KR100855654B1 - Coating machine and method for operating a coating machine - Google Patents

Abstract

The applicator of the present invention for applying a substrate by sputtering comprises a process chamber and a target 3, 3 ′ positioned within the process chamber and capable of sputtering a target material in the direction of the substrate to apply the substrate. Include. The applicator aligns the sputter direction S in a direction away from the substrate for pre-sputtering the target, and sputters the material to apply the substrate by sputtering material from the targets 3, 3 ′. Means for aligning S) in the direction towards said substrate. For example, the alignment can be changed by rotating the cathodes 2, 2 ′ at an angle of 90 ^° or 180 ^° around the longitudinal axis of the flat cathode 2. The corresponding method comprises the steps of inserting the targets 3, 3 ′ into the application chamber, evacuating the application chamber, aligning the sputter direction S in a direction away from the substrate plane 4, the target. Pre-sputtering (3, 3 '), aligning the sputter direction (S) in the direction toward the substrate plane (4), and sputtering material from the target (3, 3') Applying.

Substrates, applicators, process chambers, targets, alignment means, cathodes, metal planes, drivers, magnet systems.

Description

COATING MACHINE AND METHOD FOR OPERATING A COATING MACHINE}

1A is a cross-sectional view of the applicator.

1B is a cross-sectional view of the applicator of the present invention.

2 is a plan view of a cathode structure having a rotating cathode.

3 is a cross-sectional view of the rotary cathode of the present invention.

4 is a cross-sectional view of an applicator of another embodiment of the present invention.

Brief description of symbols for the main parts of the drawings

1: compartment 2: cathode

3: target 4: carrying plane

4a, 4b, 4c: substrate 5: metal plane

6: driver 7: magnet system

The present invention includes a process chamber and a target positioned within the process chamber to enable material to be sputtered toward the substrate to apply the substrate, the applicator applying the substrate by the sputtering method, and a method of operating the applicator. It is about.

In conventional applicators, the newly inserted target must be pre-sputtered or adjusted for a period of time in vacuum before process initiation. This preliminary work is necessary because the sputtering target must be adjusted prior to the initiation of the application process, which is actually intended to ensure that the application process is safe without problems. In particular, the target must be raised to operating temperature before the start of the process by gradually increasing the sputtering power, especially when the ceramic target can be destroyed by thermal stress when high sputtering power is applied suddenly. Moreover, when the application chamber is overflowed, the target is applied with interference materials such as water molecules or dust generated from the cleaning operation. Even after cleaning the residue from the target surface, such as cutting oil, fingerprints, etc., after the target has been produced, these contaminants may penetrate to deeper molecular levels of the target material and may not be removed by the cleaning process. For this reason, pre-sputtering serves to remove these contaminants from the target surface before the actual application process begins.

In the pre-sputtering step, approximately 80 to 100 many substrates are needed. This requirement of having to pre-sputter the target every time the target is changed increases the cost. Moreover, the substrate must be disposed of because it cannot be used again.

To reduce this cost, for example, in an applicator with the substrate aligned vertically, a so-called dummy carrier for pre-sputtering may be used instead of a more expensive substrate on the carrier. However, there are two disadvantages to using a dummy. One is that when the pre-sputtering step is completed, the pile must be disposed of or cleaned of dust and stored, and the other is that the subsequently used process carrier carried through the heating device inside the applicator during operation is It does not reach the operating temperature. That is, no pre-sputtering step is used to create the desired process state. Moreover, a dummy carrier must be provided in addition to the process carrier.

Another possibility is to pivot the so-called metal shutter into the gap between the target and the substrate, the purpose of the shutter being to absorb the sputtered particles in the pre-sputtering step and to prevent undesirable application of the substrate. A disadvantage in this regard is that in addition to the sophisticated mechanical operation for turning the shutters, these shutters must pivot close to the substrate, as a result of which the coated particles released in the production process can penetrate the substrate. Additional devices for covering the surface applied in the pre-sputtering mode all increase the cost.

In view of the above, it is an object of the present invention to provide an applicator which reduces the consumption of material, in particular the consumption of material on a substrate, when the applicator is operated and a method of operating the applicator.

This object is achieved by an applicator according to claim 1 and a method according to claim 22.

