JPH10260155A - Sensor device - Google Patents

Sensor device

Info

Publication number
JPH10260155A
JPH10260155A JP9085907A JP8590797A JPH10260155A JP H10260155 A JPH10260155 A JP H10260155A JP 9085907 A JP9085907 A JP 9085907A JP 8590797 A JP8590797 A JP 8590797A JP H10260155 A JPH10260155 A JP H10260155A
Authority
JP
Japan
Prior art keywords
sensor
temperature
gas
gas sensor
detecting element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9085907A
Other languages
Japanese (ja)
Other versions
JP3633745B2 (en
Inventor
Takashi Usami
貴司 宇佐見
Katsuhiko Horii
克彦 堀井
Hideaki Yagi
秀明 八木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP08590797A priority Critical patent/JP3633745B2/en
Publication of JPH10260155A publication Critical patent/JPH10260155A/en
Application granted granted Critical
Publication of JP3633745B2 publication Critical patent/JP3633745B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To provide a compact sensor device by which a heating type gas sensor and a temperature sensor can be housed together. SOLUTION: A sensor fitting metal 42 holds a gas sensor 20 and a temperature sensor 18 in approximate parallel with the supporting direction of a probe pipe 14, so that the width of a sensor device 10 is hardly made large even when the gas sensor 20 is arranged apart from the temperature sensor 18. In this case, since the gas sensor 20 is arranged a specified distance apart from the temperature sensor 18, the sensor 18 receives no influence of temperature in the gas sensor 20 heated by a heater.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は、センサ装置に関
し、特に、酸素濃度、湿度等をヒータを内蔵するガスセ
ンサにて測定すると共に、該ガスセンサを温度補正する
ための温度測定用の温度センサを備えるセンサ装置に関
するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sensor device, and more particularly, to a sensor device for measuring a concentration of oxygen, a humidity, and the like with a gas sensor having a built-in heater and a temperature sensor for temperature correction of the gas sensor. The present invention relates to a sensor device.

【0002】[0002]

【従来の技術】従来技術に係るガス濃度及び温度を測定
する測定装置について、図7(A)を参照して説明す
る。ガスセンサ120と温度センサ130とは、絶縁性
のセンサ台座140に配置され、該センサ台座140
は、金属パイプ114の先端に配設された接続金具11
6に取り付けられている。また、該測定装置には、ガス
センサ120と温度センサ130との防塵用のカバー1
50が配設されている。かかる構成においては、ガス濃
度と温度とが一台の測定装置にて測定することができ
る。
2. Description of the Related Art A measuring apparatus for measuring gas concentration and temperature according to the prior art will be described with reference to FIG. The gas sensor 120 and the temperature sensor 130 are disposed on an insulating sensor pedestal 140, and the sensor pedestal 140
Is the connection fitting 11 provided at the tip of the metal pipe 114.
6 attached. In addition, the measurement device includes a dustproof cover 1 for the gas sensor 120 and the temperature sensor 130.
50 are provided. In such a configuration, the gas concentration and the temperature can be measured by one measuring device.

【0003】現在、酸素濃度の測定等、例えば、工場等
におけるガスボイラの排気ガス中の酸素濃度を測定し、
空燃比を制御する場合、或いは、高温下で湿度を測定す
る場合、パン工場で加熱釜中の湿度を調整する場合等
に、ジルコニア等の固定電解質センサが用いられてい
る。かかる固定電解質のセンサは、高温下の活性状態に
おいてのみ測定が可能であるため、ヒータ等の加熱装置
を付加し500°C〜800°C程度の設定温度まで加
熱して用いている。また、固定電解質のセンサは、被測
定雰囲気の温度により出力値が偏位するため、正確に測
定を行うためには、該雰囲気の温度を測定して温度補正
を行う必要がある。
At present, the oxygen concentration in the exhaust gas of a gas boiler in a factory or the like is measured, for example, by measuring the oxygen concentration.
A fixed electrolyte sensor such as zirconia is used for controlling the air-fuel ratio, measuring humidity at a high temperature, or adjusting the humidity in a heating pot at a bread factory. Such a fixed electrolyte sensor can be measured only in an active state at a high temperature. Therefore, a heating device such as a heater is added and the sensor is heated to a set temperature of about 500 ° C. to 800 ° C. before use. Further, since the output value of a fixed electrolyte sensor deviates depending on the temperature of the atmosphere to be measured, it is necessary to measure the temperature of the atmosphere and perform temperature correction in order to perform accurate measurement.

【0004】[0004]

【発明が解決しようとする課題】ここで、上記加熱の必
要なガスセンサと、該ガスセンサにて測定した値を温度
補正するための温度測定用のセンサとを図7(A)に示
すように一台のセンサ装置に取り付けたとすると、加熱
されたガスセンサからの熱的影響を受けて、温度センサ
が適切に周囲雰囲気の温度を測定できなくなる。このた
め、本発明者は、図7(B)に示すようにガスセンサ2
20と温度センサ130とを距離的に離して配置するこ
とを案出した。しかしながら、このようにしてガスセン
サ220及び温度センサ130を配置すると、センサ装
置が大型化するという課題が発生する。
As shown in FIG. 7A, a gas sensor which needs to be heated and a temperature measuring sensor for correcting the value measured by the gas sensor are temperature-controlled. If the temperature sensor is attached to one of the sensor devices, the temperature sensor cannot properly measure the temperature of the surrounding atmosphere due to the thermal influence from the heated gas sensor. For this reason, the present inventor has proposed the gas sensor 2 as shown in FIG.
It has been devised to dispose the distance 20 and the temperature sensor 130 at a distance. However, arranging the gas sensor 220 and the temperature sensor 130 in this manner causes a problem that the sensor device becomes large.

