KR100932981B1 - 유기 발광 표시 모듈 - Google Patents
유기 발광 표시 모듈 Download PDFInfo
- Publication number
- KR100932981B1 KR100932981B1 KR1020080033720A KR20080033720A KR100932981B1 KR 100932981 B1 KR100932981 B1 KR 100932981B1 KR 1020080033720 A KR1020080033720 A KR 1020080033720A KR 20080033720 A KR20080033720 A KR 20080033720A KR 100932981 B1 KR100932981 B1 KR 100932981B1
- Authority
- KR
- South Korea
- Prior art keywords
- light emitting
- frame
- organic light
- emitting display
- display panel
- Prior art date
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
- H01L21/76829—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers
- H01L21/76834—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing characterised by the formation of thin functional dielectric layers, e.g. dielectric etch-stop, barrier, capping or liner layers formation of thin insulating films on the sidewalls or on top of conductors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/0203—Particular design considerations for integrated circuits
- H01L27/0248—Particular design considerations for integrated circuits for electrical or thermal protection, e.g. electrostatic discharge [ESD] protection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13069—Thin film transistor [TFT]
Abstract
Description
Claims (8)
- 발광 영역 및 비 발광 영역을 포함하는 유기 발광 표시 패널;상기 유기 발광 표시 패널을 수납하는 제1 프레임; 및상기 표시 패널의 발광방향에 대향하여, 상기 제1 프레임과 결합되고, 상기 유기 발광 표시 패널 전면의 비 발광 영역을 보호하는 제2 프레임을 포함하고,상기 제1 프레임의 외측면을 따라 형성된 오목부 및 상기 제2 프레임의 내측면을 따라 형성된 볼록부가 상호 결합되고,상기 오목부 및 볼록부는 반원 형상의 단면을 가지고,상기 비 발광 영역은 구동 소자(Driving IC)가 설치된 영역을 포함하는 유기 발광 표시 모듈.
- 제1항에 있어서,상기 제2 프레임은 상기 제1 프레임의 외측으로 감싸면서 상기 제1 프레임과 결합되는 유기 발광 표시 모듈.
- 삭제
- 삭제
- 삭제
- 제1항에 있어서,상기 유기 발광 표시 모듈은 상기 유기 발광 표시 패널의 발광 방향으로 상기 유기 발광 표시 패널 상에 형성된 광학 필름을 더 포함하고,상기 광학 필름은 상기 발광 영역상에 형성된 유기 발광 표시 모듈.
- 제1항에 있어서,상기 제1 프레임 및 상기 제2 프레임의 재질은스테인리스 강, 냉연강판, 알루미늄, 니켈-은 합금, 및 고분자 수지로 이루어진 군에서 선택된 재질인 유기 발광 표시 모듈.
- 삭제
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080033720A KR100932981B1 (ko) | 2008-04-11 | 2008-04-11 | 유기 발광 표시 모듈 |
US12/422,115 US20090256471A1 (en) | 2008-04-11 | 2009-04-10 | Organic light emitting diode module |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020080033720A KR100932981B1 (ko) | 2008-04-11 | 2008-04-11 | 유기 발광 표시 모듈 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20090108345A KR20090108345A (ko) | 2009-10-15 |
KR100932981B1 true KR100932981B1 (ko) | 2009-12-21 |
Family
ID=41163397
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020080033720A KR100932981B1 (ko) | 2008-04-11 | 2008-04-11 | 유기 발광 표시 모듈 |
Country Status (2)
Country | Link |
---|---|
US (1) | US20090256471A1 (ko) |
KR (1) | KR100932981B1 (ko) |
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US9116564B2 (en) | 2012-07-17 | 2015-08-25 | Samsung Display Co., Ltd. | Touch screen panel and display device with the same |
WO2021136069A1 (zh) * | 2020-01-03 | 2021-07-08 | 京东方科技集团股份有限公司 | 芯片封装结构和显示装置 |
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US8441790B2 (en) | 2009-08-17 | 2013-05-14 | Apple Inc. | Electronic device housing as acoustic input device |
US8624878B2 (en) | 2010-01-20 | 2014-01-07 | Apple Inc. | Piezo-based acoustic and capacitive detection |
KR101056261B1 (ko) * | 2010-05-17 | 2011-08-11 | 삼성모바일디스플레이주식회사 | 표시 장치 |
KR101812065B1 (ko) | 2010-10-22 | 2017-12-28 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 이를 구비한 전자 기기 |