The applicator of the present invention for applying a substrate by sputtering includes a process chamber and a target positioned within the process chamber and capable of sputtering a target material in the direction of the substrate to apply the substrate. The applicator has alignment means for aligning the sputter direction in a first direction to operate the applicator in a first mode of operation and for aligning the sputter direction in a second direction to operate the applicator in a second mode of operation. do. The means is formed for selectively changing the sputter direction. Thus, for example, in each mode of operation, it is possible to determine whether the sputter direction should be directed toward the substrate or whether sputtering should occur in a direction different from the direction.

The term sputter direction refers to the direction in which the sputtered material is basically moved. It is apparent to those skilled in the art that the direction of movement of the particles is dispersed with respect to the main sputter direction. However, one main movement direction can be determined in the sputter direction.

When the operation mode is switched, the alignment of the sputter direction or the change of alignment can be made by the operating personnel. The applicator is designed such that the sputter direction can be changed without interrupting operation in the application chamber, ie without venting the chamber beforehand.

In particular, the first direction is a direction toward the substrate, and the second direction is a direction away from the substrate. Thus, at various stages of operation, it is possible to flexibly change whether or not the substrate carried through the applicator is to be applied at this stage.

The direction towards the substrate basically means the direction perpendicular to the surface of the substrate or the plane of transport of the substrate through the applicator. The direction towards the substrate also means that the particles sputtered from the target in the sputtering direction can reach the substrate without any more distinct dispersion.

The applicator may be modified to be in the second mode of operation for pre-sputtering of the target and to be in the first mode of operation to apply the substrate by sputtering material from the target. A decisive feature of the invention is that at least two positions (the second position is for pre-sputtering in a direction away from the substrate and the first position is normal in the direction towards the substrate) without venting the applicator to change the alignment. For the intended application operation).

In the present invention, the cathode is formed so that the sputter direction is basically aligned perpendicular to the surface of the target. Thus, in normal application operation the sputter direction is basically aligned perpendicular to the target surface and the substrate surface. Thus, the target surface on which sputtering preferably occurs is essentially parallel to the substrate surface.

However, in pre-sputtering, the sputter direction should be aligned in a direction away from the substrate. This means that particles sputtered in the sputter direction should not reach the substrate surface. This is intended to prevent unnecessary consumption of the substrate in the pre-sputtering step. In other respects, however, since the state in the applicator is the same as that of the intended application process, an empty substrate carrier can be conveyed through the applicator for heating. This means that a pre-sputtering period can be used to create the process conditions required for operation. The carrier can already be used efficiently at the beginning of the intended application operation.

In this regard, “pre-sputtering” means preparing or pre-operating the applicator before the actual intended application process.

Using the applicator as intended reduces the material required for the substrate or dummy carrier to be disposed of later or cleaned and stored. This reduces the cost of operation of the applicator.

The aligning means for aligning the sputter direction is shaped such that the sputter direction can be changed by rotating the sputter direction at an angle, in particular, between 90 ^° and 180 ^° . Thus, the sputter direction can be rotated away from the substrate plane.

Preferably, a collecting device is provided for collecting the material sputtered from the target in the first direction. This collecting device may be a metal collector, for example. In terms of shape and alignment, the collecting device is formed or positioned so that, in pre-sputtering, the sputtered particles collide as little as possible against the transport plane for the substrate, the contamination wall, or other component located in the application chamber.

The collecting device basically has a surface located perpendicular to the second direction. However, a V-shaped arrangement of the metal collector is also conceivable in which the opening region formed by the edge is located perpendicular to the second direction so that the dispersed particles pass through the opening. The collecting device must be formed and positioned so that the particles sputtered in the pre-sputtering step impinge on the collecting area.

The applicator has in particular a flat cathode which supports the target. The flat cathode has a basically flat target surface, which is essentially parallel to the transport plane of the substrate in normal application operation.

The aligning means for aligning the sputter direction has in particular a rotating mechanism for rotating the balanced cathode. With the aid of the present invention, the sputter direction in the pre-sputtering step can be rotated relative to the sputter direction of the intended application operation. Naturally, the rotating mechanism can be operated from the outside, ie without venting the applicator, depending on whether pre-sputtering or intended application is to be performed, so that the sputtering direction can be rotated between at least two directions.

The rotating mechanism is formed so that the flat cathode can rotate about the longitudinal axis of the cathode.