【0005】本発明は、上述した課題を解決するために
なされたものであり、その目的とするところは、加熱式
のガスセンサと温度センサとを同時に収容し得るコンパ
クトな構成のセンサ装置を提供することにある。
SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problem, and an object of the present invention is to provide a sensor device having a compact configuration capable of simultaneously housing a heating-type gas sensor and a temperature sensor. It is in.

【0006】[0006]

【課題を解決するための手段】本発明は、上記目的を達
成するため、請求項1のセンサ装置では、加熱用のヒー
タを内蔵するガス濃度又は湿度の少なくとも一方を測定
する測定素子と、 前記測定素子を温度補正するための
温度検出素子と、前記測定素子と前記温度検出素子とを
保持する保持部材と、前記保持部材を被測定雰囲気中に
延在させて支持する支持部材と、を有するセンサ装置で
あって、前記保持部材が、前記測定素子と前記温度検出
素子とを、前記支持部材による支持方向とほぼ平行であ
って、且つ、所定距離離間させて保持すること技術的特
徴とする。
According to the present invention, in order to achieve the above object, the sensor device according to the first aspect has a measuring element for measuring at least one of a gas concentration and a humidity, which has a built-in heater for heating. A temperature detecting element for correcting the temperature of the measuring element, a holding member that holds the measuring element and the temperature detecting element, and a supporting member that extends and supports the holding member in the atmosphere to be measured. In a sensor device, a technical feature is that the holding member holds the measurement element and the temperature detection element substantially parallel to a support direction of the support member and at a predetermined distance. .

【0007】また、請求項2のセンサ装置では、請求項
1において、前記測定素子と前記温度検出素子との離間
距離は、50mm以上であることを技術的特徴とする。
According to a second aspect of the present invention, there is provided a sensor device according to the first aspect, wherein a separation distance between the measuring element and the temperature detecting element is 50 mm or more.

【0008】また、請求項3のセンサ装置では、請求項
1又は2において、前記保持部材は、筒状に形成され、
前記温度検出素子を内部に保持していることを技術的特
徴とする。
According to a third aspect of the present invention, in the first or second aspect, the holding member is formed in a cylindrical shape.
A technical feature is that the temperature detecting element is held inside.

【0009】請求項1の発明では、保持部材が測定素子
と温度検出素子とを保持しているため、測定素子と温度
検出素子との交換が容易である。また、測定素子と温度
検出素子が所定距離離間されているため、ヒータにて加
熱された測定素子の温度の影響を温度検出素子が受ける
ことがない。更に、保持部材が、測定素子と温度検出素
子とを保持部材の支持方向とほぼ平行に保持しているた
め、測定素子と温度検出素子と離間して配置しても、セ
ンサ装置の幅が広がることがない。ここで、保持部材
は、絶縁部材等を介して測定素子と温度検出素子を保持
することも、また、測定素子と温度検出素子を直接保持
することもできる。更に、保持部材は、複数の部材から
構成されていてもよい。
According to the first aspect of the present invention, since the holding member holds the measuring element and the temperature detecting element, it is easy to exchange the measuring element and the temperature detecting element. Further, since the measuring element and the temperature detecting element are separated from each other by a predetermined distance, the temperature detecting element is not affected by the temperature of the measuring element heated by the heater. Further, since the holding member holds the measuring element and the temperature detecting element substantially parallel to the supporting direction of the holding member, the width of the sensor device is widened even if the measuring element and the temperature detecting element are arranged apart from each other. Nothing. Here, the holding member can hold the measuring element and the temperature detecting element via an insulating member or the like, or can directly hold the measuring element and the temperature detecting element. Further, the holding member may be composed of a plurality of members.

【0010】請求項2の発明では、測定素子と温度検出
素子とが50mm以上離されているため、ヒータにて加熱
される測定素子の温度の影響として温度検出素子が受け
る値が1°C以下となり、温度検出素子が正確に雰囲気
温度を測定できる。
According to the second aspect of the present invention, since the measuring element and the temperature detecting element are separated by 50 mm or more, the value received by the temperature detecting element as an effect of the temperature of the measuring element heated by the heater is 1 ° C. or less. Thus, the temperature detecting element can accurately measure the ambient temperature.

【0011】請求項3の発明では、筒状の保持部材が温
度検出素子を内部に保持しており、外部雰囲気に晒され
ることがないため、温度検出素子に故障が発生し難い。
According to the third aspect of the present invention, since the cylindrical holding member holds the temperature detecting element inside and is not exposed to the outside atmosphere, the temperature detecting element is unlikely to fail.

