KR100795269B1 - Heat exchanger and method of producing the same - Google Patents

Abstract

While maintaining excellent heat exchange performance, the structure is easy to manufacture, providing a heat exchanger having a low cost, high quality and reliability. 1st board | substrate 26 which provided the 1st slit 30 and the 2nd slit 40 substantially parallel, and the 2nd board | substrate which provided the 3rd slit 50 of the substantially same shape as the 1st slit 30. FIG. And (28). Moreover, the length of the 2nd board | substrate 28 is shorter than the 2nd slit 40 in the longitudinal direction. A plurality of first substrates 26 and second substrates 28 are formed so that the first slits 30 provided on the first substrate 26 and the third slits 50 provided on the second substrate 28 communicate with each other. Laminated. The outer tube flow path 60 is comprised by the 1st slit 30 provided in the 1st board | substrate 26, and the 3rd slit 50 provided in the 2nd board | substrate 28. As shown in FIG. The in-pipe flow path 70 is comprised by the 2nd slit 40 and the 2nd board | substrate 28 which were provided in the 1st board | substrate 26. As shown in FIG. Since the heat exchange part comprised only by the pipe can be comprised by the board | substrate with a slit, a heat exchanger can be manufactured easily. In addition, the heat exchanger can be provided at low cost.

Description

Heat exchanger and manufacturing method {HEAT EXCHANGER AND METHOD OF PRODUCING THE SAME}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to heat exchangers for cooling systems, heat dissipation systems, heating systems, and the like, and more particularly, to heat and heat exchangers for liquids and gases used in systems requiring compactness such as information equipment.

Conventionally, as this kind of heat exchanger, what consists of a pipe and a fin is common. In recent years, in order to make the compactness, there exists a tendency for pipe diameter and a pipe pitch to be made small, and a pipe | density becomes high. For example, it is known that a heat exchange part is constituted by a very thin tube having an outer diameter of about 0.5 mm.

27 is a front view of a conventional heat exchanger introduced in Japanese Patent Laid-Open No. 2001-116481. As shown in FIG. 27, the conventional heat exchanger is arranged such that the inlet tank 31 and the outlet tank 32 face each other at a predetermined interval. Between the inlet tank 31 and the outlet tank 32, a plurality of pipes 33 having a circular cross section are arranged, and the outside of the pipe 33 is composed of a core portion 34 through which an external fluid flows. It is.

Then, the tube 33 is arranged in a square checkerboard grid shape, the outer diameter of the tube 33 is set to 0.2 mm or more and 0.8 mm or less, and the value obtained by dividing the pitch of the adjacent tube 33 by the tube outer diameter is 0.5. By setting it to 3.5 or less, it is said that the heat exchange amount with respect to a use power can be improved significantly.

In the conventional heat exchanger, no specific element or manufacturing method is shown. However, generally, the inlet tank 31 and the outlet tank 32 which prepared many thin pipes 33 and many thin circular holes in the specific surface beforehand are prepared, and the inlet tank 31 and the outlet tank ( Both ends of the pipe 33 are inserted into the circular hole of 32, and the method of adhering the insertion part of the pipe 33 to the inlet tank 31 and the outlet tank 32 by welding etc. is considered. However, in order to manufacture a thin round tube, a precise processing apparatus is required, so that the heat exchanger is expensive, and a fine circular hole for inserting the tube 33 into the inlet tank 31 or the outlet tank 32 is formed. It must be provided with a predetermined fine pitch, and it is difficult in the work process of inserting the pipe 33 into the inlet tank 31 or the outlet tank 32, and bonding it. Therefore, even if the heat exchange performance of such a heat exchanger is high, it is very expensive and it cannot be said that the reliability of the leakage of the fluid used is sufficient, and there are still problems.

An object of the present invention is to provide a heat exchanger which is inexpensive and highly reliable with a structure that is easy to manufacture while maintaining a very good heat exchange performance while solving the above-mentioned conventional problems.

The heat exchanger of the present invention is a substrate composed of a plurality of long plates and slits between the long plates that are substantially parallel to each other, and having recesses continuous in the longitudinal direction on some one main surface of the long plates. Two or more of these are laminated | stacked, mutually adjacent board | substrates of a board | substrate are connected, and a pipe | tube is formed, a recessed part comprises an intra-pipe flow path, and a slit comprises an extra-pipe flow path. Thereby, the heat exchange part comprised only by the pipe | tube can be comprised in a board | substrate.

In addition, the heat exchanger of the present invention is continuously provided in a longitudinal direction of a substrate consisting of a plurality of sheets and parallel plates arranged in parallel with each other, and a plurality of sheets and parallel plates arranged in parallel in a longitudinal direction of the circumferential surface of the sheets. The board | substrate which consists of recessed parts is laminated | stacked alternately. As a result, almost half of the entire substrates are simply processed by simply removing holes, thereby facilitating the structure of the heat exchanger and its manufacturing process.

