KR100859555B1 - A active heat pipe used an thermionic element - Google Patents

Abstract

An active heat pipe using a thermoelectric element is provided to finely adjust a temperature by attaching a heat sensor on an outer periphery surface of the heat pipe between an exothermic thermoelectric element and an endothermic thermoelectric element. An active heat pipe comprises a closed heat pipe(1), a coated endothermic unit thermoelectric element(10), a coated exothermic unit thermoelectric element, and an electrode(20). The coated endothermic unit thermoelectric element is surrounded by one outer periphery surface of the heat pipe. The coated exothermic unit thermoelectric element is surrounded by the other outer periphery surface of the heat pipe. The electrode is attached on an outer part of the endothermic unit and the exothermic unit thermoelectric elements. The thermoelectric elements is coated with a P-type semiconductor(11) and an N-type semiconductor(12) alternatively. The N-type semiconductor is thicker than the P-type semiconductor.

Description

Active heat pipe used an thermoelectric element

1 is a schematic configuration diagram of a general thermoelectric heat pump element,

2 is a perspective view showing an active heat pipe using a thermoelectric device according to a first embodiment of the present invention;

3 is a front sectional view showing an active heat pipe using a thermoelectric device according to a first embodiment of the present invention;

4 is a cross-sectional view illustrating an active heat pipe using a thermoelectric device according to a first embodiment of the present invention;

5 is a perspective view showing an active heat pipe using a thermoelectric device according to a second embodiment of the present invention;

6 is a plan view showing an active heat pipe using a thermoelectric device according to a second embodiment of the present invention;

7 is a state diagram showing the overall configuration according to the present invention.

※ Explanation of code for main part of drawing

1: heat pipe 10: heat absorbing portion thermoelectric element

10 ': heating element thermoelectric element 11: P-type semiconductor

12 N-type semiconductor 20,21 electrode element

30: insulator 40: metal conductor

50: incision groove 60: heat detection sensor

70: cooling controller P: cooling object

R: Refrigerant H: Heat outlet

L: wire

The present invention relates to an active heat pipe using a thermoelectric element, and a thermoelectric element in which P-type semiconductors and N-type semiconductors are alternately stacked is coated on an outer circumferential surface of both ends of a heat pipe sealed to allow a refrigerant to flow therein. The current is applied to the thermoelectric element from the power source to actively suck and discharge heat around the heat pipe.

Generally, cooling is divided into passive methods using physical heat conduction and convection such as heat sinks and heat pipes, and active methods using thermoelectron transfer of thermoelectric elements.

The heat pipe used in the passive cooling method is a thermal cooling method using a method in which a refrigerant, which is a fluid, is sealed in a metallic metal in a tubular shape, and the internal fluid is thermally circulated when a temperature difference occurs in the tubular anode end. It has been utilized in various fields by taking advantage of the lower vaporization point to utilize the very fast heat transfer principle by vaporization and liquefaction. However, the problem of the heat pipe is a passive device using a phenomenon in which the temperature is diffused from a high place to a low place, and there is no way to lower the heat below the temperature of the low temperature point. That is, the cooling target of the object to be cooled has a fundamental limit that must be equal to or higher than the temperature of the low point.

In addition, the thermoelectric element used in the active cooling method is a Peltier's Effect which is a phenomenon in which one side absorbs heat and the other side emits heat depending on the direction in which the current flows when two different materials are joined. This thermoelectric device is also called thermoelectric cooling method, and this thermoelectric device is manufactured in a form in which P-type N-type semiconductor devices are connected to each other. As it is manufactured in a plate shape, there is a limitation that the spatial difference that is physically transmitted is very small. In order to overcome this problem, a device such as a heat sink or a heat pipe is used as an auxiliary device to emit heat.

FIG. 1 is a schematic configuration diagram of a general thermoelectric heat pump element, and the poles of both ends of a π-type series circuit PN couple in which the P-type semiconductor 11 and the N-type semiconductor 12 are bonded to the metal electrode 14 are shown in FIG. When the current flows from the N-type to the P-type so as to become-and +, respectively, holes in the P-type semiconductor 11 are attracted to the -pole, and electrons in the N-type semiconductor 12 are attracted to the + electrode. In this case, due to the Peltier effect, both the holes and the electrons take heat from the upper metal electrode 14 and move to the lower bipolar electrode, so the upper metal electrode 14 is cooled to absorb heat from the surroundings, Will release heat.