US8780579B2 (en) * | 2011-01-05 | 2014-07-15 | Samsung Display Co., Ltd. | Organic light emitting diode display |
US8716932B2 (en) | 2011-02-28 | 2014-05-06 | Apple Inc. | Displays with minimized borders |
US8816977B2 (en) | 2011-03-21 | 2014-08-26 | Apple Inc. | Electronic devices with flexible displays |
US9178970B2 (en) | 2011-03-21 | 2015-11-03 | Apple Inc. | Electronic devices with convex displays |
US9866660B2 (en) | 2011-03-21 | 2018-01-09 | Apple Inc. | Electronic devices with concave displays |
KR101759235B1 (ko) * | 2011-04-18 | 2017-07-19 | 삼성디스플레이 주식회사 | 유기 발광 조명 장치 |
US8787016B2 (en) | 2011-07-06 | 2014-07-22 | Apple Inc. | Flexible display devices |
US9400576B2 (en) | 2011-07-19 | 2016-07-26 | Apple Inc. | Touch sensor arrangements for organic light-emitting diode displays |
US8804347B2 (en) | 2011-09-09 | 2014-08-12 | Apple Inc. | Reducing the border area of a device |
US8723824B2 (en) | 2011-09-27 | 2014-05-13 | Apple Inc. | Electronic devices with sidewall displays |
US10245776B2 (en) | 2011-09-30 | 2019-04-02 | Apple Inc. | Methods for forming electronic devices with bent display edges |
US10088863B2 (en) | 2011-09-30 | 2018-10-02 | Apple Inc. | Electronic devices with cover layers mounted to displays |
US8929085B2 (en) | 2011-09-30 | 2015-01-06 | Apple Inc. | Flexible electronic devices |
US9098242B2 (en) | 2011-09-30 | 2015-08-04 | Apple Inc. | Electronic devices with cover layers mounted to displays |
US8724304B2 (en) | 2012-04-20 | 2014-05-13 | Apple Inc. | Electronic devices with flexible displays having fastened bent edges |
US9110320B2 (en) | 2012-08-14 | 2015-08-18 | Apple Inc. | Display with bent inactive edge regions |
US9195108B2 (en) | 2012-08-21 | 2015-11-24 | Apple Inc. | Displays with bent signal lines |
US9601557B2 (en) | 2012-11-16 | 2017-03-21 | Apple Inc. | Flexible display |
KR20140095851A (ko) * | 2013-01-25 | 2014-08-04 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 |
KR102042678B1 (ko) | 2013-03-25 | 2019-11-11 | 삼성디스플레이 주식회사 | 디스플레이 장치 |
KR102048467B1 (ko) | 2013-04-03 | 2019-11-26 | 삼성디스플레이 주식회사 | 유기발광 표시장치 |
US9209207B2 (en) | 2013-04-09 | 2015-12-08 | Apple Inc. | Flexible display with bent edge regions |
KR102139676B1 (ko) * | 2014-05-27 | 2020-07-30 | 엘지디스플레이 주식회사 | 유기발광소자 |
US9600112B2 (en) | 2014-10-10 | 2017-03-21 | Apple Inc. | Signal trace patterns for flexible substrates |
KR20180075733A (ko) | 2016-12-26 | 2018-07-05 | 엘지디스플레이 주식회사 | 플렉서블 표시장치 |
JP7049779B2 (ja) * | 2017-06-27 | 2022-04-07 | 株式会社デンソーテン | 表示装置 |
KR20230039834A (ko) * | 2021-09-13 | 2023-03-22 | 삼성디스플레이 주식회사 | 쉴딩백 그리핑 장치, 이를 포함하는 디스플레이 포장 시스템, 및 이들을 이용한 디스플레이 포장 방법 |
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-
2009
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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US9116564B2 (en) | 2012-07-17 | 2015-08-25 | Samsung Display Co., Ltd. | Touch screen panel and display device with the same |
WO2021136069A1 (zh) * | 2020-01-03 | 2021-07-08 | 京东方科技集团股份有限公司 | 芯片封装结构和显示装置 |
US11778760B2 (en) | 2020-01-03 | 2023-10-03 | Hefei Boe Optoelectronics Technology Co., Ltd. | Chip packaging structure and display device |
Also Published As
Publication number | Publication date |
---|---|
US20090256471A1 (en) | 2009-10-15 |
KR20090108345A (ko) | 2009-10-15 |
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