The cathode can be tilted or rotated at any angle with respect to the substrate surface to pre-sputter the target. This means that the target surface is rotated away from the substrate plane, preferably laterally, inclined or backwards in the opposite direction. As a result, the sputtered particles do not impinge on the transport plane for the substrate in the pre-sputtering and therefore on the substrate carrier. Inclination of the cathode means that the axis of rotation does not necessarily have to be at the longitudinal center of the cathode. The axis of rotation can be moved parallel and slightly inclined with respect to the longitudinal axis of the cathode, so long as the action to set the direction so that the sputter direction is away from the target in the pre-sputtering step.

The rotating mechanism may comprise a motor driver.

In a further embodiment, the applicator further comprises a rotatable cathode, the rotatable cathode supporting the target and positioned such that the target is rotatable relative to the carrier structure of the cathode. Rotating cathodes generally include a cylindrical carrier on which the target material is mounted. In operation, the target is rotated to ensure uniform removal of the material. In addition, a magnet system is installed which basically determines the sputter direction.

The applicator includes a magnet system such that the target is rotatable relative to the carrier structure of the cathode. In this regard, the magnet device can be rotated with respect to the cathode between the pre-sputtering and the operating position.

The magnet system can be located on a magnet carrier. This means that the carrier can be rotated with respect to the negative pole together with the magnet device.

The cathode is located in the application chamber so as to be rotatable by a rotating mechanism together with the carrier structure and the magnet system 7.

The rotating mechanism includes a motor driver.

The cathode may also include means for positioning a first magnet system for aligning the sputter direction in the first direction, and means for locating a second magnet system for aligning the sputter direction in the second direction. Can be. Thus, the rotary magnetron is subjected to a second additional magnetic field. The first magnetic field is positioned such that, under the action of this magnetic field, the target material is sputtered in the direction of the substrate for application of the substrate, while the second magnetic field, under the action of this magnetic field, is directed in a direction away from the substrate. Positioned to be sputtered. The magnet is arranged such that the area, ie the angular section or sector, where the target material is preferably sputtered can be selected.

The first magnet system is operated in the first mode of operation, the two magnet system is operated in the second mode of operation, and the magnet system is stopped when not needed.

Instead of a magnet system in which permanent magnets are mounted, if a magnet system generated by a coil is used, the required magnetic field in each case can simply be activated or stopped. However, a magnet system with permanent magnets can also be activated or stopped by moving a sufficiently thick soft magnetic metal shield, about 5 mm thick, in front of the unneeded magnet system, which is shielded from the permanent magnet by its much higher permeability. It absorbs almost completely the emitted magnetic field and thus almost circuit-shorts it. Another possibility is to position the magnet system so that the magnet is rotated and stopped by rotating the magnetic poles towards the axis of rotation of the tubular target. As a result, the magnetic field of each "backward" rotating magnet system on the target surface is so weak that the magnetron sputtering process cannot be achieved.

The first magnet system and / or the second magnet system comprise an electromagnet that can be activated and stopped by switching on and off.

The first magnet system and / or the second magnet system may comprise permanent magnets, each of which may be activated and stopped by a shield element, in particular a soft magnetic metal shield, located between the target surface and the magnet system. have.

The first magnet system and / or the second magnet system comprise permanent magnets, and each of the magnet systems within the target can be activated and stopped by rotating the magnet pole of the respective magnet system relative to the target surface. To be located.

The object is also a method for operating an applicator, in particular any applicator of the above-described applicator,

a) inserting the target into the application chamber,

b) evacuating the application chamber,

c) aligning the sputter direction in a first direction away from the substrate plane,

d) pre-sputtering the target,

e) aligning the sputter direction in a second direction towards the substrate plane, and

f) applying the substrate by sputtering material from the target

Including;

Step c) is obtained by a method of operating an applicator, which may be performed before or after step b).

An angle between 90 ^° and 180 ^° may be formed between the first direction and the second direction, in particular. Thus, the sputtering direction of the pre-sputtering is angularly rotated by at least 90 ^° relative to the direction of the substrate, i.e., the direction in which sputtering is performed in a normal application operation. Thus, in pre-sputtering, sputtering occurs not in the direction of the substrate, but laterally with respect to the substrate, inclined with respect to the rear, or rearward in the direction opposite to the substrate. As a result, the coating material is prevented from colliding undesirably with the substrate carrier which is moved through the application chamber or in the sputtering.

In step a), in addition to the target, a collecting device for collecting the sputtered material in the first direction may be inserted into the application chamber.

The collection device may be positioned such that the openings or impingement surfaces defined by the edges are vertically aligned with respect to the second direction.