However, the conventional thermoelectric heat pump device has a disadvantage in that it is not possible to fabricate a chip to a certain size or more because there is a possibility that the device is easily damaged due to thermal stress because a very large temperature difference occurs within a small thickness. Since the semiconductor is separated from each other in a lattice form without being separated from the high temperature part and the low temperature part, there is a disadvantage in that the heat pumping cannot be effectively performed because the size of the internal and external temperature difference of the semiconductor device itself is reduced.

The present invention has been made in view of the above point, an object of the present invention is to use a thermoelectric element that can efficiently suck and discharge heat around the heat pipe by actively moving the heat entering and exiting the heat pipe To provide an active heat pipe.

In order to achieve the above object, an active heat pipe using a thermoelectric device according to the present invention includes a heat pipe whose both ends are sealed to allow a refrigerant to flow therein; A heat absorbing portion thermoelectric element coated on the outer circumferential surface of one end of the heat pipe; A heating element thermoelectric element coated on the outer circumferential surface of the other end of the heat pipe; An electrode element attached to an outer side of the thermoelectric element is included, and the thermoelectric element is alternately coated with a P-type semiconductor and an N-type semiconductor in a plurality of layers.

Between the heat pipe and the thermoelectric element is insulated with an insulator, the electrode element is attached to the inside and outside of the thermoelectric element, the thermoelectric element and the electrode element is a cut groove divided into a plurality of sectors along the longitudinal direction of the heat pipe Each of the cut thermoelectric elements is connected in series by a metal conductor to increase the potential difference between the inside and the outside of the thermoelectric element.

In another aspect, the present invention provides a heat sensing sensor unit attached to the outer peripheral surface of the heat pipe between the heat absorbing unit thermoelectric element and the heat generating unit thermoelectric element, and a cooling controller for controlling the supply of DC power by a signal transmitted from the heat sensing sensor unit. It is further included, the heat sensor is preferably made of a thermoelectric element coated with a plurality of layers.

Hereinafter, an active heat pipe using a thermoelectric device according to the present invention for achieving the above object will be described in more detail with reference to the accompanying drawings.

2 to 4 as a perspective view, a front sectional view, cutaway cross-sectional view showing an active heat pipe using a thermoelectric device according to a first embodiment of the present invention, the present invention is the heat of the refrigerant can flow from the inside to both ends of which are closed With pipe 1; A heat absorbing portion thermoelectric element 10 surrounded by an outer circumferential surface of one end of the heat pipe 1 and coated; A heat generating unit thermoelectric element 10 ′ coated on the outer circumferential surface of the other end of the heat pipe 1; The electrode device 20 is attached to the outside of the thermoelectric elements 10 and 10 '.

Since the heat pipe 1 is preferably made of a copper (Cu) pipe which is a good conductor of electrical conductivity, the heat pipe 1 itself can be used as one electrode to reduce the process and cost.

As shown in FIG. 3, the thermoelectric elements 10 and 10 ′ have a thin film type P-type semiconductor 11-N-type semiconductor 12-P-type semiconductor 11 sequentially stacked based on nanotechnology. It is coated in the form of wound around the outer circumferential surface of both ends of the heat pipe (1), the electrode element 20 is attached to the surface of the P-type semiconductor (11) located on the outermost side of the thermoelectric elements (10, 10 ').

As shown in FIG. 4, the heat transfer in the heat absorbing portion thermoelectric element 10 is performed by direct current to a bifurcation end having the heat pipe 1 as an internal electrode and the electrode element 20 as an external electrode. The power is applied, but the internal electrode is a negative electrode, and when the current flows to the external P-type semiconductor 11 so that the external electrode is a positive electrode, the inside of the thermoelectric element 10 is laminated and coated in multiple layers. The movement of the free electrons in turn passes through the outer P-type semiconductor 11 and passes through the N-type semiconductor 12 and the inner P-type semiconductor 11 while the electrode element 20 is attached to the outside of the thermoelectric element 10. The electrode element 20 is cooled and actively absorbs heat from the surroundings, since the heat is taken away and moved to the heat pipe 1, which is an internal electrode, and the heat pipe 1, which is an internal electrode, actively heats the internal refrigerant. Will be released.

