KR100780189B1 - Camera module having substrate of non-shrink ltcc-m - Google Patents

Abstract

A camera module having a substrate of a non-shrink LTCC-M(Low Temperature Co-fired Ceramic on Metal) is provided to protect a shrink phenomenon of a board, thereby improving precision of dimensions and implementing high quality camera module and a small size product. A camera module having a substrate of a non-shrink LTCC-M(Low Temperature Co-fired Ceramic on Metal) includes a housing(10), a non-shrink LTCC board(30), a printed circuit board(40), and a passive element(50). The housing mounts a lens unit. The non-shrink LTCC board includes an IR filter and an image sensor. The printed circuit board is connected to a side direction upper surface of the non-shrink LTCC board. The passive element is mounted on the side direction upper surface of the non-shrink LTCC board.

Description

Camera Module Having Non-Shrinkage Low Temperature Ceramics {{Camera Module Having Substrate of Non-Shrink LTCC-M}

1 is a cross-sectional view of an image camera module according to the related art, in which an image sensor is mounted inside a ceramic package.

2 is a diagram illustrating a multi-chip module structure using a low-temperature calcined ceramic according to the prior art, wherein a substrate is fabricated using a low-temperature calcined ceramic structure, wherein a) is a laminated cross-sectional view and b) is a respective substrate layer. Top view showing individually.

3 is an exploded perspective view showing a camera module to which the non-contraction low temperature ceramic according to the present invention is applied.

4 is a cross-sectional view showing a camera module to which the non-contraction low temperature ceramic according to the present invention is applied.

       <Description of the symbols for the main parts of the drawings>

1 .... Camera module applying non-shrink low temperature ceramic according to the present invention

5 .... Lens 10 .... Housing

20 ... IR Filter 25 .... Image Sensor

30 .... non-contraction LTCC substrate 32 .... aperture

34a, 34b ... Home 40 .... Printed Circuit Board

42 .... connector 50 .... passive element

200 .... Conventional Camera Module 205 .... Lens

210 .... Housing 212 .... Image Sensor

220 .... ceramic package 224 .... IR filter

226 .... chip 230 .... circuit board part

300 .... Conventional Ceramic Module Package

301 .... mount board 312 .... signal board

323,324 ... Pattern 325 .... Ground Substrate

336 ... dielectric layer

The present invention relates to a camera module having an image sensor for use in a digital camera. More specifically, the substrate on which the image sensor is mounted is manufactured by low temperature co-fired ceramic on metal to obtain dimensional accuracy of a product. The present invention relates to a camera module employing an improved non-shrink low-temperature ceramics to improve the quality of the product and to achieve product miniaturization.

In general, the structure of the camera module can be classified into a COB method using a wire largely and a COF method directly bonding a pad between the sensor and the PCB according to the bonding method of the sensor and the PCB. The COB method is similar to the conventional semiconductor production line, and its productivity is high. However, since the wire must be pulled out and connected to the PCB on the lower side, additional space is required to limit the size of the module and the number of circuits to be processed. Receive.

Since the COB method does not need a space to attach the wire above all, the package area can be reduced, and the height thereof can be reduced, thereby making it light and short. The use of thin films or flexible PCBs enables reliable packages to withstand external shocks, while also meeting the trends of high-speed processing, high density, and multiple pinning due to miniaturization and reduced resistance.

A technique related to a conventional camera module is shown in FIG.

The conventional camera module 200 as described above has a housing 210 which is opened at a lower portion thereof and has an opening formed at the center thereof to engage with the lens 205. And a ceramic package 220 bonded to a lower portion of the housing 210 and including an image sensor 212 therein and having an open top, and covering infrared rays incident on the upper portion of the ceramic package 220. And a circuit board portion 230 including a blocking IR filter 224 and a chip 226 bonded to a lower portion of the ceramic package 220 and driving the image sensor 212.

The conventional camera module 200 is to protect the image sensor 212 from the internal electrical noise or environmental factors by replacing the circuit board 230 with a ceramic.

However, since the prior art as described above forms the ceramic package 220 and the circuit board portion 230 with ceramics, chipping is likely to occur or break at corners during assembly of these components. In addition, since the circuit board 230 is molded and plasticized, it is difficult to precisely adjust the dimensions, so that the precision of the product is lowered and the tolerance management is difficult when the product is manufactured.