In the step e), the sputter direction can be aligned by rotating the flat cathode.

It is the sputter direction preferably be inclined at an angle of at least 90 ^o.

In step e), the sputter direction can be aligned by rotating the magnet system of the rotating negative electrode or by rotating the whole negative electrode.

In steps c) and e), the sputter direction can be aligned by actuating and stopping at least two magnet devices which can be positioned radially offset in the rotary cathode.

Other objects and advantages of the present invention will become apparent from the following description of specific embodiments.

1A is a cross-sectional view of a sub-region of an applicator. In the sectional view there are two compartments 1, 1 ', each having a flat cathode 2, 2' arranged therein. The application material is sputtered from the target surfaces 3, 3 ′ to apply the substrates 4a, 4b, 4c which are conveyed past the target in the conveying direction T. The plane 4 in which the substrates 4a, 4b, 4c are arranged in the application process is referred to below as the transport plane or the substrate plane 4.

Particles sputtered from the target surfaces 3, 3 ′ are moved toward the application surface of the substrates 4a, 4b, 4c, which direction of movement is referred to as the sputtering direction S. In the case of the flat cathodes 2, 2 ′, the sputter direction S is basically aligned perpendicular to the target surface 3, 3 ′. In general, the target surfaces 3, 3 ′ are basically aligned perpendicular to the conveying direction T of the substrates 4a, 4b, 4c and the conveying direction T and the sputtering direction S are basically in relation to each other. Vertically aligned. 1A shows the position of the cathodes 2, 2 ′ in the intended normal application operation.

The sputtering rate of the target surfaces 3, 3 ′ can be increased by supplying a conventional magnetic field to the cathodes 2, 2 ′. The magnetic device that generates the magnetic field is generally placed behind the target material, indicated by the carrying plane 4.

For example, in the pre-sputtering step of the target surface 3, 3 'required after the change of target, the series of substrates 4a, 4b, 4c is qualitatively provided that the cathodes 2, 2' are aligned as shown in FIG. The substrates 4a, 4b, 4c, which are improperly applied and are thus transported past the target surfaces 3, 3 'in this preliminary step, must be disposed of. If these substrates 4a, 4b, 4c are used, the cost before the applicator proceeds to the normal coating operation is relatively high.

1b presents a solution according to the invention for these problems. On the flat cathodes 2, 2 'and the compartments 1, 1', a device for rotating the cathodes 2, 2 'which is arranged differently from the conventional alignment (see FIG. 1A) is mounted. The rotating device is naturally formed so that it can be operated from the outside without opening and venting in the operation of the applicator. This means that switching between the two modes, "pre-sputtering" and "intentional application operation", including when the applicator is activated, can be performed by the operating personnel.

By rotating the flat cathodes 2, 2 ', the sputtering direction S, which has been directed to the substrates 4a, 4b, 4c in the normal operation shown in FIG. 1A, can be applied to the substrates 4a, 4b, 4c or 4a. It is rotated away from the conveyance plane 4 of 4b, 4c (direction S2).

In Figure 1b, a first target 3 placed in the coating compartment (1) is rotated about 90 ^O for the original alignment position (shown by the broken line search). Therefore, the sputtering direction S is also rotated in a direction parallel to the surfaces of the substrates 4a, 4b and 4c or in a direction parallel to the transport plane T.

The pre-sputtering step in order to collect the material to be sputtered from the target surface (3), the metal plane (5) is disposed parallel to the target surface of a 90 ^o rotation flat cathode 2 and 3.

In the second compartment 1 ′, the cathode 2 ′ is rotated 180 relative to its operating position (see FIG. 1A) in the pre-sputtering step. Therefore, in the pre-sputtering step, the sputter direction S2 is opposite to the sputter direction S1 in the normal operation. The metal collector 5 ′ is accordingly arranged behind the compartment 1 ′.

Naturally, for pre-sputtering, the cathodes 2, 2 ′ can be rotated obliquely in any direction away from the carrying plane 4, for example towards the rear. Thus, the metal collectors 5, 5 'are also aligned in this direction.

In the example of FIG. 1B, the axis of rotation of each cathode 2, 2 ′ corresponds to the central longitudinal axis of the cathode 2, 2 ′. However, the axis of rotation can be offset, for example laterally. The cathodes 2, 2 ′ can be rotated, inclined or pivoted by any mechanism. The rotating mechanism in this case is a motor drive, for example. It can be integrated into the cathode structure or the application compartment 1, 1 ′.

