KR100927621B1 - Apparatus for depositing a protective film layer, and a deposition method using the same - Google Patents

Abstract

A plasma display panel and a method of manufacturing the same are disclosed. According to the present invention, an anti-hydration module is provided in which a substrate is loaded from a substrate inlet and provides a space in which a substrate is mounted on a carrier; a load lock chamber connected to the anti-hydration module to maintain a vacuum; A plurality of vacuum chambers connected to the chamber and to which the substrate mounted on the carrier is transferred; and a deposition chamber installed in the vacuum chamber; and a target unit installed in the deposition chamber to deposit the raw material of the protective layer on the substrate; An anti-hydration module, a load lock chamber, a vacuum chamber, a transfer unit which is continuously installed in the deposition chamber and transfers the substrate mounted on the carrier; and, the anti-hydration module, the load lock chamber, And a gate valve installed at the boundary of the vacuum chamber and the vapor deposition chamber to selectively open and close each space. Since the carrier is not exposed to the atmosphere, it may be increased even when used for a long time. Because the chamber inside of the partial pressure can not be increased, it is possible to provide a suitable quality of the deposited overcoat layer.

Description

Apparatus for evaporating protective layer and evaporating method using the same}

1 is a block diagram showing an apparatus for depositing a protective film layer according to a conventional example,

2 is a block diagram showing an apparatus for depositing a protective film layer according to another conventional example,

3 is a plan view showing a substrate mounted on a conventional carrier,

4 is a block diagram showing an apparatus for depositing a protective film layer according to another conventional example,

5 is a block diagram showing an apparatus for depositing a protective film layer according to an embodiment of the present invention,

FIG. 6 is an enlarged view illustrating a portion A of FIG. 5.

<Brief description of symbols for the main parts of the drawings>

500 ... Deposition Unit 501 ... Substrate

503 ... carrier 504 ... first gate valve

505 ... substrate input 506 ... anti-hydration module

507 Load chamber chamber 508 Vacuum chamber

509 Deposition chamber 510 Heater

511 ... Upper and Lower Separator 512 ... Roller

512a ... carrier roller 512b ... substrate roller

516 ... slit

The present invention relates to a device for depositing a protective film layer, and more particularly, a device for preventing the inflow of water when depositing a protective film layer on a substrate, and the deposition of a protective film layer that facilitates the evacuation of moisture, and the deposition using the same. It is about a method.

In general, a plasma display panel forms a plurality of discharge electrodes between a plurality of substrates, and applies a predetermined power to each discharge electrode while generating a discharge gas in a sealed discharge space between the substrates. A flat display device is a flat display device that realizes an image by using light emitted by exciting a fluorescent material of a phosphor layer by ultraviolet rays.

The manufacturing process of the plasma display panel will be briefly described as follows.

In the case of the first substrate, the first discharge electrode is formed on the first substrate, and then the first dielectric layer is printed to fill the gap, and a passivation layer is formed on the surface of the first dielectric layer. In the case of the second substrate, a second discharge electrode is formed on the second substrate, and then the second dielectric layer is printed so as to be embedded, a partition wall for partitioning the discharge cells is formed on the second dielectric layer, and the inner side of the partition wall is formed. Red, green, and blue phosphor layers are applied.

The first and second substrates completed through the above process are coated with glass frit on the opposite inner surface edges in a mutually aligned state to be sealed to each other through heat treatment at a predetermined temperature, and between the sealed panels. In order to remove impurities including residual water, evacuation is performed in a vacuum state. Next, a discharge gas containing xenon-neon (Xe-Ne) as a main component is injected, an aging discharge is applied by applying a predetermined voltage to the panel, and the IC chip is mounted and completed.

In this case, the protective layer is formed by using a material having a large secondary electron emission coefficient, such as MgO, to induce a gas discharge at a low voltage by emitting secondary electrons from the surface thereof.

1 illustrates an apparatus 100 for depositing a protective film layer according to a conventional example.

Referring to the drawings, the substrate 101 is mounted on a carrier 103 by the robot 102. The substrate 101 mounted on the carrier 103 is loaded into the load lock chamber 105 by opening the first gate valve 104. In this case, the carrier 103 is transferred by the driving of the roller 119.

