KR100767680B1 - Electroluminescent device and the substrate therefor and method of making the same - Google Patents

Abstract

An electroluminescent device, a substrate thereof, and a method for manufacturing the same are provided to sinter a structure formed on a substrate at a high temperature by constructing the substrate including a metal. An electroluminescent device includes a metal layer(110) and a light emission layer on a substrate(100). A lower electrode(210) and a lower dielectric layer(220) are sequentially formed and an insulating layer(120) is positioned between a metal layer(110) and the light emission layer. An overall color is represented by converting a blue light into a red light and a green light with a color conversion layer(260). An upper dielectric layer(240) and an upper electrode(250) are sequentially formed on a fluorescent layer(230).

Description

Electroluminescent device and its substrate and manufacturing method thereof {Electroluminescent device and the substrate therefor and method of making the same}

1 is a cross-sectional view showing a substrate structure of the present invention.

2 is a cross-sectional view showing another example of the substrate of the present invention.

3 is a cross-sectional view showing the structure of the device of the present invention.

4 to 7 are diagrams showing a first embodiment of the present invention.

  4 is a cross-sectional view illustrating a step of forming a lower electrode and a lower dielectric layer on a substrate.

  5 is a cross-sectional view illustrating a step of forming a phosphor layer on a lower dielectric layer.

  6 is a cross-sectional view illustrating a step of forming an upper dielectric layer and an upper electrode on a phosphor layer.

  7 is a cross-sectional view illustrating a step of forming a color correction layer and a protective layer on an upper electrode.

8 to 11 are diagrams showing a second embodiment of the present invention.

  8 is a cross-sectional view illustrating a step of forming a lower electrode, a lower dielectric layer, and a phosphor layer on a substrate.

  9 is a cross-sectional view illustrating a step of forming an upper dielectric layer, an upper electrode, and a color conversion layer on a phosphor layer.

  10 is a schematic view showing the operation of the color conversion layer of the present invention.

  11 is a cross-sectional view illustrating a step of forming a protective layer on a color conversion layer.

<Brief description of the main parts of the drawing>

100 substrate 200 emitting layer

210: lower electrode 220: lower dielectric layer

230: phosphor layer 240: upper dielectric layer

250: upper electrode 260: color conversion layer

300: color correction layer 400: protective layer

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroluminescent element, a substrate thereof, and a method of manufacturing the same, and more particularly, to an electroluminescent element capable of improving luminous efficiency, a substrate thereof, and a manufacturing method thereof.

Electroluminescence is widely used in light emitting devices and display devices using the same, particularly flat panel display devices.

Among them, an inorganic electroluminescent device using an inorganic thin film can be used in a flat panel display panel, and an electron inducing light emission by exciting electrons accelerated by a high electric field impacts the phosphor and excites the phosphor. It has advantages such as high brightness, long life and high resolution.

The structure of such an inorganic electroluminescent element is mainly composed of a phosphor layer which emits light, a dielectric layer and electrodes located on both sides of the phosphor layer.

The dielectric layer not only contributes to the stability of the device by protecting the device from breakdown and external impurities, but also plays an important role in determining the characteristics of luminous efficiency and luminance according to the interface state with the phosphor.

In addition, a glass or ceramic substrate is usually used for the substrate, and the insulating film, the electrode, and the phosphor layer described above are stacked on the glass or ceramic substrate and partially or wholly fired to form a device structure.

Among the substrates, the ceramic substrate is expensive and easily broken, which requires a great deal of attention in the process and increases the cost.

In addition, the use of glass as the material of the substrate is subject to the constraint of the firing temperature. In other words, when using a conventional glass substrate such as that used in LCD or PDP, it is difficult to raise the firing temperature by 600 ° C or higher, and when other high melting glass is used, the cost is greatly increased.

The phosphor layer used in the electroluminescent device described above may increase the particle size of the phosphor when fired at a high temperature, thereby increasing the efficiency of the phosphor.

As a result, the above-described conventional substrate has a problem that the cost is not increased, the handling is not easy, and the efficiency increase effect of the phosphor obtained by firing at a high temperature is not utilized.

SUMMARY OF THE INVENTION The present invention has been made in an effort to provide an electroluminescent device, a substrate thereof, and a method of manufacturing the same, which can be baked at a high temperature, can improve mass productivity, and can improve luminous efficiency.

As a first aspect for achieving the above technical problem, the present invention provides an electroluminescent device comprising: a metal substrate; It is preferable that the light emitting layer is formed on the metal substrate.

As a second aspect for achieving the above technical problem, the present invention is an electroluminescent device comprising: a substrate comprising a metal layer; It is preferably configured to include a light emitting layer formed on the substrate.