In FIG. 1B, two different cathode positions are shown, in particular for pre-sputtering of the target surfaces 3, 3 ′. In pre-sputtering the particles withdrawn from the target surface 3 are collected by the metal planes 5, 5 ′. The metal planes 5, 5 ′ can be changed along with the targets 3, 3 ′ while changing the targets.

As soon as the targets 3, 3 ′ are activated, the cathodes 2, 2 ′ are rotated to the operating position shown in FIG. 1A, and the sputter direction S is parallel to the target surface 3, 3 ′. It is rotated in the direction of the plane (4). At this position of the targets 3, 3 ′, the substrates 4a, 4b, 4c can be applied.

FIG. 2 shows a cathode structure with a rotary cathode 2 formed in a substantially cylindrical shape which can be used for example in applications such as glass coating, monitor production and the like. As can be seen in the cross-sectional view of FIG. 3, the target material 3 is located in a basically cylindrical support structure in the illustrated cathode structure. The rotary cathode 2 is rotated about the central axis a by the driver 6 to uniformly use and remove material from the target in operation.

As shown in FIG. 3 in a cross section along the longitudinal axis of the cathode 2 and a cross section perpendicular to the longitudinal axis, the cathode 2 is provided with a magnet system 7 for increasing the sputter rate. In the case of a rotary cathode, the magnet system 7 basically determines the sputter direction S1, S2. In this embodiment, the magnet system 7 is located along the radius in a particular direction S1 which basically corresponds to the sputter direction, as can be seen, in particular from the radial cross section. Thus, the magnetic field is also directed in this direction. For the application operation in the intended manner, the magnet system 7 stops in the application chamber while the target 3 is rotated around the longitudinal axis of the cathode in the direction indicated by the arrow R. FIG. To be located. In this mode of operation, the magnet system 7 is essentially perpendicular to the surface of the substrate (not shown) to which the sputtering direction S1 is to be applied.

In the case of a conventional applicator with a rotary cathode, the substrate or dummy to be disposed behind is sputtered in the pre-sputtering step, whereas in the device of the invention, the magnet system 7 of the rotary cathode is sputtered in direction S. Can be rotated around axis A to change. Similarly described with respect to a flat cathode 2 shown, in the first magnetic field is a 90 ^o rotation or toward the arrow D1, the rear (arrow D2) by 180 ^o rotation, or any desired direction, for example, inclined with respect to the rear It may be rotated in a direction away from the substrate surface or the carrying plane. In selecting the rotation angle, the configuration of the machine can be considered. When the target is ready for operation, the magnet system 7 (thus the sputter direction) is directed in the direction of transport of the substrate or substrate.

In FIG. 3, the rotation of the magnet system 7 towards the position where the magnet system 7 should be for pre-sputtering is indicated by arrows D1 and D2 and the position of the magnet system 7 after the rotation. By means of the magnet system 7 the sputter direction is rotated from the direction s1 for application to the selected direction S2 for pre-sputtering.

However, for pre-sputtering, the entire cathode 2 can be installed with the magnet system 7, indicated by arrow D 'in FIG. 3, to be rotated. The angle of rotation can thus be selected according to the machine structure.

The rotating mechanism for the magnet system 7 can have any form. For example, a motor driver may be installed which helps the magnet system 7 to be rotated about the longitudinal axis A of the cathode between the pre-sputtering step and the start of the regular application operation.

Depending on the degree of dependence on the spatial state, the rotation of the magnet system 7 between the pre-sputtering position and the operating position can be realized by carrying out an additional rotation. In this regard, the cathode 2 can be rotated as a whole by a corresponding angle, or simply the magnet carrier to which the magnet system 7 is attached can be rotated. A separate carrier for the magnet system 7 can be installed, which can be rotated with the magnet system 7 around the cathode 2.

In addition, when the rotary cathode 2 is used, the metal panel or collector surface in the application chamber is positioned in the sputter direction S2 intended for pre-sputtering. The metal panel is formed and positioned so that the sputtered material does not impinge on the substrate or the carrying plane in pre-sputtering. The metal panel can be rotated with the target surface 3 at the change of the target.

