KR100894152B1 - Optical device based planar light waveguide circuit and manufacturing method thereof - Google Patents

Abstract

The present invention relates to an optical device based on a flat plate optical circuit connected with an optical fiber and a method of manufacturing the same.

The optical device of the present invention includes a flat panel optical circuit, a main substrate and a connecting substrate. In the flat optical circuit, an optical waveguide connected to an optical fiber is formed at an upper portion, and an active element is formed on the optical waveguide. The main substrate provides driving power to an electrical pad formed on the flat panel optical circuit or the electrical pad formed on the active element, or provides a connection point for electrical connection of input / output signals. The connecting substrate forms a plurality of vias therein, and electrically connects the plurality of vias with solder balls or bumps to connect the electrical pads of the flat panel optical circuit with the connection points of the main substrate. According to the present invention, since the wire bonding formed on the flat panel optical circuit can be eliminated, expensive equipment such as wire bonder and skilled manpower are not required, and the difficulty in handling wires due to wire bonding is solved, thereby securing process stability. can do.

Wire Bonding, Flat Panel Optical Circuits, Optical Waveguides, Bumps, Soldering

Description

Optical device based on flat optical circuit and manufacturing method thereof {OPTICAL DEVICE BASED PLANAR LIGHT WAVEGUIDE CIRCUIT AND MANUFACTURING METHOD THEREOF}

1A is an exemplary diagram of an electrical connection structure in a flat plate optical circuit by wire bonding according to the prior art.

1B is an exemplary diagram of an electrical connection structure between a plate optical circuit and a substrate by wire bonding according to the related art.

2 is a diagram illustrating a structure of an optical device based on a flat plate optical circuit according to an embodiment of the present invention.

3A is a view illustrating a process of forming a via in a connection substrate in an optical device based on an optical fiber connected to an optical fiber according to an embodiment of the present invention.

FIG. 3B is a view illustrating a process of forming conductor pads on respective upper surfaces of vias in an optical device based on an optical fiber connected to an optical fiber according to an embodiment of the present invention.

3C is a view illustrating a process of forming solder balls or bumps on a conductor pad in an optical device based on an optical fiber connected flat panel according to an embodiment of the present invention.

4 is a view illustrating a process of forming solder balls or bumps on a main substrate in an optical device based on an optical fiber connected flat panel according to an embodiment of the present invention.

5A is a diagram illustrating a process of connecting a connection substrate to a flat plate optical circuit to which an optical fiber is connected according to an embodiment of the present invention.

FIG. 5B is a view illustrating a process of connecting a main substrate to a connection substrate in a process of forming an optical device based on a flat plate optical circuit in which an optical fiber is connected according to an embodiment of the present invention.

FIG. 6 is a diagram illustrating a structure of an optical device based on a flat plate optical circuit according to another embodiment of the present invention.

FIG. 7 is a diagram illustrating a structure of an optical device based on a flat plate optical circuit according to another embodiment of the present invention.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a planar optical waveguide (PLC) based optical device, and more particularly, to an optical waveguide based optical device and a method of manufacturing the same.

A flat panel optical circuit that integrates an optical element by stacking a core layer and a clad layer, which are optical signal transmission media on a semiconductor substrate, for the purpose of optical signal processing such as branching, modulation, switching, and signal multiplexing of optical signals. Much research is being done. A driving power source for driving an optical communication device or a semiconductor electrical device made of a flat panel optical circuit and an electrical connection for signal input / output are performed using wire bonding or wedge bonding techniques.

Therefore, such electrical connection requires expensive equipment such as wire bonder for wire bonding and wedge bonder for wedge bonding, and also requires highly skilled workers. In addition, because the thickness of the wires connected over the elements or between the substrate and the elements is less than a few mils (1/10 inch), very careful work must be done when the process is not automated. And for more diverse applications, wire usage can cause constraints.

