above object of the present invention is also achieved by a substrate laminating apparatus, wherein the scintillator substrate is a thin plate and a substrate on which the scintillator material is laminated.

In addition, the object of the present invention is also achieved by the substrate laminating apparatus, the depth of the seating portion of the substrate holder is a difference between the sum of the thickness of the first substrate and the second substrate is -100㎛ to + 100㎛. .

In addition, the object of the present invention is the spacing device: a tension control roller located on the upper portion of the chamber inner wall; And one end is wound on the tension control roller, the other end is a fixed chain connected to one side of the second substrate which is not yet bonded; includes, when the tension of the fixed chain is a predetermined or more It is also achieved by a substrate laminating apparatus, characterized in that the fixing chain is released from the roller.

In addition, the object of the present invention is the compression roller device: a rubber roller for contacting the second substrate to pressurize the surface of the second substrate; A roller frame fastened to both ends of the rubber roller and guiding the rubber roller; A main frame supporting the roller frame and installed on the rail and movable; And a roller lifting mechanism provided on the main body frame and lifting the roller frame to lift the rubber roller.

In addition, the object of the present invention is the substrate laminating apparatus, characterized in that the roller lifting mechanism has a cam shaft, the cam shaft is fastened to the main frame so that the roller frame is raised or lowered according to the outer periphery of the cam. It is also achieved by

In addition, the object of the present invention is the mobile device: the motor unit is fastened to the body frame, the motor having a motor for generating a movement; It is also achieved by a substrate laminating device comprising a; and a ball screw fastened to the motor unit.

In addition, the object of the present invention is achieved by the substrate laminating device, characterized in that the roller frame includes a pressure adjusting weight capable of adjusting the pressure of the rubber roller.

The above object of the present invention is also achieved by a substrate laminating apparatus, wherein the chamber has a base for supporting the rail, the first substrate, and the second substrate.

The above object of the present invention is also achieved by a substrate laminating apparatus, wherein the base is provided with a holder fixing mechanism for fixing the substrate holder.

The above object of the present invention is also achieved by a substrate laminating apparatus, wherein the chamber is provided with a gas inlet and a vacuum gauge for measuring the degree of vacuum inside the chamber.

In addition, the object of the present invention is characterized in that the chamber is provided with a substrate laminating apparatus, characterized in that the window having a window for observing the inside of the chamber or the camera is mounted inside the chamber to monitor the inside in real time. It is also achieved by a substrate laminating apparatus.

In addition, the above object of the present invention is also achieved by a substrate laminating device, characterized in that the chamber is provided with a heating device or a photocuring lamp capable of heating the first substrate or the second substrate.

In addition, the object of the present invention is also achieved by a substrate laminating apparatus, characterized in that the adhesive material is any one or more of a thermosetting adhesive material, a photocurable adhesive material and a two-component adhesive material.

The object of the present invention is to prepare a first substrate and a second substrate; Mounting the first substrate on a substrate holder and charging the substrate holder into a chamber; Injecting an adhesive material on the first substrate; Aligning the other side of the second substrate after connecting the tension chain to one side of the second substrate while placing the second substrate on the substrate holder on which the first substrate is mounted; Exhausting the inside of the chamber to a predetermined pressure or less to remove bubbles from the adhesive material; While adjusting the length of the tension chain so that the tension chain connected to one side of the second substrate to maintain a constant tension from the other side of the second substrate to one side of the second substrate using the compression roller using the compression roller Pressing and bonding the first substrate and the second substrate to each other; And withdrawing the substrate holder from which the first substrate and the second substrate are bonded and seated from the chamber.

In addition, the object of the present invention is the step of preparing the first substrate: drawing the alignment mark on the first substrate; Attaching the tape along the alignment mark, but attaching the tape to one side of the first substrate such that the tape does not protrude to the outside of the substrate, and attaching the tape to the other three sides to protrude to the outside by a predetermined length; And attaching the transparent vinyl having a predetermined width to the protruding tape on three side surfaces of the first substrate on which the tape protrudes.