Another embodiment of the invention is shown in FIG. 4. 4 shows a cross section of an applicator having three rotary cathodes 2, 2 ′, 2 ″ positioned behind each other. Each of these cathodes 2, 2 ′, 2 ″ generates a magnetic field in the direction of the substrate plane such that the first sputter direction S1 is directed perpendicular to the substrate surface 4 in a normally intended application operation. A first magnet device 8 is provided. In addition, each of the cathodes 2, 2 ′, 2 ″ has an additional magnetic device 9 which generates a magnetic field such that the sputtering direction is rotated in a direction S2 away from the carrying plane 4. This second magnetic field, facing away, ensures that in the pre-sputtering step the sputtered material is collected by the metal panel 10 located next to the cathode 2. Particularly in the case of an applicator with vertically arranged cathodes 2, 2 ′, 2 ″, the second sputter direction S2 is rotated 180 ^{° with} respect to the first sputter direction S1. In this way, the deterioration of the application operation by the particles scraped from the metal collector 10 in the intended application operation is minimized. This effect is also true for an applicator in which the cathode is aligned horizontally, for example in the case of a glass applicator operated by a "sputter-up" manner (sputter direction S1 is upward). . In the case of an applicator operated in a “sputter down” manner and in which the cathode is aligned horizontally, in contrast, as shown in FIG. 4, the agent is rotated about 90 ^{° with} respect to the sputter direction S1 selected for the application operation. 2 sputtering direction S2 is more preferable. In such a device, the metal collector 10 may be configured to collect particles falling down. For example, a metal panel having an L-shaped cross section can be used, in which particles falling down in the horizontal cross section of the metal panel are collected. It is evident that in the “sputter down” process it is less desirable that the two sputter directions S1, S2 are rotated 180 towards each other, in which case the metal collector will be located above the cathode or substrate carrying plane 4, This is because the broken particles have to fall on the substrate passing under them.

As mentioned above, the sputtering direction S2 for the pre-sputtering operation can also be inclined or aligned rearward towards 180 ^° . The metal collector 10 will correspondingly be positioned so that the interior of the application chamber is as little contaminated as possible.

When the applicator is activated, only the second magnet system 9 is operated in the cathode in the pre-sputtering step, and the first magnet system 8 is inserted or operated in the normal application operation. Of course, the first or second magnet system 8, 9 can be operated without prior venting of the applicator, so that direct actuation switching can be made between the two actuation steps.

In all the above-described embodiments, the present invention can be implemented both in the case where the cathode or the rotary cathode is installed vertically, horizontally or inclined, depending on the shape of the applicator. Thus, the collecting means can also be positioned horizontally, inclined or vertically.

To collect material that is inadvertently separated from the metal collector, a vessel may be placed below the metal collector.

With the help of the proposed solution, it is possible to avoid using a dummy carrier or a substrate applied in the pre-sputtering step. Thus, the operating cost can be lowered overall. Moreover, there is no need to dispose of the applied substrate or dummy in the pre-sputtering step.

According to the applicator of the present invention and the method of operating the applicator, when the applicator is operated, the consumption of the material, in particular the consumption of the material on the substrate, is reduced.

Claims (34)