At present, optical devices including all electronic devices are getting smaller but their performance is increasing. However, in particular, in the case of the optical device to be dealt with in the present invention, in the manufacture of the active optical device is generally implemented using the thio can (TO CAN) technology. This thiocan technology has been used a lot since the advent of active devices to maintain a stable technology and stable characteristics. However, although the wire bonding is done inside the thio can, there is a limit to the small size, and also many optical components are required for the packaging, and thus there is a limit to lower the cost of the product. The various applications of this is a difficult situation.

Hereinafter, with reference to FIGS. 1A and 1B, an example of an electrical connection structure in a flat panel optical circuit by wire bonding according to the prior art will be described.

FIG. 1A is an exemplary diagram of an electrical connection structure in a plate optical circuit by wire bonding according to the prior art, and FIG. 1B is an illustration of an electrical connection structure between a plate optical circuit and a substrate by wire bonding according to the prior art. It is also.

Referring to FIG. 1A, formed on the surface of a photo diode (hereinafter referred to as “PD”) 13 integrated on a planar optical circuit 1 in which an optical waveguide 20 is formed on a planar substrate 14. From the electric pad 16 formed on the surface of the electric pad 12 or the laser diode (hereinafter referred to as "LD") 15 to the electric pads 10L and 10R on the surface of the flat optical circuit 1 11) is connected to form a form of electrical connection with each other.

Referring to FIG. 1B, the wires 21 are connected to the electrical pads 18L and 18R of the main substrate 17 from the electrical pads 10L and 10R on the surface of the planar optical circuit 1 to be electrically connected to each other. have.

As shown in FIGS. 1A and 1B, the wire bonding process for connecting the electrical pads through the wires 11 and 21 is very inconvenient due to the optical fiber 19 connected to the flat panel optical circuit 1. have. In addition, there is a limit to working in a different order because of the optical fiber 19. Furthermore, the case work after the operation of Figure 1b or only the optical device after the operation of the optical device to proceed with the case, the problem that the height and width of the case should be made wider than necessary to prevent the short circuit of the wires (11, 21) Occurs.

Flat optical circuits have the advantage of being able to be made smaller in size compared to thiocan-based optical devices, but this also causes a problem that they cannot be manufactured in a stable packaging process as much as desired. In addition, the conventional flat-panel optical circuit manufactured by wire bonding has a disadvantage of covering the device using a case or a mold, and thus has a limitation in reducing its size in applications with general PCB (Printed Circuit Board) based products. have.

Accordingly, the present invention eliminates the inconvenience of the optical device manufacturing process, and can be easily manufactured using a general PCB technology, and the production cost can also be lowered in order to solve the conventional problems, and its optical device It provides a manufacturing method.

In order to achieve the above object, an optical device according to one feature of the present invention,

An optical element based on a flat plate optical circuit connected with an optical fiber,

A flat optical circuit having an optical waveguide connected to the optical fiber and having an active element formed on the optical waveguide; A main substrate providing driving power to an electrical pad formed on the flat panel optical circuit or an electrical pad formed on the active element or providing a connection point for electrical connection of an input / output signal; And a connecting substrate forming a plurality of vias therein and electrically connecting the plurality of vias to the connection points of the main pad and the electrical pad of the flat panel optical circuit using the solder balls or bumps.

Here, the conductive patterns are formed on the lower surfaces of the plurality of vias formed in the connecting substrate, and the lower surfaces of the respective conductive patterns are electrically connected to the electrical pads of the flat panel optical circuit through solder balls or bumps, respectively. It is done.

According to another aspect of the present invention,

An optical element based on a flat plate optical circuit connected with an optical fiber,

A flat optical circuit having an optical waveguide connected to the optical fiber and having an active element formed on the optical waveguide; And a main substrate providing a driving power to an electrical pad formed on the flat panel optical circuit or an electrical pad formed on the active element or providing a connection point for electrical connection of an input / output signal, using a solder ball or a bump. And electrically connect the connection point of the main pad and the electrical pad of the flat panel optical circuit.

