KR100886367B1 - Super-thin semiconductor package and method for menufacture - Google Patents

Abstract

The present invention prevents short-circuits between adjacent leads when bonding a semiconductor package to a liquid crystal panel or a printed circuit board by preventing conductive foreign matters, etc. from cutting the semiconductor package from a film. The present invention relates to an ultra-thin semiconductor package and a method of manufacturing the same, wherein the amount of semiconductor package per unit area of the film is improved by removing the same. A base film mounted on a predetermined integrated circuit and corresponding to a cutting line region, and input / output leads connected to input / output pins of the integrated circuit on one side or both sides of the base film, respectively; Formed only in the inner region of the cutting line It is characterized by.

       LCD, TCP, Film, Lead, Cutting, Test, Blade

Description

Ultra-thin semiconductor package and its manufacturing method {SUPER-THIN SEMICONDUCTOR PACKAGE AND METHOD FOR MENUFACTURE}

1 is a plan view showing a state before a conventional tape carrier package is cut on a film.

2 is a plan view showing a state before the tape carrier package according to the present invention is cut on the film.

3 is a perspective view illustrating the tape carrier package after cutting in FIG. 2.

4 is a view showing the output lead portion during the test whether the tape carrier package according to the present invention.

<Explanation of symbols on main parts of the drawings>

1,2: film 10,20: TCP

11,21: base film 12,22: drive IC

14,24: Input lead 16,26: Output lead

The present invention relates to an ultra-thin semiconductor package, and more particularly, a short circuit between leads adjacent to each other in bonding a semiconductor package to a liquid crystal panel or a printed circuit board by preventing conductive foreign matters from being generated when cutting the semiconductor package from a film. The present invention relates to an ultra-thin semiconductor package and a method of manufacturing the same, wherein the production rate of the semiconductor package per unit area of the film is improved by removing the separate test area.

In general, ultra-thin semiconductor packages include chip-on-film (COF) and tape carrier packages (TCP), which are somewhat different from each other. However, since the overall structure is similar in that the semiconductor chip and the input / output leads are mounted on an insulating tape (or film), the following description will focus on TCP.

Integrated circuits (hereinafter referred to as 'IC') are packaged in order to apply video signals to the liquid crystal panel when manufacturing an LCD module, and TCPs with input / output leads are required on both sides. Such TCPs are printed circuit boards and liquid crystal panels. The liquid crystal panel is driven by supplying a signal supplied from the printed circuit board to data lines and gate lines of the liquid crystal panel.

FIG. 1 is a plan view showing a state before a conventional TCP is cut on a film. Although the TCP 10 in which the test unit 16c is formed only on the output lead 16 side is described as an example, the present invention is not limited thereto. For example, the test unit 16c may be formed on both the input lead side or the input / output lead side.

As shown in FIG. 1, a plurality of TCPs 10 are formed on the film 1 at predetermined intervals and individually cut along the cutting line c, and then a liquid crystal panel (not shown) and a printed circuit board (not shown). ), The drive IC 12 is mounted and the input / output leads 14 and 16 connected to the input / output pins (not shown) of the IC are formed of the base film 11 formed on both sides. Here, the base film 11 is a film corresponding to the cutting line c region, and distinguishes each individual TCP on the film 1.

The input leads 14 are formed inside of one side cutting line c on the base film 11, and an outer end thereof is connected to leads (not shown) on the printed circuit board to apply an external input signal from the printed circuit board. Is input to the IC 12.

The output leads 16 are formed on the other side of the base film 11 so that the outer ends thereof are connected to signal line leads (not shown) on the liquid crystal panel to apply a driving signal to the liquid crystal panel. The body portion 16a positioned in the inner base film 11 region of the c) and the line portion narrower than the body portion 16a and located near the cutting line c and the neck portion positioned on the cutting line c ( 16b) and a test section 16c extending from the neck section 16b and positioned in the outer region of the cutting line c. The test section 16c is connected to an IC by a test device (not shown). A test tag portion 16d is formed to test whether or not the pattern is defective.

