KR100884327B1 - Thermocouple device and substrate processing apparatus - Google Patents

Abstract

The present invention relates to a thermocouple adjusting apparatus for chemical vapor deposition apparatus for stably supporting the thermocouple.

The TC line 160 includes an upper tension bar 164 having a lower connection point 164a, a lower tension bar 167 having an upper connection point 167a, and upper and lower tension bars 164 and a lower tension. It is elastically installed with an elastic member 165 interposed between the bars 167 and elastically connected, and the upper tension bar 164, the elastic member 165, and the lower tension bar 167 are installed in the central tube 140. A lower TC 130 connected to the lower flange 130 and an upper TC connected to the heater plate 100 through the ceramic disk 110; The upper tension bar 164, the elastic member 165, the lower tension bar 167 is installed in the cylindrical metal tube 163 to the outside of the center tube 140, the upper portion of the upper tension bar 164 is the metal cover 166 It consists of a second T.C line 162 installed by 168).

Thermocouple, Control Line, Chemical Vapor Deposition System.

Description

Thermocouple Device and Substrate Processing Equipment {THERMOCOUPLE DEVICE AND SUBSTRATE PROCESSING APPARATUS}

1 is a schematic diagram of a conventional chemical vapor deposition apparatus,

Figure 2a, 2b is an exploded perspective view of a heater support having a thermocouple control device of the chemical vapor deposition apparatus of the present invention,

Figure 3a, 3b is an excerpt cross-sectional view of the thermocouple control device of the chemical vapor deposition apparatus of the present invention,

4 is a cross-sectional view of a heater support to which a thermocouple control device of the chemical vapor deposition apparatus of the present invention is applied,

5 is a perspective view of a heater support to which a thermocouple adjusting device of the chemical vapor deposition apparatus of the present invention is applied,

6 is a cross-sectional view of the chemical vapor deposition apparatus to which the thermocouple control device of the chemical vapor deposition apparatus of the present invention is applied.

※ Explanation of codes for main parts of drawing

160: control line, 161, 162: first, second T.C line, 163: metal tube,

164: upper tension bar, 164a: connection point, 165: elastic member, 166: metal cover,

167: lower tension bar, 167a: lower tension bar, 168: metal cover, 169: adjustment screw, 170: fixing screw.

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermocouple control device and an equipment for chemical vapor deposition using the same. In particular, a thermocouple control device is newly provided and the control device is protected from contaminated gas. The present invention relates to a thermocouple connection line (hereinafter referred to as a control line) and a chemical vapor deposition apparatus using the same.

A generally known chemical vapor deposition apparatus is shown in FIG. 1 of the accompanying drawings.

That is, the chamber lid 20 forming the upper cover of the chamber 10 and having a block plate 22 and a shower head 24 therein, a chamber body 30 forming the chamber below, and the Gas inlet and outlet 40 and 50 formed between the chamber body 30 and the chamber lead 20, the heater plate 100, the upper flange 120, the lower flange 130, the central tube ( 140, the power line 150, which is drawn out from the lower flange 130 to the upper flange 120 and connected to the heater plate 100, TC line 160, bellows (60) , Consisting of a support (70).

The heater support of the conventional chemical vapor deposition apparatus is deteriorated by the contaminated gas or the rear heating chamber structure, causing deformation of the heater support, sagging of other power lines and TC lines, and consequently poor connection. It inhibits uniform deposition or sustained processes in the chamber under control.

In order to cope with the deformation of the heater support and damage to the parts, the power line installed in the heater support, as well as the temperature of each part of the heater, are also deteriorated due to deterioration or damage. It must be.

In order to control the temperature of the heater plate in the chamber, the TC line for measuring the heater temperature has a problem in that the connection part is separated due to the minute up and down movement of the chamber, or the connection part is struck downward when connected horizontally. .

SUMMARY OF THE INVENTION An object of the present invention is to provide a thermocouple control device for a chemical vapor deposition apparatus in which a T.C line is provided with an elastic control line that can cope with fine position movement such as downward rotation or elevating of a heater support in a chamber.

It is also an object of the present invention to provide a thermocouple control device in which the T.C line and its control line are protected from deterioration by pollutant gas and reflected heat in the chamber.

