KR100834337B1 - Pressure sensor device and manufacturing method thereof - Google Patents

Abstract

The present invention relates to a pressure sensor device and a method for manufacturing the same, the technical problem to be solved is excellent sensing sensitivity in the high pressure region, the structure and manufacturing process is simple, the manufacturing process in a low temperature state to improve the reliability and productivity It is.

To this end, the present invention provides a flexible printed circuit board, which has a pressure sensing hole formed at a lower portion thereof, a pressure sensor chip adhered to an upper surface of the base corresponding to the pressure sensing hole, and an upper surface of the base and electrically connected to the pressure sensor chip. And a connector encapsulated to encapsulate the pressure sensor chip, at least one conductive pin electrically connected to the flexible circuit board, and seated on an upper surface of the base, which is the outer circumference of the flexible circuit board, the connector and the base. The pressure sensor device which consists of a case which is pressed in the outer periphery of the and which does not isolate a connector from a base is disclosed.

Pressure Sensor Chip, High Pressure, Base, Flexible Circuit Board, Metal Cover

Description

PRESSURE SENSOR DEVICE AND MANUFACTURING METHOD THEREOF

Figure 1a is a cross-sectional view showing a pressure sensor device according to the present invention, Figure 1b is a plan view showing a flexible circuit board without the pressure sensor chip mounted in Figure 1a, Figure 1c is a plan view showing a metal cover of Figure 1a. 1D is a sectional view taken along the line 1d-1d in FIG. 1C, and FIG. 1E is a sectional view taken along the line 1e-1e in FIG. 1C.

2 is a flowchart illustrating a manufacturing method of a pressure sensor device according to the present invention.

3A to 3G are cross-sectional views illustrating a method of manufacturing a pressure sensor device according to the present invention.

<Description of Symbols for Main Parts of Drawings>

100; Pressure sensor device according to the present invention

110; Base 111; Pressure sensing hole

112; Seating groove 113; Body

114; Engaging member 115;

116; O-ring 120; Pressure sensor chip

121; Adhesive 130; Flexible circuit board

131; First region 132; Second area

133; Third region 134; Seating hole

135; Coupling hole 136; Driver driver integrated circuit chip

137; Adhesive 140; Conductive wire

150; Encapsulant 160; connector

161; Conductive pin 162; O-ring

170; Metal cover 171; First area

172; Second region 173; Third area

174; Fourth region 175; Incision

180; case

The present invention relates to a pressure sensor device and a method for manufacturing the same, and more particularly, has excellent sensing sensitivity in a high pressure region, a simple structure and a manufacturing process, and a manufacturing process in a low temperature state, thereby improving reliability and productivity. A pressure sensor device and a method of manufacturing the same.

In general, since the pressure sensor device can measure not only pressure but also various physical quantities such as flow rate, flow rate, and sound intensity, it is widely used in industries such as automobile, medical, and industrial measurement.

Such a conventional pressure sensor device includes a base coupled to various pressure measurement objects, a silicon strain gauge coupled to the base to sense pressure, a printed circuit board on which the silicon strain gauge is wire bonded and encapsulated, and the silicon And a case for covering the strain gauge and the like, and a connector for drawing electrical signals from the silicon strain gauge to the outside.

Among such pressure sensor devices, in particular, the pressure sensor device used in the high pressure region (approximately 30 to 400 bar) has a disadvantage in that various complex structures for securing rigidity must be adopted because of high mechanical strength. Of course, this complicates the manufacturing process steps.

In addition, the conventional pressure sensor device has a disadvantage that a screen printing process and a high temperature process (400 ~ 600 ℃) to use the silicon strain gauge on the base has a disadvantage. Of course, this not only complicates the manufacturing process but also uses a high temperature process, which lowers the reliability and productivity of the pressure sensor device.

In addition, a conventional pressure sensor device requires an alignment device for aligning and bonding a silicon strain gauge to a base, and also requires a plurality of welding processes for bonding a printed circuit board or a case.

The present invention is to overcome the above-mentioned conventional problems, an object of the present invention is to provide excellent sensing sensitivity in the high pressure region, simple structure and manufacturing process, to improve the reliability and productivity by proceeding the manufacturing process at low temperature The present invention provides a pressure sensor device and a method of manufacturing the same.

