KR100772584B1 - Housing for camera module package and camera module package therewith - Google Patents

Abstract

The present invention relates to a housing for a camera module package and a camera module package including the same, which can improve productivity by preventing distortion and misalignment of a substrate on which LEDs and MICs are mounted, and easily positioning in a substrate attaching process. .

To this end, the camera module package according to the present invention comprises: a lens barrel equipped with a plurality of lenses; A sensor substrate on which an image sensor is attached to process light collected by the lens barrel as an electrical signal; An FPCB having one end electrically connected to the sensor substrate and the other end connected to the connector; An electronic component mounting substrate electrically connected to the FPCB and having at least one groove formed on a side thereof; And a) an upper opening for coupling with the lens barrel and a sensor substrate and fixing the electronic component attachment substrate, and a lower opening for coupling with the sensor attachment substrate with an image sensor. A main body, and a plate-shaped seating portion formed integrally with the main body, to which an electronic component mounting substrate on which a plurality of electronic components are mounted is attached, and the electronic component mounting substrate being seated on the seating portion. A guide portion comprising a plurality of guides protruding in the vertical direction of the seating portion on an outer circumference of the seating portion so as to be in contact with a side surface of the board for mounting an electronic component; Housing composed of electronic component attachment board fixing mechanism consisting of protrusions formed to correspond to the position It includes;

Camera Module, LED, MIC, Board, Fixture, Housing

Description

Housing for camera module package and camera module package including same {HOUSING FOR CAMERA MODULE PACKAGE AND CAMERA MODULE PACKAGE THEREWITH}

1 is a perspective view showing a housing structure in a camera module package according to the prior art.

FIG. 2 is a perspective view illustrating a camera module package including the housing structure of FIG. 1. FIG.

Figure 3 is a perspective view showing the housing structure in the camera module package according to the present invention.

4 is a perspective view illustrating a camera module package including the housing structure of FIG. 3.

<Description of the symbols for the main parts of the drawings>

10 housing 11 body

12: fixing mechanism 13: seating part

14: guide portion 15: projection portion

20: lens barrel 30: sensor substrate

40: electronic component mounting board 50: FPCB

61: LED 62: MIC

The present invention relates to a housing for a camera module package and a camera module package including the same, and more particularly, to prevent twisting and alignment error of a substrate on which LEDs and MICs are mounted, and to easily position the substrate during a substrate attaching process. The present invention relates to a camera module package housing and a camera module package including the same.

As a medium for transmitting video information, portable terminals such as mobile phones or PDAs with cameras have been developed and spread. Here, the camera mounted on the portable terminal has a built-in camera module in accordance with a general camera principle and includes an image sensor that receives light from an external light source and recognizes the image as an image.

In addition, in order to satisfy various needs of consumers, for example, the macro (close-up) function of the lens that can change the lens focus manually and the near-field shooting or the digital zoom function that can enlarge a specific part of the image are important functions. Hold. In addition, the flash function that can be taken even in the dark or at night is already common in analog and digital cameras, and it is essential to attach the camera to a portable terminal equipped with a camera. Functionality is also required.

Therefore, a portable terminal capable of transmitting information such as a video by performing a camera function as well as an original communication function includes a camera module for image recognition and LED and voice recording as means for emitting light to a subject so that the subject can be photographed at night. There is a need for a MIC.

The conventional portable terminal including the LED and the MIC and the camera module is a medium for transmitting electrical signals to the camera module and the LED and the MIC, respectively, and a connector for the camera module and a connector for the LED and the MIC are separately required. Due to the space occupied by the module connector and the LED and MIC connector, it was difficult to place two connectors inside the mobile terminal. In addition, the camera module embedded in the portable terminal has a problem that the volume of the portable terminal is large because it needs to accommodate two connectors, and the problem of an increase in manufacturing cost is inevitably caused by each connector separately required.

As a technique for solving such a problem, it is disclosed in Korean Patent Laid-Open Publication No. 2004-0078317 and the like, with reference to FIGS. 1 and 2.