Optical device manufacturing method according to another feature of the present invention,

A method of manufacturing an optical device based on a flat plate optical circuit connected to an optical fiber,

a) forming an optical waveguide connected to the optical fiber on top, and forming an active element on the optical waveguide to form a flat panel optical circuit, wherein an electrical pad is formed on the flat optical circuit; b) forming a connection substrate having a plurality of vias formed therein; c) electrically connecting the lower surfaces of the plurality of vias of the connection substrate and the electrical pads of the flat panel optical circuit using first solder balls or first bumps, respectively; And d) a connection point for supplying driving power to an electrical pad formed on the flat panel optical circuit or an electrical pad formed on the active element using a second solder ball or second bump, or for electrical connection of an input / output signal. Electrically connecting top surfaces of the plurality of vias of the connecting substrate, respectively.

Optical device manufacturing method according to another feature of the present invention,

A method of manufacturing an optical device based on a flat plate optical circuit connected to an optical fiber,

a) forming an optical waveguide connected to the optical fiber on top, and forming an active element on the optical waveguide to form a flat panel optical circuit, wherein an electrical pad is formed on the flat optical circuit; And b) using a first solder ball or a first bump to electrically drive the electrical pad of the flat panel optical circuit and a connection point for supplying driving power to the electrical pad of the flat panel optical circuit or for electrical connection of an input / output signal, respectively. Connecting.

DETAILED DESCRIPTION Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings so that those skilled in the art may easily implement the present invention. As those skilled in the art would realize, the described embodiments may be modified in various different ways, all without departing from the spirit or scope of the present invention. In the drawings, parts irrelevant to the description are omitted in order to clearly describe the present invention, and like reference numerals designate like parts throughout the specification.

Also. When a part is said to "include" a certain component, this means that it can further include other components, except to exclude other components unless specifically stated otherwise.

2 is a diagram illustrating a structure of an optical device based on a flat plate optical circuit according to an embodiment of the present invention.

As shown in FIG. 2, a planar optical circuit-based optical device according to an exemplary embodiment of the present invention includes a planar optical circuit 100 and a planar optical circuit 100 having an optical waveguide 102 formed on a planar substrate 101. The electrical pads 104 and 106 formed on the surfaces of the PD 103 and the LD 105 integrated thereon and the electrical pads 107 and 108 formed on the flat-panel optical circuit 100 are formed on the lower side of the main substrate 200. It consists of a connecting substrate 300 to be connected to the surface. At this time, the optical fiber 109 is connected to the optical waveguide 102 of the plate optical circuit 100.

Here, the connection substrate 300 is connected to the electrical pads 104, 106, 107, and 108 of the flat panel optical circuit 100 and the lower surface of the main substrate 200, and the upper surface of the connection substrate 200 therein. Vias 301, 302, 303 and 304 are physically formed so as to electrically connect the lower surface with each other, and the connection distance between the electrical pads is adjusted on the lower surface of each of the vias 301, 302, 303 and 304. Conductor pads 305, 306, 307, and 308 are formed respectively. At this time, the connection substrate 300 and the main substrate 200 may be a rigid or flexible PCB. Such substrates are generally used, and in the case of a PCB having reliability, it can be used. In addition, the insides of the vias 301, 302, 303, and 304 allow conductors to be deposited or plated to enable electrical connection. In addition, the heights of the conductor pads 305, 306, 307, and 308 are determined according to the heights of active elements such as the PD 103, the LD 105, and the like, which are integrated on the flat panel optical circuit 100. The conductor pads 305, 306, 307, and 308 may be manufactured by using a screen printing method or the like in a batch process when manufacturing a surface mount technology or a substrate.

Meanwhile, the conductive pads 305, 306, 307, and 308 formed on the lower surface of the connecting substrate 300 and the electrical pads 104, 106, 107, and 108 formed on the flat optical circuit 100 are solder balls or bumps 311. 312, 313, 314 are electrically connected. In addition, the upper surface of each of the vias 301, 302, 303, 304 of the connecting substrate 300 and the lower surface of the main substrate 200 are electrically connected by solder balls or bumps 201, 202, 203, and 204. . In this case, the size of the conductor pads 305, 306, 307, and 308 considers the adjacent distances between the conductor pads in order to reduce the influence from the penetration of solder or the like on the adjacent pads during the soldering process by solder balls or the die bonding process by bumps. The conductive pads must be kept clean and free of debris during the process so that the molten solder on the conductive pads does not spread elsewhere.