Moreover, the heat exchanger of this invention is provided with the holding plate which hold | maintains a holding plate mutually at both ends of a holding plate, and the long hole provided in the inside of a holding plate in a board | substrate. Moreover, the recessed part provided in one peripheral surface of the plate | board is connected with the long hole at the edge part, and the long hole of the adjacent board | substrate is connected, and comprises a branch flow path. In addition, the in-pipe flow path comprised by the recessed part is connected with the branch flow path. Thereby, the board | substrate which integrated the branch flow path and the pipe | tube can be comprised.

Further, the heat exchanger of the present invention makes the gap between the tubes also in the stacking direction of the substrates to form the extra-tube flow paths between the substrates by making the thickness of the substrates thinner than the thickness of the holding plate in some of the substrates. As a result, the heat transfer area outside the tube can be increased, the outside tube flow path can be widened, and the flow resistance of the extra fluid can be suppressed.

Moreover, the heat exchanger of this invention flows the fluid of an outer tube flow path in the planar direction of a board | substrate. As a result, the boundary between the stacked substrates does not interfere with the flow of the extra fluid.

In addition, the heat exchanger of the present invention is provided with a lid covering long holes at both ends of the laminated substrate, and an inlet pipe or an outlet pipe is provided in a part of the lid. Thereby, the part which comprises a branch flow path and an inflow pipe or an outflow pipe can be combined.

In addition, the heat exchanger of this invention uses a board | substrate made of resin. As a result, the heat exchanger can be reduced in weight.

Moreover, the heat exchanger of this invention is a manufacturing method which adhere | attaches and laminate | stacks mutually with board | substrate.

Thereby, adhesion | attachment of board | substrates can be made easy, without blocking an intra-pipe flow path or an extra-pipe flow path.

Moreover, since the heat exchanger of this invention can comprise the heat exchange part comprised only by a tube from a board | substrate, a heat exchanger can be manufactured by a very inexpensive component.

In addition, since the heat exchanger of the present invention can be configured from a substrate in which the branch flow path is integrated with the pipe, the connection between the pipe and the branch flow path is unnecessary, and the process is further simplified. It can increase the reliability.

The heat exchanger of the present invention is provided with a first substrate provided with a plurality of first slits and second slits in substantially parallel, and a third slit of approximately the same shape as the first slit at approximately the same position as the projection of the first slit. In addition, a plurality of second substrates shorter than the length in the longitudinal direction of the second slit are laminated, wherein the first slit and the slit constitute an out-of-tube flow path, and the second slit and the second substrate constitute the intra-pipe flow path.

Thereby, since the heat exchange part comprised only by the pipe can be comprised from the board | substrate with a slit, a heat exchanger can be manufactured comparatively easily.

In addition, the heat exchanger of the present invention is obtained by stacking a plurality of first substrates between a second substrate.

As a result, the cross-sectional area of the inner channel can be easily changed by changing the number of laminated sheets of the first substrate.

In addition, the heat exchanger of the present invention enlarges the inner flow path in the substrate stacking direction as much as the inflow side of the outer fluid.

As a result, the internal fluid can flow as much as the inflow side of the external fluid having a large temperature difference between the external fluid and the internal fluid and the heat exchange amount is large, and the heat exchanger can be made smaller since the heat exchange can be performed efficiently.

In addition, the heat exchanger of the present invention extends the entrance and exit of the tube flow path in the direction of the tube flow path. As a result, the opening area of the entrance and exit of the internal fluid can be increased, the resistance of the tube can be reduced, and the capacity of the heat exchanger can be improved by increasing the flow rate of the internal fluid, so that the heat exchanger can be made small.

Moreover, in the manufacturing method of the heat exchanger of this invention, at least one of a 1st board | substrate and a 2nd board | substrate is processed by the press. Thereby, a board | substrate can be manufactured easily and inexpensively.

In the method for manufacturing a heat exchanger of the present invention, at least one of the first substrate and the second substrate is processed by etching. Thereby, even if the space | interval of a 1st slit and a 2nd slit is shortened, and even if the wall thickness of an intra-channel flow path is made thin, since a stress does not apply at the time of manufacture of a slit, a heat exchanger can be manufactured easily.

Moreover, the manufacturing method of the heat exchanger of this invention joins board | substrate mutually by the thermal welding bonding. Thereby, it can be easily joined without using a brazing material, and the quality and reliability of a heat exchanger improve without clogging a flow path in a pipe.

Moreover, the manufacturing method of the heat exchanger of this invention joins board | substrate mutually by the ultrasonic bonding.

Thereby, since the base material of only a junction part melts, the defect which clogs an in-pipe flow path by a molten base material can be eliminated, and therefore the reliability of a heat exchanger improves further.

Moreover, the manufacturing method of the heat exchanger of this invention joins board | substrate mutually by the diffusion bonding.

Thereby, since the base material does not melt, the reliability of the heat exchanger is further improved without clogging the inner flow path.

In addition, the heat exchanger of the present invention can provide a heat exchanger at low cost because of its easy structure of manufacture.

Moreover, the manufacturing method of the heat exchanger of this invention can provide a heat exchanger which is easy, high in quality, and reliable.