As a third aspect for achieving the above technical problem, the present invention provides a substrate of an electroluminescent device comprising: a metal layer; It is preferably configured to include an insulating layer on the metal layer, including an additive for matching the coefficient of thermal expansion with the metal layer.

As a fourth aspect for achieving the above technical problem, the present invention provides a method of manufacturing an electroluminescent device, comprising: forming an insulating layer on a metal substrate; Forming a light emitting layer on the insulating layer; It is preferably configured to include the step of firing including the metal substrate.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

While the invention allows for various modifications and variations, specific embodiments thereof are illustrated by way of example in the drawings and will be described in detail below. However, this is not intended to limit the invention to the particular forms disclosed, but rather the invention includes all modifications, equivalents, and substitutes consistent with the spirit of the invention as defined by the claims.

Like reference numerals denote like elements throughout the description of the drawings. In the drawings, the dimensions of layers and regions may be exaggerated for clarity.

When an element such as a layer, region or substrate is referred to as being on another component "on", this means that there may be an intermediate element directly on another element or in between.

It will be understood that these terms are intended to include other directions of the device in addition to the direction depicted in the figures. Finally, the term 'directly' means that there is no element in between. As used herein, the term 'and / or' includes any and all combinations of one or more of the recorded related items.

Although the terms first, second, etc. may be used to describe various elements, components, regions, layers, and / or regions, such elements, components, regions, layers, and / or regions It will be understood that it should not be limited by these terms.

These terms are only used to distinguish one element, component, region, layer or region from another region, layer or region. Thus, the first region, layer or region discussed below may be referred to as the second region, layer or region.

First Embodiment

As shown in FIG. 1, the electroluminescent element of the present invention is formed on a substrate 100 containing a metal.

The substrate 100 including the metal may include a metal layer 110 and an insulating layer 120 positioned on the metal layer 110 as shown in FIG. 1.

The metal layer 110 that may be used for the substrate 100 may be made of any one metal of titanium (Ti), nickel (Ni), and cobalt (Co).

Of course, it may be made of an alloy of any one or more of such metals as titanium (Ti), nickel (Ni), and cobalt (Co), and at least one of such titanium (Ti), nickel (Ni), and cobalt (Co). As a main element, it may be formed from an alloy containing another metal.

The insulating layer 120 is formed to insulate the light emitting layer 200 (refer to FIG. 3) formed on the substrate 100, and may include a dielectric such as ceramic and glass.

The insulating layer 120 may be formed of a green sheet and formed on the metal layer 110 of the substrate 100. The green sheet may include a dielectric powder, a binder, a dispersant, a solvent, a plasticizer, and the like. .

As such, when manufactured by the green sheet method, the green sheet may be laminated on the metal layer 110 of the substrate 100 to form the insulating layer 120. As such, the green sheet of the laminated insulating layer 120 may be fired later.

On the other hand, when the temperature change occurs, the insulating layer 120 may include an additive for matching the thermal expansion coefficient with the metal layer 110. This is because the metal layer 110 has a thermal expansion coefficient determined according to the type of material used, but the insulating layer 120 can match the thermal expansion coefficient according to a corresponding temperature.

For example, when the structure of the substrate 100 including the metal layer 110 and the insulating layer 120 or a device including the same is fired, thermal expansion may occur according to the firing temperature, and the substrate 100 ) And the insulating layer 120 may include additives to have the same thermal expansion tendency.

In particular, it is advantageous that the matching of the thermal expansion coefficient is such that optimal matching can be achieved at the firing temperature.

For example, the substrate 100 may be temporarily deformed, such as bending or expanding in one direction or the other, depending on the temperature range. In this case, the insulating layer 120 may also be in the same direction as the substrate 100. The deformation can be caused.

As such an additive, at least one of aluminum oxide, azirconia (ZrO ₂ ), titanium oxide (TiO ₂ ), and forsterite (Mg ₂ SiO ₄ ) may be used.

In addition, the matching of the thermal expansion coefficient of the metal layer 110 and the insulating layer 120 may be achieved by including an additive in the insulating layer 120 and by changing the composition of the matrix dielectric powder included in the insulating layer 120. have.

The matching of the thermal expansion coefficient may be achieved by changing the composition of the matrix dielectric powder included in the insulating layer 120 without using an additive in the insulating layer 120.

Meanwhile, as shown in FIG. 2, a separate bonding layer 130 may be positioned to couple the insulating layer 120 and the metal layer 110.

A low melting glass powder may be used as the bonding layer 130, and by firing the glass powder, the insulating layer 120 and the metal layer 110 may be firmly bonded.