【0012】[0012]

【発明の実施の形態】以下、本発明のセンサ装置につい
て図を参照して説明する。図1は本実施形態のセンサ装
置を示す図であり、図中で一点鎖線の左側を切り欠いて
示している。本実施態様のセンサ装置10は、支持部材
であるプローブパイプ14の先端にセンサユニット12
が取り付けられ、後端に配線ケース52が取り付けられ
て成る。該プローブパイプ14としては、直径25mmで
長さ100〜1000mmのステンレスパイプを用いてい
る。該センサユニット12側の周囲には、ステンレスを
焼結させてなる多孔質の防塵用プロテクタ50が取り付
けられ、センサユニット12の先端に取り付けられてい
るガスセンサ20の保護が図られている。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a sensor device according to the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing a sensor device according to the present embodiment, in which the left side of the dashed line is cut away. The sensor device 10 of the present embodiment includes a sensor unit
Is attached, and a wiring case 52 is attached to the rear end. As the probe pipe 14, a stainless steel pipe having a diameter of 25 mm and a length of 100 to 1000 mm is used. Around the sensor unit 12 side, a porous dust-proof protector 50 made of sintered stainless steel is attached to protect the gas sensor 20 attached to the tip of the sensor unit 12.

【0013】センサ装置10は、排気ダクト内の酸素濃
度及び湿度を検出するため、該排気ダクトの壁面60に
設けられた通孔60aに該プローブパイプ14を挿通
し、排気ダクト内部にセンサユニット12を延在させ、
他方、排気ダクト外部側に配線ケース52が位置するよ
うに配設されている。該センサユニット12からの後述
するリード線は、該プローブパイプ14内を通って、配
線ケース52側まで引き込まれる。
The sensor device 10 inserts the probe pipe 14 into a through hole 60a formed in the wall surface 60 of the exhaust duct to detect the oxygen concentration and humidity in the exhaust duct, and the sensor unit 12 is inserted into the exhaust duct. Is extended,
On the other hand, the wiring case 52 is disposed outside the exhaust duct. A lead wire described later from the sensor unit 12 passes through the inside of the probe pipe 14 and is drawn into the wiring case 52 side.

【0014】図1中にサイクルCで示すセンサユニット
12を拡大して図2に示し、また、該プローブパイプ1
4から該センサユニット12を外した状態を図3に、更
に、図3に示すセンサユニット12の縦断面を図4に示
す。図3に示すように、センサユニット12は、先端部
に酸素濃度及び湿度を同時に検出する測定素子であるガ
スセンサ20が、セラミック等の絶縁体から成るガスセ
ンサ台座40を介して保持部材である筒状のセンサ取り
付け金具42に取り付けられている。該センサ取り付け
金具42は、ステンレスから成り上端にボルト部42b
が、ボルト部42bの下方にはネジ山42aが形成され
ている。
FIG. 2 is an enlarged view of the sensor unit 12 indicated by cycle C in FIG.
FIG. 3 shows a state in which the sensor unit 12 is removed from FIG. 4, and FIG. 4 shows a longitudinal section of the sensor unit 12 shown in FIG. As shown in FIG. 3, the sensor unit 12 is configured such that a gas sensor 20, which is a measuring element for simultaneously detecting oxygen concentration and humidity at the tip, is a cylindrical member that is a holding member via a gas sensor pedestal 40 made of an insulator such as ceramic. Is attached to the sensor mounting bracket 42. The sensor mounting bracket 42 is made of stainless steel and has a bolt portion 42b at the upper end.
However, a thread 42a is formed below the bolt portion 42b.

【0015】図4に示すように、センサユニットとし
て、該センサ取り付け金具42の内部には、セラミック
等の絶縁体から成る温度センサ台座46を介して温度測
定素子である温度センサ18が取り付けられている。該
温度センサは、検出精度の高い白金側温抵抗体から成
る。図中でDとして示すガスセンサ20から温度センサ
18までの距離は、約65mmに設定され、加熱されたガ
スセンサ20からの熱的影響を温度センサ18が受けな
いように構成されている。ガスセンサ20からのリード
線は、温度センサ台座46を介して外部へ引き出されて
いる。同様に温度センサ18からのリード線も該温度セ
ンサ台座46を介して引き出されている。このリード線
は、図1を参照して上述したようにプローブパイプ14
を介して配線ケース52まで引き出されている。
As shown in FIG. 4, as a sensor unit, a temperature sensor 18 as a temperature measuring element is mounted inside a sensor mounting bracket 42 via a temperature sensor pedestal 46 made of an insulator such as ceramic. I have. The temperature sensor is formed of a platinum-side temperature resistor having high detection accuracy. The distance between the gas sensor 20 and the temperature sensor 18 indicated by D in the figure is set to about 65 mm, and the temperature sensor 18 is configured so as not to be affected by the heat from the heated gas sensor 20. A lead wire from the gas sensor 20 is drawn out through a temperature sensor pedestal 46. Similarly, a lead wire from the temperature sensor 18 is also drawn out through the temperature sensor pedestal 46. This lead is connected to the probe pipe 14 as described above with reference to FIG.
Through the wiring case 52.