In order to achieve the above object, a pressure sensor device according to the present invention includes a base formed by penetrating a pressure sensing hole in a vertical direction, a pressure sensor chip adhered to an upper surface of a base corresponding to the pressure sensing hole, and an upper surface of the base. A flexible printed circuit board bonded to and electrically connected to the pressure sensor chip, an encapsulant for encapsulating the pressure sensor chip, a connector seated on an upper surface of the base and disposed on an outer circumference of the flexible circuit board. And a case that is inserted into the outer circumference of the connector and the base to prevent the connector from being separated from the base, wherein the connector is provided with at least one conductive pin and is electrically connected to the flexible circuit board. The flexible circuit board includes a first region in which a seating hole is formed in a center of the pressure sensor chip, and the first region Is connected is connected to the second region and the second region is bent in an upper direction comprises at least one third region of the coupling hole is formed such that the conductive pins are electrically connected to the connector.
The base has a pressure sensing hole penetrated in the vertical direction in the center, the upper surface is connected to the pressure sensing hole, the body is formed with a seating groove so that the pressure sensor chip is seated, protrudes in the lower direction of the body to the pressure sensing target And a coupling member coupled to the protrusion and a protrusion on which the case is mounted to protrude a predetermined length in a horizontal direction of the body.
The pressure sensor chip may be attached to the base with an adhesive.
The flexible circuit board may be attached to the base with an adhesive.
The pressure sensor chip may be electrically connected to the flexible circuit board by a conductive wire.
A driver driver integrated circuit chip may be electrically connected to the flexible circuit board.
The conductive pin may be electrically connected to the third region of the flexible circuit board by soldering.
The encapsulant may be a silicone gel.
An O-ring may be interposed between the connector and the case.
The connector may be located inside the metal cover to be positioned above the pressure sensor chip, the metal cover may be electrically connected to the flexible circuit board.
The metal cover may include a first region positioned on an upper portion of the pressure sensor chip located inside the connector, a second region connected to the first region located on a side of the pressure sensor chip, and a second region formed on the second region. A third region connected between the base and the connector and electrically connected to a circuit pattern of the flexible circuit board, and connected to the third region to extend a predetermined length to the outside of the connector, It may comprise a fourth area in contact.
The metal cover may further include an incision groove formed at a side thereof to allow the flexible circuit board to pass therethrough.
In addition, in order to achieve the above object, the manufacturing method of the pressure sensor device according to the present invention comprises the steps of preparing a base formed by penetrating the pressure sensing hole in the vertical direction, the pressure sensor on the upper surface of the base corresponding to the pressure sensing hole Bonding a chip, bonding a flexible circuit board to an upper surface of the base, electrically connecting the pressure sensor chip and the flexible circuit board, and encapsulating the pressure sensor chip; Preparing a connector provided with a conductive pin of the connector, electrically connecting the conductive pin of the connector to the flexible circuit board, and forcing the case to the outer periphery of the connector and the base, so that the connector is not separated from the base. And the flexible circuit board used in the bonding step of the flexible circuit board comprises: the pressure sensor At least one first region having a seating hole formed at a center thereof, a second region connected to the first region to be bent upwards, and at least one conductive pin of the connector to be electrically connected to the second region It may be made of a third region in which the coupling hole of the.
The base used in the base preparation step is formed with a pressure sensing hole penetrated in the vertical direction in the center, the upper surface is connected to the pressure sensing hole, the body is formed with a seating groove for mounting the pressure sensor chip, the lower direction of the body It may be made of a coupling member which is protruded to be coupled to the pressure sensing target, and a predetermined length protruding in the outer circumferential direction of the body to seat the case.
In the attaching of the pressure sensor chip, the pressure sensor chip may be attached to the base with an adhesive.
In the attaching of the flexible circuit board, the flexible circuit board may be attached to the base with an adhesive.
In the attaching of the pressure sensor chip, the pressure sensor chip may be electrically connected to the flexible circuit board by a conductive wire.
The driver driver integrated circuit chip may be electrically connected to the flexible circuit board used in the bonding step of the flexible circuit board.
In the preparing of the connector, the conductive pins of the connector may be electrically connected to each other by soldering to the third region of the flexible circuit board.
The encapsulant used in the encapsulation step may be a silicone gel.
An interference fit step of the case may be performed after an O-ring is further interposed between the connector and the case.
The connector used in the connector preparation step may be located inside the metal cover to be located above the pressure sensor chip, the metal cover may be electrically connected to the flexible circuit board.
The metal cover used in the connector preparation step may include a first region positioned on an upper portion of the pressure sensor chip, a second region connected to the first region and positioned on a side of the pressure sensor chip, and a second region. A third region connected between the base and the connector and electrically connected to a circuit pattern of the flexible circuit board, and connected to the third region to extend a predetermined length to the outside of the connector, It may be made of a fourth region in contact.
In the metal cover used in the connector preparation step, a cutout groove may be further formed at a side of the flexible circuit board to pass therethrough.

