KR100879015B1 - Cullet remover for glass - Google Patents

Abstract

A substrate cleaning apparatus is disclosed. The substrate cleaning apparatus of the present invention includes at least one roll polishing unit for cleaning the surface of the substrate, wherein the at least one roll polishing unit is rotatably contacted and pressed to the surface of the substrate to form a surface of the substrate. A polishing roll for cleaning the; And a roll shaft coupled with the polishing roll such that the polishing roll can apply a substantially uniform pressure to the entire surface of the substrate. According to the present invention, the polishing roll can be uniformly pressed against the surface of the substrate, and the surface of the substrate can be cleaned with excellent quality.

Board, Glass Board, Panel, LCD, PDP, Surface, Cleaning, Cleaning, Polishing

Description

Substrate Cleaning Equipment {Cullet remover for glass}

1 is a view schematically showing an arrangement state between a roll polishing unit and a substrate in a substrate cleaning apparatus according to an embodiment of the present invention.

FIG. 2 is a schematic cross-sectional view of the first roll polishing unit shown in FIG. 1.

3 is a schematic front view of a substrate cleaning apparatus according to an embodiment of the present invention.

4 is a view schematically showing an arrangement state between a roll polishing unit and a dressing unit in a substrate cleaning apparatus according to an embodiment of the present invention.

* Explanation of symbols for the main parts of the drawings

1: device body 8: low friction cylinder

10,20,30,40: Roll polishing unit 11,21,31,41: Polishing roll

12,22,32,42: Shaft 13,23,33,43: Rotating drive part

51 ~ 54: Dressing unit 51a ~ 54a: Polishing blade

51b ~ 54b: Blade drive part 60,70: Up / down control unit

61,71: sensing unit 63,73: up / down driving unit

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cleaning apparatus, and more particularly, to a substrate cleaning apparatus capable of uniformly contact-pressing a polishing roll against a surface of a substrate and cleaning the surface of the substrate with excellent quality.

Substrates are used for flat panel displays (FPDs), semiconductors, such as liquid crystal displays (LCDs), plasma display panels (PDPs) and organic light emitting diodes (OLEDs). Wafer, glass for a photomask, etc. are pointed out.

Although a substrate as a flat panel display device (FPD) and a substrate as a semiconductor wafer are different from each other in terms of materials and uses thereof, a series of processing processes for the substrates, for example, exposure, development, etching, stripping, rinsing, Processes, such as cleaning, are substantially very similar, and these processes proceed sequentially to produce a substrate.

Thus, the substrates described below may be considered to be all-inclusive terms. However, for convenience of description, hereinafter, the LCD substrate will be described as a substrate among flat panel display devices (FPD).

LCD substrates are released to products through TFT process, Cell process and Module process.

The TFT process is very similar to the semiconductor manufacturing process, in which thin film transistors are arranged on a glass substrate by repeating deposition, photolithography, and etching.

The Cell process forms an alignment layer on the TFT bottom plate manufactured by the TFT process and the top plate which is a color filter so that the liquid crystals can be aligned well. The top and bottom plates are formed by corals and seal printing. It is a process of bonding.

The module process attaches a polarizing plate to a completed substrate, mounts an integrated circuit (Drive-IC), assembles it with a printed circuit board (PCB), and back-lights the unit with the back surface. Refers to a series of steps to assemble an appliance.

Meanwhile, in the module process, a process for cleaning the surface of the substrate is added before attaching the polarizer to the substrate. That is, as the previous processes proceed, the surface of the substrate is cleaned to remove (clean) foreign matter such as dust or debris that may remain on the surface of the substrate to make the surface of the substrate substantially completely mirrored.

At this time, the substrate cleaning apparatus simply cleans the surface of the substrate in such a manner that it presses and polishes the surface of the substrate directly from the work by spraying water. In this way, a method using a belt and a method using an abrasive cloth have been known.

Substrate cleaning apparatus using a belt is substantially superior in cleaning power because the belt is directly forced to the surface of the substrate to clean the surface of the substrate. In contrast, in the case of a substrate cleaning apparatus using an abrasive cloth, the cleaning power is known to be somewhat inferior to the substrate cleaning apparatus using a belt because the polishing cloth is only about passing through without being forcedly contacted with the surface of the substrate.

As described above, the substrate cleaning apparatus using the polishing cloth has a slightly lower cleaning power and the substrate cleaning apparatus using the belt has excellent cleaning power. However, even in the substrate cleaning apparatus using the belt, the apparatus and peripheral devices for driving the belt to operate the belt There is a problem that the structure is complicated. Particularly, particles may be generated due to belt driving.

As a result, the surface of the substrate is cleaned by the polishing roll by inserting the substrate between two rotating polishing rolls as a new method that overcomes the above problems and combines the advantages of the belt and the polishing cloth method. Research into a substrate cleaning apparatus has been conducted.

However, although the method of cleaning the surface of the substrate by the rotation of the polishing roll is superior to the belt and the polishing cloth method described above, the efficiency of cleaning of the substrate may be reduced without solving the expected problems as follows. Therefore, the following improvement is required.

That is, a roll shaft is coupled to the polishing roll to rotate the polishing roll. If the roll shaft is provided as a pair and simply coupled to both ends of the polishing roll, the polishing roll is uniform with respect to the substrate. Hard to pressurize. In other words, when such a structure is adopted to press both ends of the roll shaft toward the substrate, the surface of the polishing roll is not uniformly pressed against the substrate, and both regions of the polishing roll are in contact with the substrate and the center region thereof is removed from the substrate. You may be excited. In this case, both ends of the substrate are well cleaned, while the central region is not well cleaned, and thus it is difficult to uniformly clean the substrate, and thus an improvement is required.

An object of the present invention is to provide a substrate cleaning apparatus capable of uniformly contact-pressing a polishing roll against the surface of a substrate, and capable of cleaning the surface of the substrate with excellent quality.

The object comprises, according to the invention, at least one roll polishing unit for cleaning a surface of a substrate, the at least one roll polishing unit being rotatably contact-pressed to the surface of the substrate. A polishing roll for cleaning the surface of the substrate; And a roll shaft coupled with the polishing roll such that the polishing roll can apply a substantially uniform pressure to the entire surface of the substrate.

Here, the roll shaft is coupled to the central region between the center and both ends of the polishing roll while penetrating the inside of the polishing roll, respectively, both end regions of the polishing roll along the longitudinal direction of the polishing roll at both ends of the polishing roll. Each may be provided to be exposed in the opposite direction.

At least one fixed ring may be provided in the roll shaft to couple the roll shaft to the polishing roll, and the at least one fixing ring may prevent a release of the fixing ring. Can be combined.

O-rings may be coupled around the at least one fixing ring, and fixing nuts for fixing the polishing rolls and the roll shafts to both end regions of the polishing roll may be mounted.

The polishing roll may be made of a buffer material, and the roll shaft may be made of a rod-shaped metal material.

The apparatus may further include at least one dressing unit provided adjacent to the at least one roll polishing unit to process a surface of the polishing roll.

The at least one dressing unit may include: an abrasive blade provided to extend along a length direction of the polishing roll, and the tip of the polishing blade selectively contacts the surface of the polishing roll to polish the surface of the polishing roll; And a blade driving unit which approaches and spaces the polishing blade with respect to the polishing roll so that the front end of the polishing blade contacts the surface of the polishing roll.

At least one up / down adjustment unit (up / down) for independently up / down the roll polishing unit relative to the substrate based on the degree of wear on the surface of the polishing roll in contact with the surface of the substrate; down adjust unit) may be further included.

Each of the at least one up / down adjustment unit may include: a sensing unit configured to detect a relative distance of the roll polishing unit to the substrate based on the amount of wear of the polishing roll; An up / down drive unit coupled to the roll polishing unit; And a controller configured to control an operation of the up / down driver based on a detection result of the detector.

The sensing unit senses a relative distance between the pair of polishing rolls when the substrate enters between any one pair of polishing rolls and when the substrate is withdrawn from the pair of polishing rolls. The controller may determine the degree of wear of the pair of polishing rolls based on the relative spacing of the pair of polishing rolls, and then control the operation of the up / down driving unit.

The up / down driving unit may include a servo motor controlled by the controller; A pair of lifting and lowering shafts disposed in a direction intersecting with the motor shaft of the servomotor, and having an upper end coupled to a pair of roll shafts provided in any one of the roll polishing units to move up and down together with the roll polishing unit; And a power transmission unit converting the rotational motion of the servo motor into a vertical motion of the pair of lifting shafts and transmitting the linear motion.

The power transmission unit, a pair of coupling pieces are respectively coupled to the lower region of the pair of lifting and moving shaft; A horizontal bar which is moved by the servomotor in the direction of the motor shaft of the servomotor and is disposed at both ends of the pair of coupling pieces; And a camshaft provided at each end of the pair of coupling pieces and coupled to the inclined long hole respectively formed at both ends of the horizontal bar.

In order to fully understand the present invention, the operational advantages of the present invention, and the objects achieved by the practice of the present invention, reference should be made to the accompanying drawings which illustrate preferred embodiments of the present invention and the contents described in the accompanying drawings.

Hereinafter, the present invention will be described in detail by explaining preferred embodiments of the present invention with reference to the accompanying drawings. Like reference numerals in the drawings denote like elements.

1 is a view schematically showing an arrangement state between a roll polishing unit and a substrate in a substrate cleaning apparatus according to an embodiment of the present invention, FIG. 2 is a schematic cross-sectional view of the first roll polishing unit shown in FIG. 1, FIG. 3 is a schematic front view of a substrate cleaning apparatus according to an embodiment of the present invention, and FIG. 4 schematically illustrates an arrangement state between a roll polishing unit and a dressing unit in the substrate cleaning apparatus according to an embodiment of the present invention. Drawing.

As shown in these figures, the substrate cleaning apparatus according to the present embodiment includes a device polishing apparatus 1 and a roll polishing unit 10, 20, 30, 40 coupled to the apparatus body 1. And dressing units 51 to 54 and up / down adjust units 60 and 70. These configurations are explained in full detail.

As shown in FIG. 2, the apparatus main body 1 is a part which forms the outer frame of the present substrate cleaning apparatus. In the present embodiment, since only the roll polishing units 10, 20, 30, 40, dressing units 51-54 and up / down adjusting units 60, 70 are shown in FIG. It is also shown locally. However, the device body 1 is considered to be organically coupled with the peripheral devices in addition to those shown in FIG. 1.

Referring briefly to FIG. 3, the apparatus body 1 includes vertical plates 1a and 1b that occupy most surfaces, and horizontal plates 2 arranged horizontally on both sides of upper ends of the vertical plates 1a and 1b. , The outer frame (3) is provided long in the vertical direction at both end regions of the vertical and horizontal plates (1a, 1b, 2).

The vertical plates 1a and 1b serve as a place for supporting the up / down adjusting units 60 and 70 and the low friction cylinder 8 as the buffer tuning member 8 to be described later. The horizontal plate 2 is used as a portion through which the first and second lifting movement shafts 65 and 75 to be described later pass. Therefore, the horizontal plate 2 is provided with a plurality of through holes, for convenience of drawing a plurality of through the reference numerals will be omitted.

The roll polishing units 10, 20, 30, and 40 are portions which come into contact with the substrate G to clean the surface of the substrate G. Here, the cleaning is considered to include all of the concepts of washing, cleaning, polishing, and the like.

In the present embodiment, a total of four roll polishing units 10, 20, 30, and 40 are provided. That is, four are provided up and down and back and front with the board | substrate G of a washing | cleaning object interposed. Of the four roll polishing units 10, 20, 30, 40, two (10, 30) located on the upper side of the substrate (G) are the upper surfaces of the substrate (G) and two located on the lower side of the substrate (G). The dog (20, 40) cleans the lower surface of the substrate (G). Therefore, the cleaning efficiency can be maximized in less time.

However, since the scope of the present invention is not limited thereto, two roll polishing units 10, 20, 30, and 40 may be provided or six or more. In addition, one roll polishing unit 10, 20, 30, 40 may be provided. As such, when one roll polishing unit 10, 20, 30, 40 is provided, only one surface of both surfaces of the substrate G may be cleaned.

In the following description, for convenience of description, the four roll polishing units 10, 20, 30, and 40 will be described as first to fourth roll polishing units 10, 20, 30, and 40, respectively. Reference numerals are also distinguished accordingly.

Of the four roll polishing units 10, 20, 30, 40, the first and second roll polishing units 10, 20 are paired, and the third and fourth polishing units 30, 40 are paired. To achieve. At this time, the first and second roll polishing units 10 and 20 and the third and fourth polishing units 30 and 40 are spaced apart from each other with a space between the substrates G interposed therebetween.

Since the configuration of each of the first to fourth roll polishing units 10, 20, 30, and 40 is substantially the same, in the following description, the first and second roll polishing units 10 and 20 will be described with reference to FIGS. 1 and 3. ) Will be described in detail, and the remaining third and fourth roll polishing units 30 and 40 will apply mutatis mutandis to the configuration and operation of the first and second roll polishing units 10 and 20 as they are.

Each of the first and second roll polishing units 10 and 20 is rotatably contact-pressed to both surfaces of the substrate G to clean the surface of the substrate G. , polishing rolls, first and second roll shafts 12 and 22 supporting the first and second polishing rolls 11 and 21, and either side of the first and second roll shafts 12 and 22. And first and second rotational drives 13 and 23 coupled to the first and second rotational shafts 12 and 22 to independently rotate the first and second roll shafts 12 and 22, respectively.

The first and second polishing rolls 11 and 21 are portions which are forcibly contacted and pressed to the upper and lower surfaces of the substrate G, and the upper and lower surfaces of the substrate G are actually the third and fourth roll polishing units. In addition to 30 and 40, the first and second polishing rolls 11 and 21 are cleaned. Therefore, the first and second polishing rolls 11 and 21 are made of at least a material which does not cause scratches such as scratches on the substrate G, a material such as rubber or silicone, or a urethane foam pad or nonwoven fabric. It is desirable to be.

However, only the materials of the first and second polishing rolls 11 and 21 may be insufficient to buffer the impact applied to the substrate G. That is, since the first and second polishing rolls 11 and 21 have a weight of about several tens of kilograms, if there is no means for buffering the first and second polishing rolls 11 and 21, the substrate G is damaged. There is also concern.

Thus, in the present embodiment, a buffer tuning member 8 for buffering the contact pressure of the first and second polishing rolls 11 and 21 that are contact pressed against the substrate G is further provided. Although there may be various types of buffer tuning members 8, in the present embodiment, a plurality of buffer tuning members 8 may be coupled to the apparatus body 1 and provided to correspond to the first to fourth roll polishing units 10, 20, 30, and 40, respectively. Low friction cylinder (8).

And in view of the lengths of the first and second polishing rolls 11 and 21, at least 46 substrates (not shown), for example from 32 inches to 46 inches, can be applied to the substrate cleaning apparatus of this embodiment. It may have a length enough to cover an inch of substrate (not shown).

Of course, since the scope of the present invention is not limited thereto, the lengths of the first and second polishing rolls 11 and 21 may have a length sufficient to cover a substrate (not shown) of 46 inches or more. The first and second polishing rolls 11 and 21 are spaced apart from each other with a space through which the substrate G passes.

The first and second roll shafts 12 and 22 extend in opposite directions along the longitudinal direction of the first and second polishing rolls 11 and 21 at both ends of the first and second polishing rolls 11 and 21, respectively. do. Although not shown in detail, the first and second roll shafts 12 and 22 are not separated from each other, and the first and second polishing rolls pass through the interior of the first and second polishing rolls 11 and 21, respectively. It is preferable that it is provided in the form coupled to (11,21).

This will be described in detail with reference to FIG. 2. FIG. 2 is a diagram illustrating a cross-sectional structure of the first roll polishing unit 10 in the four roll polishing units 10, 20, 30, and 40 illustrated in FIG. 1.

As shown therein, the first roll shaft 12 is coupled to the first polishing roll 11 while penetrating the inside of the first polishing roll 11, and both end regions thereof are both ends of the first polishing roll 11. In the first polishing roll 11 is provided to be exposed in opposite directions, respectively. In other words, the first roll shaft 12 has a straight metal rod shape.

Thus, since the first roll shaft 12 has a straight metal rod shape and the first polishing roll 11 is coupled outside the central region of the first roll shaft 12, the substrate G is used. When pressing both ends of the first roll shaft 12 toward, the surface of the first polishing roll 11 may be uniformly pressed against the substrate G without being lifted.

Therefore, as in the related art, both ends of the first polishing roll 11 are in contact with the substrate G, and the center region thereof is excited from the substrate G, so that both ends of the substrate G are well cleaned. In this case, the central region may not be cleaned well, and thus the phenomenon in which the cleaning operation may not be uniformly performed on the substrate G may be prevented.

The following structure is further provided between the first roll shaft 12 and the first polishing roll 11 so that the first polishing roll 11 can be firmly coupled to the outer surface of the first roll shaft 12. That is, a plurality of fixed rings 16a for coupling the first roll shaft 12 to the first polishing roll 11 are formed in the first roll shaft 12 in which the first polishing roll 11 is located. Prepared. In the case of this embodiment, two fixing rings 16a are spaced apart from each other.

Keys 16b and Key are fastened to the fixing rings 16a as means for preventing the separation of the fixing rings 16a. O-rings are further coupled around the fixing rings 16a, respectively. In addition, fixing nuts 16d are fixed to both end regions of the first polishing roll 11 to fix the first polishing roll 11 and the first roll shaft 12 to each other.

As such, after mounting the two fixing rings 16a inside the first roll shaft 12 and fastening them as the keys 16b, the O-ring 16c is inserted into the two fixing rings 16a, and then the first roll The first polishing roll 11 is fitted to the outside of the shaft 12. Then, by mounting the fixing nuts 16d at both end regions of the first polishing roll 11, the first roll shaft 12 and the first polishing roll 11 can be firmly coupled to each other, thereby providing a substrate. The effect of uniformly contact-pressing the first polishing roll 11 to the surface of (G) can be provided. In the above description, the internal structure of the first roll polishing unit 10 is illustrated and described only. However, in the case of the remaining second to fourth roll polishing units 20, 30, and 40, the same structure as in FIG. Shall be.

1 and 3, the lengths of the first and second roll shafts 12 and 22 are different from each other. That is, the first roll shaft 12 is formed longer than the second roll shaft 22. This is an operation for securing a space for mounting the first and second rotational driving units 13 and 23. That is, when the lengths of the first and second roll shafts 12 and 22 are equal to each other, when the first and second rotational drives 13 and 23 are coupled to the first and second roll shafts 12 and 22, Mutual spatial constraints may occur. In this embodiment, the lengths of the first and second roll shafts 12 and 22 are designed differently.

However, unless there is a spatial constraint, the first and second roll shafts 12 and 22 may have the same length. End portions of the first and second roll shafts 12 and 22 are further provided with first and second shaft coupling portions 14 and 24 to which first and second lifting shafts 65 and 75 to be described later are coupled, respectively. .

The first and second rotary drives 13 and 23 serve to rotate the first and second polishing rolls 11 and 21 by rotating the first and second roll shafts 12 and 22. Therefore, the first and second rotary drives 13 and 23 are coupled to either side of the first and second roll shafts 12 and 22, respectively. Although not shown in detail with respect to the first and second rotary drive units 13 and 23, the first and second rotary drive units 13 and 23 may include a motor capable of rotating in the forward and reverse directions, and a speed reducer for reducing the rotational force of the motor. It is assembled in one assembly form.

Accordingly, when the first and second rotary drives 13 and 23 operate according to separate control signals, the first and second roll shafts 12 and 22 rotate according to the first and second polishing rolls 11. By rotating, 21, the upper and lower surfaces of the substrate passing between the first and second polishing rolls 11, 21 can be cleaned. Of course, this configuration and operation is also applied to the third and fourth roll polishing units 30 and 40 as described above.

On the other hand, as described above, regardless of the case where only the substrate G of the same size is cleaned by the substrate cleaning apparatus, substrates G of various sizes (such as 32 inches to 46 inches) are included in the substrate cleaning apparatus. When used, the surfaces of the first and second polishing rolls 11 and 21 are inevitably worn out in a portion where the portion in contact with the substrate G is in contact with other portions. In this case, the first and second polishing rolls 11 and 21 may not be able to maintain a substantially flat state, and may not evenly clean the surface of the substrate G.

Therefore, in order to keep the gap between the substrate G and the first and second polishing rolls 11 and 21 constant, it is necessary to measure how much the surfaces of the first and second polishing rolls 11 and 21 are worn. There is a need to correct this from time to time, which is in charge of the first to fourth dressing units 51 to 54.

At this time, after the cleaning operation is completed, the first to fourth dressing units 51 to 54 may be independently performed or may be performed in parallel with the cleaning operation.

The first to fourth dressing units 51 to 54 are also provided in the first to fourth roll polishing units 10, 20, 30, and 40, respectively, and are the first to fourth polishing rolls 11, 21, and 31. A surface of 41 may be polished, which may be operated based on the operation of the up / down adjustment units 60 and 70 to be described later. That is, the first to fourth dressing units 51 to 54 as the up / down adjustment units 60 and 70 independently up / down the first to fourth roll polishing units 10, 20, 30, and 40. ) May polish the surfaces of the corresponding first to fourth polishing rolls 11, 21, 31, and 41. First, the first to fourth dressing units 51 to 54 will be described.

For reference, the drawing of this embodiment is only a figure conceptually showing the board | substrate cleaning apparatus of this embodiment. Thus, referring to FIGS. 3 and 4, the first to fourth dressing units 51 to 54 are substantially coupled to the apparatus body 1, but are substantially the first to fourth dressing units 51. 54) is also regarded as an element coupled to the apparatus body 1 by a separate connecting means.

3 and 4, each of the first to fourth dressing units 51 to 54 is provided to extend along the length direction of the first to fourth polishing rolls 11, 21, 31, and 41, and the tip thereof. First to fourth polishing the surfaces of the first to fourth polishing rolls 11, 21, 31, and 41 by selectively contacting the surfaces of the first to fourth polishing rolls 11, 21, 31, and 41. And abrasive blades 51a to 54a and first to fourth blade drivers 51b to 54b for driving the first to fourth abrasive blades 51a to 54a.

Since the first to fourth polishing blades 51a to 54a substantially polish the surfaces of the first to fourth polishing rolls 11, 21, 31, and 41, for example, ceramics, artificial diamonds, and the like have excellent polishing efficiency. It can be produced as.

In the first to fourth blade drives 51b to 54b, the tips of the first to fourth polishing blades 51a to 54a may be in contact with the surfaces of the first to fourth polishing rolls 11, 21, 31, and 41. The first to fourth polishing blades (51a to 54a) with respect to the first to fourth polishing rolls (11, 21, 31, 41) so as to access and spaced apart.

At this time, the first to fourth blade drives 51b to 54b rotate while the first to fourth polishing blades 51a to 54a are rotated based on the predetermined first to fourth operating shafts 51c to 54c. The first to fourth polishing blades 51a to 54a have an inclination angle inclined to one side with respect to the vertical direction so that the tip thereof is in contact with the surfaces of the first to fourth polishing rolls 11, 21, 31, and 41. ) Is combined.

Accordingly, when the polishing operation is performed on the surfaces of the first to fourth polishing rolls 11, 21, 31, and 41 while the cleaning operation on the substrate G is stopped, the first to fourth blade driving units 51b are performed. 54b) rotates the first to fourth abrasive blades 51a to 54a based on the first to fourth operating shafts 51c to 54c. Then, as shown by the dashed-dotted line in FIG. 3, the tips of the first to fourth polishing blades 51a to 54a are in contact with the surfaces of the first to fourth polishing rolls 11, 21, 31, and 41.

When the first to fourth polishing rolls 11, 21, 31, and 41 rotate in this state, the surfaces of the first to fourth polishing rolls 11, 21, 31, and 41 are first to fourth polishing blades. By 51a-54a, it becomes possible to process into a substantially flat state. When the polishing operation on the surfaces of the first to fourth polishing rolls 11, 21, 31, and 41 is completed, the first to fourth abrasive blades 51a to 54b by the first to fourth blade drives 51b to 54b. 54a) is returned to the original position shown by the solid line in FIG. 3, and the cleaning operation on the substrate G is performed again.

Although the detailed description is omitted, in order to proceed with the polishing operation on the surfaces of the first to fourth polishing rolls 11, 21, 31, 41, the first to fourth polishing rolls 11, 21, 31, 41 It is necessary to check the polishing amount (abrasion degree) on the surface, and for this purpose, as described below, the sensing units 61 and 71 are provided.

The sensing units 61 and 71 detect how much the first and second roll polishing units 10 and 20 should be up / down through the relative displacement with respect to the sensor reference units 62 and 72, and the control unit may The sensing signal is controlled to control the operation of the first and second servo motors 64 and 65 provided in the up / down driving units 63 and 73.

 In other words, when the substrate G enters between the corresponding first and second polishing rolls 11 and 21 and the third and fourth polishing rolls 31 and 41, respectively. And first and second polishing rolls 11 and 21 when the substrate G is withdrawn from the first and second polishing rolls 11 and 21 and the third and fourth polishing rolls 31 and 41. And detect a relative distance between the third and fourth polishing rolls 31 and 41. The detected result is transmitted to the controller, which controls the first and second polishings based on the relative distance between the first and second polishing rolls 11 and 21 and the third and fourth polishing rolls 31 and 41. After determining the degree of wear on the rolls 11 and 21 and the third and fourth polishing rolls 31 and 41, the first and second servomotors 64, The operation of the controller 65). This operation is performed continuously for every substrate G. As shown in FIG.

As a result, in view of this operation, the sensing units 61 and 71 perform a polishing amount check on the surfaces of the first to fourth polishing rolls 11, 21, 31 and 41 in real time, and then adjust up / down. The surfaces of the first to fourth polishing rolls 11, 21, 31, and 41 are polished substantially flat in conjunction with the operation of the units 60 and 70. The up / down adjustment units 60 and 70 which operate in conjunction with the first to fourth dressing units 51 to 54 will be described.

The up / down adjustment units 60 and 70 of the present embodiment are also provided corresponding to the first to fourth roll polishing units 10, 20, 30, and 40 one by one to the first to fourth roll polishing units 10, 20, 30 and 40 are up / down independently of the substrate G.

Hereinafter, for convenience of description, only the first up / down adjustment unit 60 corresponding to the first roll polishing unit 10 will be described with reference to FIG. 3. Of course, the second up / down adjustment unit 70, which will not be described, and the third and fourth up / down adjustment units (not shown), which are not shown in the drawings, constitute the first up / down adjustment unit 60. And the operation will be applied as it is. For reference, the first up / down adjustment unit 60 serves to down the first roll polishing unit 10 with respect to the substrate G in a structure thereof, and the second up / down adjustment unit 60. The structure 70 has the role which raises the 2nd roll polishing unit 20 upward with respect to the board | substrate G. As shown in FIG.

The first up / down adjusting unit 60 is a relative distance of the first roll polishing unit 10 with respect to the substrate G, that is, the first with respect to the substrate G according to the amount of wear of the first polishing roll 11. The first sensing unit 61 for detecting a relative distance of the polishing roll 11, the first up / down driving unit 63 coupled to the first roll polishing unit 10, and the first sensing unit 61 A control unit (not shown) for controlling the operation of the first up / down driving unit 63 based on the detection result is provided.

In the present embodiment, the first sensing unit 61 is used as a displacement sensor 61 for sensing the up / down position of the first roll polishing unit 10. Therefore, the first roll polishing unit 10 is further provided with a first sensor reference part 62 serving as a reference of the first detection part 61 which is the displacement sensor 61. The first sensing unit 61 may be provided on the vertical plate 1a, and the first sensing unit 61 may be provided on the first lifting movement shaft 65.

The first up / down driving unit 63 includes a first servo motor 64 controlled by a control unit to compensate for the above displacement difference, and a motor shaft 64a of the first servo motor 64. Disposed in a direction intersecting with each other, and having an upper end coupled to each of the first shaft coupling parts 14 provided on both sides of the first shaft 12 of the first roll polishing unit 10, the first roll polishing unit 10. A first moving shaft 65 moving up and down together with the first moving shaft 65 and a first servo motor 64 converted into a vertical linear movement of the pair of first lifting shaft 65 and transmitted. And a power transmission unit 66.

For reference, as described above, the first shaft 12 extends in the opposite direction to the first polishing roll 11 along the longitudinal direction at both ends of the first polishing roll 11, respectively, and the first lifting shaft 65 are respectively coupled to the first shaft coupling portions 14 provided on both sides of the first shaft 12, the first lifting and moving shaft 65 is provided in pairs to operate together. Thus, for convenience of explanation, the same reference numerals are given to the pair of first lifting movement shafts 65.

The first power transmission unit 66 includes a pair of first coupling pieces 67 coupled to lower regions of the pair of first lifting and lowering shafts 65, and a first servo motor 64. A first horizontal bar 68 moving in the direction of the motor shaft 64a of the servomotor 64 and disposed at both ends of the pair of first coupling pieces 67, and the pair of first coupling pieces 67; And a pair of first camshafts 67a provided at end portions of the first horizontal bars 68 and coupled to the first long holes 69 in the inclined directions, respectively formed at both ends of the first horizontal bar 68. Here, the first long holes 69 in the inclined direction formed at both ends of the first horizontal bar 68 are formed in the same direction.

Therefore, when power is applied to the first servomotor 64 and the motor shaft 64a of the first servomotor 64 rotates in one direction, the first servomotor 64 is coupled to the motor shaft 64a of the first servomotor 64. The first moving block 64b moves the first horizontal bar 68 in the right direction of FIG. 3, for example. As such, when the first horizontal bar 68 is moved in the right direction of FIG. 3, the pair of first cam shafts 67a coupled to both ends of the first horizontal bar 68 may be inclined in the first long hole 69. ) Along a predetermined distance downward, and thus, the pair of first coupling pieces 67 and the pair of first lifting movement shafts 65 are also moved downward. Therefore, the first roll polishing unit 10 coupled to the pair of first lifting movement shafts 65 may be moved downward by a predetermined distance with respect to the substrate G. Similarly, if the second up / down adjustment unit 70 is operated, the second roll polishing unit 20 can be moved up a predetermined distance with respect to the substrate G.

Referring to the operation of the substrate cleaning apparatus having such a configuration is as follows.

First, as shown in FIG. 2, two fixing rings 16a are mounted inside the first roll shaft 12 to be fastened as a key 16b, and the two rings 16a have an O-ring 16c. After inserting, the first polishing roll 11 is inserted into the outside of the first roll shaft 12. Then, the fixing nuts 16d are attached to both end regions of the first polishing roll 11 to thereby firmly couple the first roll shaft 12 and the first polishing roll 11 to each other. Of course, the remaining second to fourth roll polishing units 20, 30 and 40 are also assembled in the same manner.

After mounting the first to fourth roll polishing units 10, 20, 30, and 40 having such a structure to the apparatus main body 1, the cleaning operation on the substrate G is performed. That is, as shown in FIG. 1, the first to fourth rotation driving units 13, 23, 33, and 43 of the first to fourth roll polishing units 10, 20, 30, and 40 operate to operate the first to fourth roll polishing units. The fourth polishing rolls 11, 21, 31, 41 rotate.

In this state, the substrate G to be cleaned is moved in the direction A of FIG. 1, so that the first to fourth polishing rolls 10, 20, 30, and 40, that is, the first to fourth polishing rolls ( Entering between 11, 21, 31 and 41, the upper surface of the substrate G is driven by the first and third polishing rolls 11 and 31, and the lower surface of the substrate G is formed by the second and fourth polishing rolls. It is cleaned by (21, 41). In the present embodiment, since the roll shafts 12, 22, 32, and 42 are all made of a straight metal material, the roll shafts 12, 22, 32, and 42 are pressed to press the first to fourth polishing rolls ( When 11, 21, 31 and 41 are pressed against the substrate G, the first to fourth polishing rolls 11, 21, 31 and 41 are completely in contact with the substrate G without being lifted. Therefore, the surface of the substrate G can be cleaned with excellent quality.

Meanwhile, during the cleaning operation of the substrate G, the surfaces of the first to fourth polishing rolls 11, 21, 31, and 41 may be worn, and the amount of wear is based on the sensing units 61, 71 and the sensor reference. It is checked according to the relative displacement due to the interaction between the parts 62 and 72. As a result of the check, if it is determined that the polishing operation on the surfaces of the first to fourth polishing rolls 11, 21, 31, and 41 should be performed, the above-described cleaning of the substrate G is once stopped.

In connection with the polishing operation on the surfaces of the first to fourth polishing rolls 11, 21, 31, and 41, the operation of the first and second up / down adjusting units 60, 70, and the first corresponding thereto. And only look for the second dressing unit (51, 52) is as follows.

First, before the first and second up / down adjustment units 60 and 70 operate, as described above, the sensing units 61 and 71 are formed so that the first and second polishing rolls 11, 21, and when the substrate G enters between the third and fourth polishing rolls 31 and 41, the first and second polishing rolls 11 and 21, and the third and fourth polishing rolls 31. The relative distance between the first and second polishing rolls 11 and 21 and the third and fourth polishing rolls 31 and 41 when the substrate G is withdrawn from 41 is sensed. The detected result is transmitted to the controller, which controls the first and second polishings based on the relative distance between the first and second polishing rolls 11 and 21 and the third and fourth polishing rolls 31 and 41. After determining the degree of wear on the rolls 11 and 21 and the third and fourth polishing rolls 31 and 41, the first and second servomotors 64, The operation of the controller 65).

If the first roll polishing unit 10 is to be moved downward with respect to the substrate G by a predetermined distance, the power is applied to the first servomotor 64 so that the motor shaft 64a of the first servomotor 64 is moved. ) Rotates in one direction. Then, the first moving block 64b coupled to the motor shaft 64a of the first servomotor 64 moves the first horizontal bar 68 in the right direction of FIG. 3, for example. When the first horizontal bar 68 is moved in the right direction of FIG. 3, the pair of first camshafts 67a coupled to both ends of the first horizontal bar 68 may allow the first long hole 69 to be inclined. Accordingly, the predetermined distance is moved downward, and thus, the pair of first coupling pieces 67 and the pair of first lifting and moving shafts 65 are also moved downward. Therefore, the first roll polishing unit 10 coupled to the pair of first lifting movement shafts 65 may be moved downward by a predetermined distance with respect to the substrate G.

In addition, when the second roll polishing unit 20 is moved upward by a predetermined distance with respect to the substrate G, power is applied to the second servomotor 74 so that the motor shaft 74a of the second servomotor 74 may be rotated. Rotate in one direction. Then, the second moving block 74b coupled to the motor shaft 74a of the second servomotor 74 moves the second horizontal bar 78 in the left direction of FIG. 3, for example. When the second horizontal bar 78 is moved in the left direction of FIG. 3, the pair of second cam shafts 77a coupled to both ends of the second horizontal bar 78 may allow the second long hole 79 to be inclined. As a result, a predetermined distance is moved upward. Accordingly, the pair of second coupling pieces 77 and the pair of second lifting and lowering shafts 75 are also moved upward. Therefore, the second roll polishing unit 20 coupled to the pair of second lifting movement shafts 75 may be moved upward by a predetermined distance with respect to the substrate G.

Based on the operation of the first and second up / down adjustment units 60, 70, the first and second dressing units 51, 52 are operated. That is, the first and second blade drives 51b and 52b rotate the first and second abrasive blades 51a and 52a based on the first and second operating shaft cores 51c and 52c. Then, as shown by the dashed-dotted line in FIG. 3, the tips of the first and second abrasive blades 51a and 52a are in contact with the surfaces of the first and second polishing rolls 11 and 21.

The first and second polishing rolls 11 and 21 are rotated while the front ends of the first and second polishing blades 51a and 52a are in contact with the surfaces of the first and second polishing rolls 11 and 21. As a result, the surfaces of the first and second polishing rolls 11 and 21 may be processed to be substantially flat by the first and second abrasive blades 51a and 52a.

When the polishing operation on the surfaces of the first and second polishing rolls 11 and 21 is completed, the first and second polishing blades 51a and 52a are driven by the first and second blade drives 51b and 52b. It is returned to the original position shown by the solid line of three. Of course, this operation is also common to the third and fourth dressing units 53 and 54.

As such, the relative spacing between the substrate G and the first and second polishing rolls 11 and 21 is easily matched by the operation of the first and second up / down adjusting units 60 and 70. After the surfaces of the first and second polishing rolls 11 and 21 are polished substantially flat, the cleaning operation on the substrate G then proceeds again as described above.

As described above, according to this embodiment, the first to fourth polishing rolls 11, 21, 31, and 41 can be uniformly contact-pressed with respect to the surface of the substrate G, and the surface of the substrate G is of excellent quality. Can be cleaned.

In addition, while all of the substrates G having various sizes may be used in common, it is possible to clean the surface of the substrate G with better quality than the conventional art.

Further, according to the present invention, the gap between the substrate G and the first to fourth polishing rolls 11, 21, 31, and 41 can be corrected, so that the surface of the substrate G can be cleaned with superior quality than before. do.

In the above embodiment, the up / down adjustment unit has been described to be operated in parallel with the dressing unit, but if the roll polishing unit is independent from the dressing unit, for example, because of the initial setting for the present cleaning device, If it is necessary to up / down the up / down adjustment unit may be driven alone.

As described above, the present invention is not limited to the described embodiments, and various modifications and changes can be made without departing from the spirit and scope of the present invention, which will be apparent to those skilled in the art. Therefore, such modifications or variations will have to be belong to the claims of the present invention.

As described above, according to the present invention, the polishing roll can be uniformly pressed against the surface of the substrate, and the surface of the substrate can be cleaned with excellent quality.

Claims (12)

At least one roll polishing unit for cleaning the surface of the substrate, The at least one roll polishing unit, A polishing roll rotatably contacting the surface of the substrate to clean the surface of the substrate; And The polishing roll is coupled to the polishing roll so as to apply substantially uniform pressure to the entire surface of the substrate, and respectively coupled to a central region between the center and both ends of the polishing roll while penetrating the interior of the polishing roll. Wherein both end regions include roll shafts provided at opposite ends of the polishing roll in opposite directions along the longitudinal direction of the polishing roll, respectively; At least one fixed ring for coupling the roll shaft to the polishing roll is provided inside the roll shaft, and a key for preventing separation of the fixing ring is coupled to the at least one fixing ring. Substrate cleaning apparatus, characterized in that. delete delete The method of claim 1, O-ring is coupled around the at least one fixing ring, And fixing nuts for fixing the polishing roll and the roll shaft to both end regions of the polishing roll. The method of claim 1, The polishing roll is made of a buffer material, and the roll shaft is a substrate cleaning apparatus, characterized in that made of a rod-shaped metal material. The method of claim 1, And at least one dressing unit disposed adjacent said at least one roll polishing unit to process a surface of said polishing roll. The method of claim 6, The at least one dressing unit, An abrasive blade provided along the longitudinal direction of the polishing roll and having a front end selectively contacting the surface of the polishing roll to polish the surface of the polishing roll; And And a blade driver for approaching and separating the polishing blade with respect to the polishing roll so that the front end of the polishing blade contacts the surface of the polishing roll. The method of claim 6, At least one up / down adjustment unit (up / down) for independently up / down the roll polishing unit relative to the substrate based on the degree of wear on the surface of the polishing roll in contact with the surface of the substrate; down adjust unit) further comprising a substrate cleaning apparatus. The method of claim 8, Each of the at least one up / down adjustment unit, A sensing unit for sensing a relative distance of the roll polishing unit to the substrate based on the wear amount of the polishing roll; An up / down drive unit coupled to the roll polishing unit; And And a controller configured to control an operation of the up / down driver based on a detection result of the detector. The method of claim 9, The sensing unit senses a relative distance between the pair of polishing rolls when the substrate enters between the pair of polishing rolls corresponding to each other and when the substrate is withdrawn from the pair of polishing rolls. , And the control unit controls the operation of the up / down driving unit after determining the wear level of the pair of polishing rolls based on the relative spacing of the pair of polishing rolls. The method of claim 9, The up / down drive unit, A servo motor controlled by the controller; A pair of lifting and lowering shafts disposed in a direction intersecting with the motor shaft of the servomotor, and having an upper end coupled to a pair of roll shafts provided in any one of the roll polishing units to move up and down together with the roll polishing unit; And And a power transmission unit converting the rotational motion of the servo motor into vertical movements of the pair of lifting shafts and transmitting the linear motions. The method of claim 11, The power transmission unit, A pair of coupling pieces respectively coupled to lower regions of the pair of lifting movement shafts; A horizontal bar which is moved by the servomotor in the direction of the motor shaft of the servomotor and is disposed at both ends of the pair of coupling pieces; And And a camshaft provided at each end of the pair of coupling pieces and coupled to the inclined long hole respectively formed at both ends of the horizontal bar.

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