JP4765619B2 - Heat exchanger and manufacturing method thereof - Google Patents

Description

  The present invention relates to a heat exchanger for a cooling system, a heat dissipation system, a heating system, and the like, and more particularly to a heat exchanger used in a system that requires compactness and a manufacturing method thereof.

  Conventionally, this type of heat exchanger is generally composed of tubes and fins. However, in recent years, in order to achieve compactness, the tube diameter and tube pitch are reduced, and the tubes are made dense. It tends to become. As an extreme form thereof, there is one in which the heat exchanging portion is composed only of a very thin tube having a tube outer diameter of about 0.5 mm (for example, see Patent Document 1).

  FIG. 14 is a front view of a conventional heat exchanger described in Patent Document 1. FIG. 15 is a cross-sectional view taken along line AA in FIG.

  As shown in FIG. 14, the conventional heat exchanger has an inlet tank 1 and an outlet tank 2 which are arranged to face each other at a predetermined interval, and a plurality of tubes 3 having a circular cross section between the inlet tank 1 and the outlet tank 2. Is arranged, and a core portion 4 is formed through which an external fluid flows through the outside of the tube 3. Water or antifreeze is mainly used as an internal fluid that circulates in the pipe 3, and air is mainly used as an external fluid, and each circulates and performs heat exchange.

And while arrange | positioning the pipe | tube 3 in grid shape, the outer diameter of the pipe | tube 3 shall be 0.2 mm or more and 0.8 mm or less, and the value which remove | divided the pitch of the adjacent pipe | tube 3 by the pipe outer diameter is 0.5 or more. By setting it to 5 or less, it is said that the amount of heat exchange for the power used can be greatly improved.
JP 2001-116481 A

  Although the specific elements and manufacturing method constituting the conventional heat exchanger are not shown, in general, a large number of thin tubes 3 and a large number of fine circular holes on a specific surface are previously opened. There is a method in which the tank 1 and the outlet tank 2 are prepared, both ends of the pipe 3 are inserted into the circular holes of the inlet tank 1 and the outlet tank 2, and the insertion portion of the pipe 3 is bonded to the inlet tank 1 and the outlet tank 2 by welding or the like. Conceivable. However, the long and thin pipe 3 is not only very expensive, but a very small number of holes for inserting the pipes 3 are provided in the inlet tank 1 and the outlet tank 2 at a predetermined fine pitch. The process of inserting and bonding the tube 3 into the inlet tank 1 and the outlet tank 2 is very difficult, and even if the heat exchange performance is high, there is a problem that it is very expensive and has low reliability against leakage. It was.

  The present invention solves the above-described conventional problems, and provides an inexpensive and highly reliable heat exchanger having a structure that is extremely easy to manufacture while maintaining extremely excellent heat exchange performance. With the goal.

In order to solve the above-described conventional problems, the heat exchanger of the present invention includes a heat exchange part that exchanges heat between an internal fluid and an external fluid, and an inlet / outlet header that is attached to both ends of the heat exchange part. The exchange unit includes a first substrate in which a slit group including at least two slits A provided on substantially the same line and a slit B shorter than the entire length of the slit group are provided substantially in parallel, and the slit B substantially The slit B and the slit C communicate with each other in parallel with a slit C having the same shape and a slit D whose overall length is larger than the length of the divided portion between the slits A, and projection of the divided portion between the slits A is projected. a second substrate was set only to be included in said slit in D, a third substrate provided substantially in parallel to the slit B substantially the same shape of the slit E at a position that communicates with the slit C and the slit B The The slit B of the first substrate, the slit C of the second substrate, and the slit E of the third substrate communicate with each other to form an extra-tube flow path through which the external fluid flows, and the slit group The first passage is configured such that both ends are outside the both ends of the second substrate and a portion other than both ends of the slit group is sandwiched between the second substrates to form an in-tube flow path through which the internal fluid flows. A plurality of the first substrate and the second substrate are stacked with the three substrates as both ends, and the heat exchange section in which both ends of the slit group serve as entrances and exits of the flow path in the tube is configured. is there.