1 is a perspective view illustrating a housing structure in a camera module package according to the related art, and FIG. 2 is a perspective view illustrating a camera module package including a housing structure according to FIG. 1.

As shown in FIGS. 1 and 2, the housing 110 for a camera module package according to the related art is coupled to a sensor mounting substrate 130 having an upper opening and an image sensor attached to the lens barrel 120. A plate-shaped seating part 112 to which a lower opening is formed, and an electronic component mounting substrate 140 on which a plurality of electronic components 161 and 162 are surface-mounted is integrally formed. It includes.

That is, in the prior art, a double-sided tape is attached to the lower surface of the electronic component attachment substrate 140 and fixed to the mounting portion 112 when mounting the electronic component attachment substrate 140 to the mounting portion 112. .

However, such a fixing method in the prior art is difficult to manage the position to be attached at the time of attachment of the electronic component attachment substrate 140 to the mounting portion 112, not only workability is lowered, but also when external force is applied or harsh When the electronic component mounting substrate 140 is pushed out of a designated position when used in an environment, the LED and MIC positions mounted on the electronic component mounting substrate 140 may be misaligned, causing product defects.

The present invention is to solve the above-described problems, the object of the present invention is to facilitate the management of the position at the time of the substrate attached to the LED and MIC, etc., not only to improve the workability, but also to the external environment LED and The present invention provides a housing and a camera module package including the same in which a board on which a MIC or the like is mounted is fixed at a designated position to prevent product defects.

In order to achieve the above object, the camera module package housing according to the present invention, the upper opening for coupling with the lens barrel, and the lower opening for coupling with the sensor mounting substrate with an image sensor; And a) a plate-shaped seating portion formed integrally with the main body, to which a) an electronic component mounting substrate on which a plurality of electronic components are mounted, and b) the electronic component mounting substrate is seated on the seating portion. An electronic component comprising a guide portion formed of a plurality of guides protruding in the vertical direction of the seating portion on the outer peripheral portion of the seating portion so as to be in contact with the side surface of the electronic component attachment substrate, and c) a protrusion portion protruding from the guide portion into the seating portion. Attachment substrate fixing mechanism; includes.

Here, the seating portion is a rectangular plate, the projection is characterized in that the protrusion formed from a pair of guides facing each other.

In addition, the protrusion is preferably formed to protrude one or more from each guide.

On the other hand, in order to achieve the above object, the camera module package according to the present invention, a lens barrel equipped with a plurality of lenses; A sensor substrate on which an image sensor is attached to process light collected by the lens barrel as an electrical signal; An FPCB having one end electrically connected to the sensor substrate and the other end connected to the connector; An electronic component mounting substrate electrically connected to the FPCB and having at least one groove formed on a side thereof; And a) an upper opening for coupling with the lens barrel and a sensor substrate and fixing the electronic component attachment substrate, and a lower opening for coupling with the sensor attachment substrate with an image sensor. A main body, and a plate-shaped seating portion formed integrally with the main body, to which an electronic component mounting substrate on which a plurality of electronic components are mounted is attached, and the electronic component mounting substrate being seated on the seating portion. A guide portion comprising a plurality of guides protruding in the vertical direction of the seating portion on an outer circumference of the seating portion so as to be in contact with a side surface of the board for mounting an electronic component; Housing composed of electronic component attachment board fixing mechanism consisting of protrusions formed to correspond to the position It includes;

Here, the plurality of electronic components is characterized in that it comprises an LED and MIC.

In addition, the seating portion is a rectangular plate, the projection is characterized in that the protrusion formed from a pair of guides facing each other.

In addition, the protrusion is preferably formed at least one protrusion from each guide.

The above object of the present invention will become more apparent from the preferred embodiments of the present invention described below with reference to the accompanying drawings, by those skilled in the art.

Hereinafter, with reference to the accompanying drawings will be described an embodiment of the present invention;

housing  rescue

3 is a perspective view showing a housing structure for a camera module package according to an embodiment of the present invention.

The housing 10 includes a housing main body 11 corresponding to an external airtight mechanism part constituting a conventional camera module, and a fixing mechanism 12 integrally formed with the housing main body to support a substrate on which LEDs, MICs, and the like are mounted. It consists of.

