KR100941526B1 - Cooling table - Google Patents

Abstract

PURPOSE: A cooling table is provided, which can improve cooling efficiency more and more and can prevent injury of a user by reducing projection length of the thermoelectric semiconductor element unit projected to the lower part of an upper plate. CONSTITUTION: A cooling table comprises an upper plate supported by a leg; a receiving box which is buried to be exposed to the upper plate and receives the cooling object; a thermoelectric semiconductor element unit cooling the heated plate; a cooling water supply member supplying the cooling water to the cooling water storage; and a secondary thermoelectric semiconductor element unit(25) which is installed on the pipe of the cooling water supply member and lowers temperature of the cooling water transferred to the cooling water storage.

Description

Cooling Table

The present invention relates to a cooling table for cooling a wine bottle and a wine glass using a thermoelectric semiconductor device unit, and in particular, by cooling the plate in close contact with the thermoelectric semiconductor device at the bottom of the table top by using a thin coolant reservoir in a water-cooled manner, The present invention relates to a cooling table that can not only increase the cooling efficiency of a semiconductor device but also reduce the protruding length of the thermoelectric semiconductor device unit protruding from the upper plate by a thin coolant reservoir to prevent a user from injuring.

When you drink food, especially alcohol, on a hot day, such as in summer, you drink alcohol and glasses on the table top, so that the initially cooled liquor is gradually heated over time by the hot outside temperature and eventually reaches room temperature. This leads to the problem that later does not feel cool tasting.

In order to solve this problem, a cooling table having a cooling device using a thermoelectric semiconductor device unit has been developed.

The thermoelectric semiconductor device unit is a next-generation environmentally friendly cooling system that breaks the conventional cooling system that operates a compressor to circulate the refrigerant. Both sides of the thin and ceramic thin-walled thermoelectric semiconductor device are simply cooled by switching electrodes. It is a useful product that is widely used in the field of cold and temperature-related industries because it functions to keep the object at room temperature constant at -30 ~ + 180C by simultaneously heating.

In the thermoelectric semiconductor device unit 1, as shown in FIG. 1, a plate 3 is in close contact with the heat dissipation surface of the thermoelectric semiconductor element 2, and the heat dissipation plate 4 is in close contact with the plate 3 to perform heat dissipation. 4) Blower fan (5) is installed in the vicinity to disperse heat radiated hot air. The cool block 6 is tightly fixed to the heat absorbing surface of the thermoelectric semiconductor element 2, and the cooler 6 is tightly fixed to the storage container 7 for storing the contents to be cooled.

As shown in FIGS. 2 and 3, the conventional cooling table 10 equipped with the thermoelectric semiconductor device unit 1 configured as described above has a storage container 7 storing contents M to be cooled, such as a wine bottle or a wine glass. Since the thermoelectric semiconductor device unit 1 is installed to be exposed to the bottom of the storage container 7, the thermoelectric semiconductor device unit 1 is prevented from protruding from the bottom surface of the upper plate 11. Could not.

In other words, in the conventional cooling table 10, since the heat dissipation plate 4 installed under the thermoelectric semiconductor element 2 has an air cooling structure, the air cooling structure has a large volume because it exposes a large area to the air to increase cooling efficiency. Inevitably, the thickness is not only formed thick, but also directly below the thick heat sink 4, a blower fan 5 for blowing air to dissipate hot air to be dissipated must be further installed.

Therefore, in the conventional cooling table 10, the thermoelectric semiconductor device unit 1 is excessively extended to the bottom surface of the top plate 11 by the thick heat sink 4 of the thermoelectric semiconductor device unit 1 and the blowing fan 5 disposed thereunder. Extruded.

Therefore, the thermoelectric semiconductor device unit 1 protruding excessively from the bottom of the table blocks the insertion of the user's knee or leg, which should be located at the bottom of the table, resulting in inconvenience in use, and inserts the user's knee into the bottom of the table. When I hit my knees, I caused injuries and torn clothes.

In addition, since the heat sink 4 is an air-cooled structure, the cooling efficiency is lower than that of the water-cooled type, and thus there is a disadvantage in that it is impossible to drink a cool drink or a drink.

Accordingly, the present invention is to solve all the problems of the conventional cooling table as described above, the purpose of the thermoelectric semiconductor by cooling the plate in close contact with the thermoelectric semiconductor element on the bottom of the upper plate using a thin coolant reservoir, It is to provide a cooling table that can further increase the cooling efficiency of the device.