The substrate 101 mounted on the carrier 103 loaded in the load lock chamber 105 is transferred toward the buffer unit-1 chamber 106. The substrate 101 is moved by the heater 110 while being transferred from the buffer unit-1 chamber 106 to the return chamber 109 through the deposition unit 111 and the buffer unit-2 chamber 108. Is heated to the process temperature.

The substrate 101 mounted on the carrier 103 is transferred from the lower portion of the return chamber 108 to the lower portion of the deposition chamber chamber 111 through the lower portion of the buffer unit-2 chamber 108. To be deposited on the substrate. MgO particles deposited on the substrate 101 are evaporated by melting the MgO raw material on the heart 113 by the plasma or electron beam source 112.

The deposited substrate 101 is transferred to the lower portion of the buffer unit-1 chamber 106, the load lock chamber 105, the substrate taking out and the charging stand 114, and the deposited substrate 101 is transferred to the robot 102. To be taken out.

However, when the MgO raw material is deposited on the substrate 101, a portion of the MgO raw material is also deposited on the carrier 103 supporting the substrate 101. MgO thin films tend to bond physically or chemically with moisture when exposed to moisture. Moisture absorbed by the carrier 103 causes a problem of changing the environment of the deposition apparatus 100 when it is released in the deposition apparatus 100, thereby lowering the characteristics of the MgO thin film. In addition, since the carrier 103 is exposed to the atmosphere, a phenomenon in which the film characteristics are degraded due to moisture pressure is generated.

In order to solve this problem, as shown in FIG. 2, the deposition apparatus 200 of TOEL (transfer only substrate system) method manufactured by Anelva, Japan, is transported only in the vacuum chamber and is not exposed to the atmosphere. Structure.

Referring to the drawings, the substrate 201 loaded into the load lock chamber 205 is mounted on the carrier 203 on the carrier return chamber 206. The substrate 201 already deposited before the new substrate 201 is mounted to the carrier 203 is transferred to the load lock chamber 206 under the carrier return chamber 206 and the substrate 203 is not mounted. ) Is transferred to the carrier return chamber 206 to mount a new substrate 201.

By the way, Anelbas's TOSS method can transfer only in a vacuum, thereby preventing the problem of water absorption due to MgO attached to the carrier 203, but bonding and detaching the substrate 201 and the carrier 203 under vacuum. Therefore, there is a problem that substrate transfer becomes complicated.

In recent years, the panel substrate has a multi-faceted method applied to it, and after fixing it to a large substrate, it is divided into a panel of a desired size.

3 illustrates a conventional multi-sided substrate 301, a carrier 303, and a mask 305.

Referring to the drawings, a large-sized substrate 301 is mounted on the carrier 303, and the deposition surface is covered with a mask 305 to produce a panel of a desired size. In the passivation film deposition apparatus using the TOSS method of FIG. 2, roller driving is used to transfer the multi-faceted large substrate to the carrier return chamber 206.

In this case, the portion where the substrate 301 and the roller may contact each other may be a portion covered by the edge portion of the substrate 301 and the mask 305. In order to produce panels of various sizes with the same deposition apparatus, the distance and position of the rollers must be changed. If the substrate 301 is mounted on the carrier 203 from the beginning, the roller spacing problem does not occur, but in the case of the TOSS method, since only the substrate 301 has to be transferred to the carrier return chamber 206, the panel model is changed. The rollers must be repositioned for this purpose. In order to adjust the roller spacing, the vacuum must be released, and a large number of time is required to set the conditions for deposition again, which causes a problem of lowering productivity.

FIG. 4 illustrates that in the case of the CDA (clean dry air) deposition apparatus 400 manufactured by UlVA of Japan, the bonding and desorption of the TOSS method is performed at the substrate charging and taking-out unit 404 managed by dry air, not vacuum. . The newly mounted substrate 401 is transferred to the carrier vacuum charging unit 407 through the CDA passage part 406, and is loaded into the deposition chamber 411 through the load lock chamber 405.

However, the CDA method is easier to change the model than the TOSS method, but the carrier 403 with MgO is not completely blocked from contacting the atmosphere, so that impurity management in the deposition chamber 411 is more secure than the TOSS method. good. In addition, maintenance costs for maintaining the air of the long CDA passage 405 as dry air are high.