【0016】該センサ取り付け金具42の内部は、ガス
センサ台座40及び温度センサ台座46とによって気密
状態に保たれ、温度センサ18は、外部雰囲気に晒させ
ないように構成されている。従って、該温度センサ18
は、酸素濃度の測定を行っている被測定ガスの温度を直
接測定する訳ではないが、金属部分或いは空気部分を介
した熱伝導によってセンサ取り付け金具42も被測定ガ
スの温度と等しくなるため、温度センサ18は、被測定
ガス温度を正確に測定し、ガスセンサ20の測定値の温
度補正を適切に行うことができる。
The inside of the sensor mounting bracket 42 is kept airtight by a gas sensor pedestal 40 and a temperature sensor pedestal 46, and the temperature sensor 18 is configured not to be exposed to an external atmosphere. Therefore, the temperature sensor 18
Does not directly measure the temperature of the gas to be measured for which the oxygen concentration is measured, but since the sensor mounting bracket 42 becomes equal to the temperature of the gas to be measured by heat conduction through a metal portion or an air portion, The temperature sensor 18 can accurately measure the temperature of the gas to be measured, and appropriately correct the temperature of the measurement value of the gas sensor 20.

【0017】ここで、温度センサ18を構成する白金側
温抵抗体は、正確に温度を測定できる反面、比較的外部
からの機械的衝撃に弱いと共に、高湿度下で用いると、
配線に腐食が生じて故障し易い。このため、本実施態様
では、温度センサ18を気密構造のセンサ取り付け金具
内に収容し、機械的な外力が加わらないようにすると共
に、配線等に腐食を発生させないようにしてある。な
お、この実施態様では、温度センサとして白金側温度抵
抗体を用いているが、この代わりにサーミスタ、熱伝対
等種々の測温素子を用いることができる。
Here, the platinum-side temperature resistor constituting the temperature sensor 18 can accurately measure the temperature, but is relatively susceptible to external mechanical shock, and if used under high humidity,
Corrosion occurs in the wiring and it easily breaks down. For this reason, in this embodiment, the temperature sensor 18 is housed in a sensor mounting bracket having an airtight structure so that no mechanical external force is applied and corrosion is not generated in the wiring and the like. In this embodiment, a platinum-side temperature resistor is used as the temperature sensor, but various temperature measuring elements such as a thermistor and a thermocouple can be used instead.

【0018】この実施態様のセンサユニット12におい
ては、ガスセンサ20と温度センサ18とが一対で用い
られている。即ち、正確な測定を行う得るように、ガス
センサ20の特性と、温度センサ18との特性とを校正
するデータが、両センサからの出力に基づき酸素濃度及
び湿度を演算する演算回路(図示せず)中のメモリに保
持されており、ガスセンサ20或いは温度センサ18の
いずれが劣化した場合にもセンサユニット12ごと交換
を行い、この際には、該センサユニット12の特性に合
わせて単体調整されている演算回路を交換、又は、メモ
リ内の構成データを入れ替える。
In the sensor unit 12 of this embodiment, a gas sensor 20 and a temperature sensor 18 are used as a pair. That is, the data for calibrating the characteristics of the gas sensor 20 and the characteristics of the temperature sensor 18 are calculated by an arithmetic circuit (not shown) for calculating the oxygen concentration and the humidity based on the outputs from both sensors so that accurate measurement can be performed. If the gas sensor 20 or the temperature sensor 18 is deteriorated, the sensor unit 12 is replaced together. In this case, the sensor unit 12 is individually adjusted in accordance with the characteristics of the sensor unit 12. Replace the existing arithmetic circuit or replace the configuration data in the memory.

【0019】図5を参照して本実施態様に係るガスセン
サ20の構成について説明する。図5(A)は、ガスセ
ンサ20の斜視図であり、図5(B)は、図1に示すガ
スセンサ20のA−A断面図である。該ガスセンサ20
は、幅が約5mmで、高さが約20mmで、厚みが約1mmに
構成されている。ガスセンサ20は、タングステン製の
ヒータ線23を内蔵する3〜4Wのセラミックヒータ2
2の両面に、安定化ジルコニア板(固定電解質)24、
26が配設されて成る。該安定化ジルコニア板24に
は、多孔質の白金層から成る陽電極26A及び陰電極2
8Aが埋設されている。同様に、安定化ジルコニア板2
6側には、陽電極26B及び陰電極28Bが埋設されて
いる。そして、安定化ジルコニア板24側には、ガス出
口穴30A及びガス導入部32が穿設され、同様に、安
定化ジルコニア板26側には、ガス出口穴30B及びガ
ス導入部(図示せず)が穿設されている。
The configuration of the gas sensor 20 according to this embodiment will be described with reference to FIG. FIG. 5A is a perspective view of the gas sensor 20, and FIG. 5B is a cross-sectional view of the gas sensor 20 shown in FIG. The gas sensor 20
Has a width of about 5 mm, a height of about 20 mm, and a thickness of about 1 mm. The gas sensor 20 is a 3 to 4 W ceramic heater 2 having a built-in tungsten heater wire 23.
2, a stabilized zirconia plate (fixed electrolyte) 24,
26 are provided. The stabilized zirconia plate 24 has a positive electrode 26A and a negative electrode 2 made of a porous platinum layer.
8A is buried. Similarly, the stabilized zirconia plate 2
On the sixth side, a positive electrode 26B and a negative electrode 28B are embedded. A gas outlet hole 30A and a gas introduction part 32 are formed in the stabilized zirconia plate 24 side. Similarly, a gas outlet hole 30B and a gas introduction part (not shown) are formed in the stabilized zirconia plate 26 side. Are drilled.