Another object of the present invention is to provide a cooling table which can prevent the injury of the user by reducing the protruding length of the thermoelectric semiconductor device unit protruding from the bottom of the upper plate by a thin formed coolant reservoir.

The configuration of the cooling table of the present invention for achieving the above object, the top plate supported by the legs;

A storage container buried so as to be exposed to the upper plate to accommodate a cooling object therein;

A thermoelectric semiconductor device unit in which a cool block cooled by a thermoelectric semiconductor element is fixed in close contact with the storage container, and a plate heated by the thermoelectric semiconductor element is cooled in contact with the coolant entering and exiting the coolant reservoir; And

And cooling water supply means for supplying and circulating cooling water to the cooling water reservoir using a pipe.

Herein, the thermoelectric semiconductor device unit has a cool block on one side of the thermoelectric semiconductor device housed in the housing, and the plates are in close contact with each other, and the cooling water reservoir is fixed to the plate and watertightly, and the housing and the cooling water reservoir are bolted. The fastening is secured and an elastic member is inserted between the head of the bolt and the housing to closely contact the housing with the coolant reservoir.

The cooling water supply means is connected to the inlet and the outlet of the cooling water reservoir for providing a flow path for circulating the cooling water;

A heat exchanger installed on the pipe flow path to heat exchange and cool the high temperature cooling water discharged through the cooling water outlet;

A pump which is installed on the pipe flow path and pumps the cooling water cooled in the heat exchanger to a cooling water reservoir; And

Installed on the bottom of the upper plate and turned on / off by the switch operation, driving the pump when using the cooling table, driving the thermoelectric semiconductor element when the temperature detected by the temperature sensor is above the set temperature and below the set temperature. And a controller for stopping the driving of the thermoelectric semiconductor element.

The cooling table of the present invention configured as described above has a thinner thermoelectric semiconductor device unit mounted on the lower side or the side of the storage container for storing the object to be cooled, thereby significantly reducing the thickness of the thermal semiconductor device unit compared to the conventional cooling table. Inhibiting contact with the user's body inserted or positioned below has the advantage of preventing injuries.

In addition, since the cooling table of the present invention forcibly circulates the cooling water in the cooling water reservoir to cool the thermoelectric semiconductor elements by water cooling, the cooling table of the present invention can further increase the cooling efficiency of the thermoelectric semiconductor elements compared to the conventional air-cooling cooling method.

In addition, the present invention has an effect that can reduce the noise generated by the use of a blower because it does not use a blower fan to cool the heat sink.

Hereinafter, with reference to the accompanying drawings will be described in detail the configuration of the cooling table according to the present invention.

Figure 6 is a picture of the cooling table is mounted thermoelectric semiconductor device unit according to the present invention, Figure 7 is a bottom view of the cooling table is mounted thermoelectric semiconductor device unit according to the present invention, Figure 8 is a thermoelectric semiconductor device unit according to the present invention Bottom view of the cooling table. 9 is a bottom view of a cooling table mounted with an auxiliary thermoelectric semiconductor device unit according to the present invention, FIG. 10 is an exploded perspective view of a thermoelectric semiconductor device unit according to the present invention, and FIG. 11 is a thermoelectric semiconductor device unit according to the present invention. Another embodiment is an exploded perspective view. 12 is a cross-sectional view of the thermoelectric semiconductor device unit assembly according to the present invention, Figure 13 is a real picture of the thermoelectric semiconductor device unit according to the present invention, Figure 14 is a plan view of the coolant reservoir according to the present invention. Figure 15 is a picture of the actual product showing the plate according to the invention, Figure 16 is a detailed view showing a state in which the thermoelectric semiconductor device unit is assembled by the elastic member according to the present invention, Figure 17 is a secondary thermoelectric according to the present invention A cross-sectional view showing a semiconductor device unit installation state. FIG. 18 is a photograph of another embodiment of a cooling table according to the present invention, and FIG. 19 is a rear photograph of FIG. 18.

As shown in the figure, the cooling table 20 of the present invention reduces the thickness of the thermoelectric semiconductor element unit 23 installed on the bottom of the upper plate 21 to cool the storage container 22 installed on the upper plate 21, The thermoelectric semiconductor element 23a can be cooled.