delete

delete

delete

delete

delete

delete

delete

delete

delete

delete

delete

delete

delete

delete

delete

delete

delete

delete

delete

delete

delete

delete

delete

delete

delete

As described above, the pressure sensor device and the method of manufacturing the same according to the present invention have a pressure sensor chip strongly adhered to a base with a high strength adhesive, and the periphery of the pressure sensor chip is encapsulated with an encapsulant, thereby making it possible to detect a gas or Fluid or the like does not penetrate the periphery of the pressure sensor chip into the internal space, and thus various structures therein do not become contaminated and broken. In addition, the case is pressed against the outer periphery of the base and the connector, so that the pressure sensor device according to the present invention has a structure that is robust to external force. Of course, the pressure sensor device is manufactured with a small number of bases, pressure sensors, connectors, and cases, thereby simplifying the manufacturing process steps.

In addition, the pressure sensor device and the method of manufacturing the same according to the present invention do not require a screen printing process by simply attaching the pressure sensor chip to the base using a high-strength adhesive, and can perform the bonding process at a low temperature (about 150 ° C.). . Therefore, the manufacturing process is simplified and the low temperature process is used, thereby improving the reliability and productivity of the pressure sensor device.

In addition, the pressure sensor device and the method of manufacturing the same according to the present invention can be more stably protect the internal structures by coupling the metal cover inside the connector. In addition, since the metal cover is electrically connected to the flexible circuit board, not only the grounding of various circuits is easy but also the various circuits can be safely protected from static electricity.

In addition, the pressure sensor device and the method of manufacturing the same according to the present invention do not require any alignment device of the conventional pressure sensor chip because the pressure sensor chip is mounted and adhered to a mounting hole provided in the base.

In addition, the pressure sensor device and the manufacturing method thereof according to the present invention forcibly couple the case to the outer periphery of the base and the connector in a force-fitting manner, thus eliminating the need for conventional welding processes.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings such that those skilled in the art may easily implement the present invention.

Figure 1a is a cross-sectional view showing a pressure sensor device according to the present invention, Figure 1b is a plan view showing a flexible circuit board without the pressure sensor chip mounted in Figure 1a, Figure 1c is a plan view showing a metal cover of Figure 1a. 1D is a sectional view taken along the line 1d-1d in FIG. 1C, and FIG. 1E is a sectional view taken along the line 1e-1e in FIG. 1C.

As shown in FIG. 1A, the pressure sensor device 100 according to the present invention includes a base 110, a pressure sensor chip 120, a flexible circuit board 130, a conductive wire 140, and an encapsulant. 150, a connector 160, a metal cover 170, and a case 180.

The base 110 has a pressure sensing hole 111 penetrated in the vertical direction. More specifically, the base 110 is formed by penetrating the pressure sensing hole 111 in the vertical direction in the center, the upper surface is connected to the pressure sensing hole 111, the seating groove in which the pressure sensor chip 120 is seated ( 112 is formed body 113, the coupling member 114 is formed to protrude in the lower direction of the body 113 is coupled to the pressure sensing target, and a predetermined length in the horizontal direction of the body 113 is the case 180 may be formed of the protrusion 115 is seated.

Here, the O-ring 116 may be further coupled to the coupling member 114 of the base 110 so that gas or fluid does not leak from the pressure sensing target to the outside. In addition, the base 110 may be formed of any one selected from steel, stainless steel, and equivalents thereof so as not to be deformed or damaged by an external force, but the material is not limited thereto.