The present invention is to solve the above problems, by forming a chamber in the substrate loading portion on which the substrate is mounted on the carrier to form a dry atmosphere, to maintain the positive pressure to prevent the carrier from being exposed to external moisture An object of the present invention is to provide an apparatus for depositing a protective film layer and a deposition method using the same.

In order to achieve the above object, a device for depositing a protective film layer according to an aspect of the present invention,

An anti-hydration module loaded with a substrate from a substrate inlet and providing a space in which the substrate is mounted on a carrier;

A load lock chamber coupled with the anti-hydration module to maintain a vacuum;

A plurality of vacuum chambers connected to the load lock chambers and to which substrates mounted on the carriers are transferred;

A deposition chamber installed in the vacuum chamber;

A target unit installed in the deposition chamber and configured to deposit an element of a protective film layer on the substrate;

A transfer unit which is continuously installed in the anti-hydration module, the load lock chamber, the vacuum chamber, and the deposition chamber, and transfers the substrate mounted on the carrier; And

And a gate valve disposed at the boundary of the anti-hydration module, the load lock chamber, the vacuum chamber, and the deposition chamber, to selectively open and close each space.

In addition, the anti-hydration module is characterized in that the dry gas atmosphere.

In addition, between the substrate inlet and the anti-hydration module is selectively opened and closed by a door, characterized in that a slit is formed to provide a passage through which the substrate is charged.

In addition, the transfer unit includes a carrier roller for transferring the carrier, a substrate roller for transferring the substrate.

Further, the carrier roller is characterized in that it is disposed continuously through the anti-hydration module, the load lock chamber, the vacuum chamber, and the deposition chamber.

Furthermore, the substrate roller is characterized in that it is installed in the anti-hydration module.

Deposition method using a device for depositing a protective film layer according to another aspect of the present invention,

Loading a substrate from the substrate inlet into the anti-hydration module;

Mounting the loaded substrate on a carrier by a vertical transfer part;

Transferring the substrate mounted on the carrier to a load lock chamber;

Passing the substrate mounted on the carrier through a plurality of vacuum chambers;

Depositing a protective film layer on the substrate by a target unit in a deposition chamber between the chambers; And

And removing the substrate on which the protective layer is deposited, via the vacuum chamber, the load lock chamber, and anti-hydration.

In addition, the substrate is characterized in that it is loaded into the anti-hydration module through a slit provided between the substrate inlet and the anti-hydration module.

Moreover, in the step of mounting the substrate on the carrier,

Raising a carrier supported by a carrier roller toward the substrate;

Seating on a lower surface of an edge of a substrate on an upper surface of the carrier;

A substrate roller supporting the substrate is lowered to be separated from the substrate; And

And transporting the carrier on which the substrate is mounted by a care roller.

In addition, a portion of the chamber and the upper and lower separators are installed in the deposition chamber to discharge the evaporated water from the substrate mounted on the carrier passing through the upper space to the outside.

Hereinafter, an apparatus for depositing a protective film layer according to an embodiment of the present invention will be described in detail with reference to the accompanying drawings.

5 illustrates an apparatus 500 for depositing a protective film layer according to an embodiment of the present invention.

Referring to FIG. 5, the deposition apparatus 500 may include an anti-hydration loading module part 506 and a load lock chamber in communication with the anti-hydration loading module part 506. 507, a plurality of vacuum chambers 508 in communication with the load lock chamber 507, and a deposition chamber 509 provided in the vacuum chamber 508.

In front of the anti-hydration loading module unit 506, a substrate inlet 515 for transferring the substrate 501 on the substrate inlet 505 is configured as a separate chamber. The substrate inlet 515 is in communication with the anti-hydration loading module unit 506 through a slit 516. The substrate inlet 515 is coupled to the top of the anti-hydration loading module unit 506 to maintain a dry air atmosphere, preferably an inert atmosphere, so that the anti-hydration loading module unit 506 Minimizing the amount of inert gas consumed in the process.

The slit 516 is formed to a minimum size to which the substrate 501 on the substrate inlet 505 can be charged, and serves to maintain the inside of the anti-hydration loading module 506 at a positive pressure. The slit 516 is provided with a door 513 to selectively open and close it. The door 513 opens when the substrate 501 is charged, and closes the slit 516 to prevent the loss of inert gas in the anti-hydration loading module unit 506.

