KR100858462B1 - 세라믹히터 - Google Patents
세라믹히터 Download PDFInfo
- Publication number
- KR100858462B1 KR100858462B1 KR1020070047060A KR20070047060A KR100858462B1 KR 100858462 B1 KR100858462 B1 KR 100858462B1 KR 1020070047060 A KR1020070047060 A KR 1020070047060A KR 20070047060 A KR20070047060 A KR 20070047060A KR 100858462 B1 KR100858462 B1 KR 100858462B1
- Authority
- KR
- South Korea
- Prior art keywords
- sensor
- temperature sensor
- terminal
- pattern
- ceramic heater
- Prior art date
Links
- 239000000919 ceramic Substances 0.000 title claims abstract description 45
- 238000000465 moulding Methods 0.000 claims abstract description 14
- 238000010438 heat treatment Methods 0.000 claims description 33
- 238000000034 method Methods 0.000 claims description 6
- 238000005476 soldering Methods 0.000 abstract description 8
- 238000003466 welding Methods 0.000 abstract description 3
- 230000020169 heat generation Effects 0.000 abstract 2
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 235000000396 iron Nutrition 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/02—Details
- H05B3/06—Heater elements structurally combined with coupling elements or holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B1/00—Details of electric heating devices
- H05B1/02—Automatic switching arrangements specially adapted to apparatus ; Control of heating devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
- H05B3/141—Conductive ceramics, e.g. metal oxides, metal carbides, barium titanate, ferrites, zirconia, vitrous compounds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/016—Heaters using particular connecting means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/017—Manufacturing methods or apparatus for heaters
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
Abstract
Description
Claims (4)
- 발열패턴(11a)을 갖는 히터본체(10)와, 이 발열패턴(11a)의 발열단자연결부(11b)와 통전 가능하게 연결되는 발열단자(20)와, 상기 히터본체(10)에 장착되는 온도센서(30) 및 이 온도센서(30)와 통전 가능하게 연결되는 센서단자(40)를 포함하여 구성되는 세라믹히터에 있어서,상기 온도센서(30)는 히터본체(10)의 내부에 내장되는 구조로 되고, 이 온도센서(30)와 센서단자(40)를 연결시키는 연결패턴(13a)을 더 구비하되,상기 히터본체(10)는,상기 발열단자연결부(11b)를 갖는 발열패턴(11a)이 인쇄되고 발열단자연결부(11b)의 인접 부위에 접속점(11c1)을 갖는 센서단자연결부(11c)가 더 구비된 하판(11);상기 하판(11)의 상면을 덮어씌우고 그 상면 일단부에 온도센서(30)가 안착되고 타단부에 센서단자연결부(11c)의 접속점(11c1)과 접속되도록 저면까지 패턴선(13a1)이 연장되는 접속공(13a2)을 갖는 연결패턴(13a)과, 상기 센서단자연결부(11c)가 외부로 노출되도록 상하로 관통된 제1관통부(13b) 및 그 인접 부위에 발열단자연결부(11b)가 외부로 노출되도록 상하로 관통된 제2관통부(13c)를 갖는 중판(13); 및상기 중판(13)의 상면을 덮어씌우고 중앙에 연결패턴(13a) 상으로 온도센서(30)가 안착되도록 관통된 센서장착공(15a)이 구비된 상판(15);을 포함하여 구성됨을 특징으로 하는 세라믹히터.
- 삭제
- 제1항에 있어서,상기 센서장착공(15a)을 통해 연결패턴(13a)에 안착된 온도센서(30)를 덮어씌우는 몰딩부재(50)가 더 구비된 것을 특징으로 하는 세라믹히터.