【0020】このガスセンサ20は、ヒータ22によっ
て約500°Cまで加熱され、一方の安定化ジルコニア
板、例えば、安定化ジルコニア板24側にて、酸素濃度
に比例した限界電流値が得られる印加電圧値から酸素濃
度を測定すると同時に、他方の安定化ジルコニア板、例
えば、安定化ジルコニア板26側にて、水分子を分解し
た酸素濃度値から湿度を測定する。このガスセンサ20
の製造方法及び動作については、本出願人の出願に係る
特開平5−87773号公報中に詳細に述べられている
ため、ここでは説明を省略する。
The gas sensor 20 is heated to about 500 ° C. by a heater 22, and applied to one of the stabilized zirconia plates, for example, the stabilized zirconia plate 24, at which a limit current value proportional to the oxygen concentration is obtained. At the same time as measuring the oxygen concentration from the value, the other stabilized zirconia plate, for example, on the side of the stabilized zirconia plate 26, the humidity is measured from the oxygen concentration value obtained by decomposing water molecules. This gas sensor 20
Since the manufacturing method and operation of the present invention are described in detail in Japanese Patent Application Laid-Open No. Hei 5-87773 filed by the present applicant, the description is omitted here.

【0021】引き続き、図2を参照して本実施態様のセ
ンサユニット12の取り付け方法について説明する。プ
ローブパイプ14の先端には、中央にネジ山16aの穿
設された通孔16bを有する金属製の接続金具16が溶
接により取り付けられている。先ず、センサユニット1
2のリード線48を該接続金具16の通孔16bに挿通
する。そして、センサユニット12のセンサ取り付け金
具42のネジ山42aを、該通孔16b内のネジ山16
aにねじ込むことにより、該センサユニット12を固定
する。該センサユニット12を覆うように、プロテクタ
50を接続金具16のねじ山16cにねじ込む。他方、
該センサユニット12のリード線48を、図1に示す配
線ケース52内で演算回路側(図示せず)へ接続する。
この演算回路は、該センサユニット12に取り付けられ
ているガスセンサ20及び温度センサ18の特性に合わ
せて単体調整がなされている。
Next, a method of mounting the sensor unit 12 according to the present embodiment will be described with reference to FIG. At the tip of the probe pipe 14, a metal connection fitting 16 having a through hole 16b having a thread 16a formed at the center is attached by welding. First, the sensor unit 1
The second lead wire 48 is inserted into the through hole 16b of the connection fitting 16. Then, the screw thread 42a of the sensor mounting bracket 42 of the sensor unit 12 is replaced with the screw thread 16a in the through hole 16b.
The sensor unit 12 is fixed by screwing the sensor unit 12. The protector 50 is screwed into the thread 16c of the connection fitting 16 so as to cover the sensor unit 12. On the other hand,
The lead wire 48 of the sensor unit 12 is connected to the operation circuit side (not shown) in the wiring case 52 shown in FIG.
This arithmetic circuit is individually adjusted in accordance with the characteristics of the gas sensor 20 and the temperature sensor 18 attached to the sensor unit 12.

【0022】即ち、本実施態様では、上述したように、
ガスセンサ20又は温度センサ18が劣化した際、或い
は、所定運転時間が経過し定期交換する際には、該セン
サユニット12を新しい物に取り替えると共に、該新し
いセンサユニット12に合わせて単体調整された演算回
路へと取り替え、或いは、メモリ内の構成データを入れ
替える。
That is, in this embodiment, as described above,
When the gas sensor 20 or the temperature sensor 18 is deteriorated, or when a predetermined operation time elapses and the gas sensor 20 is periodically replaced, the sensor unit 12 is replaced with a new one, and a calculation which is individually adjusted according to the new sensor unit 12 is performed. Replace with a circuit or replace configuration data in the memory.

【0023】引き続き、ガスセンサ20と温度センサ1
8との配設距離Dと、熱的影響の関係について図6のグ
ラフを参照して説明する。この実験では、ガスセンサ2
0から温度センサ18までの距離を変えながら、温度セ
ンサ18側でのガスセンサ20からの熱的影響について
測定した。ここでは、上記実施態様のガスセンサ20の
ヒータ(3〜4W)に定格電流を流し、設定温度である
500°Cまで加熱し、また、温度センサ18にて15
0°C(ボイラの排気温度に対応)を測定した際の値を
示している。
Subsequently, the gas sensor 20 and the temperature sensor 1
The relationship between the disposition distance D with respect to No. 8 and the thermal effect will be described with reference to the graph of FIG. In this experiment, gas sensor 2
The thermal effect from the gas sensor 20 on the temperature sensor 18 side was measured while changing the distance from 0 to the temperature sensor 18. Here, a rated current is applied to the heater (3 to 4 W) of the gas sensor 20 of the above embodiment to heat it to the set temperature of 500 ° C.
It shows a value measured at 0 ° C. (corresponding to the exhaust temperature of the boiler).