The pressure sensor chip 120 is adhered to an upper surface of the base 110 corresponding to the pressure sensing hole 111. More specifically, the pressure sensor chip 120 is bonded to the mounting groove 112 formed in the base 110 through the adhesive 121. Here, the adhesive 121 may be any one selected from high strength epoxy adhesives and their equivalents. The gas or liquid through the pressure sensing hole 111 formed in the base 110 by the adhesive 121 may not penetrate the periphery of the pressure sensor chip 120 and be transferred upward. In addition, the pressure sensor chip 120 may be a silicon pressure sensor chip formed through a conventional semiconductor process. That is, the pressure sensor chip 120 may have a structure in which an anisotropic etching region is formed at a lower portion thereof, a dia frame is formed at an upper portion thereof, and a plurality of piezoresistors are formed in the dia frame. It does not limit the structure of 120.

The flexible circuit board 130 is adhered to an upper surface of the base 110 and is electrically connected to the pressure sensor chip 120. Of course, the flexible circuit board 130 may be adhered to the top surface of the base 110 with an adhesive 137.

Here, the adhesive force of the adhesive 137 that adheres the flexible circuit board 130 to the base 110 may be smaller than that of the adhesive 121 that adheres the pressure sensor chip 120 to the base 110. That is, the pressure of the gas or the fluid through the pressure sensing hole 111 of the base 110 affects only the pressure sensor chip 120 and hardly affects the flexible circuit board 130.

As illustrated in FIGS. 1A and 1B, the flexible circuit board 130 may include a first region 131 having a seating hole 134 formed at a center thereof so that the pressure sensor chip 120 is positioned, and the first region 131. At least one coupling to the second region 132 connected to the region 131 and bent upward, and the conductive pin 161 of the connector 160 is electrically connected to the second region 132. It may include a third region 133 in which the hole 135 is formed. Here, the driver driver integrated circuit chip 136 may be electrically connected to the first region 131 in advance. Of course, a plurality of circuit patterns 138 may be formed in the first region 131, the second region 132, and the third region 133. In addition, a circuit pattern 138a having a relatively wide width is formed around the first region 131 of the flexible circuit board 130, which is an area electrically connected to the metal cover 170.

The conductive wire 140 electrically connects the pressure sensor chip 120 and the flexible circuit board 130. In this way, the pressure signal sensed by the pressure sensor chip 120 is transmitted to the flexible circuit board 130. Of course, the signal transmitted as described above is amplified by the driver driver IC chip 136 and then transmitted to the external electronic device through the conductive pin 161 installed in the connector 160. In addition, the conductive wire 140 may be formed of any one selected from a gold wire, an aluminum wire, a copper wire, and an equivalent thereof, but the material is not limited thereto.

The encapsulant 150 covers the pressure sensor chip 120 and the conductive wire 140. The encapsulant 150 basically serves to prevent damage or breakage of the pressure sensor chip 120 and the conductive wire 140. In addition, the encapsulant 150 may be deformed together at the time of minute deformation of the pressure sensor chip 120 by using any one selected from silicon gel and its equivalents.

The connector 160 is positioned on the upper surface of the base 110 and at the same time serves to protect the pressure sensor chip 120 and the flexible circuit board 130 from the external environment. The connector 160 may be formed of any one selected from ordinary plastic, nylon, and equivalents thereof, but the present invention is not limited thereto. In addition, a plurality of conductive pins 161 are formed in the connector 160. The conductive pins 161 are soldered and connected to the third region 133 of the flexible circuit board 130 described above. That is, the conductive pin 161 is connected to the coupling hole 135 formed in the third region 133 of the flexible circuit board 130 by soldering. Accordingly, the electrical signal through the flexible circuit board 130 is eventually transmitted to the external electronic device through the conductive pin 161. The conductive pin 161 may be formed of any one selected from a nickel alloy, a copper alloy, and an equivalent thereof, but the material is not limited thereto.

1A and 1C to 1F, the metal cover 170 is positioned inside the connector 160 as an upper portion of the pressure sensor chip 120 to approximately drive the pressure sensor chip 120 and the drive. The driver integrated circuit chip 136 may be covered. In addition, the metal cover 170 may be electrically connected to the flexible circuit board 130, and thus may be used for various ground or static electricity blocking. The metal cover 170 is connected to the first region 171 and the first region 171 located above the pressure sensor chip 120 and the driver driver integrated circuit chip 136 and the pressure sensor chip. And a second region 172 positioned at a side of the 120 and the driver driver integrated circuit chip 136, and connected between the base 110 and the connector 160 connected to the second region 172. It may include a third region 173 and a fourth region 174 connected to the third region 173 and in contact with the top surface 117 of the base 110. As such, the third region 173 of the metal cover 170 is interposed between the base 110 and the connector 160 such that the metal cover 170 does not move inside the connector 160. . In addition, the metal cover 170 may further include a cutout groove 175 at a side thereof to allow the flexible circuit board 130 to pass therethrough.