1 is a front view of a heat exchanger according to a first embodiment of the present invention.

Fig. 2 is a sectional view of a direction orthogonal to the tube axis of the heat exchanger according to the first embodiment.

3 is a cross-sectional view in the tube axis direction of the heat exchanger according to the first embodiment.

4 is a front view of the substrate constituting the heat exchanger according to the first embodiment.

Fig. 5 is a sectional view of the substrate of the heat exchanger according to the first embodiment.

6 is a front view of the substrate constituting the heat exchanger according to the first embodiment.

7 is a cross-sectional view of the substrate of the heat exchanger according to the first embodiment.

Fig. 8 is a sectional view of a direction orthogonal to the tube axis of another heat exchanger with respect to the first embodiment.

9 is a sectional view of a direction orthogonal to the tube axis of another heat exchanger with respect to the first embodiment.

Fig. 10 is a sectional view of a direction orthogonal to the tube axis of another heat exchanger with respect to the first embodiment.

11 is a perspective view of a heat exchanger according to a second embodiment of the present invention.

12 is a front view of a first substrate according to the second embodiment.

13 is a front view of a second substrate according to the second embodiment.

14 is a front view of a heat exchanger according to the second embodiment.

15 is a side view of a heat exchanger according to the second embodiment.

FIG. 16 is a cross-sectional view taken along the line A-A of FIG. 14 with respect to the second embodiment.

17 is a cross-sectional view taken along the line BB of FIG. 14 with respect to the second embodiment.

18 is a cross-sectional view taken along the line C-C of FIG. 15 with respect to the heat exchanger of the second embodiment.

19 is a perspective view of a heat exchanger according to a third embodiment of the present invention.

20 is a front view of a first substrate according to the third embodiment.

21 is a front view of a second substrate according to the third embodiment.

22 is a front view of a heat exchanger according to the third embodiment.

23 is a side view of a heat exchanger according to the third embodiment.

FIG. 24 is a sectional view taken along the line D-D in FIG. 22 with respect to the third embodiment.

FIG. 25 is a sectional view taken along the line E-E in FIG. 22 with respect to the third embodiment.

FIG. 26 is a sectional view taken along the line F-F in FIG. 23 with respect to the third embodiment.

27 is a front view of a conventional heat exchanger.

<Description of the code>

3 tubes

4 jurisdiction euro

5 outside the euro

6 quarter euro

7 inlet pipe

8 outlet pipe

9 sheets

Ten sheets

11 long holes

12 long holes

13 lids

14 lid

15 boards

16 boards

17 recess

18 slits

19 Maintenance Plate

20 slits

21 Maintenance Plate

22 spaces

26 first substrate

28 second substrate

30 first slit

31 inlet tank

32 outlet tank

33 tubes

34 core parts

40 2nd slit

50 third slit

60 euro outside

70 jurisdiction euro

80 inlet header

90 exit header

126 first substrate

128 second substrate

130 first slit

140 2nd slit

150 third slit

160 euros

170 Euro

171 Euro

172 Euro exit

(First embodiment)

BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a front view of a heat exchanger according to a first embodiment of the present invention, Fig. 2 is a sectional view in a direction orthogonal to the tube axis of the heat exchanger according to the heat exchanger, and Fig. 3 is a sectional view of a heat exchanger according to the heat exchanger. will be.

1 to 3, the heat exchanger is composed of a heat exchange part 1 and a header part 2 at both ends of the heat exchange part 1. The heat exchange part 1 has a pipe 3 arranged in a checkerboard graduation shape, an inner tube flow path 4 and an outer tube flow path 5. The header part 2 is provided with the branch flow path 6, the inflow pipe 7, and the outflow pipe 8 in the inside, and the pipe flow path 4 is connected with the branch flow path 6. As shown in FIG. The tube 3 is substantially square in cross section, and is composed of a strip-shaped long plate 9 and a cross-sectional shape of the long plate 10 having a U shape. The branch flow path 6 has long holes 11 and 12 formed in series, and one end thereof is provided with a flat lid 13, and the other end thereof has an inflow pipe 7 or an outflow pipe. The lid 14 provided with (8) is provided. In addition, this heat exchanger consists of two types of board | substrates 15 and the board | substrate 16 made of resin.

4 is a front view of the substrate 15, FIG. 5 is a sectional view of the substrate 15, FIG. 6 is a front view of the substrate 16, and FIG. 7 is a sectional view of the substrate 16. As shown in FIG.