Another object of the present invention is to provide a chemical vapor deposition apparatus to which the T.C line control device is elastically responded to a predetermined position movement as well as being protected from pollution gas and deterioration.

Thermocouple control device of the chemical vapor deposition apparatus of the present invention for achieving the above object of the present invention,

The bent portion (A) of the T.C line installed vertically between the upper and lower flanges,

An upper tension bar having a lower connection point, a lower tension bar forming an upper connection point, an elastic member installed at each connection point between the upper and lower tension bars and the lower tension bar, and a chemical vapor structure elastically supported as an adjustment screw to control the same. It is achieved as a thermocouple regulator of the deposition apparatus.

The T.C line of the thermocouple control device of the chemical vapor deposition apparatus of the present invention for achieving the above object of the present invention is characterized by being separated into a first T.C line, a second T.C line and covered with ceramic.

The first T.C line of the thermocouple control device of the chemical vapor deposition apparatus of the present invention for achieving the above object of the present invention is preferably carried by the upper and lower tension bar and the elastic member inserted into the central tube.

The second T.C line of the thermocouple control device of the chemical vapor deposition apparatus of the present invention for achieving the above object of the present invention, the upper and lower tension bar, the ceramic tube body is loaded with the elastic member, and the bent portion (A) It is preferably supported as a ceramic cover.

Chemical vapor deposition apparatus of the present invention for achieving the above object of the present invention,

A ceramic disk coupled to a heater plate, an upper flange attached to a bottom surface of the ceramic disk and having mounting grooves formed thereon, a lower flange positioned below the upper flange, and connected between the upper and lower flanges. Cylindrical central tube,

Power lines drawn from the lower flange to the upper flange and connected to the heater plate; and an upper tension bar having a lower connection point at a bent portion A of the TC line vertically installed between the upper and lower flanges; Upper and lower flanges, a center tube, and a power line, including a lower tension bar having an upper connection point, and a thermocouple adjusting device elastically supported as an elastic member which is installed at each connection point between the upper and lower tension bars and the lower tension bar. , TC line, and control line is covered with ceramic, and the TC line is stably supported.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

2A is an exploded perspective view of a heater support in which the thermocouple control apparatus of the chemical vapor deposition apparatus of the present invention is implemented, and FIG. 2B is an exploded perspective view of a heater support in which the thermocouple control apparatus of the chemical vapor deposition apparatus of the present invention is implemented. 3a is a cross-sectional view of the thermocouple control device of the first T.C line of the chemical vapor deposition apparatus of the present invention, Figure 3b is a cross-sectional view of the thermocouple control device of the second T.C line of the chemical vapor deposition device of the present invention, Figure 4 Is a cross-sectional view of the thermocouple control device of the second T.C line of the chemical vapor deposition apparatus of the present invention.

Thermocouple control device 160 of the chemical vapor deposition apparatus of the present invention according to the drawings,

The first T.C adjusting line consisting of the upper tension bar 164, the lower tension bar 167, the elastic member 165 and the adjustment screw 169, the upper tension bar 164, and the lower tension bar ( 167, the elastic member 165, the metal tube 163, the metal cover 166, 168, and the second T.C adjusting line consisting of the adjusting screw (169).

In detail, the first T.C line 161 and the second T.C line 162 are each covered with ceramic, and the first T.C control line is installed inside the central tube 140. The second T.C control line is installed on the outer side of the 140.

The first and second T.C control lines 160 have a common upper tension bar 164 having a lower connection point 164a, a lower tension bar 167 having an upper connection point 167a, and the upper, Elastic support as an elastic member 165 which is installed at each connection point 164a and 167a between the lower tension bar 164 and the lower tension bar 167 and an adjustment screw 169 which is elastically adjusted at the lower flange 130. do.

That is, the first T.C line 161 is supported by the upper and lower tension bars 164 and 167 and the elastic member 165 inserted into the central tube 140, the second T.C line 162. The upper and lower tension bars 164 and 167 are supported by the metal tube 163 into which the elastic member 165 is inserted, and the metal covers 166 and 168 holding the bent portion A, respectively. The TC lines 161 and 162 adjust the elastic force by adjusting the adjusting screw 169 to the bottom of the lower flange 130.