Here, the third region 173 of the metal cover 170 may be electrically connected to the circuit pattern 138a formed on the flexible circuit board 130 as shown in FIG. 1F. Of course, the third region 173 of the metal cover 170 is not easily separated from the circuit pattern 138a because the third region 173 is pressed downward by the connector 160. Meanwhile, the fourth region 174 of the metal cover 170 is in contact with the upper surface 117 of the metal base 110. Therefore, the ground signal, the static electricity, and the like of the flexible circuit board 130 are absorbed by the base 110 of a metal material having a relatively large volume.

The case 180 is forcibly fitted to the outer periphery of the connector 160 and the base 110, thereby preventing the connector 160 from being separated from the base 110. The case 180 may also be formed of any one selected from steel, stainless steel, and equivalents thereof, but the material is not limited thereto. In addition, since the O-ring 162 is further interposed between the connector 160 and the case 180, moisture or external contaminants may be formed along the gap between the connector 160 and the case 180. The base 110 is prevented from penetrating into the space formed.

Thus, in the pressure sensor device 100 according to the present invention, the pressure sensor chip 120 is strongly adhered to the base 110 with a high strength adhesive 121, and the periphery of the pressure sensor chip 120 is all encapsulated. By encapsulation to 150, the gas or the fluid, which is the pressure sensing target, does not penetrate through the periphery of the pressure sensor chip 120 and penetrate into the internal space formed by the connector 160 and the base 110, and thus, various types of internal The structures are not damaged and broken. In addition, the case 180 is forcibly fitted to the outer periphery of the base 110 and the connector 160, so that the pressure sensor device 100 according to the present invention has a structure that is robust to external force. Of course, in the present invention, since the number of components is small, the manufacturing cost is low and the manufacturing process is simplified.

In addition, the pressure sensor device 100 according to the present invention is coupled to the metal cover 170 inside the connector 160, it is possible to more stably protect the internal structures. In addition, since the metal cover 170 is electrically connected to the flexible circuit board 130, not only the grounding of various circuits is easy but also the various circuits may be protected from static electricity.

In addition, since the pressure sensor device 100 according to the present invention mounts and adheres the pressure sensor chip 120 to the seating hole 134 provided in the base 110, the alignment of the pressure sensor chip 120 as in the related art is conventional. There is no need for a device at all.

Moreover, since the pressure sensor device 100 according to the present invention forcibly couples the case 180 to the outer circumferences of the base 110 and the connector 160 in a force-fitting manner, there is no need for a conventional welding process. .

2 is a flowchart illustrating a manufacturing method of a pressure sensor device according to the present invention.

As shown in FIG. 2, the method for manufacturing the pressure sensor device 100 according to the present invention includes preparing a base 110 in which a pressure sensing hole 111 is formed (S1) and the pressure sensing hole 111. Attaching the pressure sensor chip 120 to the upper surface of the base 110 corresponding to the step S2, and attaching the flexible circuit board 130 to the upper surface of the base 110, and the pressure sensor chip 120. ) Electrically connecting the flexible circuit board 130 (S3), encapsulating the pressure sensor chip 120 (S4), and at least one conductive pin 161. Preparing the 160, electrically connecting the conductive pins 161 of the connector 160 to the flexible circuit board 130 (S5), and the metal cover 170 inside the connector 160. Coupling step (S6), and the case 180 is forcibly fitted on the outer periphery of the connector 160 and the base 110, the large from the base 110 And a step (S7) of the emitter 160 from being separated.

3A to 3G are cross-sectional views illustrating a method of manufacturing a pressure sensor device according to the present invention. Referring to the flowchart shown in FIG. 2 and FIGS. 3A to 3G, a method of manufacturing the pressure sensor device 100 according to the present invention is as follows.

As shown in FIG. 3A, in the preparing step S1 of the base 110, the base 110 having the pressure sensing hole 111 penetrated in the vertical direction is prepared. Here, the base 110 has a pressure sensing hole 111 penetrating through the center in the vertical direction, the upper surface is connected to the pressure sensing hole 111, the mounting groove 112, the pressure sensor chip 120 is seated The formed body 113, the coupling member 114 is formed to protrude in the lower portion of the body 113 and coupled to the pressure sensing target, and the case to be protruded a predetermined length in the horizontal outer peripheral direction of the body 113 180 may be formed of the protrusion 115 is seated. In addition, the O-ring 116 may be further coupled to the coupling member 114 to prevent leakage of gas or liquid from the pressure sensing target.