And another conventional technique is shown in FIG.

This conventional technology relates to a ceramic module package 300, which includes a mounting substrate 301 in which a plurality of electronic components are disposed, a ball grid array in which the plurality of electronic components are formed in an external device, and It is provided with a signal board 312 is electrically connected to form a plurality of terminals to enable the input and output of the signal.

And a pattern substrate 323 disposed between the mounting substrate 301 and the signal substrate 312, and having a pattern formed to transmit signals between the plurality of electronic components and between the electronic components and the plurality of terminals. And a ground substrate 325 connected to ground to remove noise included in signals inputted to and outputted from the plurality of electronic components.

In addition, a dielectric layer 336 having a set permittivity is positioned between each of the substrates 301, 312, 323, 324, 325 so that the substrates 301, 312, 323, 324, 325 are positioned. By insulating between the substrates, electrical interference can be prevented from occurring between the substrates 301, 312, 323, 324, and 325. Each of the substrates 301, 312, 323, 324, and 325 transmits signals through via holes (not shown) formed between the substrates.

The conventional ceramic module package 300 is a multilayer structure in which a plurality of substrates are stacked through low-temperature calcined ceramic, and it is easy to realize miniaturization and complex functionalization, and passive devices such as capacitors, resistors, and inductors. Since they can be formed in a pattern on a substrate, high integration, light and small size, and high reliability are possible.

In addition, the prior art as described above is to design an internal circuit to the green tape to configure each of the substrates 301, 312, 323, 324, 325, applying a proper pressure to the laminated structure After forming a glass material, a glass material or the like is mixed and co-fired at a low temperature of 1000 ° C. or lower to use a low temperature predetermined ceramic (LTCC) method. However, such a conventional technique has a problem that it is difficult to control the exact dimensions because the ceramic shrinks during the firing process, and that it is difficult to control the tolerance of the product, resulting in deterioration of the quality of the finished product.

The present invention is to solve the above conventional problems, the object is to improve the dimensional accuracy by suppressing the shrinkage action generated during the firing of the substrate, improved non-shrink low-temperature ceramics to further reduce the size of the product It is to provide a camera module applying the.

In order to achieve the above object, the present invention provides a camera module for use in image pickup of an image camera,

A lens mounted housing;

A non-contraction LTCC substrate connected to the housing and equipped with an IR filter and an image sensor;

A printed circuit board connected to the lateral upper surface of the substrate; And

It provides a camera module applying a non-shrink low-temperature ceramic comprising a; passive elements mounted on the lateral upper surface of the substrate.

In addition, the present invention preferably provides a camera module to which the non-shrink low-temperature ceramic is applied, wherein the passive elements are located inside the housing.

In another aspect, the present invention preferably provides a camera module to which the non-condensation LTCC substrate is applied a non-condensation low-temperature ceramic, characterized in that the groove is formed on the front, rear to mount the IR filter and the image sensor.

In addition, the present invention preferably provides a camera module to which a non-condensing low temperature ceramic is applied, wherein the passive element comprises at least one multilayer ceramic capacitor (MLCC).

In another aspect, the present invention provides a camera module to which the non-shrink low-temperature ceramics are applied, characterized in that the bumps are formed on an electrode pad portion electrically connected to the non-shrinkage LTCC substrate.

The present invention preferably provides a camera module to which the non-shrink low-temperature ceramic is applied, wherein the bump is any one of a stud bump, an electroless bump, and an electrolytic bump.

In another aspect, the present invention preferably provides a camera module to which a non-condensing low temperature ceramic is applied, wherein the printed circuit board is any one of a flexible printed circuit board (FPCB) and a flexible printed circuit board (RF-PCB).

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

The camera module 1 to which the non-shrink low temperature ceramic according to the present invention is applied is used for image pickup of an image camera.

The camera module 1 to which the non-shrink low temperature ceramic according to the present invention is applied has a housing 10 having an opening 10a in which a lens 5 is mounted, as shown in FIGS. 3 and 4.