The substrate 100 having such a structure may be fired separately, or may be fired together with some or all of the light emitting layer 200 formed on the substrate 100.

As described above, the substrate 100 including the metal layer 110 may be fired at a high temperature, for example, at a temperature of 600 ° C. or higher. In general, since the melting point of the metal is much higher than that of glass, the firing temperature can be greatly increased, and thus, the effect of the firing temperature rise can be sufficiently enjoyed.

In addition, since the metal has excellent thermal conductivity, heat generated in the device may be easily discharged by the substrate 100 including the metal layer 110, and thus, the above-described substrate 100 structure may have an advantage in generating heat. Can be.

3, the light emitting layer 200 including the phosphor layer emitting light by an electric field is formed on the substrate 100. The formation of the light emitting layer 200 will be described below.

First, a lower electrode 210 is formed on the substrate 100, and the lower electrode 210 may be patterned into a specific pattern, for example, a stripe shape.

The lower electrode 210 may be formed of a metal such as copper (Cu), chromium (Cr), or gold (Au) by a sputtering method, or may be formed of an alloy containing silver (Ag) or silver (Ag). have.

At this time, the alloy containing silver (Ag) or silver (Ag) can be formed by a printing method or a green sheet method. Thus, when the lower electrode 210 is formed of silver (Ag) or an alloy containing silver (Ag), the lower electrode 210 may be formed thicker in a simpler process.

That is, the printing method or the green sheet method described above does not require expensive equipment than the sputtering method, and can be manufactured by a simple process, and the lower electrode 210 is formed thicker than the sputtering method. can do.

The lower dielectric layer 220 is formed on the lower electrode 210. The lower dielectric layer 220 may be formed one or several times, and may be formed by a printing method, a green sheet method, or a table coating method.

Subsequently, as shown in FIG. 5, the phosphor layer 230 is formed on the lower dielectric layer 220. In the phosphor layer 230, a red phosphor 231, a green phosphor 232, and a blue phosphor 233 may be sequentially formed or patterned to form a light emitting cell.

These three phosphors may form one pixel, and the red 231 phosphor, the green 232 phosphor, and the blue phosphor 233 may be formed as subpixels, respectively.

On the phosphor layer 230 formed as described above, as shown in FIG. 6, the upper dielectric layer 240 and the upper electrode 250 are sequentially formed.

The upper dielectric layer 240 may be formed in the same manner as the lower dielectric layer 220 described above.

In addition, the upper electrode 250 may be formed in a pattern crossing the lower electrode 210. For example, the upper electrode 250 may be formed in a stripe shape orthogonal to the pattern of the lower electrode 210.

As illustrated in FIG. 7, the color correction layer 300 for correcting the light emitted from the phosphor layer 230 to match the color coordinates may be positioned on the formed light emitting layer 200.

In addition, a protective layer 400 may be formed on the light emitting layer 200 or the color correction layer 300 to protect the light emitting layer 200 and the substrate 100 from external impact.

Second Embodiment

As shown in FIG. 8, the light emitting layer 200 is formed on the substrate 100 including the metal layer 110.

In addition, the lower electrode 210 and the lower dielectric layer 220 of the light emitting layer 200 may be sequentially formed, and the insulating layer 120 may be positioned between the metal layer 110 and the light emitting layer 200. Same as the example.

In this case, as shown in FIG. 8, the blue phosphor 233 may form the phosphor layer 230 forming the entire layer on the lower dielectric layer 220.

As described above, the blue light emitted by the blue phosphor 233 may be converted into red light and green light by the color conversion layer 260 (see FIG. 9), which will be described later, to represent the entire color.

The upper dielectric layer 240 and the upper electrode 250 are sequentially formed on the phosphor layer 230 formed as described above.

The upper dielectric layer 240 may be formed in the same manner as the lower dielectric layer 220 described above.

In addition, the upper electrode 250 may be formed in a pattern crossing the lower electrode 210. For example, the upper electrode 250 may be formed in a stripe shape orthogonal to the pattern of the lower electrode 210.

The color conversion layer 260 is formed on the upper electrode 250. As described above, the color conversion layer 260 may convert blue light emitted from the blue phosphor 233 into red (R) light and green (G) light, respectively.

10 schematically illustrates the operation of the color conversion layer 260. That is, the color conversion layer 260 is composed of a red conversion unit 261, a green conversion unit 262, and a blue correction unit 263, and the red conversion unit 261 converts blue light into red and green conversion. The unit 262 converts blue light into green.

In this case, the blue corrector 263 may correct the blue light, and may pass the light as it is.