  Thereby, the heat exchange part comprised only with the pipe | tube can be comprised from the board | substrate which provided the slit, and can be manufactured easily. In addition, by configuring the pipe flow path with slits A and D, the pipe flow path length can be increased even if each slit length is shortened, and the pipe wall is twisted, twisted or bent. It can be manufactured easily and accurately without blocking the flow path in the tube.

  The heat exchanger according to the present invention is arranged so that the first substrate is sandwiched between the second substrates.

  As a result, the external flow path can be easily configured with a simple configuration by leaving both ends of the slit group and sandwiching them between the second substrates.

  Moreover, the heat exchanger of this invention arrange | positions the said slit group and the said slit B alternately.

  As a result, the heat exchange efficiency is further improved by alternately arranging the external flow paths and the internal flow paths, and the entire substrate area can be efficiently utilized.

  Moreover, the heat exchanger of this invention expands the entrance / exit of the said flow path in a pipe | tube in the said flow path outside a pipe | tube.

  As a result, the opening area of the entrance / exit of the internal fluid can be increased, the resistance in the pipe can be reduced, and the capacity of the heat exchanger can be improved by increasing the flow rate of the internal fluid. Can be small.

  In the heat exchanger of the present invention, at least one of the slit B or the slit C is divided in the full length direction.

  Thereby, the flow path outside the tube is not twisted and can be manufactured easily and accurately. Moreover, since the dividing part of the slit can divide the boundary layer of the fluid flowing outside the pipe and heat transfer performance can be promoted, the heat exchanger can be made small.

  In the heat exchanger according to the present invention, the slit B is divided, and the slit C is divided into substantially the same shape as the slit B.

  Thereby, since the first substrate and the second substrate can be bonded even at the dividing portion, the bonding strength can be improved and the reliability can be improved.

  Moreover, the manufacturing method of the heat exchanger of this invention processes the said board | substrate with a press.

  Thereby, a board | substrate can be manufactured easily and cheaply.

  Moreover, the manufacturing method of the heat exchanger of this invention joins the said board | substrates by heat welding joining.

  Thereby, it can join easily, without using a brazing material, and does not clog a pipe | tube flow path, and reliability improves.

  Moreover, the manufacturing method of the heat exchanger of this invention joins the said board | substrates by ultrasonic bonding.

  Thereby, since the base material is melted only at the joint portion, the flow path in the tube is not clogged with the melted base material, and the reliability is further improved.

  Moreover, the manufacturing method of the heat exchanger of this invention joins the said board | substrates by diffusion bonding.

  Thereby, since the base material is not melted, the flow path in the tube is not clogged, and the reliability is further improved.

  Since the heat exchanger of the present invention has a structure that is easy to manufacture, the heat exchanger can be provided at low cost.

  Moreover, the manufacturing method of the heat exchanger of this invention can provide an easy and reliable heat exchanger.

The invention according to claim 1 includes a heat exchanging part for exchanging heat between an internal fluid and an external fluid, and an inlet / outlet header attached to both ends of the heat exchanging part, and the heat exchanging part is at least substantially on the same line. A first substrate provided with a slit group consisting of two or more slits A and a slit B shorter than the entire length of the slit group, and a slit C having the same shape as the slit B and the slit A The slit B and the slit C communicate with each other so that the slit D having a total length larger than the length of the divided portion between the slits B and the slit C communicates with each other so that the projection of the divided portion between the slits A is included in the slit D. and a second substrate was set only, and a third substrate provided substantially in parallel to the slit B substantially the same shape of the slit E at a position that communicates with the slit C and the slit B, the first substrate Of the above The slit B, the slit C of the second substrate and the slit E of the third substrate communicate with each other to form an extra-tube flow path through which the external fluid flows, and both ends of the slit group are formed on the second substrate. The third substrate is disposed at both ends so that an in-tube flow path through which the internal fluid flows is formed by sandwiching portions other than both ends of the slit group outside the both ends between the second substrate. A heat exchanger in which a plurality of first substrates and the second substrate are stacked, and the heat exchange unit in which both ends of the slit group serve as entrances and exits of the flow path in the tube, is configured only by a tube The heat exchange part thus formed can be constructed from a substrate provided with a slit, and can be easily manufactured. In addition, by configuring the pipe flow path with slits A and D, the pipe flow path length can be increased even if each slit length is shortened, and the pipe wall is twisted, twisted or bent. It can be manufactured easily and accurately without blocking the flow path in the tube. As a result, the heat exchanger can be provided at low cost.