And the camera module (1) applying the non-shrink low temperature ceramic according to the present invention is connected to the housing 10, the IR filter 20 to block the infrared rays from the incoming light inside the housing 10, and the lens An image sensor 25 for capturing an image introduced through (5) is provided, and a non-contraction LTCC substrate 30 equipped with such an IR filter 20 and an image sensor 25 is provided.

The non-contraction LTCC substrate 30 forms an opening 32 at the center so that the image signal introduced through the lens 5 and the IR filter 20 is transmitted to the image sensor 25 side.

The non-shrink LTCC substrate 30 is a low temperature co-fired ceramic on metal (LTCC-M) technology using a metal, and is a method of simultaneously baking green tape by laminating it on a metal plate. Since the metal plate on which the ceramic is laminated suppresses shrinkage of the ceramic generated during firing, not only can the ceramic structure be implemented according to the mold design, but also there is no shrinkage in the plane direction of the substrate, that is, the X-Y direction.

Therefore, since the low-temperature calcined ceramic substrate technology (LTCC-M) using such a metal has no shrinkage after firing of the ceramic, the product can be produced in the desired dimensions, and accordingly, the dimensional accuracy is greatly improved, resulting in excellent product performance. do. In addition, a pattern is formed on the surface of the non-shrink LTCC substrate 30 by plating, and the pattern may be formed by an electroplating method or an electroless plating method.

In addition, the image sensor 25 includes an electrode pad portion (not shown) for electrically connecting to the non-contraction LTCC substrate 30, and the electrode pad portion forms a bump. The bump is made of gold or solder, and adopts a stud type bump that decreases in height when pressurized by a flip chip method. Alternatively, electroless bumps and electrolytic bumps may be used.

In addition, the camera module (1) applying the non-shrink low temperature ceramic according to the present invention includes a printed circuit board (40) connected to the lateral upper surface of the substrate, and the printed circuit board (40) has a connector (42) on one side thereof. Is electrically connected to the electronic device to which the present invention is mounted.

The printed circuit board 40 may be made of any one of a flexible printed circuit board (FPCB) and a flexible printed circuit board (RF-PCB), and is disposed in a lateral direction of the non-contraction LTCC substrate 30. A pattern is formed on the non-contraction LTCC substrate 30, and the pattern is mounted on the non-contraction LTCC substrate 30 through an in-position mounting method for electrically connecting the printed circuit board 40 to the pattern using lead-free solder. It is possible. Alternatively, the method using a lead-free solder heat and a film (ACF) having conductive balls may be pressed to bond the present invention, and the present invention is not limited to these specific bonding methods.

In addition, the present invention includes passive elements 50 mounted on the lateral upper surface of the substrate 30, and the passive element 50 includes at least one multilayer ceramic capacitor (MLCC). The passive element 50 may further include other electronic components such as resistors, diodes, and transistors in addition to the multilayer ceramic capacitor (MLCC). Here, the multilayer ceramic capacitor (MLCC) serves to eliminate the screen noise problem that occurs in the camera module 1 of the present invention, and other electronic components used other than the screen noise problem to improve the quality Can be used for

In addition, the multilayer ceramic capacitor (MLCC) as described above is advantageous in that a thin and small package can be realized by combining a multi-chip package and a multi-layered three-dimensional stack structure rather than a single chip package as semiconductors are developed in high performance, high integration, and high speed directions.

And the passive elements 50 are preferably located inside the housing 10 to reduce the size of the product as a whole, on-pattern mounting method using a lead-free solder on the pattern of the non-shrink LTCC substrate 30 There is a method of joining by using the heat of the lead-free and lead-free solder, any method may be used.

In addition, the present invention preferably is the non-shrink LTCC substrate 30 is characterized in that the grooves 34a and 34b are formed on the front and rear in order to mount the IR filter 20 and the image sensor 25. Provided is a camera module (1) employing shrinkage low temperature ceramics.

As shown in FIG. 4, the concave grooves 34a and 34b are formed on the upper and lower surfaces of the non-contraction LTCC substrate 30 around the opening 32, and the grooves 34a ( 34b), the IR filter 20 and the image sensors 25 are disposed. The IR filter 20 serves to block infrared rays incident from the outside, and coats the circumference with a polymer including a resin reacting with ultraviolet rays, and an upper portion of the opening of the non-contraction LTCC substrate 30. Attach to the side center groove.