Although a separate color correction layer may be located on the color conversion layer 260, a separate color correction layer may not be necessary if the color conversion layer 260 can output each color in an optimal color coordinate. .

In addition, a protective layer 400 is formed on the color conversion layer 260 to protect the light emitting layer 200 and the substrate 100 from external impact.

As described above, the substrate 100 including the metal layer 110 may be fired at a high temperature, for example, at a temperature of 600 ° C. or higher. In general, since the melting point of the metal is much higher than that of glass, the firing temperature can be greatly increased, and thus, the effect of the firing temperature rise can be sufficiently enjoyed.

The above embodiment is an example for explaining the technical idea of the present invention in detail, and the present invention is not limited to the above embodiment, various modifications are possible, and various embodiments of the technical idea are all protected by the present invention. It belongs to the scope.

The present invention as described above has the following effects.

First, by constructing a substrate including a metal, it is possible to fire the structure formed on the substrate at a high temperature.

Secondly, high-temperature firing is possible such that the efficiency of the phosphor can be improved.

Third, the handling of the substrate and the structure formed on the substrate is easy to improve mass productivity and reduce cost.

Claims (27)

In the electroluminescent device, A metal substrate; And a light emitting layer formed on the metal substrate and including a phosphor layer and a dielectric layer positioned on both surfaces of the phosphor layer. The electroluminescent device of claim 1, further comprising an electrode disposed on each of the dielectric layers. The electroluminescent device according to claim 1, wherein the phosphor layer emits red (R), green (G), and blue (B). The electroluminescent device according to claim 1, wherein the phosphor layer emits blue (B). The electroluminescent device according to claim 4, further comprising a color conversion layer for converting the blue (B) light into red (R) and green (G) on the phosphor layer. The electroluminescent device according to claim 5, wherein the color conversion layer is located on the electrode. The electroluminescent device according to claim 2, wherein the electrode is made of Ag or an alloy containing Ag. The electroluminescent device according to claim 1, further comprising a color correction layer that corrects the color of light emitted from the phosphor layer. The electroluminescent device according to claim 1, wherein the metal substrate comprises any one of Ti, Ni, and Co. The electroluminescent device according to claim 1, wherein the metal substrate is made of at least one alloy of Ti, Ni, or Co, or an alloy containing Ti, Ni, or Co as a main element. The electroluminescent device according to claim 1, further comprising an insulating layer between the metal substrate and the light emitting layer. The electroluminescent device according to claim 11, wherein the insulating layer comprises an additive for matching a coefficient of thermal expansion with the metal substrate. The electroluminescent device according to claim 12, wherein the thermal expansion coefficient is matched with the metal substrate so that the thermal expansion coefficient is optimally matched at the firing temperature of the device. The method of claim 12, wherein the additive is at least one of aluminum oxide (alumina), zirconia (zirconia: ZrO ₂ ), titanium oxide (TiO ₂ ), forsterite (Mg ₂ SiO ₄ ). EL device. The electroluminescent device according to claim 11, further comprising a bonding layer between the metal substrate and the insulating layer for bonding the metal substrate and the insulating layer. The electroluminescent device according to claim 15, wherein the bonding layer is low melting glass. In the electroluminescent device, A substrate comprising a metal layer; And a light emitting layer formed on the substrate, the light emitting layer including a phosphor layer and a dielectric layer positioned on both surfaces of the phosphor layer. In the substrate of the electroluminescent element, A metal layer; And an insulating layer on the metal layer, the insulating layer including an additive for matching a coefficient of thermal expansion with the metal layer. The substrate of an electroluminescent device according to claim 18, wherein the insulating layer is a green sheet containing a dielectric. 19. The substrate of claim 18, further comprising a bonding layer for bonding the metal layer and the insulating layer between the metal layer and the insulating layer. The substrate of an electroluminescent device according to claim 20, wherein the bonding layer is low melting glass. In the manufacturing method of the electroluminescent element, Forming an insulating layer on the metal substrate; Forming a light emitting layer including a dielectric layer on the insulating layer; Method of manufacturing an electroluminescent device comprising the step of firing including the metal substrate. The method of claim 22, wherein the applying of the insulating layer comprises laminating a green sheet including a dielectric. 23. The method of claim 22, wherein the insulating layer includes an additive for matching a thermal expansion coefficient. 23. The method of claim 22, further comprising forming an electrode between the metal substrate and the insulating layer. The method of claim 25, wherein the electrode is formed of Ag or an alloy of Ag. The method according to claim 25, wherein the electrode is formed by a printing method or a green sheet method.

Images