The anti-hydration loading module unit 506 is injected with a dry gas, preferably an inert gas such as nitrogen. Accordingly, since the inside of the anti-hydration loading module unit 506 maintains the atmosphere of the inert gas, the water pressure is not present.

A roller for transferring the load lock chamber 507, the plurality of vacuum chambers 508, and the substrate 501 mounted on the carrier 503 in the deposition chamber 509 from the anti-hydration loading module unit 506. 512 is installed. The roller 512 tracks the anti-hydration loading module unit 506, the load lock chamber 507, the vacuum chamber 508, and the deposition chamber 509 as shown in FIG. 7A. A substrate roller for mounting on the carrier 503 a carrier roller 512a for movement and a substrate 501 charged from the substrate inlet 515 in the anti-hydration loading module portion 506 ( 512b).

In the anti-hydration loading module unit 506, the carrier roller 512a and the vertical transfer unit 514 for lifting and lowering the substrate roller 512b up and down are provided. The vertical transfer unit 514 is not limited to any structure as long as the structure can be moved up and down by a lifting means such as a cylinder. In the anti-hydration loading module unit 506, the carrier roller 512a, the substrate roller 512b, and the vertical transfer unit 514 which lifts and lowers the substrate 501 to the carrier 503. Desorption is possible.

A first gate valve 504 is installed between the anti-hydration loading module unit 506 and the load lock chamber 507. A second gate valve 517 is provided between the load lock chamber 507 and the vacuum chamber 508. Accordingly, the load lock chamber 507 is loaded with the substrate 501 mounted on the carrier 503, and then the first gate valve 504 and the second gate valve 517 are loaded with the load-lock chamber. By shielding the interior of 507, the pressure in the load lock chamber 507 is adjusted to be similar to the pressure in the vacuum chamber 508.

The vacuum chamber 508 is provided with a plurality of gate valves, that is, a third gate valve 518, a fourth gate valve 520, and a fifth gate valve 521. The second chamber 508b, the third chamber 508c, the fourth chamber 508d, and the fifth chamber 508e are partitioned. The vacuum chamber 508 can be vacuum-stored by being partitioned into a plurality of chambers (508a to 508e), and if any one of the chambers is abnormal, repair by blocking only the chamber with a gate valve It is done easily.

A vapor deposition chamber 509 is provided between the third chamber 508c and the fourth chamber 508d. A plurality of heaters 510 are provided in the third chamber 508c, the deposition chamber 509, and the fourth chamber 508d, and upper and lower separator plates 511 are provided. The substrate 501 mounted on the carrier 503 inserted through the anti-hydration loading module unit 506 is heated by the heater 510.

1, 2, and 4 of the conventional deposition apparatus (100, 200, 400) is heated to release the moisture adsorbed from the carrier and the substrate to increase the internal pressure of the vapor deposition chamber, which is the discharged moisture through the vacuum pump at the bottom of the chamber This is a phenomenon that occurs because of the emission.

In this embodiment, since the upper and lower separation plates 511 separating the deposition chamber 509 are installed, vacuum pumping is performed separately toward the upper transfer part. In this case, the moisture discharged from the substrate 501 or the carrier 503 does not move to the lower portion of the deposition chamber 509 where deposition is performed, and is exhausted so that the moisture pressure inside the deposition chamber 509 is not increased. The heaters 510 are respectively installed in vertical spaces separated by the upper and lower separating plates 511, and the heaters 510 may replace the upper and lower separating plates.

In the deposition chamber 509, a target portion, for example, a plasma or electron beam source 522 is provided to form a protective layer on the substrate 501, and a furnace is located near the plasma or electron beam source 522. 523 is provided, the raw material of the protective film layer, such as MgO deposited on the substrate 501 can melt and evaporate the raw material of the protective film layer on the furnace 523 by the plasma or electron beam source 522. have.

The operation of the apparatus 500 for depositing the passivation layer having the above configuration will be described with reference to FIGS. 5, 6A to 6C, and FIGS. 7A and 7B.