First, the main body 11 includes an upper opening formed at an upper side for coupling with a lens barrel (20 in FIG. 4) equipped with a plurality of imaging lenses, and an image sensor for converting light passing through the lens barrel into an electrical signal. And a lower opening formed downward to engage the attached sensor substrate (30 in FIG. 4). Typically, the upper opening of the main body 11 is formed to protrude in a cylinder structure with a threaded inside to screw the spherical lens barrel, and the lower opening of the main body 11 has a rectangular sensor substrate, an epoxy resin, or the like. It is formed to protrude into a tetrahedral structure in order to bond through the adhesive.

Next, the fixing mechanism 12 refers to a supporting structure formed integrally with the main body 11 in order to mount and support the electronic component mounting board (40 in FIG. 4) in which elements such as LEDs and MICs are mounted. The support structure, which is the fixing mechanism 12, includes a seating part 13, a guide part 14 formed on the seating part 13, and a protrusion part protruding toward the seating part from the guide part 14. 15).

The seating part 13 is a plate to which the electronic component mounting substrate 40 on which a plurality of electronic components are surface mounted is attached. Therefore, the rear surface of the electronic component mounting substrate 40 is coupled to each other in a state where the upper surface of the seating portion 13 and the adhesive means such as a double-sided tape. On the other hand, the seating portion 13 may be formed in a shape corresponding to the shape of the electronic component mounting substrate 40, and is typically made of a rectangular plate.

The guide part 14 is a guide means for preventing the electronic component mounting substrate 40 from being pushed from side to side. It is formed on the edge portion of the seating portion 13, the electronic component mounting substrate 40 is in contact with the side of the electronic component mounting substrate 40 in a state seated on the seating portion (13) The outer peripheral portion of the seating portion 13 includes a plurality of guides protruding in the vertical direction of the mounting portion 13 surface.

The plurality of guide parts 14 may be formed on three surfaces of the rectangular seating parts in consideration of the position of the FPCB (50 in FIG. 4) connected to the electronic component mounting board 40. On the other hand, the guide may be formed in a continuous shape along one surface or may be formed in a discrete shape.

The protrusion part 15 is a fixing means protruding from the guide part 14 toward the seating part 13. That is, as described above, the guide constituting the guide part 14 is formed on three sides of the rectangular seating parts in consideration of the position of the FPCB (50 in FIG. 4) connected to the electronic component mounting substrate 40. Therefore, the electronic component mounting substrate 40 may be pushed in the surface direction in which the guide is not formed. The protrusion 15 is configured to prevent such a phenomenon. In addition, the protrusion 15 may serve as an attachment criterion when combined with the electronic component mounting substrate 40, thereby improving productivity by accurately and easily attaching a substrate at a predetermined position.

In the case where the seating portion 13 is a rectangular plate, the protrusion 15 is preferably protruded from a pair of guides facing each other for more stable support for the electronic component mounting substrate 40. The protrusions 15 may be formed to protrude one or more from each guide.

Camera Module Package

4 is a perspective view of a camera module package used in a portable terminal configured using the housing described above.

 The camera module package according to the present invention includes a lens barrel (20) equipped with a plurality of lenses, and a sensor substrate (30) with an image sensor for processing light collected by the lens barrel (20) as an electrical signal. ), An FPCB 50 having one end electrically connected to the sensor substrate 30 and the other end connected to a connector (not shown), and an electronic component mounting board 40 electrically connected to the FPCB 50. And a main body 11 and a fixing mechanism 12 for coupling with the lens barrel 20 and the sensor substrate 30 and fixing the electronic component mounting substrate 40 as described above. And a housing 10.

The lens barrel 20 functions as a lens holder and is typically formed of a resin such as polycarbonate, and has apertures and condensing on the bottom side inserted into the housing 10. A lens or the like is installed. The aperture defines a passage of light passing through the condenser lens, and the condenser lens receives light passing through the aperture to the light receiving portion of the image sensor element described later. IR coated glass is adhered to the upper surface of the lens barrel 20 to prevent foreign matter from penetrating into the aperture and the condenser lens.