As shown in FIG. 3B, in the bonding step S2 of the pressure sensor chip 120, the pressure sensor chip 120 is attached to an upper surface of the base 110 corresponding to the pressure sensing hole 111. That is, the pressure sensor chip 120 is bonded to the mounting groove 112 formed in the base 110 with an adhesive 121. Of course, after the adhesion of the pressure sensor chip 120, the adhesive 121 is cured by performing a low temperature process of about 150 ° C. Here, the adhesive 121 may use any one selected from a high strength epoxy adhesive and its equivalents, but the material is not limited thereto. By the adhesion of the pressure sensor chip 120, the gas or liquid through the pressure sensing hole 111 formed in the base 110 does not pass in the substantially upper direction of the base 110. In addition, since the adhesive 121 has high strength, no gap is formed between the mounting groove 112 and the adhesive 121 of the base 110 or between the pressure sensor chip 120 and the adhesive 121. .

As shown in FIG. 3C, in the bonding step S3 of the flexible circuit board 130, the flexible circuit board 130 is adhered to an upper surface of the base 110, and then the pressure sensor chip 120 and the The flexible circuit board 130 is electrically connected to each other by the conductive wire 140.

Here, the driver driver IC chip 136 may be electrically connected to the flexible circuit board 130 in advance. Of course, the flexible circuit board 130 is bonded to the upper surface of the base 110 through the adhesive 137, and then the wire bonding process is performed.

The flexible circuit board 130 is connected to the first region 131 having a seating hole 134 formed at the center of the pressure sensor chip 120 and the first region 131 and bent upward. A third region having a second region 132 and at least one coupling hole 135 connected to the second region 132 to electrically connect the conductive pin 161 of the connector 160 to be described below. 133).

As shown in FIG. 3D, in the encapsulation step (S4), the pressure sensor chip 120 and the conductive wire 140 are encapsulated with the encapsulant 150. By the encapsulation process, the pressure sensor chip 120 and the conductive wire 140 are protected from moisture or various contaminants. Here, the encapsulant 150 may be formed of any one selected from silicon gel and equivalents thereof. In particular, in the case of using the silicone gel as the encapsulant 150, the fine deformation of the pressure sensor chip 120 is made well, thereby improving the pressure sensing characteristics.

As shown in FIG. 3E, in the preparing step (S5) of the connector 160, the connector 160 and the flexible circuit board 130 are electrically connected to each other. More specifically, the conductive pins 161 of the connector 160 are electrically connected to the coupling holes 135 formed in the third region 133 of the flexible circuit board 130 by using solder. do.

As shown in FIG. 3F, in the attaching step S6 of the metal cover 170, the metal cover 170 is attached to the inside of the connector 160. The metal cover 170 is later positioned on the pressure sensor chip 120 and the driver driver integrated circuit chip 136. More specifically, the metal cover 170 is connected to the first region 171 located on the pressure sensor chip 120 and the driver driver integrated circuit chip 136 and the first region 171. A second region 172 positioned on the side of the pressure sensor chip 120 and a third region 173 connected to the second region 172 and interposed between the base 110 and the connector 160. ) And a fourth region 174 connected to the third region 173 and in contact with the top surface of the base 110. In addition, the metal cover 170 may be further formed with a cutout groove 174 (see FIG. 1C) at a side thereof to allow the flexible circuit board 130 to pass therethrough.

In addition, the third region 173 of the metal cover 170 may be electrically connected to the circuit pattern 138a formed on the flexible circuit board 130. Of course, the third region 173 of the metal cover 170 is not easily separated from the circuit pattern 138a because the third region 173 is pressed downward by the connector 160. Meanwhile, the fourth region 174 of the metal cover 170 is in contact with the upper surface 117 of the metal base 110. Therefore, the ground signal, the static electricity, and the like of the flexible circuit board 130 are absorbed by the base 110 of a metal material having a relatively large volume.

When the attachment of the metal cover 170 is completed, the connector 160 is positioned approximately on the top surface of the base 110. In this case, the second region 132 of the flexible circuit board 130 is bent upward.