The configuration of the cooling table 20 is an upper plate 21 supported by the legs;

A storage container 22 embedded in the upper plate 21 to receive a cooling object therein;

The cool block 23b cooled by the thermoelectric semiconductor element 23a is tightly fixed to the storage container 22, and the plate 23c heated by the thermoelectric semiconductor element 23a enters and exits the coolant reservoir 23d. A thermoelectric semiconductor device unit 23 which is cooled by being in contact with the cooling water; And

And cooling water supply means (24) for supplying and circulating cooling water to the cooling water reservoir (23d).

Here, the storage container 22 is a good aluminum material with a good thermal conductivity and low cost, and if the price is not a problem, a copper material having a better thermal conductivity will be more preferable.

The storage container 22 may vary in size depending on the object to be stored, and in particular, the storage container 22 may accommodate a wine bottle, a wine glass, a water bottle, a beverage bottle, a side dish, and various dishes. The storage container 22 is wrapped with a heat insulator 22c to block external temperature and heat transfer, and an upper end portion thereof has a locking jaw 22b formed at an upper end thereof so that the decorative strip 22a can be fitted thereto.

Here, the storage container 22 is the surface of the decorative strip 22a fitted to the upper locking jaw 22b to be the same as the surface of the upper plate 21 so that the upper plate 21 is smoothly processed.

The thermoelectric semiconductor device unit 23 has a cool block 23b on one side of the thermoelectric semiconductor device 23a housed in the housing 23e, and plates 23c on the other side of the thermoelectric semiconductor device unit 23, and the plate 23c and the watertight seal. The cooling water reservoir 23d is secured, and the housing 23e and the cooling water reservoir 23d are fastened and fastened by the bolt 23f, and the elastic member 23g is disposed between the head of the bolt 23f and the housing 23e. Is fitted to bring the housing 23e into close contact with the cooling water reservoir 23d.

Here, the coolant reservoir 23d and the plate 23c in close contact with the coolant reservoir 23d and in contact with the coolant are important elements for cooling the thermoelectric semiconductor element unit 23 of the present invention by water cooling.

The coolant reservoir 23d is preferably made of an aluminum material having excellent heat transfer, and mouths 23d-1 and outlets 23d-2 are formed to be connected to pipes 24a described below for circulating the coolant. In the internal storage chamber 23d-3, partition walls 23d-4 are formed between the inlets and outlets 23d-1 and 23d-2 to guide the flow of cooling water in a u-turn manner. The reason for forming the partition 23d-4 as described above is because the inlets and outlets 23d-1 and 23d-2 are close, the coolant flowing into the inlet 23d-1 is immediately discharged to the outlet 23d-2. Instead, U turn away along the partition 23d-4 so that the cooling water rises evenly as a whole when the plate 23c cools.

In addition, the plate 23c cooled by the cooling water is tightly fixed to the cooling water reservoir 23d, which is possible by the bolt 23f and the elastic member 23g. The plate 23c has protrusions 23c-1 formed on one side thereof so as to be in contact with the coolant stored in the coolant reservoir 23d. Preferably, the plate 23c is formed in a plurality of the plates 23c so as to be evenly distributed in the storage chamber 23d-3. It is preferable to be. The plurality of protrusions 23c-1 smoothly flows the cooling water and widens the surface contact with the cooling water, thereby increasing the cooling efficiency of the plate 23c.

On the other hand, the thermoelectric semiconductor device unit 23 is preferably equipped with a first temperature sensor (23h) for sensing the temperature of the storage container (22) cooled by the thermoelectric semiconductor device (23a). The first temperature sensor 23h is installed at an arbitrary position in contact with the cool block 23 or the storage container 22 to sense a temperature. The controller C is configured to detect the temperature by the first temperature sensor 23h. When the sensed temperature is lower than the input set temperature, the driving of the thermoelectric semiconductor device unit 23 is stopped, and when the temperature is higher than the set temperature, the thermoelectric semiconductor device unit 23 is driven to lower the temperature of the storage container 22. do.

In addition, the thermoelectric semiconductor device unit 23 of the present invention is shown in FIG. 12 to prevent the failure of the thermoelectric semiconductor device unit 23 due to overheating due to the failure of the pump 24c to circulate the cooling water. As described above, the second temperature sensor S for detecting a temperature is further mounted at any position of the plate 23c or the coolant reservoir 23d.