An applicator for applying the substrates 4a, 4b, 4c by sputtering, the process chamber and the substrates 4a, 4b, 4c located in the process chamber and for applying the substrates 4a, 4b, 4c. In an applicator comprising targets 3, 3 'capable of sputtering a target material in the direction of Align sputter direction S in a first direction S1 to operate the applicator in a first mode of operation, and sputter direction S in a second direction S2 to operate the applicator in a second mode of operation. Including an alignment means for aligning The first direction S1 is a direction facing the substrates 4a, 4b, and 4c. And the second direction (S2) is a direction away from the substrate (4a, 4b, 4c). delete The method of claim 1, The applicator applies the substrates 4a, 4b, 4c by sputtering material from the targets 3, 3 'in the first mode of operation, and the targets 3, 3 in the second mode of operation. Applicator, to pre-sputter '). The method of claim 1, And said aligning means for aligning said sputtering direction (S) is shaped such that said sputtering direction (S) can be changed by rotating said sputtering direction (S). The method of claim 4, wherein The alignment means for aligning the sputter direction S is shaped such that the sputter direction S can be changed by rotating the sputter direction S at an angle between 90 ^° and 180 ^°. Applicator characterized by. The method of claim 1, And a collecting device (5, 5 ', 10) for collecting said material sputtered from said target in said second direction. The method of claim 6, And said collecting device (5, 5 ', 10) is positioned and formed such that an opening or impingement surface defined by the edge is located perpendicular to said second direction. The method of claim 1, Applicator further comprising a flat cathode (2, 2 ') supporting the target (3, 3'). The method of claim 8, And said aligning means for aligning said sputter direction (S) comprises a rotating mechanism for rotating said balanced cathode (2, 2 '). The method of claim 9, And said rotating mechanism is formed so that said flat cathode (2, 2 ') can rotate about a longitudinal axis of said cathode (2, 2'). The method of claim 8, Applicator characterized in that the cathode (2, 2 ') can be tilted or rotated relative to the substrate surface to pre-sputter the target (3, 3'). The method of claim 10, The negative electrode 2 and 2 'are, the applicator, characterized in that it can be inclined or rotated at an angle of between 90 ^o and 180 ^o with respect to the substrate surface. The method of claim 10, And said rotating mechanism comprises a motor driver. The method of claim 1, It further comprises a rotary cathode (2, 2 ', 2' '), the rotary cathode (2, 2', 2 '') supports the target 3, the target 3 is the cathode ( 2, 2 ', 2' '), wherein the applicator is rotatably positioned. The method of claim 14, Applicator further comprising a magnet system (7) such that the target is rotatable relative to the carrier structure of the cathode (2). The method of claim 15, Applicator characterized in that the magnet system (7) is located on a magnet carrier. The method of claim 14, The applicator according to claim 1, wherein the cathode (2) together with the carrier structure and the magnet system (7) are positioned in the application chamber so as to be rotatable by a rotating mechanism. The method of claim 15, And said rotating mechanism comprises a motor driver. The method of claim 15, Means for positioning the first magnet system 8 for the cathodes 2, 2 ′, 2 ″ to align the sputter direction in the first direction S1, and the sputter direction in the second direction ( And means for positioning the second magnet system (9) for alignment in S2). The method of claim 19, Applicator characterized in that the first magnet system (8) is operated in the first mode of operation and the two-magnet system (9) is operated in the second mode of operation. The method of claim 20, At least one of the first magnet system (8) and the second magnet system (9) comprises an electromagnet which can be activated and stopped by switching on and off. The method of claim 20, At least one of the first magnet system 8 and the second magnet system 9 comprises a permanent magnet, each of the magnet systems 8, 9 being in contact with the target surface 3, 3 ′. Applicator, characterized in that it can be activated and stopped by the shielding element located. The method of claim 20, At least one of the first magnet system 8 and the second magnet system 9 comprises a permanent magnet, and each of the magnet systems 8, 9 in the target 3, 3 ′ is each of the respective ones. Applicator, characterized in that it is positioned so that it can be activated and stopped by rotating the magnet pole of the magnet system (8, 9) of the magnet against the target surface (3, 3 '). In the method of operating the applicator, a) inserting the targets 3, 3 ′ into the application chamber, b) evacuating the application chamber, c) aligning the sputter direction S in a first direction S1 away from the substrate plane 4, d) pre-sputtering the target 3, 3 ′, e) aligning the sputter direction S in a second direction S2 facing the substrate plane 4, and f) applying the substrates 4a, 4b, 4c by sputtering material from the targets 3, 3 '. Including; The step c) may be performed before or after the step b). The method of claim 24, And wherein said first direction and said second direction are different from each other. The method of claim 24, In step a), in addition to the targets 3, 3 ′, a collecting device 5, 5 ′, 10 for collecting the sputtered material in the first direction is inserted into the application chamber. To operate the applicator. The method of claim 26, And the collecting device (5, 5 ', 10) is positioned such that the openings or impingement surfaces defined by the edges are aligned perpendicular to the second direction. The method of claim 24, And in step e), said sputter direction (S) can be aligned by rotating a flat cathode (2, 2 '). The method of claim 28, And said sputter direction (S) is inclined. The method of claim 29, Method of the sputter direction (S) is operating an application, characterized in that inclined at an angle of between 90 ^o and 180 ^o. The method of claim 24, In step e), the sputter direction S is operated by rotating the magnet system 7 of the rotary cathode or by rotating the tubular cathode 2 supporting the magnet system. Way. The method of claim 24, In steps c) and e), wherein the sputter direction is aligned by actuating and stopping at least two magnet devices that can be positioned radially offset in the rotary cathode. The method of claim 24, 24. A method of operating an applicator, wherein said applicator is an applicator according to any one of claims 1 to 23. The method of claim 25, And an angle of between 90 and 180 degrees is formed between the first direction and the second direction.

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