4-7, the recessed part 17 is provided continuously along the longitudinal direction of the one peripheral surface of the board | substrate 15. In FIG. Moreover, the inside of the holding plate 19 which hold | maintains the both ends of the parallel plate side by side, the slit 18 provided between mutually the longitudinal plate 10, the holding plate 19 which hold | maintains both ends of the longitudinal plate 10 in the longitudinal direction. It consists of the long hole 11 provided in the edge part, and the edge part of the recessed part 17 communicates with the long hole 11. As shown in FIG. In addition, the substrate 16 includes a plurality of flat plate-like long plates 9, slits 20 provided between the long plates 9, and a holding plate 21 for maintaining the longitudinal direction of the long plates 9, The long hole 12 provided in the inside of the holding plate 21 is comprised. Moreover, the thickness of the sheet 9 is made smaller than the thickness of the holding plate 21, and the space 22 is provided on one peripheral surface of the sheet 9. Subsequently, the substrate 15 and the substrate 16 are alternately stacked and welded to form a heat exchanger, and the recessed portion 17 is the pipe passage 4, and the slit 18, the slit 20, and the space 22 are formed. The extraneous flow paths 5 and the plate 11 and 12 serve as the branch flow paths 6.

In the heat exchanger comprised as mentioned above, the liquid which flowed in from the inflow port 7 branches in the branch flow path 6, flows in the pipe flow path 4, merges in the branch flow path 6, and flows out from the outflow pipe 8. In addition, the airflow flows in the planar direction of the board | substrate 15 and the board | substrate 15 through the outer tube flow path 5. This liquid and airflow are heat-exchanged in the heat exchange part 1 via the pipe 3. At this time, since the fine processing of the board | substrate 15 and the board | substrate 16 can be made easy to make the pitch of the pipe | tube 3 small while making the pipe | tube 3 thin, it becomes easy to comprise a very compact heat exchanger. Can be.

As mentioned above, in 1st Example, the board 16 provided with the slit 20 provided between the parallel board | substrates 10 and the board 10 is provided. Moreover, the board | substrate 15 which consists of the several slit plate 9 and the slit 18 provided in parallel, and the recessed part 17 provided in the longitudinal direction of the one peripheral surface of the pleated plate 9 in parallel They are stacked alternately. Moreover, while the board | plate 9 and 10 of adjacent board | substrates 15 and 16 are mutually connected and comprise the pipe | tube 3, the recessed part 17 comprises the pipe | channel flow path 4, and also the slit 18 , 20 constitutes the out-of-pipe flow path 5, so that the heat exchanger 1 constituted only by the pipe 3 can be constituted by the substrates 15 and 16, and the heat exchanger can be manufactured using inexpensive components. .

In addition, since the substrate 16 includes a plurality of parallel plates parallel to each other and the slits 20 provided between the substrates 10, the substrate 16 only needs to be subjected to a simple hole, so that heat exchange is performed. The machine can be manufactured in a simple process.

Moreover, the board | substrate 15 is provided with the holding plate 19 which hold | maintains the holding plate 10 mutually at the both ends of the longitudinal plate 10 in the longitudinal direction, and the long hole 11 provided in the inside of the holding plate 19. As shown in FIG. In addition, the holding plate 21 which holds the holding plate 9 mutually at both ends of the holding plate 9 and the elongated hole 12 provided inside the holding plate 21 are provided in the substrate 16. The recessed part 17 of 15 has its extension part communicating with the long hole 11, and the long holes 11 and 12 of the adjacent board | substrates 15 and 16 are mutually connected, and comprise the branch flow path 6; In addition, the in-pipe flow path 4 comprised by the recessed part 17 is connected with the branch flow path 6. In addition, since the branch flow path 6 can be formed integrally with the pipe 3 from the substrates 15 and 16, the connection between the pipe and the branch flow path becomes unnecessary, and the process is further simplified. The reliability of gas leakage can be improved.

In addition, the thickness of the plate 9 is made thinner than the thickness of the holding plate 21, and the space 22 is provided on one circumferential surface of the plate 9. As a result, gaps between the pipes 3 are also provided in the stacking direction of the substrates 15 and 16, and the outer channel flow paths 15 are also formed between the substrates 15 and 16, thereby increasing the heat transfer area outside the pipes. In addition to this, it is possible to widen the outer tube flow path and to suppress the flow resistance of the extra fluid.

In addition, by flowing the fluid in the outer tube flow path 5 in the planar direction of the substrates 15 and 16, the boundary between the stacked substrates 15 and 16 does not interfere with the flow of the outer fluid. In addition to being able to further suppress the flow resistance, the adhesion of dust and the like can also be prevented.

In addition, the heat exchanger of the present invention is provided with the lids 13 and 14 covering the long holes 11 and 12 at both ends of the stacked substrates 15 and 16, and the inlet pipe 7 to the lid 14. Or the outflow pipe 8 is installed. Such a structure can use both the part which comprises the branch flow path 6, and the inflow pipe 7 or the outflow pipe 8, and can reduce the number of parts which comprise a heat exchanger, and can make a heat exchanger much cheaper. .

In addition, since both of the substrates 15 and 16 are made of resin, the heat exchanger can be reduced in weight.

Moreover, it is a manufacturing method of bonding and laminating | stacking mutually the board | substrate 15 and 16 by welding, and can mutually adhere | attach the board | substrate 15 and 16 easily, without obstructing the in-pipe flow path 4 and the out-of-pipe flow path 5, respectively. have.