First, as shown in FIG. 6A, the substrate 501 is charged through the slit 516 at the substrate inlet 515. In this case, since the carrier 503 is not carried out to the substrate inlet 515, only the substrate 501 is transferred, not transferred like the substrate 501. In the anti-hydration loading module unit 506, the carrier 503 on the roller 512 is raised by the vertical transfer unit 514.

Subsequently, as illustrated in FIG. 6B, a substrate 501 loaded through the substrate inlet 515 is mounted on the carrier 503. After the substrate 501 is charged, the slit 516 is sealed by the door 513 to maintain the inside of the anti-hydration loading module unit 506 at a positive pressure. When the substrate 501 mounted on the carrier 503 enters the load lock chamber 507, as shown in FIG. 6C, the vertical transfer part 514 is lowered.

The process of mounting the substrate 501 on the carrier 503 is anti-hydration with the substrate 501 supported on the substrate roller 512a through the slit 516 as shown in FIG. 7A. When charged into the loading module unit 506, the carrier roller 512a supporting the carrier 503 is lifted by the vertical transfer unit 514.

At this time, the carrier 503 is formed in a rectangular frame shape, the substrate 501 is formed of a plate glass, the lower surface of the substrate 501 is supported by a substrate roller 512a, the carrier 503 The lower surface of) is supported by the carrier roller 512a, and can act independently of each other.

Next, as shown in FIG. 7B, the lower surface of the substrate 501 transferred by the substrate roller 512a is seated on the upper surface of the carrier 503 supported by the elevated carrier roller 512a. When the substrate 501 is seated on the carrier 503, the substrate roller 512b is lowered to the lower space of the anti-hydration loading module unit 506 by the vertical transfer unit 514.

Accordingly, the substrate 501 is mounted on the carrier 503, and the carrier 503 can be transferred into the load lock chamber 507 by a carrier roller 512a. In addition, the substrate roller 512b is moved up and down only inside the anti-hydration loading module unit 506.

Next, the first gate valve 504 is opened, and the substrate 501 mounted on the carrier 503 is transferred into the load lock chamber 507 by the rotational movement of the carrier roller 512a. At this time, the inside of the load lock chamber 507 is to adjust the pressure corresponding to the first vacuum chamber 508a by using a vacuum pump.

Subsequently, the second gate valve 507 is opened, and the substrate 501 mounted on the carrier 503 passes through the first vacuum chamber 508a and the second vacuum chamber 508b, and the upper and lower separator 511. It passes through the upper space of the third vacuum chamber 508c, the deposition chamber 509, and the fourth vacuum chamber 508d separated by.

At this time, since a plurality of heaters 510 are provided in the upper spaces of the third vacuum chamber 508c, the deposition chamber 509, and the fourth vacuum chamber 508d, the substrate 501 mounted on the carrier 503 to be transferred. ) Will release moisture as it is heated. The heating temperature applied by the heater 510 is about 100 to 400 ° C, preferably about 250 ° C. The discharged water is quickly discharged to the outside through separate vacuum pumping from the upper space of the third vacuum chamber 508c, the deposition chamber 509, and the fourth vacuum chamber 508d.

Subsequently, the substrate 501 mounted on the carrier 503 returns while passing through the fifth chamber 508e to pass through the lower space of the fourth chamber 508d and the deposition chamber 509.

When the substrate 501 mounted on the carrier 503 is transferred to the lower space of the deposition chamber 509, the raw material of the protective layer is deposited on the substrate 501. Particles of the protective film layer, such as MgO deposited on the substrate 501 is evaporated by melting the raw material of the protective film layer on the furnace 523 by the plasma or electron beam source 522.

The substrate 501 mounted on the deposited carrier 503 is successively transferred to the lower space of the third chamber 508c, the second chamber 508b, and the first chamber 508a, and the second gate valve 517. Is opened, it is transferred to the load lock chamber 507, and after passing a cooling time of a predetermined time, is transferred to the anti-hydration loading module unit 506 by opening the first gate valve 504.

The substrate 501 mounted on the carrier 503 transferred to the anti-hydration loading module unit 506 may interact with the interaction of the carrier roller 512a and the substrate roller 512b by the vertical transfer unit 514. As a result, the anti-hydration loading module 506 is moved upward. Subsequently, the door 513 opens the slit 506, and the substrate 501 is taken out to the substrate inlet 515 by the substrate roller 512b.