In addition, the lower surface of the main substrate 200 on which the solder balls or bumps 201, 202, 203, and 204 are formed may be used as driving power or input / output to the electrical pads 104, 106, 107, 108 of the flat panel optical circuit 100. An electrode or electrical pad (not shown) is provided for connecting the output signal.

On the other hand, when connecting the connection substrate 300 and the flat panel optical circuit 100, if the height of the solder ball or bumps (311, 312, 313, 314) can be adjusted, using the conductor pads (305, 306, 307, 308) Instead, the lower surface of the vias 301, 302, 303, and 304 of the connection board 300 and the electrical pad 104 of the planar optical circuit 100 may be formed using solder balls or bumps 311, 312, 313, and 314. , 106, 107, 108 may be connected directly.

The electrical connection path between the electrical pads 104, 106, 107, 108 and the main substrate 200 on the flat panel optical circuit 100 is as follows.

The electrical pad 107 on the flat panel optical circuit 100 may include a solder ball or bump 311, a conductor pad 305, a via 301 of the connecting substrate 300, and a solder ball or bump 201. Is connected to.

The electrical pads 104 formed on the PD 103 of the planar optical circuit 100 may include solder balls or bumps 312, conductor pads 306, vias 302 of the connecting substrate 300, and solder balls or bumps 202. It is connected to the main substrate 200 through.

The electrical pads 106 formed on the LD 105 of the planar optical circuit 100 may include solder balls or bumps 313, conductor pads 307, vias 303 of the connecting substrate 300, and solder balls or bumps 203. ) Is connected to the main substrate 200.

The electrical pads 108 on the flat-panel optical circuit 100 are connected to the main substrate 200 through solder balls or bumps 314, conductor pads 308, vias 304 of the connecting substrate 300, and solder balls or bumps 204. Is connected to.

Hereinafter, a method of manufacturing an optical device based on a flat plate optical circuit connected to an optical fiber according to an embodiment of the present invention will be described with reference to the accompanying drawings.

3 is a view illustrating a process of forming a connection substrate in an optical device based on an optical fiber connected to an optical fiber according to an embodiment of the present invention. FIG. 3A illustrates vias 301, 302, 303, FIG. 3B is a view illustrating a process of forming 304, and FIG. 3B illustrates a process of forming conductor pads 305, 306, 307, and 308 on upper surfaces of vias 301, 302, 303, and 304. 3C illustrates a process of forming solder balls or bumps 311, 312, 313, and 314 on the conductor pads 305, 306, 307, and 308.

Referring to FIG. 3A, a via hole penetrating through an upper surface and a lower surface of the connecting substrate 300 is formed to connect the flat panel optical circuit 100 and the main substrate 200, and then the inside of the conductor deposition or plating. To form vias 301, 302, 303 and 304. In this case, the via 301 corresponds to the position of the electrical pad 107 formed on the flat panel optical circuit 100, and the via 302 is formed on the PD 103 of the flat panel optical circuit 100. 104 corresponds to the position of the via 303 corresponds to the position of the electrical pad 106 formed on the LD 105 of the planar optical circuit 100, and the via 304 is positioned on the planar optical circuit 100. It should be formed to correspond to the position of the electrical pad 108 formed in the. Since the above-mentioned via hole and conductor deposition or plating method is performed by methods commonly used in the art, detailed description thereof is omitted here.