The invention according to claim 2 is the invention according to claim 1 , wherein the heat exchanger of the present invention is configured by alternately arranging the slit group and the slit B, Are arranged alternately so that the heat exchange efficiency can be further improved and the entire area of the substrate can be efficiently utilized.

The invention according to claim 3 is the invention according to claim 1 or 2 , wherein the entrance / exit of the flow path in the pipe is enlarged in the direction of the flow path outside the pipe, and the opening area of the entrance / exit of the internal fluid is increased. Since the capacity of the heat exchanger can be improved by reducing the pipe resistance and increasing the flow rate of the internal fluid, the heat exchanger can be made smaller.

The invention according to claim 4 is the invention according to any one of claims 1 to 3 , wherein at least one of the slit B, the slit C, or the slit E is divided in the full length direction. In addition, the flow path outside the tube is not twisted and can be manufactured easily and accurately. Moreover, since the dividing part of the slit can divide the boundary layer of the fluid flowing outside the pipe and heat transfer performance can be promoted, the heat exchanger can be made small.

The invention according to claim 5 is the invention according to any one of claims 1 to 3 , wherein at least one of the slit B or the slit C is divided in the full length direction, Can be manufactured easily and accurately. Moreover, since the dividing part of the slit can divide the boundary layer of the fluid flowing outside the pipe and heat transfer performance can be promoted, the heat exchanger can be made small.

The invention according to claim 6 is the invention according to any one of claims 1 to 3 , wherein the slit B is divided, and the slit C is divided in substantially the same shape as the slit B. However, since the first substrate and the second substrate can be bonded, the bonding strength can be improved and the reliability can be improved.

The invention of claim 7 is the invention according to any one of claims 1 to 6, a method of manufacturing a heat exchanger by processing the substrate by the press, to be easily and inexpensively manufactured substrate The heat exchanger can be provided at low cost.

The invention of claim 8 is the invention according to any one of claims 1 to 7, the substrate cross a method of manufacturing a heat exchanger joined by thermal fusion bonded, easily without using a brazing material Since they can be joined together, the flow path in the pipe is not clogged by the brazing material, the reliability is improved, and the heat exchanger can be provided at a low cost.

In the invention described in the invention is any one of claims 1 to 7 according to claim 9, a method of manufacturing a heat exchanger joined by ultrasonic bonding to the substrate each other substrates only joint is melted Therefore, the melted base material does not clog the flow path in the pipe, and the reliability is further improved and the heat exchanger can be provided at a low cost.

The invention according to claim 10 is the method of manufacturing a heat exchanger according to any one of claims 1 to 7 , wherein the substrates are bonded to each other by diffusion bonding, and the diffusion bonding does not melt the base material. In addition, the flow path in the pipe is not clogged, the reliability is further improved, and the heat exchanger can be provided at a low cost.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings. The same reference numerals are given to the same configurations as those of the conventional example or the embodiments described above, and detailed descriptions thereof will be omitted. The present invention is not limited to the embodiments.

(Embodiment 1)
FIG. 1 is a perspective view of a heat exchange unit according to Embodiment 1 of the present invention. The heat exchanging unit is configured by laminating a plurality of first substrates 10 and second substrates 20 alternately and laminating a third substrate at both ends.