On the other hand, heat is transferred from the heat generating part thermoelectric element 10 'so that the inner electrode is a positive electrode, and the outer electrode is a negative electrode, and when current flows through the inner P-type semiconductor, it is stacked in multiple layers. Free electron movement in the coated thermoelectric element 10 passes through the inner P-type semiconductor 11 and passes through the N-type semiconductor 12 and the outer P-type semiconductor 11 in turn, and the free electrons are internal electrodes. Since the heat of the heat pipe 1 is taken away and moved to the electrode element 20 which is the external electrode, the heat pipe 1 is cooled to actively absorb heat from the refrigerant P inside and the electrode element 20 which is the external electrode. ) Will actively release heat to the outside. I.e. Peltier effect (Peltier to cause a temperature difference in electromotive force difference between both ends effect ) causes a heat transfer phenomenon that actively transfers heat due to the temperature difference induced between both ends.

The N-type semiconductor 12 stacked on the middle portion of each of the thermoelectric elements 10 and 10 'coated with the plurality of layers is formed thicker than the P-type semiconductor 11 stacked on the inner and outer surfaces. The N-type semiconductor 12 in the center serves as a thermal insulation layer that prevents heat actively moved by electromotive force due to the Peltier effect from being moved back in the opposite direction by diffusion. That is, the process of inhaling heat from the heat absorbing portion of the thermoelectric element 10 is performed by heat diffusion from the electrode element 20 to the refrigerant inside the heat pipe 1 by the Peltier effect, and then heats again by diffusion of heat. It moves from the refrigerant inside the pipe 1 to the electrode element 20, which is located at the center of the heat absorbing portion thermoelectric element 10 to prevent heat from spreading to the outside of the heat absorbing portion thermoelectric element 10. The N-type semiconductor 12 is formed thicker than the inner and outer P-type semiconductor 11.

In addition, the P-type semiconductor 11 stacked on the inner and outer surfaces of the N-type semiconductor 12 is a P-type semiconductor, and the N-type semiconductor 12 formed in the middle of the thermoelectric elements 10 and 10 'is thick. May be replaced with an N-type semiconductor and have a power polarity in the opposite direction.

5 and 6 are respectively a perspective view and a plan view showing an active heat pipe using a thermoelectric device according to a second embodiment of the present invention, wherein the heat pipe 1 and the thermoelectric elements 10 and 10 'are insulated ( 30 is insulated from each other, and the electrode elements 21 are attached to the inside and the outside of the thermoelectric elements 10 and 10 ', and the thermoelectric elements 10 and 10' and the electrode element 21 are heat pipes 1. An incision groove 50 divided into a plurality of sectors is formed along the longitudinal direction of E, so that each of the incision thermoelectric elements 10 and 10 ′ is connected in series by a metal conductor 40.

In the series connection by the metal conductor 40, the electrode element 21 located inside the thermoelectric elements 10 and 10 'and the electrode element 21 positioned outside the thermoelectric elements 10 and 10' are made of metal. It has a structure connected in a zigzag by the conductor 40, the electrode element 21 located outside the thermoelectric elements (10, 10 ') to the positive pole, the electrode element 21 located inside the negative pole Direct current power is applied.

By connecting the thermoelectric elements 10 and 10 'divided into a plurality of sectors in series by the metal conductor 40 as described above, the voltage of the applied power becomes high, and the inner and outer sides of the thermoelectric elements 10 and 10' are increased. The free electrons are moved quickly, and thus the heat of the heat entering and exiting through the inside and the outside of the heat pipe 1 is fast, so that the endothermic and heat generation efficiency is improved.

7 is a state diagram showing the overall configuration according to the present invention, the heat sensing sensor unit attached to the outer peripheral surface of the heat pipe 1 between the heat absorbing portion thermoelectric element 10 and the heat generating portion thermoelectric element 10 '( 60, and a cooling controller 70 for controlling the supply of DC power by the signal transmitted from the heat sensor unit 60 is further included, the refrigerant (R) filled inside the heat pipe (1) The two-phase condensable heat exchange medium has a configuration in which the equilibrium state is maintained inside the heat pipe 1 by having a liquid part vapor bubble part, and is overheated through the endothermic part thermoelectric element 10 configured as described above. When heat is sucked into the refrigerant R inside the heat pipe 1 from the cooling target P, the equilibrium state of the liquid phase part and the vapor bubble part is broken, and the latent heat generated when the phase change from the liquid part part to the vapor bubble part is performed. Move along the inside of the heat pipe 1 As it will transfer heat to the heating portion thermoelectric element 10 '.

The latent heat in which heat sucked through the heat absorbing portion thermoelectric element 10 is transferred along the inside of the heat pipe 1 is heat-exposed in the heat generating portion thermoelectric element 10 ′ inside the heat pipe 1. Heat is released from the outside to the heat generating port (H). In this case, a fan (F) is installed at one side of the heating port (H) so that the heat is released to the outside more smoothly.