In addition, the object of the present invention is the step of mounting the first substrate to the substrate holder in the chamber, one side of the first substrate is mounted on the substrate holder, one side of the first substrate is seated on the substrate holder It is also achieved by the substrate laminating method characterized in that the step of mounting in contact with the side surface of the first substrate and fixing the substrate holder with a tape.

In addition, the object of the present invention is the step of preparing the second substrate: the step of attaching a corner adhesive sheet to the surface edge of the second substrate bonded to the first substrate; And attaching a tape to protrude to the outside of the substrate on four sides of a surface of the second substrate that is not bonded to the first substrate, and attaching the transparent vinyl to the tape. Is achieved.

The substrate laminating device and the bonding method using the same of the present invention provide a substrate laminating device including a chamber, a substrate holder, a compression roller device, a moving device, and a spacing device, and by using the substrate laminating device, two large area substrates are used. When bonding using an adhesive, there is an effect of providing a substrate laminating apparatus and a bonding method using the same, which provide a substrate bonding method capable of bonding without generating bubbles between two large-area substrates.

Although the present invention has been shown and described with reference to preferred embodiments as described above, it is not limited to the above-described embodiments and those skilled in the art without departing from the spirit of the present invention. Various changes and modifications will be possible.

1 is a perspective view showing a substrate laminating apparatus according to an embodiment of the present invention, Figures 2a to 2c are perspective views showing the shape of the substrate holder used in the substrate laminating apparatus according to an embodiment of the present invention, Figure 3 FIG. 4 is an enlarged perspective view of a compression roller device of a substrate laminating device according to an embodiment of the present invention, and FIG. 4 is an enlarged perspective view of a moving device of the substrate laminating device according to an embodiment of the present invention.

1 to 4, the substrate laminating apparatus 1000 according to an embodiment of the present invention may be classified into a chamber 100, a substrate holder 200, a base 300, a compression roller device 400, A mobile device 500 and a spacing device 600.

The chamber 100 should be able to seal the inside and the outside of the chamber 100, and the inside and the outside of the chamber 100 should have a strength that can withstand the pressure difference.

In addition, the chamber 100 is detachable, and a vacuum pump (not shown) for adjusting the degree of vacuum therein and a vacuum gauge (not shown) for measuring the degree of vacuum inside the chamber may be connected to the chamber ( The lower surface of the 100 is provided with an exhaust port 110 connected to the vacuum pump. By providing a vacuum pump as described above it is possible to lower the vacuum degree of the chamber 100 to a predetermined pressure or less to remove bubbles from the adhesive material for bonding the first substrate and the second substrate will be described later.

In this case, the adhesive material may be any adhesive material, and in particular, any one or more of a thermosetting adhesive material, a photocurable adhesive material, and a two-component adhesive material may be used. At this time, the adhesive material used in the embodiment of the present invention is PDMS (PolyDiMethylSiloane).

In addition, one side wall of the chamber 100 is provided with a gas inlet 120. A pressure sensor (not shown) is attached to the gas inlet to measure the pressure when a vacuum is formed in the chamber 100.

In addition, the gas injection hole 120 may be provided with a gas flow relief device (not shown). In this case, the gas flow relief device functions to gently relax the flow of gas when injecting gas into the chamber 100. In this case, the gas injected into the gas inlet 120 may be an inert gas such as nitrogen gas or helium gas, or may be general air in the atmosphere.

In this case, the first substrate is a TFT substrate, the second substrate is a scintillator substrate, and the scintillator substrate is a substrate on which a scintillator material is laminated on a thin plate made of metal, ceramic, or plastic.

The first substrate and the second substrate may be large area substrates, for example, substrates having sizes of 470 × 480 mm and 450 × 450 mm.

In addition, at least one window 130 is provided on the sidewall of the chamber 100. The window 130 is preferably made of glass or quarts to observe the inside of the chamber 100. The camera may be mounted at a predetermined position inside the chamber 100 to monitor the inside of the chamber 100 in real time.

The substrate holder 200 may be charged and fixed in the chamber 100, and may be configured to be drawn out to the outside. Although not shown in the drawing, a holder fixing mechanism for fixing the substrate holder 200 to the base 300 provided inside the substrate and supporting the substrate holder 200 may be provided.