  FIG. 2 is a front view of the first substrate in the first embodiment of the present invention. In the first substrate 10, three slits A <b> 40 are arranged on substantially the same straight line in the entire length direction with the dividing portion 41 interposed therebetween, and one slit B <b> 50 having a shorter overall length than the slit group 45 is arranged substantially in parallel. They are arranged alternately. In the present embodiment, three slits A40 are arranged, but two or more slits A40 may be used. Further, the slit B50 is divided into two in the full length direction, and a dividing portion 55 is formed. In this embodiment, the slit B50 is divided into two equal parts. However, the slit B50 may not be equally divided and may be divided into two or more parts.

  FIG. 3 is a front view of the second substrate in the first embodiment of the present invention. The second substrate 20 includes slits C60 having substantially the same shape as the slits B50 and slits A40, that is, slits D70 having a total length larger than that of the dividing portion 41 are alternately arranged in parallel one by one. Is provided so as to communicate with the slit B50. Further, the slit C60 is divided into three in the full length direction, and a dividing portion 65 is formed. In the present embodiment, the slit C60 is divided into three equal parts, but it may not be equally divided, and may be divided into two or more. Further, when the first substrate 10 and the second substrate 20 are stacked, the dividing portion 65 and the dividing portion 55 do not overlap. In addition, the slit D70 is disposed so as to include the projection of the dividing portion 41, and when the first substrate 10 and the second substrate 20 are stacked, the slit A40 and the slit D70 are in communication. The total length of the second substrate 20 is smaller than the slit group 45.

  FIG. 4 is a front view of the third substrate in the first embodiment of the present invention. The third substrate 30 is provided substantially parallel to a position where the slit B50 and the slit C60 communicate with each other when a slit E80 having substantially the same shape as the slit B50 is laminated.

  Thus, since the slit B50, the slit C60, and the slit E80 overlap on the projection surface, they communicate with each other, and the extra-tube flow path 90 is configured. Further, regarding the dimension of the second substrate 20, the dimension in the longitudinal direction of the slit B 50 is shorter than the length of the slit group 45 in the longitudinal direction, and both ends of the slit group 45 are outside the both ends of the second substrate 20. The in-pipe flow path 100 is configured by sandwiching portions other than both ends of the slit group 45 between the second substrate 20, and the slit D 70 of the second substrate 20 is divided at the dividing portion 45. The slit D70 serves as a bypass circuit and communicates with the slit A40 on the downstream side. Further, both ends of the slit group 40 serve as entrances / exits of the in-pipe channel 100. In the present embodiment, the first substrate 10 and the second substrate 20 are alternately installed. However, when the cross-sectional area of the in-tube flow path 100 is desired to be increased, the first substrate 10 is interposed between the second substrates 20. You may install more than one. The heat resistance can be reduced and the heat transfer performance can be improved by reducing the distance between the slit A40 and the slit B50 and the distance between the slit C and the slit D as walls of the in-pipe flow path 100 as much as possible. At this time, by connecting the slit A40 with the bypass circuit of the slit D70, the overall length of the slit A can be shortened without shortening the overall length of the in-tube flow path 100. It is no longer necessary to prevent the in-pipe flow path 100 from being twisted or bent, and the defect rate can be reduced. Therefore, a heat exchanger can be provided at low cost.

  If the first substrate 10, the second substrate 20, and the third substrate 30 are bonded to each other by heat welding, the brazing material is melted and bonded without using the brazing material. It does not flow out into the tube, and defects due to clogging of the in-pipe channel 100 can be reduced. In particular, in ultrasonic bonding, only the bonded portion can be heated, so that reliability is further improved. In addition, diffusion bonding causes atomic diffusion (interdiffusion) phenomenon by simultaneously applying heating and pressurization to a temperature at which the base material does not melt, and bonding is performed by linking atoms. Therefore, clogging of the in-pipe channel 100 can be prevented, and the reliability is further improved.