Since the second temperature sensor S is electrically connected to the controller C, when the temperature sensed by the second temperature sensor S rises above the temperature inputted by the controller C, the controller C is supplied with electricity. All the driven components, i.e., the thermoelectric semiconductor element unit 23, the pump 24c, the auxiliary thermoelectric element unit 25, and the like are stopped.
Here, the controller (C) is separately mounted on the bottom surface of the upper plate 21 as shown in Figure 7, using a well-known temperature control method widely used in electrical and electronic products.
For example, a controller of a home boiler is similar to running a boiler when the room temperature measured by the sensor is lower than a temperature set by the user, and stopping the boiler when the temperature measured by the sensor is higher. Do.

The cooling water supply means 24 is for circulating by supplying cooling water to the cooling water reservoir 23d. The coolant supply means 24 includes a pipe 24a connected to the inlets and outlets 23d-1 and 23d-2 of the coolant reservoir 23d to provide a flow path for circulating the coolant;

A heat exchanger (24b) installed on the pipe (24a) flow path to heat-exchange and cool the high-temperature cooling water discharged through the cooling water outlet (23d-2);

A pump (24c) installed on the pipe (24a) flow path and for feeding the cooling water cooled in the heat exchanger (24b) to a cooling water reservoir (23d); And

When the cooling table 20 is used, the pump 24c is driven when the cooling table 20 is used, and the temperature detected by the temperature sensor 23h is equal to or higher than the set temperature. And a controller (C) for driving the thermoelectric semiconductor element (23a) and stopping the driving of the thermoelectric semiconductor element (23a) when the temperature is lower than the set temperature.

The cooling water supply unit 24 may further include a blower fan 24d for forcibly supplying air cooled by passing the heat exchanger 24b to the side of the heat exchanger. When the blower fan 24d supplies the outside air to the heat exchanger 24b, the cooling water passed through the heat exchanger 24b is cooled by fresh air, thereby improving the cooling efficiency.

In addition, the cooling water supply means 24 is preferably equipped with a supplement tank 24e for replenishing the cooling water on the pipe (24a) flow path. The replenishment tank 24e may be located in the upper portion of the pipe 24a so that the excess coolant is filled and automatically supplied by the amount when the coolant is consumed in the pipe 24a.

Here, the pipe 24a provides a flow path through which cooling water flows, and a flexible hose, a metal pipe, or the like may be used. After the pipe 24a is installed, the pipe 24a may be protected by being covered with a protective member such as a mold or a thin metal plate.

The heat exchanger 24b is well known in the air-conditioning field or in automobiles, and performs heat exchange with external air when the coolant passes through a thin aluminum port (not shown) by the pump 24c. The temperature of the cooling water heated by 23a) is lowered. At this time, when one side of the thermoelectric semiconductor element 23a cools the storage container 22, heat is generated on the other side, and the heat is cooled by the cooling water.

 The controller C is driven by the operation of the switch SW installed on the upper plate 21 of FIG. 18, and is electrically connected to a temperature sensor 23h for sensing the temperature of the storage container 22. When the temperature sensed by 23h) is higher than or equal to the set temperature, the thermoelectric semiconductor element unit 23 is driven to cool the storage container 22. When the sensing temperature is lower than or equal to the set temperature, the thermoelectric semiconductor element unit 23 is stopped. Let's go. Therefore, the storage container 22 maintains the set temperature.

In addition, the controller C is electrically connected to the pump 24c to control the driving of the pump 24c, which is driven when the thermoelectric semiconductor element unit 23 drives to cool the storage container 22. The pump 24c is driven to cause the pump 24c to circulate the cooling water to cool the plate 23c.

Cooling water supply means 24 of the present invention is a pipe manifold manifold of the pipes (24a) corresponding to the outlet 23d-2 of the cooling water reservoir 23d of the plurality of storage containers 22 installed on the top plate 21 (MF) is connected to form a single flow path (A), the single flow path (A) is connected to the heat exchanger (24b). In addition, pipes connected to the inlet 23d-1 of the coolant reservoir 23d are connected to the manifold MF to form a single flow path A, which is connected to the pump 24c. . As such, when the manifold MF is connected to the heat exchanger 24b and the pump 24c, the pipe piping is simple and the structure of the present invention can be simplified.

On the other hand, in the present invention, it is preferable to further increase the cooling efficiency by cooling the cooling water using the auxiliary thermoconductor element unit 25. That is, as shown in FIG. 16, the auxiliary thermoconductor element unit 25 has a structure in which two coolant reservoirs are formed at both sides in a state in which one auxiliary thermoconductor element 25b is shared.