In the conventional TCP 10 configured as described above, the probe of the TCP test apparatus (not shown) is not cut from the film 1, and the test tag portion 16d of the upper part of the input lead 14 and the output lead is not shown. Each of them is in contact with each other to test for IC defects and pattern defects, and after the test is individually cut along the cutting line (c) and connected to the liquid crystal panel and the printed circuit board.

However, a part of the output lead on the cutting line is dropped due to the friction between the cutter and the output lead (not shown), and the conductive foreign substances generated in this way are adsorbed onto the TCP by static electricity or the like and are loaded with the lead bonding device (not shown) together with the TCP. . As a result, when bonding the input / output leads of TCP to the leads on the adjacent printed circuit board or the liquid crystal panel, short circuit occurs due to conductive foreign matter generated during cutting, which causes a process defect.

On the other hand, the test unit formed by extending the output lead out of the cutting line to test whether the IC IC or pattern bad of TCP is not necessary after the test is removed because the cutting is removed, by forming such a test portion causes the overall cost of the film, There is also a problem that the throughput of TCP is reduced.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems of the prior art, and is not adjacent to each other in bonding a semiconductor package onto a liquid crystal panel and a printed circuit board by preventing conductive foreign matters from occurring when cutting the semiconductor package from a film. The purpose is to prevent a short circuit between the leads.

Another object is to improve the yield of the semiconductor package per unit area of the film by removing the separate test area.

In order to achieve the above object, the tape carrier package according to the present invention is a plurality of tape carrier package is formed on the film and is individually cut along the cutting line, the base film is mounted on a predetermined integrated circuit and corresponding to the cutting line area; And input / output leads connected to input / output pins of the integrated circuit on one side or both sides of the base film, respectively, wherein the input and output leads are formed only in the inner region of the cutting line.

In the method of manufacturing a tape carrier package according to the present invention, a method of manufacturing an ultra-thin semiconductor package which is formed on a plurality of films and is individually cut along a cutting line, the method comprising: forming a base film defined within a cutting line region; Forming input and output leads on the inside of the cutting line and mounting the integrated circuit such that the input and output leads and the input and output pins of the integrated circuit are connected to the base film, respectively; Cutting along the cutting line to separate the ultra-thin semiconductor package from the film.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2 is a plan view showing a state before the TCP according to the present invention is cut on the film, Figure 3 is a perspective view showing the TCP after cutting in Figure 2, the TCP 20 according to the present invention on the film (2) A plurality of substrates are formed and individually cut along the cutting line c to be connected to a liquid crystal panel (not shown) and a printed circuit board (not shown). The base film 21 on which a predetermined IC 22 is mounted and an input lead ( 24 and output leads 26.

Base film 21 is a film corresponding to the cutting line (c) region, and distinguishes each individual TCP on the film (2). The drive IC 22 for driving the liquid crystal panel is mounted at the center of the base film 21, and the drive IC includes a source drive IC and a gate drive IC.

The input leads 24 are formed inside one cutting line c on the base film 21. That is, the input leads 24 are not formed to extend to the outside of the cutting line c and are formed only in the inner base film 21 region. These input leads 24 are connected to the input pins (not shown) of the IC 22 and the outer ends thereof are connected to the leads on the printed circuit board to transfer the external input signal applied from the printed circuit board to the IC 22. Enter it.

The output leads 26 are formed inside the other cutting line c on the base film 21. That is, the output leads 26 are not formed to extend to the outside of the cutting line c and are formed only in the inner base film 21 region. In addition, the output leads 26 may be formed in various shapes. Preferably, the output leads 26 are narrower than the input leads 24 and are arranged at regular intervals as conductive metal plates in the longitudinal direction, which are arranged at intervals. This is because there are more output signals output through the output leads 26 than the input signals through, so that the number of output leads 26 is greater than the number of input leads 24. These output leads 26 are connected to output pins (not shown) of the IC 22 and the outer ends thereof are connected to signal line leads on the liquid crystal panel to apply a driving signal to the liquid crystal panel.

Referring to the manufacturing method and the test whether the TCP according to the present invention configured as described above are as follows.

