KR100838265B9 - 반도체 패키지 핸들링장치 - Google Patents

반도체 패키지 핸들링장치

Info

Publication number
KR100838265B9
KR100838265B9 KR1020070023463A KR20070023463A KR100838265B9 KR 100838265 B9 KR100838265 B9 KR 100838265B9 KR 1020070023463 A KR1020070023463 A KR 1020070023463A KR 20070023463 A KR20070023463 A KR 20070023463A KR 100838265 B9 KR100838265 B9 KR 100838265B9
Authority
KR
South Korea
Prior art keywords
handling apparatus
semiconductor packages
packages
semiconductor
handling
Prior art date
Application number
KR1020070023463A
Other languages
English (en)
Other versions
KR100838265B1 (ko
Inventor
임재영
Original Assignee
한미반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=39771403&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR100838265(B9) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 한미반도체 주식회사 filed Critical 한미반도체 주식회사
Priority to KR1020070023463A priority Critical patent/KR100838265B1/ko
Application granted granted Critical
Publication of KR100838265B1 publication Critical patent/KR100838265B1/ko
Publication of KR100838265B9 publication Critical patent/KR100838265B9/ko

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H01L21/67265—Position monitoring, e.g. misposition detection or presence detection of substrates stored in a container, a magazine, a carrier, a boat or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020070023463A 2007-03-09 2007-03-09 반도체 패키지 핸들링장치 KR100838265B1 (ko)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020070023463A KR100838265B1 (ko) 2007-03-09 2007-03-09 반도체 패키지 핸들링장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020070023463A KR100838265B1 (ko) 2007-03-09 2007-03-09 반도체 패키지 핸들링장치

Publications (2)

Publication Number Publication Date
KR100838265B1 KR100838265B1 (ko) 2008-06-17
KR100838265B9 true KR100838265B9 (ko) 2024-07-31

Family

ID=39771403

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020070023463A KR100838265B1 (ko) 2007-03-09 2007-03-09 반도체 패키지 핸들링장치

Country Status (1)

Country Link
KR (1) KR100838265B1 (ko)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5312857B2 (ja) * 2008-06-30 2013-10-09 Ｔｏｗａ株式会社 基板の切断方法及び装置
KR101411053B1 (ko) * 2012-10-30 2014-06-30 세메스 주식회사 패키지 개별화 장치
CN108275303A (zh) * 2018-02-08 2018-07-13 苏州公高自动化设备有限公司 一种自动ic视觉包装机
KR102581147B1 (ko) * 2018-07-12 2023-09-25 (주)테크윙 전자부품 재배치장치
KR20230056283A (ko) 2021-10-20 2023-04-27 (주)디오네스 트레이 내의 자재의 안착 검사 장치, 방법 및 모듈
KR102441250B1 (ko) * 2022-02-21 2022-09-07 (주)네온테크 레이저를 사용하여 소재의 들뜸을 측정하는 검출 시스템 및 이를 사용한 소재의 들뜸을 측정하는 방법
KR102682563B1 (ko) * 2023-06-07 2024-07-08 제너셈(주) 트레이 운반 모듈을 구비하는 패키지 처리 시스템

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57147247A (en) 1981-03-06 1982-09-11 Hitachi Ltd Automatic inspecting device for semiconductor chip
KR100429875B1 (ko) * 2001-07-23 2004-05-04 삼성전자주식회사 트레이 내에 수납된 반도체 칩들의 수납 상태를 검사하는방법
KR100633798B1 (ko) 2004-07-07 2006-10-16 최종주 반도체 안착상태 및 외관형상 검사장치
KR20060041454A (ko) * 2004-11-09 2006-05-12 삼성전자주식회사 칩 외관 자동검사 장치
KR100727882B1 (ko) 2006-04-05 2007-06-14 삼성전자주식회사 테스트 핸들러

Also Published As

Publication number Publication date
KR100838265B1 (ko) 2008-06-17

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