As described above, the device for depositing the protective film layer of the present invention and the deposition method using the same can obtain the following effects.

First, since the carrier is not exposed to the atmosphere, the moisture pressure inside the deposition chamber does not increase even when used for a long time, thereby ensuring a certain quality of the deposited protective film layer.

Second, since the carrier does not increase the water pressure in the deposition chamber even after a certain time has elapsed, the maintenance period is long, thereby improving productivity.

Although the present invention has been described with reference to one embodiment shown in the drawings, this is merely exemplary, and those skilled in the art will understand that various modifications and equivalent other embodiments are possible therefrom. Therefore, the true technical protection scope of the present invention will be defined by the technical spirit of the appended claims.

Claims (18)

An anti-hydration module which is charged with a substrate from a substrate inlet and provides a space in which the substrate is mounted on a carrier; A load lock chamber connected to the anti-hydration module to maintain a vacuum; and A plurality of vacuum chambers connected to the load lock chamber and to which a substrate mounted on the carrier is transferred; A deposition chamber installed in the vacuum chamber; A target unit installed in the deposition chamber and configured to deposit the raw material of the protective film layer on the substrate; A transfer unit which is continuously installed in the anti-hydration module, the load lock chamber, the vacuum chamber, and the deposition chamber, and transfers the substrate mounted on the carrier; And a gate valve installed at the boundary between the anti-hydration module, the load lock chamber, the vacuum chamber, and the deposition chamber to selectively open and close each space. The anti-hydration module is an atmosphere of inert gas, Some of the vacuum chamber and the deposition chamber of the vacuum chamber is separated into a vertical space by the vertical separation plate, A device for depositing a protective film layer, characterized in that a heater for heating the substrate is installed in the space separated up and down. delete The method of claim 1, And a slit formed between the substrate inlet and the anti-hydration module to be selectively opened and closed by a door and providing a passage through which the substrate is inserted. The method of claim 1, And the vacuum chamber is divided into a plurality of chambers to maintain the vacuum in multiple stages. delete delete The method of claim 1, And the target portion deposits a passivation layer comprising a plasma or electron beam source and a furnace on which the raw material of the passivation layer is mounted. The method of claim 1, The transfer unit is a device for depositing a protective film layer comprising a carrier roller for transferring the carrier, the substrate roller for transferring the substrate. The method of claim 8, And the carrier roller is disposed continuously through the anti-hydration module, the load lock chamber, the vacuum chamber, and the deposition chamber. The method of claim 8, And the substrate roller is installed in the anti-hydration module. The method of claim 10, The anti-hydration module is a device for depositing a protective film layer, characterized in that the carrier roller and the vertical conveying unit for lifting and lowering the substrate roller is further installed. Loading the substrate into the anti-hydration module from the substrate inlet; and Mounting the loaded substrate on a carrier by a vertical transfer part; Transferring the substrate mounted on the carrier to a load lock chamber; Passing the substrate mounted on the carrier through a plurality of vacuum chambers; Depositing a protective film layer on the substrate by a target unit in a deposition chamber between the chambers; And removing the substrate on which the passivation layer is deposited, via the vacuum chamber, the load lock chamber, and anti-hydration. The interior of the anti-hydration module maintains the atmosphere of inert gas When passing through a part of the chamber and the deposition chamber provided therebetween, the heater installed therein is heated to evaporate the moisture on the substrate mounted on the carrier, And a portion of the chamber and a top and bottom separator in the deposition chamber to discharge the evaporated water from the substrate mounted on the carrier passing through the upper space to the outside. The method of claim 12, And the substrate is loaded into the anti-hydration module through a slit provided between the substrate inlet and the anti-hydration module. The method of claim 12, In the step of mounting the substrate on the carrier, Raising a carrier supported by a carrier roller toward the substrate; Seating on a lower surface of an edge of a substrate on an upper surface of the carrier; A substrate roller supporting the substrate is lowered to be separated from the substrate; And And transporting the carrier on which the substrate is mounted by a carrier roller. delete The method of claim 12, And in the load lock chamber, the substrate mounted on the carrier is transferred, and then the gate valve is closed to adjust the pressure corresponding to the pressure in the adjacently communicated vacuum chamber. delete delete

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