In the heat exchanger of the first embodiment, the cross-sectional shape of the tube 3 is substantially square, but the cross-sectional shape of the tube 3 may be any other shape. For example, the substantially octagonal shape shown in FIG. 8 and FIG. It is good also as a substantially circular shape shown to.

In the heat exchanger of the first embodiment, the substrates 15 and 16 were alternately stacked to provide a gap between the pipes 3 in the stacking direction, and to flow airflow in the planar direction of the substrates 15 and 16. However, as shown, for example, as shown in FIG. 10, the board | substrate 15 is laminated | stacked continuously and the pipe 3 mutually contacts in a lamination direction, and even if it flows airflow in the perpendicular | vertical direction of the plane of the board | substrate 15, the same effect will exist. Of course it is obtained.

(2nd Example)

11 is a perspective view of a heat exchanger according to a second embodiment of the present invention.

12 is a front view of the first substrate of the second embodiment, and FIG. 13 is a front view of the second substrate. The heat exchange part is formed by alternately stacking the first substrate 26 and the second substrate 28. The plurality of first slits 30 and the plurality of second slits 40 are alternately arranged one by one in substantially parallel to the first substrate 26. The 3rd slit 50 of the same shape as the 1st slit 30 is provided in the 2nd board | substrate 28 at the same position as the projection of the 1st slit 30. FIG.

Thus, since the 1st slit 30 and the 3rd slit 50 overlap on a projection surface, it mutually communicates and the extra-pipe flow path 60 is comprised. In addition, the dimension in the longitudinal direction of the third slit 50 disposed on the second substrate 28 is shorter than that in the longitudinal direction of the second slit 40. In addition, both ends in the longitudinal direction of the second slit 40 protrude more than both ends of the second substrate 28. A part other than the both ends of the longitudinal direction of the 2nd slit 40 is interposed in the 2nd board | substrate 28, and the intraductal flow path 70 is comprised, and the both ends of the 2nd slit 40 in the longitudinal direction are the intravascular flow path 70. It becomes the entrance of. In the second embodiment, the first substrate 26 and the second substrate 28 are alternately arranged. However, when a plurality of first substrates 26 are disposed between the second substrates 28, the cross-sectional area of the in-pipe flow path 70 can be increased.

In addition, when the first substrate 26 and the second substrate 28 are joined together by heat welding, the brazing material flows into the tube flow path 70 because the substrate is melted and bonded without using the brazing material. Since defects cannot occur, it is possible to prevent clogging of the intra-channel flow path 70 in advance. In particular, when the ultrasonic bonding is used, only the bonded portion can be heated, so that the quality and life of the heat exchanger can be further improved. In addition, by employing diffusion bonding, heat treatment and pressurization can be performed simultaneously to a temperature at which the substrate does not melt. As a result, diffusion (interdiffusion) of atoms occurs, and bonding by bonding of atoms can be performed. That is, by joining by the method of diffusion bonding, melting of the base material can be eliminated, and clogging of the inner flow path 70 can be prevented, so that the reliability of the heat exchanger is further improved.

Moreover, when at least one of the 1st board | substrate 26 and the 2nd board | substrate 28 is shape | molded by press work, since it can form comparatively easily and a large quantity, a heat exchanger can be provided inexpensively. Moreover, the space | interval of the 1st slit 30 and the 2nd slit 40 used as the wall of the in-pipe flow path 70 is made larger than the thickness of the 1st board | substrate 26. As shown in FIG. Thereby, since the defect that the wall of the in-pipe flow path 70 is twisted by the stress at the time of press work can be eliminated, product yield improves. As a result, a heat exchanger can be provided at low cost. In addition, when the first substrate 26 and the second substrate 28 are formed by etching, the stress in the slit molding can be eliminated and alleviated, so that the wall of the tube flow path 70 is twisted. Defects can be ruled out. For this reason, even if the wall of the in-pipe flow path 70 is made small, a heat exchanger can be manufactured easily and a heat exchanger can be provided inexpensively.

14 is a front view of the heat exchanger according to the second embodiment, and FIG. 15 is a side view of the heat exchanger of the second embodiment. 16 is a cross-sectional view taken along the line A-A of FIG. 14, and FIG. 17 is a cross-sectional view taken along the line B-B of FIG. 18 is a cross-sectional view taken along the line C-C in FIG. Usually, the inner fluid inlet header 80 and the outlet header 90 are attached to both ends of the heat exchanger. In addition, the inlet header 80 and the outlet header 90 may be replaced.

The operation and action of the heat exchanger configured as described above will be described below. The internal fluid flowing from the inlet header 80 branches and flows inside the pipe passage 70, and flows out of the outlet header 90. In addition, the external fluid flows in the planar direction of the first substrate 26 or the second substrate 28 through the outer tube flow path 60. The inner fluid and the outer fluid exchange heat in the heat exchange unit. At this time, the tube can be made thin by making the width | variety of the 2nd slit 40 provided in the 1st board | substrate 26 small, and making the space | interval of the 1st slit 30 and the 2nd slit 40 small. In addition, since the width of the first slit 30 and the third slit 50 can be reduced, it is easy to reduce the pitch of the tube, so that a very compact heat exchanger can be easily configured.