At this time, the substrate holder 200 is formed with a mounting portion 210 on which the first substrate to be described later is formed.

In this case, the seating portion 210 may be a shape as shown in Figures 2a to 2c, the first shape is all areas except the upper area of the substrate holder 200 as shown in Figure 2a 2B is a case in which the seat 210 is provided with a predetermined space in an area excluding the lower area of the substrate holder 200, as shown in FIG. 2B. Third, as shown in FIG. 2C, the seating unit 210 may be provided in an inner space except for four edges.

The seating portion 210 as described above has a step having a depth compared to other areas of the substrate holder 200. The depth should be almost equal to the sum of the thicknesses of the first substrate and the second substrate, which will be described later. Preferably, the difference between the sum of the thicknesses of the first and second substrates and the depth of the seating portion 210 is not large, and more specifically, it is preferably within -100 μm to +100 μm.

This is because when the compression roller, which will be described later, applies pressure to the second substrate while moving the substrate holder 200 on which the first substrate and the second substrate are seated, the first substrate and This is to prevent damage to the second substrate.

As shown in FIG. 1, the base 300 may include a base plate 310 supporting upper devices or apparatuses and a substrate holder support 320 supporting the substrate holder 200. The base plate 310 may directly support the substrate holder 200 without the support 320, and the substrate holder 200 may be easily placed in the area where the substrate holder 200 is placed. Substrate holder transfer means (not shown), such as a conveyor roller, may be provided to allow mounting or detachment into the 100.

The chamber may include a heating device (not shown) capable of heating the first substrate or the second substrate. The heating device may be provided on an upper inner wall of the chamber 100 to heat the first substrate or the second substrate provided on the substrate holder 200, or may be provided under the base 300 to provide a first substrate. The substrate or the second substrate may be heated. The heating apparatus may use a UV lamp or a heating wire, and may heat the first substrate or the second substrate in a process of curing after the first substrate and the second substrate are bonded with an adhesive material.

Meanwhile, when the adhesive material is a photocurable adhesive material, a photocurable lamp device in addition to a heating device may be provided at a predetermined position inside the chamber 100 to cure the photocurable adhesive material.

In addition, the chamber may be provided with an adhesive material injection device for injecting the adhesive material for bonding with the second substrate on the first substrate seated on the seating portion 210 of the substrate holder 200. The adhesive material injection device may be provided on the upper inner wall or sidewall of the chamber 100 to inject the adhesive material onto the first substrate.

The chamber 100 is provided with a compression roller device 400 which is bonded by pressing the first substrate to be described later and the second substrate bonded to the first substrate at a predetermined pressure.

In this case, the compression roller device 400 is provided on the base 300, and is provided to be movable on the rail 330 provided on the outer side of the region where the substrate holder 200 is placed.

The compression roller device 400 is a rubber roller 410, roller frame 420, the main frame 430 and the roller lift as shown in FIG. 3, which enlarges the compression roller device 400 shown in FIG. And a mechanism 440.

In this case, the rubber roller 410 has a predetermined diameter, the length of the rubber roller 410 should be at least equal to or longer than the width of the second substrate is bonded to the first substrate seated on the seating portion (210). This is because the rubber roller 410 is in contact with the surface of the second substrate and given a constant pressure to bond the first substrate and the second substrate, but only for the pressure to be evenly applied to the entire first substrate and the second substrate. In addition, to apply a uniform pressure to the edge adhesive sheet attached to the edge of the second substrate to be described later. In addition, the rubber roller 410 is preferably made of a sufficient elastic material, such as rubber because the rubber substrate 410 is made of a material that is easily damaged, such as glass in the case of the second substrate pressed.

The roller frame 420 is fastened to both ends of the rubber roller 410 and serves to guide the rubber roller 410 to move in a predetermined direction.

At this time, the roller frame 420 is vertically connected to the roller guide 422, the roller guide 422 for guiding the rubber roller 410, the roller lifting pillar fastened to the body frame 430 to be described later And a roller elevating guide 426 connected to the elevating pillar 424 and in contact with the roller elevating mechanism 440 which will be described later.