【0024】グラフ中に示すように、150mm以上離す
ことにより、熱的影響を殆ど受けなく成ることが分かっ
た。また、50mm以上離せば、熱的影響が1°C以下、
即ち、測定温度が雰囲気温度+1°Cとなり、ガスセン
サ20の出力値の温度補正をほぼ正確に行い得ることが
判明した。このため、本実施態様の構成では、ガスセン
サ20と温度センサ18とを50mm以上離間させること
が望ましい。
As shown in the graph, it was found that when the distance was 150 mm or more, there was almost no thermal effect. Also, if the distance is more than 50 mm, the thermal effect is 1 ° C or less,
That is, it was found that the measured temperature was the ambient temperature + 1 ° C, and that the temperature correction of the output value of the gas sensor 20 could be performed almost accurately. Therefore, in the configuration of the present embodiment, it is desirable that the gas sensor 20 and the temperature sensor 18 be separated by 50 mm or more.

【0025】上記実施態様では、センサ取り付け金具4
2にガスセンサ20と温度センサ18との両方を保持す
るユニット構成としているため交換が容易である。ま
た、ガスセンサ20と温度センサ18とを65mm離間し
てあるため、ヒータにて加熱されたガスセンサ20の温
度の影響を温度センサ18が受けることがない。更に、
センサ取り付け金具42が、ガスセンサ20と温度セン
サ18とをプローブパイプ14の支持方向とほぼ平行に
保持しているため、図7(B)を参照した配置例と異な
り、ガスセンサ20と温度センサ18と離間して配置し
ても、センサ装置10の幅が広がることがない。
In the above embodiment, the sensor mounting bracket 4
2 is a unit configuration that holds both the gas sensor 20 and the temperature sensor 18 so that replacement is easy. Further, since the gas sensor 20 and the temperature sensor 18 are separated by 65 mm, the temperature sensor 18 is not affected by the temperature of the gas sensor 20 heated by the heater. Furthermore,
Since the sensor mounting bracket 42 holds the gas sensor 20 and the temperature sensor 18 substantially parallel to the direction in which the probe pipe 14 is supported, unlike the arrangement example shown in FIG. Even if they are spaced apart, the width of the sensor device 10 does not increase.

【0026】更に、筒状のセンサ取り付け金具42の内
部に温度センサ18を保持しているため、センサユニッ
ト12取り付けの際に、温度センサ18が他の部材と接
触して機械的衝撃を受けることが無い。また、ボイラ等
の高温多湿度、或いは、亜硫酸ガス等を含む腐食性の高
いガス中でも、外部雰囲気に晒されることがないため、
温度センサ18に腐食によって故障が発生しない。
Further, since the temperature sensor 18 is held inside the cylindrical sensor mounting bracket 42, when the sensor unit 12 is mounted, the temperature sensor 18 comes into contact with other members and receives a mechanical shock. There is no. Further, even in a high temperature and high humidity such as a boiler, or a highly corrosive gas including a sulfurous acid gas, the gas is not exposed to an external atmosphere.
No failure occurs in the temperature sensor 18 due to corrosion.

【0027】なお、この実施態様では、酸素濃度と湿度
とを同時に測定するガスセンサ20を例示したが、ガス
濃度のみ、或いは、湿度のみを検出するセンサにも本発
明を適用し得る。また、この例では、固定電解質のガス
センサ20により、酸素濃度を測定する場合を例に挙げ
たが、NOx、SOx等の濃度を測定する場合にも、本構
成を適用できる。また、この例では、固定電解質のガス
センサを用いたが、ヒータを備えるセンサであれば、例
えば、金属酸化物を用いる半導体式等のセンサにも本実
施態様の構成を適用できる。
In this embodiment, the gas sensor 20 for simultaneously measuring the oxygen concentration and the humidity is exemplified. However, the present invention can be applied to a sensor for detecting only the gas concentration or only the humidity. Further, in this example, the case where the oxygen concentration is measured by the gas sensor 20 of the fixed electrolyte is described as an example, but the present configuration can be applied to the case where the concentration of NOx, SOx, and the like is measured. Further, in this example, the gas sensor of the fixed electrolyte is used, but the configuration of the present embodiment can be applied to a sensor of a semiconductor type using a metal oxide, for example, as long as the sensor includes a heater.

【0028】更に、本実施態様では、センサ取り付け金
具42内に温度センサ18を収容したが、該温度センサ
18を外部に取り付けることも可能である。例えば、図
4に示ように温度センサ台座46から上方を指向して取
り付けられている温度センサ18を、該温度センサ台座
46から下方を指向させ、外部へ取り付けることも可能
である。また、本実施態様では、金属製のセンサ取り付
け金具42が、セラミック製のガスセンサ台座40、温
度センサ台座46を介してガスセンサ20及び温度セン
サ30を保持したが、該センサ取り付け金具42をセラ
ミックにより構成することで、ガスセンサ20及び温度
センサ30を直接保持することも可能である。
Further, in this embodiment, the temperature sensor 18 is housed in the sensor mounting bracket 42, but it is also possible to mount the temperature sensor 18 outside. For example, as shown in FIG. 4, the temperature sensor 18 attached upward from the temperature sensor pedestal 46 can be attached to the outside by pointing downward from the temperature sensor pedestal 46. Further, in this embodiment, the metal sensor mounting bracket 42 holds the gas sensor 20 and the temperature sensor 30 via the ceramic gas sensor pedestal 40 and the temperature sensor pedestal 46, but the sensor mounting bracket 42 is made of ceramic. Thus, the gas sensor 20 and the temperature sensor 30 can be directly held.