As mentioned above, in 2nd Example, the 1st board | substrate 26 which alternately arrange | positioned the some 1st slit 30 and the some 2nd slit 40 one by one substantially parallel is provided. In addition, the third slit 50, which is approximately the same shape as the first slit 30, is provided at approximately the same position as the projection of the first slit 30, and is further than the length of the second slit 40 in the longitudinal direction. A plurality of short second substrates 28 are laminated. In addition, the outside slit 60 is constituted by the first slit 30 and the third slit 50. Moreover, it is the structure which comprises the in-pipe flow path 70 with the 2nd slit 40 and the 2nd board | substrate 28 through this. That is, the heat exchanger of the present invention conventionally comprises a heat exchanger constituted only by a tube, and the present invention consists of a substrate provided with a slit. Such a structure can be produced relatively easily, and a heat exchanger can be provided at low cost.

In addition, in 2nd Example, at least one of the 1st board | substrate 26 and the 2nd board | substrate 28 can be manufactured by press work. Thereby, a board | substrate can be manufactured easily, large quantity, and low cost, and a heat exchanger can be provided inexpensively.

Moreover, when mutually bonding the 1st board | substrate 26 and the 2nd board | substrate 28 by heat welding bonding, a base material can be melted and bonded, without using a brazing material. For this reason, the defect that a brazing material flows out in the intraductal flow path 70 cannot generate | occur | produce, and the defect that an internal flow path 70 is blocked can be eliminated beforehand. In particular, since only the junction part can be heated by ultrasonic bonding, the quality and reliability of a heat exchanger further improve. In addition, when diffusion bonding is employed, diffusion (interdiffusion) of atoms occurs by simultaneously performing heat treatment and pressurization treatment to a temperature at which the substrate does not melt, and bonding by atom bonding can be realized. In addition, by joining by diffusion bonding, there is no melting of the base material, it is possible to prevent the clogging of the tube flow path 70, the reliability is further improved, the product yield is improved, and the heat exchanger can be provided at low cost.

In the second embodiment, a plurality of first slits 30 and a plurality of second slits 40 are alternately arranged one by one. Thereby, the outer tube flow path 60 and the inner tube flow path 70 are alternately arrange | positioned, heat exchange efficiency becomes further higher, and the whole board | substrate area | region can be utilized efficiently. However, the present invention is not limited to this embodiment, and for example, the plurality of second slits 40 may be disposed between the first slits 30, or the plurality of first slits 40 may be disposed between the second slits 40. You may arrange | position 30).

In addition, it is one of design matters to arrange the area of the some 1st slit 30 and the some 2nd slit 40 separately.

In addition, the shape of the heat exchanger is not necessarily limited to such a slit shape as long as the same action can be expected instead of the first slit 30 and the second slit 40.

In addition, it is preferable to arrange the first slit 30 and the second slit 40 in substantially parallel in terms of space factor and heat exchange efficiency in forming the flow path. However, this point is not necessarily limited to the arrangement in substantially parallel, and can be appropriately modified according to the design matters of the heat exchanger, the processing apparatus of the heat exchanger, or the processing method employed.

(Third Embodiment)

19 is a perspective view of a heat exchanger according to a third embodiment of the present invention. The heat exchange part is configured by stacking the first substrate 126 so that the second substrate 128 is interposed. As in the second embodiment, the extra slit 130 and the third slit 150 constitute the extra duct passage 160. In addition, an in-pipe flow path 170 is formed of the second slit 140 and the second substrate 128. Here, three first substrates 126 are stacked between the second substrates 128 on the inflow side of the external fluid, and then two sheets are stacked on the outlet of the external fluid. It is made larger in the substrate stacking direction as much as the inflow side.

In the third embodiment, three rows are arranged in the flow direction of the external fluid, but three rows are not required if they are a plurality of rows. In addition, the length of the stacking direction of the first substrate 126 is changed to increase the length of the substrate stacking direction of the tube flow path 170. However, the thickness of the first substrate 126 may be changed to increase the length of the stacking direction of the substrate.

20 is a front view of the first substrate 126 according to the third embodiment, and FIG. 21 is a front view of the second substrate 128. The first substrate 126 is provided with a plurality of first slits 130 and a plurality of second slits 140 substantially in parallel. The in-pipe flow path inlet 171 and the in-pipe flow path outlet 172 of the second slit 140 extend in the direction of the out-of-pipe flow path 160. Like the second embodiment, the second substrate 128 is provided with a third slit 150 that is the same shape as the first slit 130 at the same position as the projection of the first slit 130.