As shown in FIG. 3G, in the interference fitting step S7 of the case 180, an O-ring 162 is interposed between the connector 160 and the case 180, and then the case 180 is connected to the connector. Forcing the fitting 160 to prevent the connector 160 from being separated from the base 110. Of course, in this case, the case 180 is pressed until it comes in contact with the protrusion 115 provided in the base 110.

As such, the present invention does not require a screen printing process as in the prior art by simply attaching the pressure sensor chip 120 to the base 110 using a high strength adhesive 121, and performs the bonding process at a low temperature (approximately 150 ° C.). The process not only simplifies the process but also improves reliability and productivity.

In addition, in the manufacturing method of the pressure sensor device 100 according to the present invention, since the pressure sensor chip 120 is seated and adhered to the seating hole 134 provided in the base 110 in advance, the pressure sensor chip 120 as in the related art. There is no need for an alignment device.

In addition, since the manufacturing method of the pressure sensor device 100 according to the present invention couples the case 180 to the outer periphery of the base 110 and the connector 160 in a force-fitting manner, a conventional welding process is unnecessary. do.

As described above, the pressure sensor device and the method of manufacturing the same according to the present invention have a pressure sensor chip strongly adhered to the base with an adhesive, and the periphery of the pressure sensor chip is encapsulated with an encapsulant, thereby making it possible to detect a gas or fluid. The back does not penetrate through the periphery of the pressure sensor chip into the interior space, and thus various structures therein do not break. In addition, the case is pressed against the outer periphery of the base and the connector, so that the pressure sensor device according to the present invention has a structure that is robust to external force. Of course, the pressure sensor device is manufactured with a small number of bases, pressure sensors, connectors, and cases, thereby simplifying the manufacturing process steps.

In addition, the pressure sensor device and the method of manufacturing the same according to the present invention do not require a screen printing process by simply attaching the pressure sensor chip to the base using a high-strength adhesive, and can perform the bonding process at a low temperature (about 150 ° C.). . Therefore, the manufacturing process is simplified and the low temperature process is used, thereby improving the reliability and productivity of the pressure sensor device.

In addition, the pressure sensor device and the method of manufacturing the same according to the present invention is coupled to the metal cover inside the connector, it is possible to more stably protect the structures therein. In addition, since the metal cover is electrically connected to the flexible circuit board, not only the grounding of various circuits is easy but also the various circuits can be protected from static electricity.

In addition, the pressure sensor device and the method of manufacturing the same according to the present invention do not require any alignment device of the conventional pressure sensor chip because the pressure sensor chip is mounted and adhered to a mounting hole provided in the base.

Moreover, since the pressure sensor device and the manufacturing method thereof according to the present invention couple the case to the outer periphery of the base and the connector in an interference fit manner, there is no need for a conventional welding process.

What has been described above is just one embodiment for implementing the pressure sensor device and the manufacturing method according to the present invention, the present invention is not limited to the above-described embodiment, as claimed in the following claims Without departing from the gist of the invention, anyone of ordinary skill in the art to which the present invention will have the technical spirit of the present invention to the extent that various modifications can be made.

Claims (26)