The roller lifting pillar 424 may be composed of two pillars, and a pressure adjusting weight (not shown) of a predetermined weight may be provided between the roller lifting pillars 424 to adjust the pressure of the rubber roller 410. have. In addition, the roller lifting pillar 424 may be provided with a pressure adjustment spring (not shown) in addition to the pressure adjustment weight to adjust the pressure of the rubber roller 410.

The body frame 430 supports the roller frame 420.

In addition, the body frame 430 is provided on the rail 330 provided on the base 300, and is connected to the mobile device 500 to be described later, so that the main body frame 430 is driven by the mobile device 500. It serves to move the roller frame 420 and the rubber roller 410 connected to the roller frame.

In addition, the main body frame 430 is provided with a roller lifting mechanism 440, the roller lifting mechanism 440 is in contact with the lifting guide 426 by the roll of the roller frame 420, the lifting guide 426 by the roll Raising or lowering) serves to lift or lower the rubber roller 410 by raising or lowering the roller frame 420. This is because the roller lifting mechanism 440 has a camshaft. That is, since the camshaft is not at the center of the cam, the distance between the outer circumference of the cam and the center of the cam is different, so that the roller frame 420 rises or falls as the cam rotates. In FIG. 3, the rubber roller 410 is lifted because the outer periphery of the cam and the outer periphery of the cam are in contact with the roller lifting guide 426.

In this case, although the roller lifting mechanism 440 is shown as a mechanism for lifting the roller frame 420, a roller motor 420 is provided in place of the roller lifting mechanism 440 in place of the roller lifting mechanism 440 if necessary. Lifting or lowering may implement the vertical movement of the rubber roller 410.

A moving device 500 capable of moving the rubber roller 410, the roller frame 420, and the body frame 430 is fastened to the body frame 430.

The moving device 500 includes a motor unit 510 and a ball screw 520 as shown in FIG. 4 in which the moving device 500 illustrated in FIG. 1 is enlarged.

The motor unit 510 may reduce the torque generated by the motor 512 and the motor 512 at a predetermined ratio, and move the motor 500, particularly the motor unit 510, along the ball screw 520. And a gear box 514 for moving the compression roller device 400 connected thereto. The ball screw 520 is fastened and fixed to the ball screw guide 522 fastened to the side of the rail 330.

When the second substrate is attached to the first substrate in the upper portion of the chamber, a gap maintaining device 600 may be provided to maintain one side of the second substrate, which is not yet bonded, with a predetermined distance from the first substrate. have. This is because when the first substrate and the second substrate are bonded to each other, the surfaces to be bonded are sequentially processed so that no bubbles or non-contact areas are formed between the first and second substrates.

The gap maintaining device 600 includes a tension adjusting roller 610 and a fixed chain 620 largely, although not shown in the figure to loosen or wind the tension adjusting roller 610 or the fixed chain 620 is It may be provided with a tension control motor (not shown) that serves to prevent the fixing chain 620 is released to have a constant tension.

One end of the fixing chain 620 is fastened and wound to the tension control roller 610, the other end is connected to one side of the second substrate can be fixed. At this time, one side of the second substrate is the side that is finally bonded. A detailed description of the fastening position of the fixing chain 620 will be described later in the substrate bonding method.

In addition, when the tension of the fixing chain 620 is increased by more than a predetermined amount, the fixing chain 620 is released from the tension adjusting roller to adjust the tension, which is fixed when the tension of the fixing chain 620 is too high. This is because the second substrate fastened to 620 may be damaged.

5A to 5C are perspective views illustrating a process of preparing a first substrate according to an embodiment of the present invention, and FIGS. 6A to 6D are perspective views illustrating a process of preparing a second substrate according to an embodiment of the present invention. 7A to 7D are cross-sectional views illustrating a method of bonding the first substrate and the second substrate by using the substrate laminating apparatus according to an embodiment of the present invention.

Referring to FIGS. 5A to 7D, first and second substrates 700 and 800 are prepared.

In this case, the first substrate 700 is a TFT substrate and the second substrate 800 is a scintillator substrate. The first substrate 700 is a substrate that senses visible light and converts it into an electrical signal, and the second substrate 800 is a substrate that converts X-rays into visible light.