【0029】[0029]

【発明の効果】以上のように、請求項1の発明では、保
持部材が測定素子と温度検出素子とを一体的にユニット
方式で保持しているため、交換が容易である。また、測
定素子と温度検出素子とが所定距離離間されているた
め、ヒータにて加熱された測定素子の温度の影響を温度
検出素子が受けることがない。更に、保持部材が、測定
素子と温度検出素子とを支持部材の支持方向とほぼ平行
に保持しているため、測定素子と温度検出素子と離間し
て配置しても、センサ装置の幅が広がることがない。
As described above, according to the first aspect of the present invention, since the holding member integrally holds the measuring element and the temperature detecting element in a unit system, replacement is easy. Further, since the measuring element and the temperature detecting element are separated by a predetermined distance, the temperature detecting element is not affected by the temperature of the measuring element heated by the heater. Further, since the holding member holds the measuring element and the temperature detecting element substantially parallel to the supporting direction of the supporting member, the width of the sensor device is widened even if the measuring element and the temperature detecting element are arranged apart from each other. Nothing.

【0030】請求項2の発明では、測定素子と温度検出
素子とが50mm以上離されているため、ヒータにて加熱
される測定素子の温度の影響として温度検出素子が受け
る値が1°C以下となる。このため、温度検出素子が正
確に雰囲気温度を測定できるので、温度検出素子の測定
した雰囲気温度に基づいて測定素子の検出値を適切に補
正することが可能となる。
According to the second aspect of the present invention, since the measuring element and the temperature detecting element are separated from each other by 50 mm or more, the value received by the temperature detecting element as an effect of the temperature of the measuring element heated by the heater is 1 ° C. or less. Becomes For this reason, since the temperature detecting element can accurately measure the ambient temperature, it is possible to appropriately correct the detection value of the measuring element based on the ambient temperature measured by the temperature detecting element.

【0031】請求項3の発明では、筒状の保持部材が温
度検出素子を内部に保持しており、外部雰囲気に晒され
ることがないため、温度検出素子に故障が発生し難い。
また、取り付けの際に、該温度検出素子を他の部材等と
接触させることがない。
According to the third aspect of the present invention, since the cylindrical holding member holds the temperature detecting element inside and is not exposed to the outside atmosphere, the temperature detecting element is unlikely to fail.
Further, at the time of mounting, the temperature detecting element does not come into contact with other members or the like.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本実施形態のセンサ装置の一部を切り欠いて示
す説明図である。
FIG. 1 is an explanatory diagram showing a sensor device of the present embodiment with a part cut away.

【図2】図1のサイクルCを拡大して示す説明図であ
る。
FIG. 2 is an explanatory diagram showing a cycle C in FIG. 1 in an enlarged manner.

【図3】本実施形態のセンサユニットの側面図である。FIG. 3 is a side view of the sensor unit of the embodiment.

【図4】図3に示すセンサユニットの縦断面図である。FIG. 4 is a longitudinal sectional view of the sensor unit shown in FIG.

【図5】図5(A)は本実施態様のガスセンサの斜視図
であり、図5(B)は図5(A)のA−A断面を示す断
面図である。
FIG. 5A is a perspective view of a gas sensor according to the present embodiment, and FIG. 5B is a cross-sectional view taken along the line AA of FIG. 5A.

【図6】ガスセンサから温度センサまでの距離と温度差
との関係を示すグラフである。
FIG. 6 is a graph showing a relationship between a distance from a gas sensor to a temperature sensor and a temperature difference.

【図7】図7(A)は従来技術に係るセンサを示す断面
図であり、図7(B)はセンサ装置の一構成例を示す断
面図である。
FIG. 7A is a cross-sectional view illustrating a sensor according to the related art, and FIG. 7B is a cross-sectional view illustrating a configuration example of a sensor device.

【符号の説明】[Explanation of symbols]

10 センサ装置 12 センサユニット 14 プローブパイプ(支持部材) 20 ガスセンサ(測定素子) 30 温度センサ(温度測定素子) 40 ガスセンサ台座 42 センサ取り付け金具(保持部材) 46 温度センサ台座 48 リード線 Reference Signs List 10 sensor device 12 sensor unit 14 probe pipe (supporting member) 20 gas sensor (measuring element) 30 temperature sensor (temperature measuring element) 40 gas sensor pedestal 42 sensor mounting bracket (holding member) 46 temperature sensor pedestal 48 lead wire