Next, referring to FIG. 3B, conductor pads 305, 306, 307, and 308 are formed on the upper surfaces of the vias 301, 302, 303, and 304 of the connection substrate 300 formed in FIG. 3A, respectively. At this time, the conductor pad 305 is formed on the top surface of the via 301, the conductor pad 306 is formed on the top surface of the via 302, and the conductor pad 307 is the top surface of the via 303. Is formed at the top surface of the via 304. The conductive pads 305, 306, 307, and 308 may also be formed through a commonly used method, and may be formed by, for example, a surface mounting technique or a screen printing method. Here, the heights of the conductive pads 305, 306, 307, and 308 may be formed by passing the conductive pads 305, 306, 307, and 308 through the solder balls or bumps 311, 312, 313, and 314 into the electrical pads of the planar optical circuit 100. When connected to (104, 106, 107, 108), respectively, it is determined to be in close contact with each other without a gap. That is, the heights of the electric pads 104 and 106 formed on the PD 103 and the LD 105 among the electric pads 104, 106, 107 and 108 formed in the flat panel optical circuit 100 are the flat panel optical circuit 100. The height of the conductor pads 305, 308 corresponding to the electrical pads 107, 108 is higher than the height of the electrical pads 107, 108 formed directly on the conductor pad 306 corresponding to the electrical pads 104, 106. , 307 is formed higher than the height.

Next, referring to FIG. 3C, solder balls or bumps 311, 312, 313, and 314 are formed on the surfaces of the conductive pads 305, 306, 307, and 308 of the connection substrate 300 formed in FIG. 3B. At this time, the solder ball or bump 311 is formed on the surface of the conductor pad 305, the solder ball or bump 312 is formed on the surface of the conductor pad 306, the solder ball or bump 313 is the conductor pad 307 ) And a solder ball or bump 314 is formed on the surface of the conductor pad 308. Here, the solder ball is for the soldering process, the bump is for the die bonding process, it can be formed using a surface mounting technique or a plating technique. Conventional methods other than these may be used to form solder balls or bumps. In addition, the technical scope of the present invention is not limited thereto, and may be replaced with a stud bump of Au (Ag, Ni, etc.) instead of solder balls or bumps.

4 is a view illustrating a process of forming solder balls or bumps on a main substrate in an optical device based on an optical fiber connected flat panel according to an embodiment of the present invention.

Referring to FIG. 4, solder balls or bumps 201, 202, 203, and 204 are formed on the upper surface of the main substrate 200. In this case, the solder ball or bump 201 is formed to correspond to the position of the via 301 of the connection board 300, and the solder ball or bump 202 corresponds to the position of the via 302 of the connection board 300. The solder ball or bump 203 is formed to correspond to the position of the via 303 of the connecting substrate 300, and the solder ball or bump 204 corresponds to the position of the via 304 of the connecting substrate 300. Is formed. In addition, the solder ball is for the soldering process, the bump is for the die bonding process, it can be formed using a surface mounting technique or a plating technique. Conventional methods other than these may be used to form solder balls or bumps. In addition, the technical scope of the present invention is not limited thereto, and may be replaced with a stud bump of Au (Ag, Ni, etc.) instead of solder balls or bumps.

5 is a view illustrating a process of forming an optical device based on a flat plate optical circuit connected to an optical fiber according to an embodiment of the present invention. FIG. 5A is a view illustrating a process of connecting a connection substrate to a flat plate optical circuit, and FIG. 5B. Is a diagram illustrating a process of connecting a main substrate to a connecting substrate.

Referring to FIG. 5A, after the connecting substrate 300 manufactured through the process of FIG. 3C is positioned on the flat plate optical circuit 100, the conductor pads 305, 306, 307, and 308 formed on the connecting substrate 300 are positioned. ) Are aligned so that they are positioned over the electrical pads 104, 106, 107, 108 formed on the flat panel optical circuit 100. At this time, the conductor pads 305 formed on the connection substrate 300 are aligned to match the positions of the electric pads 107 formed on the flat panel optical circuit 100, and the conductor pads 306 are arranged on the electric pads 104. The conductor pads 307 are aligned to match the position of the electrical pads 106, and the conductor pads 308 are aligned to match the position of the electrical pads 108.