That is, the auxiliary thermoconductor element unit 25 has the auxiliary thermoconductor element 25b housed inside the housing 25a, and the first plate 25c is disposed on the heat absorbing surface of the auxiliary thermoconductor element 25b. The two plates 25d are tightly fixed, and the first and second plates 25c and 25d are tightly fixed to the first and second coolant reservoirs 25e and 25f, and the first and second plates 25c ( The first and second projections 25c-1 and 25d-1 protruding from each other are inserted into the storage chambers 25e-1 and 25f-1 of the first and second cooling water reservoirs 25e and 25f, respectively. .

The auxiliary thermoconductor element unit 25 configured as described above is provided on the single channel A. FIG. Therefore, as shown in FIG. 17, the outlet 25e-3 of the first coolant reservoir 25e and the inlet 25f-2 of the second coolant reservoir 25f are connected to the single channel pipe A.

Therefore, the coolant flows into the inlet 25e-2 of the first coolant reservoir 25e and discharged to the outlet 25e-3 as shown in FIG. 17, and the coolant discharged from the outlet 25e-3 is manifold ( MF) is introduced into the heat exchanger 24b to repeatedly perform the cooling function.

The coolant repeating the flow is introduced into the first coolant reservoir 25e and heated while cooling the auxiliary thermoconductor element 25b, and then discharged to the heat exchanger 24b, after which the second coolant reservoir 25f is continued. It is introduced into and cooled by the second plate 25d in close contact with the heat absorbing surface of the auxiliary thermoelectric semiconductor element 25b and discharged in a state where the temperature is lowered.

As described above, the cooling water cooled by the auxiliary thermoconductor element unit 25 is supplied to the cooling water reservoir 23d of each of the thermoconductor element units 23 through a pump 24c, and is supplied at low temperature. Since 23a) is cooled, the storage container 22 has a low cooling temperature.

On the other hand, the cooling water used in the present invention not only prevents evaporation but also prevents corrosion of plates, cooling water reservoirs, and pipes constituting the flow path, such as ethylene glycol {(EG) ETHYLENE GLYCOL} and deionized water {(DI) DEIONIZED. It is preferable to use a mixture of WATER}, and preferably, the ethylene glycol and deionized water are mixed at a ratio of 1: 1.

1 is an exploded perspective view of a typical thermoelectric semiconductor device unit

2 is a perspective view of a conventional cooling table to which a thermoelectric semiconductor device unit according to the related art is applied.

3 is a front view of a conventional thermoelectric semiconductor device unit mounted on a cooling table;

4 is a detailed view in which a thermoelectric semiconductor device unit is mounted on a conventional cooling table;

5 is a bottom view of the actual product table equipped with a conventional thermoelectric semiconductor device unit

6 is a picture of a cooling table equipped with a thermoelectric semiconductor device unit according to the present invention

7 is a bottom view of a cooling table equipped with a thermoelectric semiconductor device unit according to the present invention.

8 is a bottom perspective view of a cooling table equipped with a thermoelectric semiconductor device unit according to the present invention.

9 is a bottom view of a cooling table mounted with an auxiliary thermoelectric semiconductor device unit according to the present invention.

10 is an exploded perspective view of an embodiment of a thermoelectric semiconductor device unit according to the present invention.

11 is an exploded perspective view of another embodiment of a thermoelectric semiconductor device unit according to the present invention.

12 is a cross-sectional view of the thermoelectric semiconductor device unit assembly according to the present invention

Figure 13 is a perspective photo of the actual thermoelectric semiconductor device unit according to the present invention

14 is a plan view of the coolant reservoir according to the present invention

Figure 15 is a picture of the actual product showing a plate according to the present invention

16 is a detailed view showing a state in which the thermoelectric semiconductor device unit according to the present invention is assembled to be compressed by the elastic member

17 is a cross-sectional view showing an installation state of an auxiliary thermoelectric semiconductor device unit according to the present invention.

18 is a picture of another embodiment cooling table actual article according to the present invention

19 is a rear view of FIG. 18.