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 加熱用のヒータを内蔵するガス濃度又は
湿度の少なくとも一方を測定する測定素子と、 前記測定素子を温度補正するための温度検出素子と、 前記測定素子と前記温度検出素子とを保持する保持部材
と、 前記保持部材を被測定雰囲気中に延在させて支持する支
持部材と、を有するセンサ装置であって、 前記保持部材が、前記測定素子と前記温度検出素子と
を、前記支持部材による支持方向とほぼ平行であって、
且つ、所定距離離間させて保持すること特徴とするセン
サ装置。
A measuring element for measuring at least one of a gas concentration and a humidity having a built-in heater for heating; a temperature detecting element for correcting the temperature of the measuring element; and the measuring element and the temperature detecting element. A sensor device comprising: a holding member for holding; and a supporting member that extends and supports the holding member in an atmosphere to be measured, wherein the holding member includes the measurement element and the temperature detection element, It is almost parallel to the support direction by the support member,
And a sensor device which is held at a predetermined distance.
【請求項2】 前記測定素子と前記温度検出素子との離
間距離は、50mm以上であることを特徴とする請求項1
に記載のセンサ装置。
2. The apparatus according to claim 1, wherein a distance between the measuring element and the temperature detecting element is 50 mm or more.
The sensor device according to claim 1.
【請求項3】 前記保持部材は、筒状に形成され、前記
温度検出素子を内部に保持していることを特徴とする請
求項1又は2に記載のセンサ装置。
3. The sensor device according to claim 1, wherein the holding member is formed in a cylindrical shape, and holds the temperature detecting element inside.
JP08590797A 1997-03-18 1997-03-18 Sensor device Expired - Fee Related JP3633745B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP08590797A JP3633745B2 (en) 1997-03-18 1997-03-18 Sensor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP08590797A JP3633745B2 (en) 1997-03-18 1997-03-18 Sensor device

Publications (2)

Publication Number Publication Date
JPH10260155A true JPH10260155A (en) 1998-09-29
JP3633745B2 JP3633745B2 (en) 2005-03-30

Family

ID=13871915

Family Applications (1)

Application Number Title Priority Date Filing Date
JP08590797A Expired - Fee Related JP3633745B2 (en) 1997-03-18 1997-03-18 Sensor device

Country Status (1)

Country Link
JP (1) JP3633745B2 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11194111A (en) * 1997-10-22 1999-07-21 Robert Bosch Gmbh Flat sensor element
US6849239B2 (en) 2000-10-16 2005-02-01 E. I. Du Pont De Nemours And Company Method and apparatus for analyzing mixtures of gases
KR100482490B1 (en) * 2002-05-16 2005-04-14 기아자동차주식회사 Air quality control sensor having temperature sensor for outside door as a one body
US6960476B2 (en) 2000-10-16 2005-11-01 E. I. Du Pont De Nemours And Company Method and apparatus for analyzing mixtures of gases

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11194111A (en) * 1997-10-22 1999-07-21 Robert Bosch Gmbh Flat sensor element
US6849239B2 (en) 2000-10-16 2005-02-01 E. I. Du Pont De Nemours And Company Method and apparatus for analyzing mixtures of gases
US6960476B2 (en) 2000-10-16 2005-11-01 E. I. Du Pont De Nemours And Company Method and apparatus for analyzing mixtures of gases
US8043566B2 (en) 2000-10-16 2011-10-25 E. I. Du Pont De Nemours And Company Method and apparatus for analyzing mixtures of gases
KR100482490B1 (en) * 2002-05-16 2005-04-14 기아자동차주식회사 Air quality control sensor having temperature sensor for outside door as a one body

Also Published As

Publication number Publication date
JP3633745B2 (en) 2005-03-30

Similar Documents

Publication Publication Date Title
EP3809126B1 (en) Combustible gas sensors with multiple active elements
EP0281378B1 (en) Electrochemical device having a heater
TWI388814B (en) Pirani vacuum gauge
JP2007248220A (en) Heat conductivity measuring method, its measuring instrument, and gas component ratio measuring instrument
JP4897354B2 (en) Gas detector
JP5373474B2 (en) Combustible gas detector
JP2011164087A (en) Gas sensor control device and gas sensor control method
JP3633745B2 (en) Sensor device
JP6350359B2 (en) Gas sensor
JP5166202B2 (en) Gas detector
JP5927647B2 (en) Gas detector
JP5091078B2 (en) Combustible gas detector
JPH05223764A (en) Furnace unit of differential scanning calorimeter
JP5021400B2 (en) Combustible gas detector
JP7187139B2 (en) Catalytic combustion gas sensor
JP3188752B2 (en) Pirani vacuum gauge
JPH05505886A (en) Device for continuously monitoring the concentration of gaseous components in a gas mixture
JP2604593Y2 (en) Gas sensor
JP3649544B2 (en) Gas analyzer
JPH084610Y2 (en) Oxygen sensor with heater
JP3161803B2 (en) Differential scanning calorimeter
JP2007155502A (en) Detector
JP3926949B2 (en) Oxygen sensor and electromotive force compensation method thereof
JPH0829385A (en) Oxygen concentration detection meter
JP2603633Y2 (en) Gas sensors and combustion appliances

Legal Events

Date Code Title Description
A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20040309

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040423

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20041207

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20041221

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20090107

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100107

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100107

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110107

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110107

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120107

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20120107

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130107

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130107

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20130107

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20140107

Year of fee payment: 9

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees