KR100864460B1 - Adhesive composition for a ceramic package - Google Patents

Adhesive composition for a ceramic package Download PDF

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KR100864460B1
KR100864460B1 KR1020070052101A KR20070052101A KR100864460B1 KR 100864460 B1 KR100864460 B1 KR 100864460B1 KR 1020070052101 A KR1020070052101 A KR 1020070052101A KR 20070052101 A KR20070052101 A KR 20070052101A KR 100864460 B1 KR100864460 B1 KR 100864460B1
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South Korea
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ring
adhesive
adhesive composition
ceramic
ceramic layer
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KR1020070052101A
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Korean (ko)
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조숙철
김대흥
남희동
마용준
박장호
전종열
최운성
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(주) 세라트론
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/10—Homopolymers or copolymers of methacrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/01—Hydrocarbons
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Ceramic Products (AREA)

Abstract

An adhesive composition for ceramic package is provided to prevent carbon from remaining after brazing when a kobar ring is adhered on the ceramic layer of ceramic package. An adhesive composition for adhering a kobar ring on the ceramic layer of ceramic package comprises 22-25 wt% of poly(isobutyl methacrylate); 63-65 wt% of butyl acetate; and 12-13 wt% of 1,2,4-trimethylbenzene.

Description

세라믹 패키지용 접착제 조성물{ADHESIVE COMPOSITION FOR A CERAMIC PACKAGE}Adhesive composition for ceramic packages {ADHESIVE COMPOSITION FOR A CERAMIC PACKAGE}

도 1a 내지 도 1c는 세라믹층에 코바 링(kovar ring)을 가접합하는 것을 개략적으로 도시한 것으로, 도 1a는 접착제가 도포된 세라믹층에 코바 링이 올려지는 것을 나타낸 것이고, 도 1b는 세라믹층에 코바 링이 가접합된 것을 나타낸 것이며, 도 1c는 도 1b에 대한 A-A 단면을 나타낸 것이다.Figures 1a to 1c schematically show the temporary bonding of the kovar ring (kovar ring) to the ceramic layer, Figure 1a shows that the cobar ring is mounted on the adhesive-coated ceramic layer, Figure 1b is a ceramic layer It is shown that the Koba ring is temporarily bonded, Figure 1c shows the AA cross section for Figure 1b.

도 2는 종래의 접착제로 세리막층과 코바 링을 가접합한 후와 브레이징한 후의 광학 현미경 사진이다.2 is an optical photomicrograph after the temporary bonding of the serifilm layer and the cobar ring with a conventional adhesive and after brazing.

도 3a 및 도 3b는 본 발명에 의한 접착제로 세리막층과 코바링을 가접합하고 브레이징한 후의 광학현미경 사진으로, 도 3a는 하나의 셀(cell)을 나타낸 것이고, 도 3b는 노치 홀(notch hole) 주위의 여러 셀을 나타낸 것이다. 3A and 3B are optical micrographs after temporarily bonding and brazing a seri layer and a cobaring ring with an adhesive according to the present invention, and FIG. 3A shows one cell, and FIG. 3B shows a notch hole. ) Shows multiple cells around.

<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>

14: 세라믹층 20: 코바 링(kovar ring) 14: ceramic layer 20: kovar ring

30: 접착제 32: 잔존 카본30: adhesive 32: remaining carbon

본 발명은 세라믹 패키지용 접착제 조성물에 관한 것으로서, 보다 상세하게는 세라믹 패키지의 세라믹층 위에 코바 링(kovar ring)을 가접합시키기 위한 접착제 조성물에 관한 것이다. The present invention relates to an adhesive composition for a ceramic package, and more particularly, to an adhesive composition for temporarily bonding a kovar ring on a ceramic layer of a ceramic package.

상기 코바 링(kovar ring)에서 코바(kovar)란 Fe-Ni-Co를 주성분으로 하고 Al, Mg, Mn, Zr, Ti, C를 미량 함유하고 있는 합금으로서, 링(ring), 와이어(wire), 로드(rod), 바(bar), 스트립(strip), 시트(sheet), 튜브(tube) 등의 다양한 형태로 사용된다. 코바 링(kovar ring)은 링 형상의 코바를 말하는 것으로, 세라믹 패키지의 세라믹층 위에 접합되어 세라믹 패키지 내부의 칩을 보호하며, 리드 캡(lid cap) 접합 중에 발생하는 열충격에 의한 세라믹층의 파괴를 방지하는 역할을 한다. 코바 링 위에는 다시 리드 캡이 접합되어 기밀성을 유지하게 된다. In the kovar ring, a kovar is an alloy containing Fe-Ni-Co as a main component and a small amount of Al, Mg, Mn, Zr, Ti, and C. Rings and wires , Rods, bars, strips, sheets, tubes and the like. The kovar ring refers to a ring-shaped koba, which is bonded on the ceramic layer of the ceramic package to protect the chip inside the ceramic package and prevents the destruction of the ceramic layer due to thermal shock generated during the lid cap bonding. It serves to prevent. The lead cap is again bonded onto the cobar ring to maintain airtightness.

도 1a 내지 도 1c는 세라믹층에 코바 링(kovar ring)을 가접합하는 것을 개략적으로 도시한 것으로, 도 1a는 접착제가 도포된 세라믹층에 코바 링이 올려지는 것을 나타낸 것이고, 도 1b는 세라믹층에 코바 링이 가접합된 것을 나타낸 것이며, 도 1c는 도 1b에 대한 A-A 단면을 나타낸 것이다. 도 2는 종래의 접착제로 세리막층과 코바 링을 가접합한 후와 브레이징한 후의 광학 현미경 사진이다.Figures 1a to 1c schematically show the temporary bonding of the kovar ring (kovar ring) to the ceramic layer, Figure 1a shows that the cobar ring is mounted on the adhesive-coated ceramic layer, Figure 1b is a ceramic layer It is shown that the Koba ring is temporarily bonded, Figure 1c shows the AA cross section for Figure 1b. 2 is an optical photomicrograph after the temporary bonding of the serifilm layer and the cobar ring with a conventional adhesive and after brazing.

이 도면들을 참조하면, 세라믹층(14) 위에 코바 링(20)을 접합하기 위해서는, 접착제(30)를 이용하여 세라믹 패키지의 세라믹층(14) 위에 코바 링(20)을 가접합한 다음에, 세라믹층(14)과 코바 링(20)을 완전히 접합하기 위해서 800~900℃의 전기로에서 브레이징(brazing)을 하게 되는데, 브레이징 후에 접착제 성분이 탄화되어 잔존 카본(32)이 생기게 된다는 문제가 있었다. Referring to these figures, in order to bond the cobar ring 20 onto the ceramic layer 14, the cobar ring 20 is temporarily bonded onto the ceramic layer 14 of the ceramic package using an adhesive 30. In order to completely bond the ceramic layer 14 and the cobar ring 20, the brazing is performed in an electric furnace at 800 to 900 ° C. After the brazing, the adhesive component is carbonized to generate residual carbon 32.

본 발명은 전술한 문제를 해결하기 위한 것으로서, 브레이징 후에도 잔존 카본이 생기지 않는 접착제 조성물을 제공하는 것을 목적으로 한다.The present invention has been made to solve the above problems, and an object thereof is to provide an adhesive composition in which residual carbon does not occur even after brazing.

상기 목적을 달성하기 위하여 본 발명에 의한 세라믹 패키지용 접착제 조성물은 폴리이소부틸 메타크릴레이트, 부틸 아세테이트, 및 1, 2, 4-트리메틸벤젠을 포함한다.Adhesive composition for a ceramic package according to the present invention for achieving the above object includes polyisobutyl methacrylate, butyl acetate, and 1, 2, 4-trimethylbenzene.

이하, 첨부된 도면을 참조하여 본 발명을 상세히 설명한다. Hereinafter, with reference to the accompanying drawings will be described in detail the present invention.

도 1a 내지 도 1c를 참조하면, 전술한 세라믹층(14)과 코바 링(20)의 가접합에 사용되는 접착제(30)는 일시적으로 세라믹층(14)과 코바 링(20)을 접합하여 세라믹층(14) 위에 코바 링(20)을 안착시킬 수 있어야 하므로 속경성(대략 5~10초 후에 건조)이 있어야 하며, 점도가 낮아야 한다(10~1,000cps의 점도, 바람직하게는 대략 물과 유사한 점도). 또한 브레이징 후에 잔존 카본(32)이 발생하지 않아야 한다. 종래의 접착제(30)는 속경성은 있었으나 전술한 바와 같이 브레이징 후에 잔존 카본(32)이 발생하는 문제가 있었다. 1A to 1C, the adhesive 30 used for temporary bonding of the ceramic layer 14 and the cobar ring 20 described above is temporarily bonded to the ceramic layer 14 and the cobar ring 20. Since it must be possible to seat the cobar ring 20 on the layer 14, there must be fast hardening (drying after approximately 5 to 10 seconds) and a low viscosity (a viscosity of 10 to 1,000 cps, preferably approximately similar to water). Viscosity). In addition, residual carbon 32 should not be generated after brazing. The conventional adhesive 30 had a fast hardness but had a problem of remaining carbon 32 after brazing as described above.

본 발명자는 속경성이 있으면서 브레이징 후에도 잔존 카본(32)이 발생하지 않는 접착제(30)의 조성을 연구한 결과, 폴리이소부틸 메타크릴레이트(poly(isobutyl methacrylate)), 부틸 아세테이트(butyl acetate), 및 1, 2, 4-트리메틸벤젠(1, 2, 4-trimethylbenzene)을 포함하는 접착제 조성물을 개발하게 되었다. The present inventors have studied the composition of the adhesive 30, which has fast curing properties and does not generate residual carbon 32 even after brazing. As a result, polyisobutyl methacrylate (poly (isobutyl methacrylate)), butyl acetate, and Adhesive compositions comprising 1, 2, 4-trimethylbenzene have been developed.

여기서, 폴리이소부틸 메타크릴레이트의 함량은 22~25중량%, 부틸 아세테이트의 함량은 63~65중량%, 1, 2, 4-트리메틸벤젠의 함량은 12~13중량%인 것이 바람직하다. Here, the content of polyisobutyl methacrylate is 22 to 25% by weight, the content of butyl acetate is 63 to 65% by weight, the content of 1, 2, 4-trimethylbenzene is preferably 12 to 13% by weight.

폴리이소부틸 메타크릴레이트의 함량이 22중량% 미만이면 접착제의 점도가 너무 낮아져서 접착력이 낮아지고, 25중량%를 초과하면 점도가 너무 높아져서 잔존 카본이 생길 가능성이 높아진다. If the content of polyisobutyl methacrylate is less than 22% by weight, the viscosity of the adhesive is too low to lower the adhesive force, and if it exceeds 25% by weight, the viscosity is too high to increase the possibility of remaining carbon.

부틸 아세테이트의 함량이 63중량% 미만이면 접착제의 점도가 너무 높아져서 경화시간이 너무 짧아지고, 65중량%를 초과하면 점도가 너무 낮아져서 경화시간이 너무 길어진다. If the content of butyl acetate is less than 63% by weight, the viscosity of the adhesive is too high and the curing time is too short. If it exceeds 65% by weight, the viscosity is too low and the curing time is too long.

1, 2, 4-트리메틸벤젠의 함량이 12중량% 미만이면 접착제의 점도가 너무 높아져서 경화시간이 너무 짧아지고, 13중량%를 초과하면 점도가 너무 낮아져서 경화시간이 너무 길어진다. If the content of 1, 2, 4-trimethylbenzene is less than 12% by weight, the viscosity of the adhesive is too high and the curing time is too short. If it is more than 13% by weight, the viscosity is too low and the curing time is too long.

이하에서 바람직한 실시예를 통하여 본 발명을 보다 상세히 기술한다. Hereinafter, the present invention will be described in more detail with reference to preferred embodiments.

실시예Example

순도 99% 이상인 파우더상의 폴리이소부틸 메타크릴레이트(미국 알드리치(Aldrich)사 제조) 22.6중량%, 순도 99%인 액상의 부틸 아세테이트(일본 준세이(Junsei)사 제조) 64.9중량%, 및 순도 98%인 액상의 1, 2, 4-트리메틸벤젠(미국 알드리치사 제조) 12.5중량%를 30℃에서 초음파 분산기로 혼합하여 접착제 조성물을 제조한다. Powdery polyisobutyl methacrylate (Aldrich, USA) 22.6% by weight, liquid butyl acetate (Junsei, Japan) 64.9% by weight, and 98% purity An adhesive composition is prepared by mixing 12.5% by weight of 1, 2, 4-trimethylbenzene (manufactured by Aldrich, USA) in a phosphorus liquid phase with an ultrasonic disperser at 30 ° C.

도 3a 및 도 3b는 위 실시예에서 제조된 접착제 조성물로 세라믹층과 코바링 을 가접합하고 브레이징한 후의 광학현미경 사진으로, 도 3a는 하나의 셀(cell)을 나타낸 것이고, 도 3b는 노치 홀(notch hole)(16) 주위의 여러 셀을 나타낸 것이다. 여기서 점선 원은 위 실시예의 접착제가 도포된 부위를 나타낸다. 3A and 3B are optical micrographs after temporarily bonding and brazing a ceramic layer and a cobaring with the adhesive composition prepared in the above example, FIG. 3A shows one cell, and FIG. 3B shows a notch hole. (notch hole) 16 shows several cells around. Here, the dotted circle indicates the area where the adhesive of the above embodiment is applied.

이 도면들을 참조하면, 도 2에 도시한 종래의 접착제(30)를 도포한 경우의 브레이징 후의 사진과 비교할 때, 본 발명의 접착제(30)를 도포한 경우에는 브레이징 후에 잔존 탄소(32)가 전혀 발생하지 않았음을 알 수 있다. 상기 종래의 접착제로서는 에폭시 재질의 E 6002 Epoxy(상품명; 에머슨 앤드 큐밍(Emerson & Cuming)사 제조)를 사용하였다. Referring to these figures, when compared with the photograph after brazing when the conventional adhesive 30 shown in FIG. 2 is applied, when the adhesive 30 of the present invention is applied, the remaining carbon 32 after brazing is completely absent. It can be seen that it did not occur. As the conventional adhesive, E 6002 Epoxy (trade name; manufactured by Emerson & Cuming) made of epoxy was used.

한편, 코바 링(20)이 세라믹층(14)에 가접합 및 브레이징되는 것을 보다 상세히 설명하면, 먼저 세라믹층(14)은 통상 제1 및 제2세라믹층(10, 12)이 가열, 가압에 의해 접합되어 이루어지는데, 제2세라믹층(12) 표면에 텅스텐 페이스트로 패턴이 형성되고 1500~1600℃에서 소결된다. 이 패턴 위에 니켈 도금층(13)이 형성된다. 이 니켈 도금층(13) 위에 접착제(30)가 도포되고 그 위에 코바 링(20)이 가접합된다. 이 상태에서 브레이징이 이루어지고 코바 링(20) 위에 다시 니켈 도금이 되고 어닐링(annealing) 후 금 도금이 된다. On the other hand, when the cobar ring 20 is temporarily bonded and brazed to the ceramic layer 14, the ceramic layer 14 is first to the first and second ceramic layers (10, 12) to heat and pressurize. Although bonded together, a pattern is formed on the surface of the second ceramic layer 12 by tungsten paste and sintered at 1500 to 1600 ° C. The nickel plating layer 13 is formed on this pattern. The adhesive 30 is apply | coated on this nickel plating layer 13, and the cobar ring 20 is temporarily bonded on it. In this state, brazing is performed and nickel plating is again performed on the cobar ring 20 and gold plating is performed after annealing.

미설명 번호 11, 18은 금속 패턴, 15는 캐비티(cavity), 17은 스크라이빙 라인(scribing line)을 나타낸다.Reference numerals 11 and 18 denote metal patterns, 15 denote cavities, and 17 denote scribing lines.

본 발명에 의한 세라믹 패키지용 접착제 조성물은 SAW(surface acoustic wave) 필터 패키지, X'tal(crystal) 패키지에 주로 사용된다. Adhesive compositions for ceramic packages according to the present invention are mainly used in surface acoustic wave (SAW) filter packages, X'tal (crystal) packages.

본 발명에 의한 세라믹 패키지용 접착제 조성물로 세라믹층과 코바 링을 가접합하고 브레이징을 하면 잔존 카본이 발생하지 않는다.Residual carbon is not generated when the ceramic layer and the cobar ring are temporarily bonded and brazed with the adhesive composition for ceramic package according to the present invention.

이상에서 살펴본 본 발명은 기재된 구체적인 예에 대해서만 상세히 설명되었지만, 본 발명의 기술사상 범위 내에서 다양한 변형 및 수정이 가능함은 당업자에게 있어서 명백한 것이며, 이러한 변형 및 수정이 첨부된 특허청구범위에 속함은 당연한 것이다.Although the present invention described above has been described in detail only with respect to the specific examples described, it will be apparent to those skilled in the art that various modifications and changes are possible within the technical scope of the present invention, and such modifications and modifications belong to the appended claims. will be.

Claims (2)

폴리이소부틸 메타크릴레이트, 부틸 아세테이트, 및 1, 2, 4-트리메틸벤젠을 포함하는 세라믹 패키지용 접착제 조성물.Adhesive composition for ceramic packages comprising polyisobutyl methacrylate, butyl acetate, and 1, 2, 4-trimethylbenzene. 제1항에 있어서, The method of claim 1, 상기 폴리이소부틸 메타크릴레이트의 함량은 22~25중량%, 상기 부틸 아세테이트의 함량은 63~65중량%, 상기 1, 2, 4-트리메틸벤젠의 함량은 12~13중량%인 것을 특징으로 하는 세라믹 패키지용 접착제 조성물.The content of the polyisobutyl methacrylate is 22 to 25% by weight, the content of the butyl acetate is 63 to 65% by weight, the content of the 1, 2, 4-trimethylbenzene is characterized in that 12 to 13% by weight Adhesive composition for ceramic package.
KR1020070052101A 2007-05-29 2007-05-29 Adhesive composition for a ceramic package KR100864460B1 (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100286378B1 (en) 1996-01-31 2001-04-16 아토피나 Adhesive composition for (meth)acrylic (co)polymer materials
US6444772B1 (en) 1998-10-28 2002-09-03 Nitto Denko Corporation Supercritical fluid pressure sensitive adhesive polymers and their preparation

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100286378B1 (en) 1996-01-31 2001-04-16 아토피나 Adhesive composition for (meth)acrylic (co)polymer materials
US6444772B1 (en) 1998-10-28 2002-09-03 Nitto Denko Corporation Supercritical fluid pressure sensitive adhesive polymers and their preparation

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