An image sensor for recognizing an image captured by an imaging lens mounted on the lens barrel 20 is mounted on an upper surface of the sensor substrate 30. Here, the image sensor is mounted on the substrate by a known die bonding and wire bonding method. That is, the image sensor is fixed by die bonding to the upper surface of the substrate on which the metallized conductor is formed by using a conductive adhesive or the like, and the electrode pad of the image sensor is wire bonded to the metallized conductor by metal wires for mounting. Can be. However, it is apparent to those skilled in the art that the mounting structure of the image sensor of the camera module such as the portable terminal according to the present invention is not limited thereto. For example, the image sensor may be adopted as a known mounting method as long as it is a mounting method well known to those skilled in the art such as a flip chip method and a gold bump method.

One end of the FPCB 50 is electrically connected to the sensor substrate 30 and the electronic component mounting substrate 40, and the other end thereof is connected to a connector (not shown). The FPCB 50 is a flexible connection. Electrical coupling with the substrates 30 and 40 as a substrate may be performed by a method that is typically performed by those skilled in the art.

Electronic components including LEDs and MICs are mounted on the electronic component mounting substrate 40, wherein the electronic component mounting substrate 40 is provided with the protrusions 15 of the electronic component mounting substrate fixing mechanism 12. It is preferable to include a groove formed corresponding to the position. That is, as a result of the coupling between the groove formed in the electronic component mounting substrate 40 and the protrusion 15 of the electronic component mounting substrate fixing mechanism 12, the seating portion in which the guide portion 14 is not formed ( 13) not only can the electronic component mounting substrate 40 be pushed in a plane direction, but also can be a reference when the electronic component mounting substrate 40 is attached, so that it can be accurately and easily positioned at a predetermined position. The substrate is attached to improve productivity.

Since the configuration of the housing 10 overlaps with the above description, a description of the detailed description will be omitted.

Preferred embodiments of the present invention described above are disclosed for the purpose of illustration, and various substitutions, modifications, and changes within the scope without departing from the spirit of the present invention for those skilled in the art to which the present invention pertains. It will be possible, but such substitutions, changes and the like should be regarded as belonging to the following claims.

As will be understood from the above description, the present invention facilitates the management of the position at the time of attaching the substrate on which the LEDs and the MICs are mounted, thereby improving workability, and the LEDs and the MICs mounted to the external environment. The substrate is fixed at the designated position, which has the effect of preventing product defects.

Claims (7)

delete delete delete A lens barrel equipped with a plurality of lenses; A sensor substrate on which an image sensor is attached to process light collected by the lens barrel as an electrical signal; An FPCB having one end electrically connected to the sensor substrate and the other end connected to the connector; An electronic component mounting substrate electrically connected to the FPCB and having at least one groove formed on a side thereof; And In order to be coupled to the lens barrel and the sensor substrate, to fix the electronic component mounting substrate, A) a main body having an upper opening for coupling with the lens barrel and a lower opening for coupling with a sensor substrate with an image sensor attached thereto; and B) a plate-shaped mounting portion formed integrally with the main body, to which the electronic component mounting substrate on which a plurality of electronic components are mounted is attached, and the electronic component mounting substrate mounted on the mounting portion; A guide portion comprising a plurality of guides protruding in the vertical direction of the seating portion on the outer peripheral portion of the seating portion so as to contact the side surface of the mounting substrate, and protruding from the guide portion toward the inside of the seating portion and the groove of the electronic component mounting substrate; Electronic component mounting board fixing mechanism consisting of protrusions formed to correspond to position A housing composed of; Camera module package comprising a. The method of claim 4, wherein The plurality of electronic components camera module package, characterized in that it comprises an LED and MIC. The method of claim 4, wherein The seating portion is a rectangular plate, wherein the projection is a camera module package, characterized in that protruding from a pair of guide portions facing each other. The method according to any one of claims 4 to 6, The projection module is a camera module package, characterized in that one or more protruding from each guide portion.

Images