       In the manufacturing method of the TCP which is formed on the film 2 and is cut along the cutting line (c) and connected to the liquid crystal panel and the printed circuit board, the inside of the TCP cutting line (c) on the base film 21 Input and output leads 24 and 26 are formed. Here, a bonding layer (not shown) is formed between the base film 21 and the input and output leads 24 and 26 to be bonded to each other. Then, the IC 22 is mounted in the center of the base film 21 so that the input and output leads 24 and 26 and the input and output pins are connected to each other, and along the cutting line c on the base film 21. Cut it. At this time, since the input and output leads 24 and 26 do not exist on the cutting line c, it is possible to prevent the generation of minute conductive foreign matters during cutting, so that the TCP 20 is connected to the printed circuit board or the liquid crystal panel. There is no short circuit between the leads during contact connection. The TCP 20 is cut off from the film 2 and then connected to the liquid crystal panel and the printed circuit board. Accordingly, the TCP input leads 24 are connected to the leads on the printed circuit board to input the external input signal applied from the printed circuit board to the IC 22, and the output leads 26 are connected to the signal line on the liquid crystal panel. Connected to the light emitting device to apply a driving signal to the liquid crystal panel.

       On the other hand, the TCP 20 formed on the film 2 is a probe (not shown) of the TCP test apparatus (not shown) in the uncut state, respectively, on the upper portions of the input lead 24 and the output lead 26. The contact is tested for IC failure and pattern failure. At this time, since the line width of the output leads 26 is narrower than that of the input leads 24, the output lead 26 of TCP is preferably as shown in FIG. 4. Signals are transmitted to a comparator (not shown) by a plurality of blades 30 respectively disposed in a shape corresponding to the upper portion of the tops of the output leads 26, and the comparator receives signals input from the blades 30. It compares with the normal data input in advance to determine whether or not bad.

Although the tape carrier package and the manufacturing method thereof according to the present invention have been described with reference to the illustrated drawings, the present invention is not limited by the embodiments and drawings disclosed herein, and various modifications by those skilled in the art within the scope of the technical idea of the present invention. Of course this can be done. Particularly, in the embodiment of the present invention, the input / output leads are applied to the TCP formed on both sides of the base film, respectively, but the input / output leads may be applied to a chip on film (Chip On Film; COF) structure. It is self-evident.

According to the ultra-thin semiconductor package of the present invention and the manufacturing method as described above has the following effects.

First, by eliminating the test area outside the cutting line of the conventional output lead, the overall LCD module process is improved, and the amount of semiconductor package per unit area of the film is improved to reduce the cost.

Second, since the input and output leads of the semiconductor package are formed only in the inner region of the cutting line, it is possible to prevent the generation of minute conductive foreign matters during cutting, so that the short circuit between the leads when the semiconductor package is in contact with the printed circuit board or the liquid crystal panel. There is also an advantage that does not occur.

Third, regardless of the form or type of the test tag of the conventional output lead can be connected to the output lead through the same type of blade, there is also an advantage that the connection is improved by being connected to the upper front side of the output lead.

Claims (3)

     In the ultra-thin semiconductor package is formed on a plurality of films and individually cut along the cutting line, A base film for mounting a predetermined integrated circuit and corresponding to a cutting line area; An input / output lead connected to input / output pins of the integrated circuit on one side or both sides of the base film, respectively; The ultra-thin semiconductor package, characterized in that the input and output leads are formed only in the inner region of the cutting line.        The method of claim 1,       Ultra-thin semiconductor, characterized in that a plurality of blade-type probe is arranged on the upper lead of any one or more of the input lead and output lead, and is connected to the upper front portion of the lead by the probe to check the failure of the ultra-thin semiconductor package package.        In the manufacturing method of the ultra-thin semiconductor package is formed on the film in plurality and individually cut along the cutting line,        Forming a base film defined within the cutting line region;        Forming input and output leads on the base film and inside the cutting line;        Mounting an integrated circuit on the base film such that the input and output leads and the input and output pins of the integrated circuit are respectively connected;        Cutting along the cutting line to separate the ultra-thin semiconductor package from the film.

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