When the mutual relationship between the 1st board | substrate 126 and the 2nd board | substrate 128 is bonded by heat welding bonding, a base material can be melted and bonded, without using a brazing material. For this reason, a brazing material does not flow out in the in-pipe flow path 170, and clogging of the in-pipe flow path 170 can be eliminated. In particular, since only the junction part can be heated by ultrasonic bonding, the quality and reliability of a heat exchanger further improve. When diffusion bonding is employed, diffusion (interdiffusion) of atoms occurs by simultaneously performing heat treatment and pressurization treatment to a temperature at which the substrate does not melt, and bonding by atom bonding can be realized. For this reason, by employing diffusion bonding, melting of the base material can be eliminated, and clogging of the tube flow path 170 can be prevented, so that the reliability of the entire heat exchanger can be further improved.

In addition, when the first substrate 126 and the second substrate 128 are molded by press working, the heat exchanger can be provided at a low cost because the molding can be performed relatively easily and in large quantities. Moreover, what is necessary is just to make the space | interval of the 1st slit 130 and the 2nd slit 140 which become the wall of the intra-channel flow path 170 larger than the thickness of the 1st board | substrate 126. As a result, the walls of the tube flow path 170 are hardly twisted by the stress at the time of press working, so that the quality of the heat exchanger is improved while the yield is also improved, so that the heat exchanger can be provided at low cost. In addition, when at least one of the first substrate 126 and the second substrate 128 is formed by etching, the defect that the wall of the intra-channel flow path 170 is twisted can be eliminated. Thereby, even if the wall of the pipe | channel flow path 170 is made small, it can be manufactured easily and a heat exchanger can be provided inexpensively.

Fig. 22 is a front view of the heat exchanger according to the third embodiment of the present invention, and Fig. 23 is a side view of the heat exchanger of the third embodiment. 24 is a sectional view taken along the line D-D of FIG. 22, FIG. 25 is a sectional view taken along the line E-E of FIG. 22, and FIG. 26 is a sectional view taken along the line F-F of FIG. Usually, the inner fluid inlet header 80 and the outlet header 90 are mounted on both ends of the heat exchanger. In addition, the inlet header 80 and the outlet header 90 may be replaced.

The operation and action of the heat exchanger configured as described above will be described below.

The internal fluid flowing from the inlet header 80 branches and flows in the tube flow path 170 from the tube flow path inlet 171, passes through the pipe flow path outlet 172, and flows out of the outlet header 90. At this time, since the pipe flow path inlet 171 and the pipe flow path outlet 172 are enlarged, the flow path resistance is small, and the circulation amount of the internal fluid can be increased even at the same pump power. Therefore, since the heat exchange amount can be improved and the heat exchanger can be made small, the heat exchanger can be provided at low cost. In addition, the external fluid flows in the planar direction of the first substrate 126 or the second substrate 128 through the extra-channel flow path 160. The inner fluid and the outer fluid exchange heat in the heat exchange unit. At this time, by increasing the number of stacked sheets of the first substrate 126 on the upstream side of the external fluid having a large temperature difference between the external fluid and the internal fluid, and increasing the length of the substrate stacking direction, the internal fluid can be flowed a lot, and the heat exchange amount is improved. The heat exchanger can be made small, and the heat exchanger can be provided at low cost.

As mentioned above, in the 3rd Example, the 1st board | substrate 126 which provided two or more 2nd slit 140 and the 1st slit 130 in substantially parallel is provided. Moreover, the 3rd slit 150 of substantially the same shape as the 1st slit 130 is provided in the substantially same position as the projection of the 1st slit 130. FIG. In addition, a plurality of second substrates 128 shorter than the second slits 140 are stacked. By such a configuration, the first slit 130 and the third slit 150 constitute the external tube flow path 160, and the second slit 140 and the second substrate 128 constitute the internal pipe flow path 170. Can be. Since such a structure is relatively simple, it can be manufactured easily and a heat exchanger can be provided inexpensively.

In addition, since the inner flow path 170 is enlarged in the substrate stacking direction as much as the inflow side of the outer fluid, the inner fluid flows as much as the inflow side of the outer fluid having a large temperature difference between the outer fluid and the large heat exchanger. The amount can be improved, the heat exchanger can be made smaller, and the heat exchanger can be provided at a low cost.

In addition, since the number of the first substrates 126 laminated between the second substrates 128 is increased and decreased, and the size of the substrate stacking direction of the tube flow path 170 is changed, the heat exchanger can be easily manufactured. It can be provided at low cost.

In addition, since the inlet 171 and the outlet 172 of the tube flow path 170 are enlarged toward the tube outside flow path 160, the opening area of the entrance and exit of the internal fluid can be enlarged. As a result, the amount of heat exchanger can be improved by reducing the resistance in the tube and increasing the flow rate of the internal fluid, so that the heat exchanger can be made small.

In addition, if at least one of the first substrate 126 and the second substrate 128 is formed by press working, the heat exchanger can be provided at a low cost since it can be molded relatively easily and in large quantities. Moreover, the space | interval of the 1st slit 130 and the 2nd slit 140 which become the wall of the in-tube flow path 170 is made larger than the thickness of the 1st board | substrate 126. FIG. As a result, the defect that the wall of the tube flow path 170 is twisted in accordance with the stress at the time of press working can be eliminated, so that a heat exchanger of high quality and high yield can be provided at low cost. In addition, when at least one of the first substrate 126 and the second substrate 128 is formed by etching, the defect that the wall of the intra-channel flow path 170 is twisted can be eliminated. For this reason, even if the wall of the pipe flow path 170 is made small, it can be manufactured easily and a heat exchanger can be provided inexpensively.