Meanwhile, as described above, the heat sucked through the heat absorbing portion thermoelectric element 10 is large inside and outside the heat generating portion thermoelectric element 10 'due to the latent heat transferred along the inside of the heat pipe 1. The temperature difference is generated, and the temperature difference between the two ends due to the seeback effect causes electricity between the two ends. In this case, when the heat pipe 1 is used as an internal electrode and direct current power is applied to both ends using the electrode element 20 attached to the outside of the heat generating unit thermoelectric element 10 'as an external electrode, power generation is generated. there is, thus advanced electric again the heat absorbing section thermoelectric element 10 Feedback to actively heat pumped to supply the necessary power for operating the power source and the fan (F) in the (feed back ) effect to increase the energy efficiency to bring back the effect of recycling some of the waste heat generated in the heating port (H), and at the same time has the advantage of reducing environmental pollution due to waste heat.

In addition, the heat sensor 60 attached to the outer circumferential surface of the heat pipe 1 between the heat absorbing part thermoelectric element 10 and the heat generating part thermoelectric element 10 ′ senses the temperature of the heat pipe 1 in real time. The sensed signal is transmitted to the cooling controller 70, and the cooling controller 70 is sensed data for cooling control of the cooling object P by the signal transmitted from the heat sensor 60. It can be utilized to provide a stable and uniform cooling function (L in Fig. 7 represents the wire for signal transmission of the cooling controller). In addition, since the structures of the heat absorbing portion thermoelectric element 10 and the heat generating portion thermoelectric element 10 'may be manufactured in the same process, it is possible to minimize the process cost and additional costs for cooling the thermoelectric elements 10 and 10'. Has a useful advantage.

As described above, the active heat pipe using the thermoelectric device of the present invention integrates a passive method using a physical tropical flow phenomenon such as a heat sink and a heat pipe and an active method using a free electron transfer phenomenon using a thermoelectric device into one device. Therefore, there is an advantage that can be effectively used in a narrow space, etc., by coating the thermoelectric element so as to surround the outer circumferential surface of the heat pipe has the advantage that the heat absorbing and heat generation to the inside and outside of the heat pipe can be maximized. In addition, there is an advantage that can be attached to the heat sensor unit to enable very fine temperature control.

Although the invention has been described in detail only with respect to the described embodiments, it will be apparent to those skilled in the art that various changes or modifications can be made within the spirit and scope of the invention, and such modifications or variations are attached to the accompanying drawings. It should fall within the scope of the claims.

Claims (7)

delete delete delete Heat pipe (1) in which both ends of the heat pipe are sealed to allow the refrigerant to flow therein, the heat absorbing portion thermoelectric element (10) coated by being wrapped around the outer circumferential surface of one end of the heat pipe (1), and the heat generation coated by being surrounded by the outer circumferential surface of the other end of the heat pipe (1) And a secondary thermoelectric element 10 'and an electrode element 20 attached to the outer side of the thermoelectric elements 10 and 10'. The thermoelectric elements 10 and 10 'are formed of a P-type semiconductor 11 and In an active heat pipe using a thermoelectric element in which N-type semiconductors 12 are alternately coated with a plurality of layers; The N-type semiconductor 12 stacked on the middle portion of the thermoelectric elements 10 and 10 'coated with the plurality of layers is formed thicker than the P-type semiconductor 11 stacked on the inner and outer surfaces. Active heat pipe using. Heat pipe (1) in which both ends of the heat pipe are sealed to allow the refrigerant to flow therein, the heat absorbing portion thermoelectric element (10) coated by being wrapped around the outer circumferential surface of one end of the heat pipe (1), and the heat generation coated by being surrounded by the outer circumferential surface of the other end of the heat pipe (1) And a secondary thermoelectric element 10 'and an electrode element 20 attached to the outer side of the thermoelectric elements 10 and 10'. The thermoelectric elements 10 and 10 'are formed of a P-type semiconductor 11 and In an active heat pipe using a thermoelectric element in which N-type semiconductors 12 are alternately coated with a plurality of layers; The P-type semiconductor 11 stacked on the middle portion of the thermoelectric elements 10 and 10 'coated with the plurality of layers is formed to be thicker than the N-type semiconductor 12 stacked on the inner and outer surfaces. Active heat pipe using. delete delete

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