Thereafter, the solder pads or bumps 311, 312, 313, and 314 formed on the conductor pads 305, 306, 307, and 308 of the connection board 300, respectively, are formed on the planar optical circuit 100. After aligning so as to be positioned on the surface of the 106, 107, 108, respectively, the conductive pads 305, 306, 307, 308 of the connecting substrate 300 is formed on the flat-panel optical circuit 100 through a soldering or die bonding process The electrical pads 104, 106, 107 and 108 are connected and fixed, respectively. At this time, if necessary, the connection substrate 300 may be fixed to the flat panel optical circuit 100 by applying downward pressure to the connection substrate 300 during the soldering process or the bonding process.

In the above-described process, since the position alignment process of each device and the connection fixing between the devices through the soldering process or the die bonding process are possible by a commonly used method, detailed descriptions will be omitted herein. Will be easily understood.

In addition, when a method such as soldering is used, multiple samples may be implemented by using a reflow method at the same time. Since a large amount of samples can be worked at once, there is a big advantage such as reduced production time and production cost.

In particular, according to the embodiment of the present invention, since the connection board 300 serves as an external case, a separate external case is not required, and thus the production cost can be lowered, and also no external case is required, so that the thickness or size It could be a new alternative to applications that are small in size and could not be used because of their size.

Next, referring to FIG. 5B, the main substrate 200 manufactured through FIG. 4 is positioned on the connection substrate 300 connected on the flat panel optical circuit 100 manufactured through FIG. 5A, and then the main substrate ( The solder balls or bumps 201, 202, 203, and 204 formed in the 200 are aligned to be positioned on the upper surfaces of the vias 301, 302, 303, and 304 formed in the connecting substrate 300, respectively. At this time, the solder balls or bumps 201 formed on the lower surface of the main substrate 200 are aligned to match the position of the vias 301 formed on the connection board 300, and the solder balls or bumps 202 are connected to the connection board 300. The solder balls or bumps 203 are aligned to match the position of the vias 302 formed on the connecting substrate 300, and the solder balls or bumps 204 are aligned to match the positions of the vias 303 formed on the connecting substrate 300. Aligned to match the location of via 304 formed in 300.

Thereafter, the solder balls or bumps 201, 202, 203, and 204 formed on the lower surface of the main substrate 200 are positioned to contact the upper surfaces of the vias 301, 302, 303, and 304 formed in the connecting substrate 300. After the connection, the lower surface of the main substrate 200 is connected to and fixed to the vias 301, 302, 303, and 304 formed on the connecting substrate 300 through soldering or die bonding. At this time, if necessary, the main substrate 200 may be connected and fixed to the connection substrate 300 by applying downward pressure to the main substrate 200 during the soldering process or the bonding process.

In the above-described process, since the position alignment process of each device and the connection fixing between the devices through the soldering process or the die bonding process are possible by a commonly used method, detailed descriptions will be omitted herein. Will be easily understood.

Through the above process, in the embodiment of the present invention, when manufacturing the optical device based on the optical fiber is connected to the optical device, instead of using a conductor wire to make an electrical connection between the device using a solder ball or bump, the size of the solder ball or bump Compared to the conductor wire, the area is larger, and thus the adhesion strength between the flat panel and the main board can be increased, thereby increasing the electrical and physical stability, and the size of the solder balls or bumps and the large size of the electrical pad of the flat panel. When attaching them, the process margin can be increased to increase productivity, and therefore, the high efficiency can be achieved at a low production cost.

Meanwhile, in the above, when connecting the connection board 300 and the flat panel optical circuit 100, the electric pads 104 and 106 formed on the flat panel optical circuit 100 using the conductor pads 305, 306, 307, and 308. , 107, 108 to compensate for the difference in height, but the technical scope of the present invention is not limited to this, as shown in Figure 6, the electrical pad 104 formed on the planar optical circuit 100, Conductor pads 305 and 306 by adjusting the heights of the solder balls or bumps 311, 312, 313, and 314 connecting the 106, 107, and 108 and the vias 301, 302, 303, and 304 formed in the connection substrate 300. The lower surface of the vias 301, 302, 303, and 304 of the connection substrate 300 using the solder balls or the bumps 311, 312, 313, and 314, and the planar optical circuit ( The electrical pads 104, 106, 107, 108 of the 100 may also be directly connected.