Meanwhile, fixing screws 170 are used to assemble and fix the metal covers 166 and 168 or the lower flange 130.

5 is a perspective view of a heater support of a chemical vapor deposition apparatus to which the thermocouple control device of the present invention is applied, and FIG. 6 is a cross-sectional view of a chemical vapor deposition apparatus to which the thermocouple control device of the present invention is applied.

Chemical vapor deposition apparatus using the thermocouple control device of the present invention according to the drawings,

The ceramic disk 110 coupled to the heater plate 100, the upper flange 120 is fixed to the bottom surface of the ceramic disk 110, the mounting grooves 122, 123 are formed, and the upper flange 120 And a lower flange 130 positioned below and corresponding to the upper and lower flanges 120 and 130, and a cylindrical central tube 140 connected between the upper and lower flanges 120 and 130, and the upper portion from the lower flange 130. TC lines 161 and 162 which are drawn out to the flange 120 and are vertically installed between the power lines 150 connected to the heater plate 100 and the upper and lower flanges 120 and 130. It consists of a thermocouple control line 160 to elastically support them.

In this configuration, the chemical vapor deposition apparatus of the present invention covers the upper, lower flange, the center tube, the power line, the T.C line, and the control line with ceramic and stably supports the thermocouple (or T.C line).

The thermocouple control device of the chemical vapor deposition apparatus of the present invention made as described above has a bent portion (A) of the first T.C line 161 vertically installed between the upper and lower flanges (120, 130) of the central tube (140). The upper tension bar 164, which is inserted into the lower connection point 164a, the lower tension bar 167 forming the upper connection point 167a, and the upper and lower tension bars 164 and the lower tension bar 167. Is elastically supported as an elastic member 165 which is installed at each of the connection points 164a and 167a, and an adjustment screw 169 is screwed onto the lower flange 130 to adjust the elastic force.

In addition, the second T.C line 162 may include an upper tension bar 164 having a lower connection point 164a, a lower tension bar 167 having an upper connection point 167a, and upper and lower tension bars 162. An elastic member 165 installed at each connection point 164a and 167a between the 164 and the lower tension bar 167, and a metal tube 163 into which the upper and lower tension bars 164 and 167 are loaded; The bent portion A of the second T.C line 162 may be supported as the metal covers 166 and 168.

Therefore, even if the support member 70 of the entire lower flange 130 has a flow of fine up and down movement such as rotation operation, the contacts of the TC lines 161 and 162 are elastically connected to detect the temperature of each part of the heater plate. This is stably detected.

As described above, the thermocouple control device of the chemical vapor deposition apparatus of the present invention is suitably elastically supported by the contacts of the TC lines 161 and 162 even when the microfluidic device flows in a fine up and down motion such as the rotation of the heater support. Each part temperature is stably detected.

In addition to the new control device for supporting the T.C line, the T.C line is also protected from deterioration due to polluted gases and reflected heat inside the chamber.

According to the present invention, the means for protecting the TC line from deterioration is determined, and the temperature of the heater plate can be stably maintained by flexibly responding to any micro-flow of the entire chemical vapor deposition apparatus through a control device for stably supporting the TC line. To provide a chemical vapor deposition apparatus is detected.

Claims (5)

Heater plate; A thermocouple having one end in contact with the heater plate and measuring a temperature of the heater plate through the one end; And And an upper tension bar having one end in contact with the thermocouple and pressurizing the thermocouple through the one end to bring the end of the thermocouple into close contact with the measurement object. The method of claim 1, The thermocouple has a bent portion substantially parallel to the radial direction of the heater plate, One end of the upper tension bar is in contact with the bent portion substrate processing apparatus. The method of claim 1, The substrate processing apparatus further includes an elastic member for providing an elastic force to the upper tension bar, The upper tension bar is a substrate processing apparatus for pressing the thermocouple by the elastic force. delete A thermocouple having an end in contact with a measurement object and measuring a temperature of the measurement object through the one end; And And an upper tension bar having one end in contact with the thermocouple, and pressurizing the thermocouple through the one end to bring one end of the thermocouple into close contact with the measurement object. And the thermocouple has a bent portion substantially perpendicular to the upper tension bar, wherein one end of the upper tension bar is in contact with the bent portion.

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