First, in order to easily explain the bonding method to be described later, the regions of the first substrate 700 and the second substrate 800 are defined, and the first substrate 700 and the second substrate illustrated in FIGS. The upper surface is referred to as the adhesive surface (710, 810) and the lower surface is referred to as the non-bonded surface (720, 820), and the upper edges (732,832) and lower edges (edge edges) are adjacent to each side of the surface, respectively. 734.834), left sides 736 and 836 and right sides 738 and 838.

In this case, an external connection terminal 705 may be connected to an outer side of the right side 736 of the first substrate 700 to externally connect the electric signal generated by the first substrate 700.

In this case, the first substrate 700 may be one in which the external connection terminal 705 is not connected, and after the substrate bonding process is completed, connect the external connection terminal 705 to the first substrate 700. It may be. 5A to 5C illustrate an external connection terminal 705 connected to the first substrate 700 for convenience.

In addition, the second substrate 800 is a substrate in which a scintillator material is laminated on a thin plate made of metal, ceramic, or plastic, and the scintillator material is stacked on the non-adhesive surface 820 with a predetermined thickness. In this embodiment, the thin plate of the second substrate 800 may be aluminum, and the scintillator material may be CsI (cesium iodide).

Referring to FIGS. 5A to 5C, the process of preparing the first substrate 700 is described. First, the alignment marks 740 are designed on the four sides 732, 734, 736 and 738 (see FIG. 5A).

At this time, the alignment mark 740 is designed on the surface of the first substrate 700, the area inside the alignment mark 740 is adjusted so that the second substrate 800 is bonded within the alignment mark 740. It is desirable to.

At this time, the alignment mark 740 preferably maintains a distance of 5 to 20mm from each corner of the four sides (732,734,736,738) of the first substrate (700).

The alignment mark 740 is then an alignment reference of the second substrate 800 when the second substrate 800 is bonded.

The tapes 750 are attached to four sides 732, 734, 736 and 738 of the first substrate 700 based on the alignment mark 740.

At this time, the three sides (734, 736, 738) excluding the upper side 732 of the first substrate 700 of the tape 750 is attached so that a predetermined length protrudes out of the substrate, and the tape on the upper side 732 Attach 750 so that it does not protrude (see FIG. 5B).

The three sides 734, 736 and 738 of which the tape 750 protrudes out of the substrate are attached with transparent vinyls 760 having a predetermined width to the protruding tape (see FIG. 5C).

In this case, the transparent vinyls 760 are substrate holders 200 by the transparent vinyls 760 even when an adhesive material used to bond the first substrate 700 and the second substrate 800 is ejected to the outside of the substrates. ) And the inside of the chamber.

6A to 6D, the process of preparing the second substrate 800 will be described. First, the second substrate 800 may be bonded to all four sides 832, 834, 836, and 838, ie, at the edge of the adhesive surface 810. The sheet 840 is attached (see FIG. 6A).

In this case, the edge adhesive sheet 840 is preferably maintained at a distance of 1 to 10mm from each corner of the four sides (832,834,836,838) of the second substrate (800).

In this case, the edge adhesive sheet 840 serves to bond the outermost surface of the surface to be bonded when the first substrate 700 and the second substrate 800 are bonded to each other by the adhesive member having the adhesive force on both sides.

The second substrate 800 is smaller than the size of the first substrate 700. The entirety of the second substrate 800 is a tape 750 attached to four sides 732, 734, 736 and 738 of the first substrate 700. It is large enough to fit inside its area without being covered. Therefore, the area where the edge adhesive sheet 840 adheres to the first substrate 700 is the inside of the four sides 732, 734, 736 and 738 of the first substrate 700.

The second substrate 800 is then flipped over so that the non-bonded surface 820 is visible (see FIG. 6B).

The tape 850 is then attached to all four sides 832, 834, 836, 838 of the non-adhesive surface 820, but with a predetermined length of exposure outside the substrate (see FIG. 6C).

In addition, the four sides 832, 834, 836, and 838 protruding out of the substrate attach the transparent vinyls 860 having a predetermined width to the protruding tape (see FIG. 6D). At this time, the role of the transparent vinyl 860 plays the same role as the transparent vinyl 760 attached to the first substrate 700.