In addition, in the above, the configuration for electrically connecting the flat panel optical circuit 100 and the main substrate 200 using the connection substrate 300 has been described. However, the technical scope of the present invention is not limited thereto, and it is illustrated in FIG. 7. As shown in the drawing, the conductor pads 211 and 212 for height adjustment are additionally formed on the main substrate 200 without using the connection substrate 300 to directly connect the main substrate 200 to the flat optical circuit 100. It may also be connected to electrical pads 104, 106, 107, 108 formed thereon. More specifically, the solder balls or bumps 201 of the main substrate 200 corresponding to the electric pads 107 and 108 requiring height adjustment among the electric pads 104, 106, 107 and 108 formed on the flat panel optical circuit 100. And forming conductive pads 211 and 212 on 204 and solder balls or bumps 213 and 214 for connection with electrical pads 107 and 108 on the conductive pads 211 and 212, respectively. The main substrate 200 may be directly connected to the electrical pads 104, 106, 107, and 108 formed on the flat panel optical circuit 100. Such a configuration will be readily understood by those skilled in the art when the detailed description is omitted, but the above description is made with reference to FIGS. 2 to 5. As such, by directly connecting the main substrate 200 and the flat panel optical circuit 100 without using the connection substrate 300, the thickness of the optical device may be greatly reduced. In addition, the number of substrates used can be reduced, leading to a reduction in production costs.

Although the present invention has been described with reference to the most practical and preferred embodiments, the present invention is not limited to the above-described embodiments, but includes various modifications and equivalents within the scope of the following claims.

According to the present invention, a soldering process for soldering a main board and a flat plate optical circuit through solder balls using a connection board having vias without wire bonding for power supply and signal input / output required for the active optical device of the flat panel optical circuit. Alternatively, by connecting through a die bonding process through bumps, electrical stability and process stability can be increased, and the size can be reduced since a case is not required.

In addition, by reducing the size, it can be used in a wide range of products, and can be used in a wider range, and does not require expensive equipment such as wire bonder, and also facilitates work in the process. This eliminates the need for qualified operators and lowers production costs.

Claims (16)