  If the first substrate 10, the second substrate 20, and the third substrate 30 are formed by press working, they can be formed relatively easily and in large quantities, so that a heat exchanger can be provided at low cost.

  FIG. 5 is a front view of the heat exchanger according to Embodiment 1 of the present invention, and FIG. 6 is a side view of the heat exchanger of the same embodiment. 7 is a BB cross-sectional view of FIG. 5, and FIG. 8 is a CC cross-sectional view of FIG. 9 is a cross-sectional view taken along the line DD of FIG. Usually, the internal fluid inlet header 110 and the outlet header 120 are attached to both ends of the heat exchange unit. Note that the inlet header 110 and the outlet header 120 may be interchanged.

  About the heat exchanger comprised as mentioned above, the operation | movement and an effect | action are demonstrated below.

  The internal fluid flowing in from the inlet header 110 is branched and flows in the in-pipe channel 100 and flows out from the outlet header 120. Further, the external fluid flows in the planar direction of the first substrate 10, the second substrate 20, and the third substrate 30 through the extra-tube flow path 90. The internal fluid and the external fluid exchange heat in the heat exchange section. At this time, the width of the slit A40 and the slit D70 provided in the first substrate 10 is made fine, the distance between the slit A40 and the slit B50 and the distance between the slit D70 and the slit C60 are made small, and the tube is made thin. By reducing the widths of the slit B50, the slit C60, and the slit E80, it is possible to easily reduce the pitch of the tubes, and thus it is possible to easily configure a very compact heat exchanger.

  At this time, since three slits A40 are installed on substantially the same straight line and the slit A40 is bypassed by the slit D70 to form the pipe flow path 100, the pipe flow path that is effective even if the slit A40 is shortened. 100 lengths can be molded. Therefore, even if the interval between the slit A40 and the slit B50 which are walls of the in-pipe channel 100 is reduced, the slit A40 is short, so there is no kinking, twisting, or bending of the in-pipe channel 100 wall, and the defect rate is reduced. Therefore, the heat exchanger can be provided at a lower cost.

  As described above, in the present embodiment, the first substrate 10 in which the slit group 45 provided with three slits A40 on substantially the same line and the slit B50 shorter than the entire length of the slit group 45 are provided substantially in parallel. And a slit D70 having substantially the same length as that of the split portion between the slit C60 and the slit A40 having substantially the same shape as that of the slit B50, is provided substantially in parallel, and is longer than the entire length of the slit group 45 of the first substrate 10. A second substrate 20 having a shorter length, and a third substrate 30 provided with a slit E80 substantially in the same shape as the slit B50 in a substantially parallel manner and having a total length larger than that of the second substrate 20. The slit B40, the slit C60 of the second substrate 20 and the slit E80 of the third substrate 30 communicate with each other, and the projection of the dividing portion 41 between the slits A40 is included in the slit D70. As described above, a plurality of first substrates 10 and second substrates 20 are stacked, and a third substrate 30 is installed at both ends thereof. A slit B40 of the first substrate 10 and a slit C60 of the second substrate 20 The external flow path 90 is configured by the slit E80 of the third substrate 30, and the internal flow path 100 is configured by the slit A40 of the first substrate 10 and the slit D70 of the second substrate 20 communicating with each other. In the prior art, the heat exchanging part constituted only by the tube is constituted by a substrate provided with a slit, which can be easily manufactured, and a heat exchanger can be provided at low cost. In addition, by configuring the flow path in the pipe with the slit A40 and the slit D70, the length of the flow path 100 in the pipe can be lengthened even if each slit length is shortened, and the pipe wall is twisted, twisted or bent. Thus, the in-pipe channel 100 can be manufactured easily and accurately without being blocked. Accordingly, even a heat exchanger having a long distance between the inlet header 110 and the outlet header 120 can be provided at low cost.