In this case, the step of attaching the corner adhesive sheet 840 and the step of attaching the tape 850 and the transparent vinyl 860 may be performed in reverse order. That is, the tape 850 and the transparent vinyl 860 may be attached first and the edge adhesive sheet 840 may be attached later.

When the process of preparing the first substrate 700 and the second substrate 800 is completed, the first substrate 700 and the second substrate 800 are bonded to each other in the process sequence as shown in FIGS. 7A and 7D. .

Referring to FIGS. 7A and 7D, a process of attaching the first substrate 700 and the second substrate 800 to each other will be described. The substrate holder 200 of the substrate laminating apparatus 1000 may include the first substrate 700. It is mounted on the seating portion 210 exactly.

At this time, the upper side 732 of the four side (732, 734, 736, 738) of the first substrate 700 is mounted in contact with the side of the seating portion 210 of the substrate holder 200, the first substrate 700 The upper side 732 of the substrate holder 200 is fixed with a tape so that the first substrate 700 does not move in a subsequent process.

In this case, the process of mounting the first substrate 700 to the substrate holder 200 may proceed in a state where the substrate holder 200 is fixed inside the chamber 100. After mounting the 700 to the substrate holder 200, the substrate holder 200 may be charged into the chamber 100, but in the case of the former, the first substrate 700 may be removed from the inside of the chamber 100. While the process of mounting increases the possibility that the chamber 100 is contaminated, in the latter case, since the possibility is low, the first substrate 700 may be moved from the outside of the chamber 100 to the substrate holder 200. ), It is preferable to proceed with the mounting process (see Fig. 7a).

An adhesive material 900 is injected onto the first substrate. In this case, the adhesive material 900 covers both the adhesive surfaces 810 and 820 of the first substrate 700 and the second substrate 800, and injects the adhesive material 900 in a predetermined thickness. The predetermined thickness is not defined but is preferably a thickness of about 100㎛.

When the adhesive material 900 is injected onto the first substrate 700, the user may directly inject the adhesive material 900 into the adhesive material injection device (not shown) provided in the chamber 100.

Subsequently, the second substrate 800 is aligned with the alignment mark 740 of the first substrate 700.

In this case, the adhesive surface 810 of the second substrate 800 is positioned to face the adhesive surface 710 of the first substrate 700, and the edge of the upper side 832 of the second substrate 800 is positioned. The second substrate 800 is aligned to coincide with the alignment mark 740 designed on the upper side 732 of the first substrate 700. In this case, the edge adhesive sheet 840 attached to the upper side 832 of the second substrate 800 is preferably aligned in a bonded form with the first substrate 700, which is the first substrate 700. ) Is aligned so that it does not move when you proceed to another process.

At the same time, the second substrate 800 is aligned, and the connection member 630, which is a fixture, is fixed to the lower side 834, which is the opposite side of the upper side 832, with a tape or the like. Then, the other end of the fixing chain 620 of the space maintaining apparatus 600 provided in the chamber 100 is connected to the connecting member 630 which is a tension body (see FIG. 7B).

After the alignment process of the first substrate 700 is completed, a vacuum pump (not shown) connected to the chamber 100 is operated to perform an exhaust process of lowering a vacuum in the chamber 100 to a predetermined atmospheric pressure or less.

The lowering of the pressure inside the chamber 100 as described above is to remove bubbles contained in or on the surface of the adhesive material injected on the first substrate 700.

When the bubbles included in the surface or the inside of the adhesive material are not removed, after the first substrate 700 and the second substrate 800 are bonded together, bubbles remain between them, and the characteristics of the X-ray sensor are caused by the bubbles. This is because the problem worsens.

After the evacuation process is completed, that is, bubbles are removed from the adhesive material, the next process is performed. After the evacuation process is completed, air or nitrogen gas is injected into the chamber to create atmospheric pressure, and the next process may be performed. It may be possible to proceed with the next process while maintaining. Of course, after the bonding process of the first substrate 700 and the second substrate 800 is completed, the pressure inside the chamber is equal to atmospheric pressure when the substrate is pulled out or the substrate holder 200 on which the substrate is mounted is withdrawn. It is natural to withdraw after making the state.