When the image sensor 25 is attached by a COF flip chip method, the image sensor 25 may be thermally compressed to be bumped (not shown) of the image sensor 25 and the pad portion of the non-contraction LTCC substrate 30. (Not shown), and apply a non-conductive liquid polymer (NCP: Non-Conductive Paste) to the pad portion of the non-condensing LTCC substrate 30 to increase the bond strength therebetween, and rapidly cure it. Attach.

The camera module 1 to which the non-condensing low temperature ceramic according to the present invention configured as described above is applied to the non-condensing LTCC substrate 30, the IR filter 20, the image sensor 25, and the passive element (s) 50. And a printed circuit board 40, and the housing 10 having the lens 5 therein is fixed to the non-contraction LTCC substrate 30.

In this case, the non-contraction LTCC substrate 30 may be formed by sealing the housing 10 using an organic polymer. When the housing 10 having the lens 5 is mounted as described above, the lens 5 of the housing 10, the IR filter 20, and the image sensor 25 are positioned in a straight line with respect to the incident light axis. do.

Accordingly, the image image incident through the lens 5 of the housing 10 passes through the IR filter 20 to remove infrared rays, and passes through the IR filter 20 and then is captured by the image sensor 25. This is done and converted into an electrical signal.

Meanwhile, according to the present invention, the non-condensing LTCC substrate 30 equipped with the IR filter 20, the image sensor 25, the passive element (s) 50, and the printed circuit board 40 is produced in the plastic manufacturing process. There is no shrinkage and the size is kept according to the design dimensions, so the exact size production is possible. Therefore, a camera module having excellent quality can be produced.

In the present invention, since the printed circuit board 40 is connected to the side of the non-contraction LTCC substrate 30, the overall height of the camera module can be lowered by the height of the printed circuit board 40. In addition, the non-shrinkable LTCC substrate 30 does not deteriorate the image quality of the image sensor 25 due to its material properties such that foreign matters are not attached during the manufacturing process. In addition, due to the material properties with low dielectric constant, it is possible to obtain excellent communication efficiency, high speed signal processing, high circuit integration, and high reliability of the product.

In addition, the present invention forms concave grooves 34a and 34b on the upper and lower surfaces of the non-contraction LTCC substrate 30, and the IR filter 20 and the image sensors 25 in the grooves 34a and 34b. Since it is arranged, the overall miniaturization and slimming of the camera module can be achieved.

As described above, according to the present invention, it is possible to prevent the substrate shrinkage action generated at the time of manufacture, thereby improving the dimensional accuracy, thereby obtaining a camera module of excellent quality.

In addition, according to the present invention, by connecting the printed circuit board to the side of the substrate, or forming concave grooves on the upper and lower surfaces of the substrate, and by placing the IR filter and the image sensor in the groove, further improvement in slimming and miniaturization of the product Effect is obtained.

While the invention has been shown and described with respect to specific embodiments thereof, it has been described by way of example only to illustrate the invention, and is not intended to limit the invention to this particular structure. Those skilled in the art will appreciate that various modifications and changes of the present invention can be made without departing from the spirit and scope of the invention as set forth in the claims below. Nevertheless, it will be clearly understood that all such modifications and variations are included within the scope of the present invention.

Claims (7)

In the camera module used for image pickup of the image camera, A lens mounted housing; A non-contraction LTCC substrate connected to the housing and equipped with an IR filter and an image sensor; A printed circuit board connected to the lateral upper surface of the substrate; And And a passive element mounted on the lateral upper surface of the substrate. The camera module of claim 1, wherein the passive elements are positioned inside the housing. The camera module of claim 1, wherein the non-contraction LTCC substrate has grooves formed on the front and rear surfaces thereof to mount the IR filter and the image sensor. The camera module of claim 1 or 2, wherein the passive element comprises at least one multilayer ceramic capacitor (MLCC). The camera module of claim 1, wherein bumps are formed on an electrode pad part electrically connected to the non-contraction LTCC substrate. 6. The camera module of claim 5, wherein the bump is any one of a stud type bump, an electroless bump, and an electrolytic bump. The camera module of claim 1, wherein the printed circuit board is any one of a flexible printed circuit board (FPCB) and a flexible printed circuit board (RF-PCB).

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