  In the present embodiment, the third substrate 30 is installed at both ends where the first substrate 10 and the second substrate 20 are stacked to seal the substrate stacking direction. However, the present invention is not limited to this mode. For example, only the in-pipe flow paths of the substrates at both ends may be filled with resin, adhesive, or the like.

  In the present embodiment, the slit B50 is divided into two equal parts, and the slit C60 is divided into three equal parts. Therefore, when the divided part 55 of the slit B50 and the divided part 65 of the slit C60 do not overlap, the boundary of the external fluid The layer separation effect is increased and the heat transfer performance is improved. As a result, even if the number of stacked substrates is reduced, the same performance can be obtained, so that a heat exchanger can be provided at a low cost.

  In the present embodiment, the slit B50 is divided into two equal parts and the slit C60 is divided into three equal parts. However, the number of divisions and the division ratio are not limited thereto.

  In the present embodiment, the dividing portion 55 of the slit B50 and the dividing portion 65 of the slit C60 are provided at positions where they do not overlap. However, the second substrate of the other case in the first embodiment of the present invention shown in FIG. Like the second substrate 20 shown in the front view, the slit C60 may be divided into two equal parts, and the dividing part 65 may be provided so as to overlap the dividing part 55 of the slit B50. In this case, the boundary layer dividing effect of the external fluid is Although it reduces, since the parting part 55 and the parting part 65 can be joined, the intensity | strength of a heat exchanger will improve. The number of divisions and the division ratio are not limited to this.

  In the present embodiment, the slit B50 and the slit C60 are divided. However, the slit B50 and the slit C60 are not necessarily divided, and can be divided according to design and processing circumstances.

  In the present embodiment, the first substrate 10 and the second substrate 20 are processed by pressing, and the substrate can be manufactured easily, in large quantities and at low cost, and a heat exchanger can be provided at low cost. Can do.

  Further, in the present embodiment, if the first substrate 10 and the second substrate 20 are bonded to each other by heat welding, the brazing material is melted and bonded without using the brazing material. It does not flow into the channel 100, and defects due to clogging of the in-pipe channel 100 can be reduced. In particular, in ultrasonic bonding, only the bonded portion can be heated, so that reliability is further improved. In addition, diffusion bonding causes atomic diffusion (interdiffusion) phenomenon by simultaneously applying heating and pressurization to a temperature at which the base material does not melt, and bonding is performed by linking atoms. Therefore, it is possible to prevent clogging of the flow path 100 in the tube, further improve the reliability, reduce defective products, and provide a heat exchanger at low cost.

  In the present embodiment, the slit groups 45 and the slits B50 are alternately arranged one by one, so that the external flow paths 90 and the internal flow paths 100 are alternately arranged, and the heat exchange efficiency. However, the present invention is not limited to this form. For example, a slit group 45 is arranged between the slits B50, or a plurality of slit groups 45 are arranged between the slit groups 45. A slit B50 may be arranged.

  In addition, it is possible to dare to arrange the areas of the plurality of slits B50 and the plurality of slit groups 45 in balance with design convenience and other conditions.

  Furthermore, the shape is not necessarily limited to the slit shape as long as the same action can be expected instead of the slit B30 and the slit group 45.

In addition, it is preferable to arrange the slit B50 and the slit group 45 substantially in parallel in terms of space factor and heat exchange efficiency in the formation of the flow path, but this is not necessarily limited to the substantially parallel arrangement. It is also possible to carry out by appropriately modifying depending on the processing circumstances.
In the present embodiment, the pipe flow path 100 has the same size, but is not limited to this form, and the temperature difference is increased by increasing the pipe flow path 100 toward the inflow side of the external fluid. By increasing the flow rate of the internal fluid on the inflow side of the external fluid having a large heat exchange amount, heat can be exchanged efficiently. Examples of the method of changing the size of the in-tube flow path 100 include increasing the thickness of the first substrate 10 and increasing the number of the first substrates 10 stacked between the second substrates 20.