A base formed by penetrating the pressure sensing hole in a vertical direction, A pressure sensor chip adhered to an upper surface of the base corresponding to the pressure sensing hole; A flexible circuit board adhered to an upper surface of the base and electrically connected to the pressure sensor chip; An encapsulant for encapsulating the pressure sensor chip; A connector seated on an upper surface of the base and disposed at an outer periphery of the flexible circuit board; It includes a case for being pressed against the outer periphery of the connector and the base, so that the connector is not separated from the base, The connector is provided with at least one conductive pin is electrically connected to the flexible circuit board, The flexible circuit board may include a first region having a seating hole formed at a center thereof to position the pressure sensor chip, a second region connected to the first region and bent upwards, and connected to the second region of the connector. And a third region in which at least one coupling hole is formed to electrically connect the conductive pins. The method of claim 1, wherein the base A body having a pressure sensing hole penetrated in a vertical direction at the center thereof, and having a top surface connected to the pressure sensing hole and having a seating groove formed thereon so as to seat a pressure sensor chip; A coupling member protruding in a lower direction of the body and coupled to a pressure sensing object; Pressure sensor device characterized in that it comprises a projection for protruding a predetermined length in the horizontal direction of the body is seated the case. The pressure sensor device according to claim 1, wherein the pressure sensor chip is attached to the base with an adhesive. The pressure sensor device of claim 1, wherein the flexible circuit board is attached to the base with an adhesive. The pressure sensor device of claim 1, wherein the pressure sensor chip is electrically connected to a flexible circuit board by a conductive wire. The pressure sensor device of claim 1, wherein a driving driver integrated circuit chip is electrically connected to the flexible circuit board. delete The pressure sensor device of claim 1, wherein the conductive pin is electrically connected to a third region of the flexible circuit board by soldering. The pressure sensor device of claim 1, wherein the encapsulant is a silicone gel. The pressure sensor device according to claim 1, wherein an O-ring is interposed between the connector and the case. The pressure sensor device of claim 1, wherein the connector has a metal cover positioned therein so as to be positioned above the pressure sensor chip, and the metal cover is electrically connected to the flexible circuit board. The method of claim 11, wherein the metal cover A first region located above the pressure sensor chip located inside the connector; A second region connected to the first region and positioned at a side of the pressure sensor chip; A third region connected to the second region and interposed between the base and the connector and electrically connected to a circuit pattern of the flexible circuit board; And a fourth region connected to the third region and extending a predetermined length to the outside of the connector and contacting the base. The pressure sensor device of claim 12, wherein the metal cover further has a cutout formed at a side thereof to allow the flexible circuit board to pass therethrough. Preparing a base formed by penetrating a pressure sensing hole in a vertical direction; Adhering a pressure sensor chip to an upper surface of a base corresponding to the pressure sensing hole; Bonding a flexible circuit board to an upper surface of the base, and electrically connecting the pressure sensor chip and the flexible circuit board; Encapsulating the pressure sensor chip; Preparing a connector provided with at least one conductive pin, and electrically connecting the conductive pin of the connector to the flexible circuit board; Comprising a case in the outer periphery of the connector and the base, to prevent the connector from being separated from the base, The flexible printed circuit board used in the bonding step of the flexible printed circuit board includes a first region having a seating hole formed at a center thereof to position the pressure sensor chip, a second region connected to the first region and bent upwards, and And a third region connected to a second region, the third region having at least one coupling hole to electrically connect the conductive pins of the connector. The method of claim 14, wherein the base used in the base preparation step A body having a pressure sensing hole penetrated in the vertical direction at the center thereof, and having a seating groove connected to the pressure sensing hole at the top thereof, and having a seating groove in which a pressure sensor chip is seated; A coupling member protruding in a lower direction of the body and coupled to a pressure sensing object; Producing a predetermined length in the outer peripheral direction of the body manufacturing method of the pressure sensor device, characterized in that consisting of the projection is seated. 15. The method of claim 14, wherein the attaching the pressure sensor chip to the pressure sensor chip is attached to the base with an adhesive. The method of claim 14, wherein the bonding of the flexible circuit board is performed by bonding the flexible circuit board to the base with an adhesive. The method of claim 14, wherein the attaching of the pressure sensor chip comprises electrically connecting the pressure sensor chip to a flexible circuit board with a conductive wire. The method of claim 14, wherein a driver driver integrated circuit chip is electrically connected to the flexible circuit board used in the bonding step of the flexible circuit board. delete The method of claim 14, wherein the preparing of the connector comprises electrically connecting the conductive pins of the connector to a third region of the flexible circuit board. 15. The method of claim 14, wherein the encapsulant used in the encapsulation step is a silicone gel. The method of manufacturing a pressure sensor device according to claim 14, wherein the step of pressing the case is performed after an O-ring is further interposed between the connector and the case. 15. The method of claim 14, wherein the connector used in the connector preparation step is located inside the metal cover to be located above the pressure sensor chip, wherein the metal cover is characterized in that it is electrically connected to the flexible circuit board. Method of manufacturing a pressure sensor device. The method of claim 24, wherein the metal cover used in the connector preparation step A first region located above the pressure sensor chip; A second region connected to the first region and positioned at a side of the pressure sensor chip; A third region connected to the second region and interposed between the base and the connector and electrically connected to a circuit pattern of the flexible circuit board; And a fourth region connected to the third region and extending a predetermined length to the outside of the connector and contacting the base. The method of manufacturing a pressure sensor device according to claim 25, wherein the metal cover used in the connector preparation step is further provided with a cutout at a side thereof so that the flexible circuit board passes therethrough.

Images