After the second substrate 800 is aligned, the compression roller device 400 moves from the upper side 832 to the lower side 834 of the non-adhesive surface 820 of the second substrate 800. . At this time, the movement speed of the compression roller device 400 may be moved at any speed when the bonding speed of the first substrate 700 and the second substrate 800 is well achieved.

In this case, the rubber roller 410 of the compression roller device 400 presses the entire non-adhesive surface 820 of the second substrate 800 at a constant pressure to the first substrate 700 and the second substrate 800. Is coalesced. At this time, the adhesive material 900 is widely spread between the first substrate 700 and the second substrate 800 between the first substrate 700 and the second substrate 800.

In this case, as shown in FIGS. 7C and 7D, the compression roller device 400 travels in a predetermined direction while making linear contact with the non-adhesive surface 820 of the first substrate 800. The 700 and the second substrate 800 are bonded to each of the lower side sides 734 and 834 at the upper side edges 732 and 832, and are later bonded to the lower side edges 734 and 834. The side edge 834 is finally joined.

At this time, the fixing chain 620 of the gap maintaining device 600 to maintain a constant tension, which is the lower side 834 side of the second substrate 800 is first bonded to the first substrate 700, the first In addition to preventing bubbles from being generated between the substrate 700 and the second substrate 800, the adhesive material 900 that is pushed toward the lower side 834 by the compression roller device 400 is compressed to move smoothly. This is to spread the entire surface between the first substrate 700 and the second substrate 800 while being pushed. In addition, as the bonding process proceeds, the fixing chain 620 is released from the tension control roller 610 much so that the fixing chain 620 is too high so that the second substrate 800 is not damaged.

As shown in FIG. 7D, when the compression roller device 400 reaches the lower side 834 of the second substrate 800, the bonding of the first substrate 700 and the second substrate 800 is performed. It will be completed to some extent.

The substrate holder 200 on which the first substrate 700 and the second substrate 800 are seated is withdrawn from the chamber 100 and then hardened to complete the bonding.

In this case, when the heating device is provided inside the chamber 100, the curing process may be performed inside the chamber to complete the bonding process and then withdraw the same.

When the first substrate 700 and the second substrate 800 are withdrawn, the substrate holder 100 on which the first substrate 700 and the second substrate 800 are mounted may be withdrawn or bonded. Only the first substrate 700 and the second substrate 800 may be withdrawn.

In this case, the tapes 750 and 850 and the transparent vinyls 760 and 860 adhered to the bonded first substrate 700 and the second substrate 800 are removed.

Details of the above objects and technical configurations and the effects thereof according to the present invention will be more clearly understood by the following detailed description with reference to the drawings showing preferred embodiments of the present invention. In addition, in the drawings, the length, thickness, etc. of layers and regions may be exaggerated for convenience. Like numbers refer to like elements throughout.

1 is a perspective view showing a substrate laminating apparatus according to an embodiment of the present invention.

2A to 2C are perspective views illustrating shapes of a substrate holder used in a substrate laminating apparatus according to an embodiment of the present invention.

3 is an enlarged perspective view of the compression roller device of the substrate laminating apparatus according to an embodiment of the present invention.

4 is an enlarged perspective view of a moving device of the substrate laminating apparatus according to an embodiment of the present invention.

5A to 5C are perspective views illustrating a process of preparing a first substrate according to an embodiment of the present invention.

6A to 6D are perspective views illustrating a process of preparing a second substrate according to an embodiment of the present invention.

7A to 7D are cross-sectional views illustrating a method of bonding the first substrate and the second substrate by using the substrate laminating apparatus according to an embodiment of the present invention.