Explanation of symbols on the main parts of the drawings

20: cooling table 21: top plate

22: accommodating container 23: thermoelectric semiconductor element unit

24: cooling water supply means 24a: pipe

24b: heat exchanger 24c: pump

24d: blower fan 25: auxiliary thermoconductor element unit

Claims (13)

A top plate supported by the legs; A storage container buried so as to be exposed to the upper plate to accommodate a cooling object therein; A thermoelectric semiconductor device unit in which a cool block cooled by a thermoelectric semiconductor element is fixed in close contact with the storage container, and a plate heated by the thermoelectric semiconductor element is cooled in contact with the coolant entering and exiting the coolant reservoir; Cooling water supply means for supplying and cooling the cooling water to the cooling water reservoir using a pipe; And And an auxiliary thermoconductor element unit (25) installed on the pipe of the cooling water supply means to lower the temperature of the cooling water being transferred to the cooling water reservoir. Here, the auxiliary thermoconductor element unit 25 has an auxiliary thermoconductor element 25b housed inside the housing 25a, and the first plate 25c is disposed on the heat absorbing surface of the auxiliary thermoconductor element 25b. The second plate 25d is tightly fixed, and the first and second plates 25c and 25d are tightly fixed to the first and second coolant reservoirs 25e and 25f, and the first and second plates 25c are fixed. 25d, the first and second projections 25c-1 and 25d-1 protruding from each other are inserted into the storage chambers 25e-1 and 25f-1 of the first and second cooling water reservoirs 25e and 25f, respectively. Cooling table comprising a. The cooling table according to claim 1, wherein the thermoelectric semiconductor device unit has a plate and a coolant reservoir tightly fixed to each other, and the plate has protrusions formed on one side thereof to be in contact with the coolant stored in the coolant reservoir. The cooling table of claim 1, wherein an inlet and an outlet are formed to be connected to a pipe for circulating the cooling water, and an internal storage chamber is formed with a partition wall for guiding the flow of the cooling water between the inlet and the outlet. . The thermoelectric semiconductor device unit of claim 1, wherein a cool block is attached to one side of the thermoelectric semiconductor element housed in a housing, and a plate is closely attached to the other side of the thermoelectric semiconductor device unit, and the coolant reservoir is fixedly sealed to the plate and the housing and the coolant reservoir. The fastening table is fixed to the bolt and the cooling table, characterized in that the elastic member is sandwiched between the head and the housing of the bolt to close the housing to the coolant reservoir. The thermoelectric semiconductor device unit of claim 1, wherein a first temperature sensor for sensing a temperature of the storage container cooled by the thermoelectric semiconductor device is mounted to the cool block or the storage container, and a controller senses the first temperature sensor. And stopping the driving of the thermoelectric semiconductor element unit when one temperature is lower than the set temperature inputted to the self, and driving the thermoelectric semiconductor element unit when the temperature reaches or exceeds the set temperature. 2. The thermoelectric semiconductor device unit of claim 1, wherein a second temperature sensor is mounted on a plate or a coolant reservoir, and a controller is driven by an electric supply when a temperature detected by the second temperature sensor rises above a temperature input thereto. A cooling table comprising stopping driving of a thermoelectric semiconductor element unit, a pump, and an auxiliary thermoelectric semiconductor element unit (25). According to claim 1, The coolant supply means is connected to the inlet and outlet of the coolant reservoir pipe for providing a flow path for circulating the coolant; A heat exchanger installed on the pipe flow path to heat exchange and cool the high temperature cooling water discharged through the cooling water outlet; A pump which is installed on the pipe flow path and pumps the cooling water cooled in the heat exchanger to a cooling water reservoir; And It is installed on the bottom of the upper plate and turned on / off by a switch operation, driving the pump when using the cooling table, driving the thermoelectric semiconductor element when the temperature sensed by the temperature sensor is above the set temperature and when the temperature is below the set temperature, And a controller for stopping the driving of the semiconductor device. The cooling table according to claim 7, wherein the cooling water supply means further includes a cooling water supplement tank so as to supplement the cooling water on the pipe flow path. The cooling table according to claim 7, wherein the cooling water supply means further comprises a blower fan at one side of the heat exchanger to air-cool the heat exchanger. The method of claim 1, wherein a plurality of storage containers are installed on the top plate, the pipes of the cooling water supply means corresponding to each of the storage containers are connected to the manifold to form a single flow path, the manifold is connected to the pump Cooling table. The cooling table of claim 1, wherein the cooling water comprises a mixture of ethylene glycol (ETHYLENE GLYCOL) and deionized water (DEIONIZED WATER). delete delete

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