KR100806230B1 - 단자연결장치 - Google Patents
단자연결장치 Download PDFInfo
- Publication number
- KR100806230B1 KR100806230B1 KR1020060020442A KR20060020442A KR100806230B1 KR 100806230 B1 KR100806230 B1 KR 100806230B1 KR 1020060020442 A KR1020060020442 A KR 1020060020442A KR 20060020442 A KR20060020442 A KR 20060020442A KR 100806230 B1 KR100806230 B1 KR 100806230B1
- Authority
- KR
- South Korea
- Prior art keywords
- terminal
- wire
- insertion hole
- terminal portion
- connection
- Prior art date
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1306—Details
- G02F1/1309—Repairing; Testing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8803—Visual inspection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Optics & Photonics (AREA)
- Biochemistry (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Analytical Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Health & Medical Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
Description
도 1b는 도 1a에 도시된 단자연결장치의 접속부재와 전선의 결합상태를 나타낸 사시도,
상기 전선연결부(21)는 전선이 수용되는 전선수용부(21a)와 전선고정편(21b)으로 이루어지는데, 상기 전선고정편(21b)은 전선수용부(21a)에서 연장·형성된 것으로 상기 전선수용부(21a)쪽으로 접히면서 전선을 고정시키게 된다.
특히, 도 1a 및 도 1b에서 확인되는 바와 같이, 상기 전선고정편(21b)은 전선(C)피복된 부분과 피복이 벗겨진 부분을 각각 효율적으로 고정시킬 수 있도록 하기 위하여 크기가 다른 제 1 전선고정편(21b')과 제 2 전선고정편(21b'')으로 구분되며,
피복된 부분은 길이가 긴 제 2 전선고정편(21b'')에서 고정되고, 피복이 벗겨진 부분은 제 1 전선고정편(21b')에서 고정되도록 이중으로 고정시켜 상기 접속부재(20)에 전선이 견고하게 고정될 수 있도록 한다.
즉, 전선(C)을 상기 전선수용부(21a)에 위치시키고 전선수용부(21a)에서 연장되어 형성된 전선고정편(21b)의 각각을 전선수용부쪽으로 접어 전선을 감싸게 되면 상기 전선(C)은 전선연결부(21)와 간편하면서도 효율적으로 전기적 연결이 이루어지게 된다.
Claims (9)
- 삭제
- 삭제
- 일측에 삽입공이 형성된 단자부와;일측에 전선이 연결되고, 상기 단자부와 전기적으로 연결가능하게 접촉되는 접속부재 및;상기 단자부의 삽입공과 접속부재를 결합시키며, 선단부가 상기 단자부의 삽입공에 삽입되도록 상기 접속부재의 일측에 연장되어 절곡형성되는 적어도 1개 이상의 걸림편;을 포함하는 단자연결장치에 있어서,상기 걸림편은 상기 접속부재 폭방향의 선단에 형성되는 것을 특징으로 하는 단자연결장치.
- 일측에 삽입공이 형성된 단자부와;일측에 전선이 연결되고, 상기 단자부와 전기적으로 연결가능하게 접촉되는 접속부재 및;상기 단자부의 삽입공과 접속부재를 결합시키며, 선단부가 상기 단자부의 삽입공에 삽입되도록 상기 접속부재의 일측에 연장되어 절곡형성되는 적어도 1개 이상의 걸림편;을 포함하는 단자연결장치에 있어서,상기 걸림편은 상기 접속부재 길이방향의 선단에 형성되는 것을 특징으로 하는 단자연결장치.
- 제3항 또는 제4항에 있어서, 상기 단자연결장치는 상기 접속부재의 선단으로부터 내측으로 소정거리를 두고 형성된 보조걸림편을 더 포함하는 것을 특징으로 하는 단자연결장치.
- 삭제
- 제3항 또는 제4항에 있어서, 상기 단자연결장치는상기 접속부재의 일단에 연장되어 형성되고, 상기 단자부의 일측면을 지지하도록 절곡되어 형성된 지지부재;를 더 포함하는 것을 특징으로 하는 단자연결장치.
- 제7항에 있어서, 상기 지지부재는,상기 걸림편의 양측으로 걸림편과 소정간격을 두고 나란하게 구비되는 것을 특징으로 하는 단자연결장치.
- 제5항에 있어서, 상기 접속부재의 일측에는 상기 삽입공을 관통한 걸림편 또는 보조걸림편 또는 이들 모두가 삽입되는 리세스부가 형성된 것을 특징으로 하는 단자연결장치.
Priority Applications (1)
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KR1020060020442A KR100806230B1 (ko) | 2006-03-03 | 2006-03-03 | 단자연결장치 |
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KR1020060020442A KR100806230B1 (ko) | 2006-03-03 | 2006-03-03 | 단자연결장치 |
Publications (2)
Publication Number | Publication Date |
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KR20070090570A KR20070090570A (ko) | 2007-09-06 |
KR100806230B1 true KR100806230B1 (ko) | 2008-02-22 |
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KR1020060020442A KR100806230B1 (ko) | 2006-03-03 | 2006-03-03 | 단자연결장치 |
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Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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KR100964134B1 (ko) * | 2009-07-23 | 2010-06-16 | 김권희 | 전열매트 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19980036202U (ko) * | 1996-12-14 | 1998-09-15 | 박병재 | 배터리 단자연결장치 |
KR19990031545U (ko) * | 1997-12-31 | 1999-07-26 | 최진호 | 전원연결단자 |
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- 2006-03-03 KR KR1020060020442A patent/KR100806230B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19980036202U (ko) * | 1996-12-14 | 1998-09-15 | 박병재 | 배터리 단자연결장치 |
KR19990031545U (ko) * | 1997-12-31 | 1999-07-26 | 최진호 | 전원연결단자 |
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