In the optical device based on the optical fiber connected to the optical fiber, A flat optical circuit having an optical waveguide connected to the optical fiber and having an active element formed on the optical waveguide; A main substrate providing driving power to an electrical pad formed on the flat panel optical circuit or an electrical pad formed on the active element or providing a connection point for electrical connection of an input / output signal; And A connection board forming a plurality of vias therein and electrically connecting the plurality of vias with solder balls or bumps to electrically connect the electrical pads of the flat panel optical circuit to the connection points of the main substrate. Optical device comprising a. The method of claim 1, Conductor patterns are formed on lower surfaces of the plurality of vias formed in the connection substrate, respectively. The lower surface of each conductor pattern is electrically connected to the electrical pad of the flat panel optical circuit through solder balls or bumps, respectively. Optical device, characterized in that. The method of claim 2, The height of the conductor pattern formed on the connecting substrate is determined according to the height of the electrical pad of the flat panel optical circuit. The method according to any one of claims 1 to 3, A plurality of vias formed in the connecting substrate is characterized in that the inside thereof is deposited or plated with a conductor to enable electrical connection. The method according to any one of claims 1 to 3, The connecting substrate and the main substrate is an optical device, characterized in that the rigid or flexible PCB (Printed Circuit Board). The method according to any one of claims 1 to 3, And a connection point of the main substrate is electrically connected to upper surfaces of the plurality of vias formed in the connection substrate through solder balls or bumps. The method of claim 1, And a lower surface of the plurality of vias formed in the connection substrate through solder balls or bumps, respectively, to the electrical pads of the flat panel optical circuit. In the optical device based on the optical fiber connected to the optical fiber, A flat optical circuit having an optical waveguide connected to the optical fiber and having an active element formed on the optical waveguide; And A main substrate providing driving power to an electrical pad formed on the plate optical circuit or an active pad formed on the active element or providing a connection point for electrical connection of an input / output signal Including, Electrical connection between the electrical pad of the plate optical circuit and the connection point of the main substrate using solder balls or bumps. Optical device, characterized in that. The method of claim 8, The first solder ball or the first bump is formed at each connection point of the main substrate, A conductor pattern and a second solder ball or a second bump are formed on a surface of the solder ball or the bump of the first solder ball or the first bump, and the surface of the conductor pattern. The connection points of the main substrates are electrically connected to the electrical pads of the flat panel optical circuit through the first solder balls or the first bumps and the second solder balls or the second bumps, respectively. Optical device, characterized in that. The method of claim 9, The formation of the conductor pattern and the second solder ball or the second bump is determined according to the height of the electrical pad of the flat panel optical circuit. In the method for manufacturing an optical element based on a flat plate optical circuit connected to the optical fiber, a) forming an optical waveguide connected to the optical fiber on top, and forming an active element on the optical waveguide to form a flat panel optical circuit, wherein an electrical pad is formed on the flat optical circuit; b) forming a connection substrate having a plurality of vias formed therein; c) electrically connecting the lower surfaces of the plurality of vias of the connection substrate and the electrical pads of the flat panel optical circuit using first solder balls or first bumps, respectively; And d) a connection point for supplying driving power to an electrical pad formed on the flat panel optical circuit or an electrical pad formed on the active element using a second solder ball or second bump, or for electrical connection of an input / output signal; Electrically connecting the top surfaces of the plurality of vias of the connecting substrate, respectively Optical device manufacturing method comprising a. The method of claim 11, B), Forming a plurality of via holes in the connection substrate; Depositing or plating a conductor inside the plurality of via holes to form the plurality of vias; Forming conductive pads on the bottom surfaces of the plurality of vias, respectively; And Forming the first solder ball or the first bump on each surface of the conductor pad Optical device manufacturing method comprising a. The method according to claim 11 or 12, wherein C), Positioning the first solder ball or the first bump formed on the connection substrate on the electrical pad of the flat panel optical circuit; And Soldering or die bonding the first solder ball or the first bump to electrically connect the lower surfaces of the plurality of vias of the connection substrate to the electrical pads of the flat panel optical circuit, respectively. Optical device manufacturing method comprising a. The method according to claim 11 or 12, wherein Step d), Forming each of the second solder balls or the second bumps at the connection points; Positioning the second solder ball or the second bump at a position of an upper surface of the plurality of vias of the connecting substrate; And Electrically connecting upper surfaces of the plurality of vias of the connection substrate and the connection points by performing soldering or die bonding on the second solder balls or the second bumps, respectively. Optical device manufacturing method comprising a. In the method for manufacturing an optical element based on a flat plate optical circuit connected to the optical fiber, a) forming an optical waveguide connected to the optical fiber on top, and forming an active element on the optical waveguide to form a flat panel optical circuit, wherein an electrical pad is formed on the flat optical circuit; And b) using a first solder ball or a first bump, electrically connecting a connection point for supplying a driving power to the electrical pad of the flat panel optical circuit or an electrical connection of an input / output signal and the electrical pad of the flat panel optical circuit, respectively. Steps to Optical device manufacturing method comprising a. The method of claim 15, B), Forming each of the first solder balls or the first bumps at the connection points; Forming a conductive pad on the solder balls or bumps of the first solder balls or the first bumps; Forming a second solder ball or a second bump on the conductor pad; Positioning the first solder ball or the first bump and the second solder ball or the second bump on the electrical pad of the flat panel optical circuit; And Electrically connecting the electrical pad and the connection point of the flat panel optical circuit by performing soldering or die bonding on the first solder ball or the first bump and the second solder ball or the second bump, respectively. Optical device manufacturing method comprising a.

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