(Embodiment 2)
FIG. 11 is a front view of the first substrate according to Embodiment 2 of the present invention. The first substrate 200 includes a slit group 260 including a slit A 220 including an in-tube channel inlet 210, a slit A 240 including an in-tube channel outlet 230, and a slit A 250 disposed between both slits, and a slit shorter than the slit group 260. A plurality of B270s are provided substantially in parallel. The in-pipe flow path inlet 210 of the slit A220 and the in-pipe flow path outlet 230 of the slit A240 are enlarged in the direction of the slit B270 that is an external pipe flow path. Since the second substrate 20 and the third substrate 30 have the same configuration as in the first embodiment, the same reference numerals are used for description. In the second substrate 20, slits C60 having substantially the same shape as the slits B270 and slits D40 having a larger overall length than the dividing portion 41 are alternately arranged in parallel, one by one. It is provided so as to communicate with the slit B270. Further, the slit C60 is divided into three in the full length direction, and a dividing portion 65 is formed. In the present embodiment, the slit C60 is divided into three equal parts, but it may not be equally divided, and may be divided into two or more. Further, when the first substrate 10 and the second substrate 20 are stacked, the dividing portion 65 and the dividing portion 55 do not overlap. Further, the slit D70 is disposed so as to include the projection of the dividing portion 55, and when the first substrate 10 and the second substrate 20 are laminated, the slit A40 and the slit D70 are in communication. The total length of the second substrate 20 is smaller than the slit group 45.

  The third substrate 30 is provided substantially parallel to a position where it communicates with the slit B 270 when the slit E 80 having substantially the same shape as the slit B 270 is laminated.

  If the first substrate 200 and the second substrate 20 are bonded to each other by thermal welding, the brazing material is not used and the base material is melted and bonded, so that the brazing material does not flow into the flow path in the pipe, Defects due to clogging of the in-pipe flow path can be reduced. In particular, in ultrasonic bonding, only the bonded portion can be heated, so that reliability is further improved. In addition, diffusion bonding causes atomic diffusion (interdiffusion) phenomenon by simultaneously applying heating and pressurization to a temperature at which the base material does not melt, and bonding is performed by linking atoms. Therefore, it is possible to prevent clogging of the flow path in the tube and further improve the reliability.

  If the 1st board | substrate 200 and the 2nd board | substrate 20 are shape | molded by press work, since it can shape | mold comparatively easily and in large quantities, a heat exchanger can be provided cheaply.

  FIG. 12 is a side view of the heat exchanger according to Embodiment 2 of the present invention, and FIG. 13 is a cross-sectional view taken along the line DD of FIG. In the heat exchanger according to the second embodiment, as in the first embodiment, a plurality of first substrates 200 and second substrates 20 are alternately stacked, and a third substrate 30 is stacked at both ends to exchange heat. The internal fluid inlet header 110 and the outlet header 120 are attached to both ends of the heat exchange unit. Note that the inlet header 110 and the outlet header 120 may be interchanged.

  About the heat exchanger comprised as mentioned above, the operation | movement and an effect | action are demonstrated below.

  The internal fluid flowing in from the inlet header 110 is branched and flows from the in-pipe channel inlet 210 into the in-pipe channel 170 and flows out from the outlet header 120 through the in-pipe channel outlet 230. At this time, since the in-pipe channel inlet 210 and the in-pipe channel outlet 230 are enlarged, the channel resistance is small, and the circulation amount of the internal fluid can be increased even with the same pump power. Therefore, the amount of heat exchange is improved and the heat exchanger can be made small, so that the heat exchanger can be provided at low cost. Further, the external fluid flows in the planar direction of the first substrate 200 and the second substrate 20 through the extra-tube flow path. The internal fluid and the external fluid exchange heat in the heat exchange section.