<Description of the symbols for the main parts of the drawings>

100: chamber 200: substrate holder

300: base 400: compression roller device

500: moving device 600: space keeping device

700: first substrate 800: second substrate

900: adhesive material

Claims (20)

delete delete delete delete delete A chamber capable of adjusting the degree of vacuum inside; A substrate holder charged in the chamber, the substrate holder having a mounting portion on which a first substrate is mounted; A compression roller device provided in the chamber and pressing the second substrate bonded to the first substrate at a predetermined pressure; A moving device for moving the compression roller device for compressing the second substrate; And And a gap maintaining device configured to maintain a predetermined distance from one side of the second substrate to be bonded to the second substrate when the second substrate is bonded to the first substrate. The depth of the seating portion of the substrate holder is characterized in that the difference between the sum of the thickness of the first substrate and the second substrate is -100㎛ to + 100㎛, The spacing device: a A tension adjusting roller located above the chamber inner wall; And One end is wound on the tension control roller, the other end is a fixed chain connected to one side of the second substrate is not yet bonded; includes; Substrate laminating apparatus, characterized in that the fixed chain is released from the tension control roller when the tension of the fixed chain is more than a predetermined. A chamber capable of adjusting the degree of vacuum inside; A substrate holder charged in the chamber, the substrate holder having a mounting portion on which a first substrate is mounted; A compression roller device provided in the chamber and pressing the second substrate bonded to the first substrate at a predetermined pressure; A moving device for moving the compression roller device for compressing the second substrate; And And a gap maintaining device configured to maintain a predetermined distance from one side of the second substrate to be bonded to the second substrate when the second substrate is bonded to the first substrate. The depth of the seating portion of the substrate holder is characterized in that the difference between the sum of the thickness of the first substrate and the second substrate is -100㎛ to + 100㎛, The compression roller device: A rubber roller in contact with the second substrate to pressurize the surface of the second substrate; A roller frame fastened to both ends of the rubber roller and guiding the rubber roller; A main frame supporting the roller frame and installed on the rail and movable; And And a roller lifting mechanism provided on the main body frame to lift the roller frame and lift the rubber roller. The method of claim 7, wherein The roller lifting mechanism includes a cam shaft, and the cam shaft is fastened to the main frame so that the roller frame is raised or lowered in accordance with an outer circumference of the cam. The method of claim 7, wherein Mobile device: A motor unit coupled to the main frame and having a motor generating a movement; And Substrate laminating apparatus comprising a; ball screw coupled to the motor unit. The method of claim 7, wherein The roller frame is a substrate laminating device, characterized in that it comprises a pressure adjusting weight capable of adjusting the pressure of the rubber roller. The method of claim 7, wherein And the chamber has a base for supporting the rail, the first substrate, and the second substrate. The method of claim 11, The base is provided with a substrate laminating device, characterized in that the holder fixing mechanism for fixing the substrate holder. delete delete delete delete Preparing a first substrate and a second substrate; Mounting the first substrate on a substrate holder and charging the substrate holder into a chamber; Injecting an adhesive material on the first substrate; Aligning the other side of the second substrate after connecting the tension chain to one side of the second substrate while placing the second substrate on the substrate holder on which the first substrate is mounted; Exhausting the inside of the chamber to a predetermined pressure or less to remove bubbles from the adhesive material; While adjusting the length of the tension chain so that the tension chain connected to one side of the second substrate to maintain a constant tension from the other side of the second substrate to one side of the second substrate using the compression roller using the compression roller Pressing and bonding the first substrate and the second substrate to each other; And And withdrawing a substrate holder from the chamber on which the first substrate and the second substrate are bonded to and seated on the substrate. The method of claim 17, Preparing the first substrate: Drawing an alignment mark on the first substrate; Attaching the tape along the alignment mark, but attaching the tape to one side of the first substrate such that the tape does not protrude to the outside of the substrate, and attaching the tape to the other three sides to protrude to the outside by a predetermined length; And And attaching the transparent vinyl having a predetermined width to the protruding tape on three side surfaces of the first substrate on which the tape protrudes. The method of claim 17, The mounting of the first substrate on the substrate holder may include mounting one side of the first substrate to the substrate holder, and mounting one side of the first substrate to be in contact with the side of the seating part of the substrate holder. A substrate laminating method characterized in that the step of fixing the one side of the substrate and the substrate holder with a tape. The method of claim 17, Preparing the second substrate: Attaching an edge adhesive sheet to a surface edge of the second substrate bonded to the first substrate; And And attaching a tape to four sides of the surface of the second substrate that is not bonded to the first substrate so as to protrude out of the substrate, and attaching the transparent vinyl to the tape.

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