- 제1항 또는 제3항에 있어서,상기 상판(15) 중 중판(13)의 각 관통부(13b,13c)에 대응되는 위치에 이들 중판(13)의 관통부(13b,13c)들과 상하 방향으로 각각 동일하게 연통된 보조관통부(15b)가 더 구비된 것을 특징으로 하는 세라믹히터.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070047060A KR100858462B1 (ko) | 2007-05-15 | 2007-05-15 | 세라믹히터 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020070047060A KR100858462B1 (ko) | 2007-05-15 | 2007-05-15 | 세라믹히터 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100858462B1 true KR100858462B1 (ko) | 2008-09-12 |
Family
ID=40023065
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020070047060A KR100858462B1 (ko) | 2007-05-15 | 2007-05-15 | 세라믹히터 |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR100858462B1 (ko) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180061861A (ko) | 2016-11-30 | 2018-06-08 | 주식회사 유라테크 | 초고온에 적합한 적층식 온도 센서 |
KR20180078747A (ko) | 2016-12-30 | 2018-07-10 | 주식회사 유라테크 | 글로우 플러그용 세라믹 발열체 및 이를 포함하는 글로우 플러그 |
KR102436016B1 (ko) | 2022-03-14 | 2022-08-25 | 주식회사 지성바이오텍 | 세라믹 히터 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200307205Y1 (ko) | 2002-12-11 | 2003-03-15 | 한성프린텍 주식회사 | 온도감지센서가 내장된 히터 |
KR20060106546A (ko) * | 2005-04-06 | 2006-10-12 | 미츠비시덴키 가부시키가이샤 | 전기 가열 조리기 |
KR100686893B1 (ko) | 2002-05-29 | 2007-02-27 | 에스펙 가부시키가이샤 | 가열장치 |
-
2007
- 2007-05-15 KR KR1020070047060A patent/KR100858462B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100686893B1 (ko) | 2002-05-29 | 2007-02-27 | 에스펙 가부시키가이샤 | 가열장치 |
KR200307205Y1 (ko) | 2002-12-11 | 2003-03-15 | 한성프린텍 주식회사 | 온도감지센서가 내장된 히터 |
KR20060106546A (ko) * | 2005-04-06 | 2006-10-12 | 미츠비시덴키 가부시키가이샤 | 전기 가열 조리기 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180061861A (ko) | 2016-11-30 | 2018-06-08 | 주식회사 유라테크 | 초고온에 적합한 적층식 온도 센서 |
KR20180078747A (ko) | 2016-12-30 | 2018-07-10 | 주식회사 유라테크 | 글로우 플러그용 세라믹 발열체 및 이를 포함하는 글로우 플러그 |
KR102436016B1 (ko) | 2022-03-14 | 2022-08-25 | 주식회사 지성바이오텍 | 세라믹 히터 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6037574A (en) | Quartz substrate heater | |
KR102052811B1 (ko) | 기판지지장치 | |
KR101170638B1 (ko) | 온도센서 내장형 세라믹 히터 | |
CN101778501B (zh) | 一种带干烧保护功能的厚膜加热组件 | |
KR100858462B1 (ko) | 세라믹히터 | |
KR101113713B1 (ko) | 소형 센서내장형 세라믹 기판 히터의 제조 방법 | |
CN108539003A (zh) | 用于制造热电模块的方法 | |
US11828490B2 (en) | Ceramic heater for heating water in an appliance | |
JP2006261095A (ja) | 面状ヒータ装置 | |
JP3128996U (ja) | 温風暖房機発熱体の電気連結構造体 | |
KR100735104B1 (ko) | 발열체와 발열판의 일체형 구조를 가지는 헤어아이론용히터구조 | |
US11641698B2 (en) | Connecting thermally-sprayed layer structures of heating devices | |
KR100840796B1 (ko) | 세라믹 발열체용 단자 | |
KR100614195B1 (ko) | 초소형 백금후막 발열소자를 이용한 헤어 아이론용 히터 및그 제조방법 | |
KR102351852B1 (ko) | 히터 및 이를 포함하는 히팅 시스템 | |
JP5244497B2 (ja) | Ptcヒーター装置及びその製造方法 | |
JP3194388U (ja) | 赤外線ヒーター | |
KR200389238Y1 (ko) | 정온도계수 써미스터를 이용한 온도보상용 히터 | |
JPH02158079A (ja) | 瞬間電気湯沸器用パネルヒータとパネルヒータを用いた瞬間電気湯沸器 | |
JP3541402B2 (ja) | 管ヒータおよびそれを用いた調理器 | |
CN211557522U (zh) | 加热器芯,加热器及包括该加热器的加热系统 | |
JP4285351B2 (ja) | セラミックヒータ及びこれを用いたガスセンサ | |
JP3117328U (ja) | 発熱体 | |
JP3183014U (ja) | 遠赤外線面状発熱体 | |
KR100579439B1 (ko) | 정온도계수 써미스터를 이용한 온수히터 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20120816 Year of fee payment: 5 |
|
FPAY | Annual fee payment |
Payment date: 20130905 Year of fee payment: 6 |
|
FPAY | Annual fee payment |
Payment date: 20140910 Year of fee payment: 7 |
|
FPAY | Annual fee payment |
Payment date: 20150904 Year of fee payment: 8 |
|
FPAY | Annual fee payment |
Payment date: 20160825 Year of fee payment: 9 |
|
FPAY | Annual fee payment |
Payment date: 20170908 Year of fee payment: 10 |
|
FPAY | Annual fee payment |
Payment date: 20180910 Year of fee payment: 11 |
|
FPAY | Annual fee payment |
Payment date: 20190930 Year of fee payment: 12 |