  As described above, in the present embodiment, in addition to the first embodiment, by expanding the in-tube flow path inlet 210 and the in-pipe flow path outlet 230 in the direction of the external flow path, the opening area of the internal fluid inlet / outlet is increased. The amount of heat exchanger can be increased by reducing the pipe resistance and increasing the flow rate of the internal fluid, so the amount of heat exchanger can be improved, so the heat exchanger can be made smaller and the heat exchanger can be provided at low cost. can do.

  As described above, the heat exchanger according to the present invention can be realized at low cost while maintaining very excellent heat exchange performance, such as heat exchangers for refrigeration equipment and air conditioning equipment, waste heat recovery equipment, etc. It can also be applied to applications.

The perspective view of the heat exchange part in Embodiment 1 of this invention Front view of the first substrate in Embodiment 1 of the present invention Front view of second substrate in embodiment 1 of the present invention Front view of third substrate according to Embodiment 1 of the present invention The front view of the heat exchanger in Embodiment 1 of this invention Side view of heat exchanger in Embodiment 1 of the present invention BB sectional view of FIG. CC sectional view of FIG. DD sectional view of FIG. The front view of the 2nd board | substrate in the other case in Embodiment 1 of this invention Front view of first substrate according to Embodiment 2 of the present invention Side view of heat exchanger in Embodiment 2 of the present invention DD sectional view of FIG. Front view of conventional heat exchanger AA sectional view of FIG.

Explanation of symbols

10, 200 First substrate 20 Second substrate 40, 220, 240, 250 Slit A
41, 55, 65 Dividing part 45, 260 Slit group 50, 270 Slit B
60 Slit C
70 Slit D
90 Out-of-tube flow path 100 In-pipe flow path 210 In-pipe flow path inlet 230 In-pipe flow path outlet

Claims (10)

It consists of a heat exchanging part for exchanging heat between the internal fluid and the external fluid, and an inlet / outlet header attached to both ends of the heat exchanging part. A first substrate in which a slit group and a slit B shorter than the entire length of the slit group are provided substantially in parallel, and the length of the split part between the slit C and the slit A having substantially the same shape as the slit B. a second substrate was set only as overall length projection of divided portion between a large slit D and substantially parallel to the slit B and through the slit C and the communicating the slit a mutually contained within the slit D, wherein A slit E having a shape substantially the same as that of the slit B and a third substrate provided substantially parallel to the slit B and the position where the slit C communicates with the slit B; the slit B and the second substrate of the first substrate; substrate The slit C and the slit E of the third substrate communicate with each other to form an extra-tube flow path through which the external fluid flows, and both ends of the slit group are outside the both ends of the second substrate. The first substrate and the second substrate with the third substrate at both ends so as to form an in-tube flow path through which the internal fluid flows by sandwiching a portion other than both ends of the second substrate. A heat exchanger in which the heat exchanging portion is configured such that both ends of the slit group serve as entrances and exits of the flow path in the pipe.   The heat exchanger according to claim 1, wherein the slit groups and the slits B are alternately arranged.   The heat exchanger according to claim 1 or 2, wherein an entrance / exit of the flow path in the pipe is expanded in the direction of the flow path outside the pipe.   The heat exchanger according to any one of claims 1 to 3, wherein at least one of the slit B and the slit C is divided in a full length direction.   The heat exchanger according to any one of claims 1 to 3, wherein the slit B is divided and the slit C is divided into substantially the same shape as the slit B.   The heat exchanger according to any one of claims 1 to 3, wherein a dividing position where the slit B is divided and a dividing position where the slit C is divided do not overlap.   The manufacturing method of the heat exchanger as described in any one of Claim 1 to 6 which processed the said board | substrate with the press.   The manufacturing method of the heat exchanger as described in any one of Claim 1 to 7 which joined the said board | substrates by heat welding joining.   The manufacturing method of the heat exchanger as described in any one of Claim 1 to 7 which joined the said board | substrates by ultrasonic bonding.   The method for manufacturing a heat exchanger according to any one of claims 1 to 7, wherein the substrates are bonded to each other by diffusion bonding.

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