In addition, when the first substrate 126 and the second substrate 128 are joined by heat welding bonding, the substrate can be melted and bonded without using a brazing material. For this reason, the defect that a brazing material flows out in the tube flow path 170 cannot generate | occur | produce, and it can exclude that the pipe flow path 170 is clogged. In particular, when ultrasonic bonding is employed, only the bonded portion can be heated, so that the quality and reliability of the heat exchanger are further improved. In addition, in the diffusion bonding, the diffusion (interdiffusion) phenomenon of atoms occurs by simultaneously heating and pressurizing up to a temperature at which the substrate is not melted, and bonding by atom bonding can be performed. That is, by joining by diffusion bonding, there is no melting of the base material, it is possible to prevent the blockage of the internal flow path 170, the quality and reliability of the heat exchanger can be further improved, and the heat exchanger with a long product life can be provided at low cost. .

The heat exchanger and its manufacturing method according to the present invention can be realized at low cost while maintaining excellent heat exchange performance, and can be applied to applications such as heat exchangers for refrigeration refrigerators and air conditioners, waste heat recovery equipments, and the like. The availability of the award is high.

Claims (19)

A plurality of substrates parallel to each other and slits formed between the substrates, and a plurality of resin substrates each having a concave portion formed continuously in a longitudinal direction on one peripheral surface of the substrate; The heat exchanger of the said board | substrate of the adjacent said board | substrate is connected, and it comprises a pipe | tube, the said recessed part comprises an intra-pipe flow path, and the said slit comprises an extra-pipe flow path. The method according to claim 1, A plurality of parallel plates and a substrate having slits between the plates, a plurality of parallel plates and slits between the plates and concave portions continuously arranged in the longitudinal direction of the circumferential surface of the sheet Laminated with heat exchanger. The method according to claim 1 or 2, A holding plate for holding the sheet metal mutually at both ends of the sheet is provided, and a long hole provided in the inside of the holding plate is provided on the substrate, and the recess provided on one circumferential surface of the sheet is extended. A heat exchanger in communication with the elongated hole, wherein the elongated holes of the adjacent substrates are connected to each other to form a branching flow path, and the in-pipe flow path formed by the recess is connected to the branching flow path. The method according to claim 3, The heat exchanger in which the said plate | board is made thinner than the thickness of the said holding plate, the clearance gap of the said pipe | tube is provided also in the lamination direction of the said board | substrate, and an extra-tube flow path also comprises between said board | substrates. delete The method according to claim 3, A heat exchanger provided with an inlet pipe or an outlet pipe at a part of the lid, with a lid covering the long hole at both ends of the stacked substrates. The method according to claim 4, And a heat exchanger for flowing the fluid in the extra-tube flow path in the planar direction of the substrate. The manufacturing method of the heat exchanger of Claim 1 or 2 WHEREIN: The manufacturing method of the heat exchanger which laminated | stacked and laminated | stacked the said board | substrate mutually by welding. A second substrate having a first substrate in which a first slit and a second slit are provided in parallel, and a third slit having the same shape as the first slit, and having a length smaller in length than that in the length direction of the second slit; A substrate is provided, and a plurality of the first substrate and the second substrate on which the first slit and the third slit of the first substrate communicate with each other are laminated, and the extra slit is formed by the first slit and the third slit. And constitute an inner tube flow path with the second slit and the second substrate, and enlarge the inner flow path in the substrate stacking direction as much as the inflow side of the external fluid so as to reduce the internal resistance, and increase the entrance and exit of the inner flow path. Heat exchanger enlarged in the direction. The method according to claim 9, A heat exchanger having a configuration in which a plurality of the first substrates are disposed between the second substrates. The method according to claim 9 or 10, A heat exchanger in which the first slit and the second slit are alternately arranged. The method according to claim 9 or 10, And a plurality of said first substrates laminated between said second substrates. delete delete The manufacturing method of the heat exchanger of Claim 9 or 10 which processed the one board | substrate of the said 1st board | substrate and the said 2nd board | substrate by the press. The manufacturing method of the heat exchanger of Claim 9 or Claim 10 WHEREIN: The manufacturing method of the heat exchanger which processed one of the said 1st board | substrate and the said 2nd board | substrate by etching. The manufacturing method of the heat exchanger of Claim 9 or 10 which bonded each other of the said 1st board | substrate and the said 2nd board | substrate by heat welding joining. The manufacturing method of the heat exchanger of Claim 9 or 10 which bonded each other of the said 1st board | substrate and the said 2nd board | substrate by the ultrasonic bonding. The manufacturing method of the heat exchanger of Claim 9 or Claim 10 WHEREIN: The manufacturing method of the heat exchanger which bonded each other of the said 1st board | substrate and the said 2nd board | substrate by diffusion bonding.

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