KR100846374B1 - 광 커넥터 및 기판 - Google Patents
광 커넥터 및 기판 Download PDFInfo
- Publication number
- KR100846374B1 KR100846374B1 KR1020060097788A KR20060097788A KR100846374B1 KR 100846374 B1 KR100846374 B1 KR 100846374B1 KR 1020060097788 A KR1020060097788 A KR 1020060097788A KR 20060097788 A KR20060097788 A KR 20060097788A KR 100846374 B1 KR100846374 B1 KR 100846374B1
- Authority
- KR
- South Korea
- Prior art keywords
- optical
- connector
- substrate
- main body
- signal
- Prior art date
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/30—Optical coupling means for use between fibre and thin-film device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/36—Mechanical coupling means
- G02B6/38—Mechanical coupling means having fibre to fibre mating means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10121—Optical component, e.g. opto-electronic component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10295—Metallic connector elements partly mounted in a hole of the PCB
- H05K2201/10303—Pin-in-hole mounted pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10962—Component not directly connected to the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
- H05K3/305—Affixing by adhesive
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Couplings Of Light Guides (AREA)
- Mechanical Coupling Of Light Guides (AREA)
Abstract
Description
Claims (4)
- 광신호를 전송하는 광도파로가 형성된 기판에 실장되어 상기 기판과 외부 사이의 광신호의 전송을 매개하는 광 커넥터로서,광의 전송을 담당하는 커넥터 본체와, 상기 커넥터 본체를 상기 기판에 실장할 때 상기 커넥터 본체를 상기 기판에 고착시키는 고착 핀으로 이루어지며,상기 기판에는 전자 부품이 실장되고,상기 커넥터 본체가 상기 고착 핀이 삽입 통과되는 핀 삽입 구멍을 가지며, 또한 상기 기판과 외부 사이의 전기 신호의 전송을 매개하는 전기 접속부를 구비하고,상기 고착 핀이 상기 커넥터 본체와 상기 기판상의 전자 부품 사이의 전기 신호의 전송도 담당하는 것인 것을 특징으로 하는 광 커넥터.
- 제 1 항에 있어서,상기 커넥터 본체가 상기 커넥터 본체 내의 광로의 방향을 변환하는 광로 변환부를 구비한 것인 것을 특징으로 하는 광 커넥터.
- 삭제
- 광신호를 전송하는 광도파로가 형성되는 동시에, 전기 신호와 광신호 사이에 서의 변환을 담당하는 신호 매체 변환 소자가 상기 광도파로와의 사이에서 광신호의 전송을 담당하는 위치에 탑재된 기판 본체와, 상기 기판 본체에 실장되어 상기 기판 본체와 외부 사이의 광신호의 전송을 담당하는 광 커넥터로 이루어진 기판으로서,상기 광 커넥터는 광의 전송을 담당하는 커넥터 본체와, 상기 광 커넥터 본체를 상기 광 커넥터 본체와 상기 광도파로 사이에서 광신호가 전송되는 위치에 고착시키는 고착 핀으로 이루어지며,상기 기판 본체 및 상기 커넥터 본체가 상기 고착 핀이 삽입 통과되는 핀 삽입 구멍을 갖는 것인 것을 특징으로 하는 기판.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006003893A JP2007187742A (ja) | 2006-01-11 | 2006-01-11 | 光コネクタおよび基板 |
JPJP-P-2006-00003893 | 2006-01-11 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20070075252A KR20070075252A (ko) | 2007-07-18 |
KR100846374B1 true KR100846374B1 (ko) | 2008-07-15 |
Family
ID=38232829
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020060097788A KR100846374B1 (ko) | 2006-01-11 | 2006-10-09 | 광 커넥터 및 기판 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20070160330A1 (ko) |
JP (1) | JP2007187742A (ko) |
KR (1) | KR100846374B1 (ko) |
CN (1) | CN101000396A (ko) |
TW (1) | TW200732723A (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011154951A2 (en) * | 2010-06-07 | 2011-12-15 | Fci | Optical system |
CN105142343B (zh) * | 2015-08-31 | 2017-09-22 | 中航光电科技股份有限公司 | 印制板组件及其连接器锁紧装置 |
JP7261404B2 (ja) * | 2018-06-01 | 2023-04-20 | 株式会社日本マイクロニクス | 接続装置の製造方法 |
JP2020016756A (ja) * | 2018-07-25 | 2020-01-30 | 日東電工株式会社 | 光導波路部材コネクタおよびその製造方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5420954A (en) | 1993-05-24 | 1995-05-30 | Photonics Research Incorporated | Parallel optical interconnect |
KR20000025887A (ko) * | 1998-10-15 | 2000-05-06 | 윤종용 | 광커넥터 모듈 |
JP2004020973A (ja) | 2002-06-18 | 2004-01-22 | Sumitomo Electric Ind Ltd | 光通信装置 |
US20040114866A1 (en) * | 2002-12-10 | 2004-06-17 | Mitsubishi Denki Kabushiki Kaisha | Optical path-changing connector |
US20050105860A1 (en) | 2003-02-24 | 2005-05-19 | Ngk Spark Plug Co., Ltd. | Optical device mounted substrate assembly |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5195154A (en) * | 1990-04-27 | 1993-03-16 | Ngk Insulators, Ltd. | Optical surface mount technology (o-smt), optical surface mount circuit (o-smc), opto-electronic printed wiring board (oe-pwb), opto-electronic surface mount device (oe-smd), and methods of fabricating opto-electronic printed wiring board |
US6384896B1 (en) * | 1997-10-02 | 2002-05-07 | Unisia Jecs Corporation | Microfilm search device |
-
2006
- 2006-01-11 JP JP2006003893A patent/JP2007187742A/ja not_active Withdrawn
- 2006-09-22 US US11/525,083 patent/US20070160330A1/en not_active Abandoned
- 2006-10-09 KR KR1020060097788A patent/KR100846374B1/ko active IP Right Grant
- 2006-10-27 TW TW095139702A patent/TW200732723A/zh unknown
- 2006-11-17 CN CNA2006101484873A patent/CN101000396A/zh active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5420954A (en) | 1993-05-24 | 1995-05-30 | Photonics Research Incorporated | Parallel optical interconnect |
KR20000025887A (ko) * | 1998-10-15 | 2000-05-06 | 윤종용 | 광커넥터 모듈 |
JP2004020973A (ja) | 2002-06-18 | 2004-01-22 | Sumitomo Electric Ind Ltd | 光通信装置 |
US20040114866A1 (en) * | 2002-12-10 | 2004-06-17 | Mitsubishi Denki Kabushiki Kaisha | Optical path-changing connector |
US20050105860A1 (en) | 2003-02-24 | 2005-05-19 | Ngk Spark Plug Co., Ltd. | Optical device mounted substrate assembly |
Also Published As
Publication number | Publication date |
---|---|
TW200732723A (en) | 2007-09-01 |
JP2007187742A (ja) | 2007-07-26 |
CN101000396A (zh) | 2007-07-18 |
US20070160330A1 (en) | 2007-07-12 |
KR20070075252A (ko) | 2007-07-18 |
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