KR100765814B1 - Gas tank inner-face grinder - Google Patents

Abstract

An inner-face grinder of a semiconductor gas tank is provided to restrain the generation of accidents by loading/unloading automatically the gas tank to/from a container using a tank loading unit. An inner-face grinder of a semiconductor gas tank includes a tank grinding unit and a tank loading unit. The tank grinding unit(100) is composed of a cabinet(110) with a body and a lid, a plurality of containers spaced apart from each other along a periphery of an inner portion of the cabinet, a driving member for polishing an inner-face of the gas tank by rotating the cabinets. The tank loading unit(200) is used for loading/unloading the gas tank to/from the container. The tank loading unit is composed of a base frame(210) spaced apart from the tank grinding unit, a moving block(220) capable of moving to and fro by using a guide member, a tank loading bar, an operation part. The tank loading bar(230) is connected to the moving block. The tank loading bar includes an adsorbing portion for adsorbing the gas tank using a magnetic force. The operation part is used for operating the tank loading bar.

Description

Gas tank inner surface grinder for semiconductors {GAS TANK INNER-FACE GRINDER}

The present invention relates to a gas tank inner surface polishing machine for semiconductors, and more particularly, a loading / unloading operation for polishing a gas tank is performed by an automated process, so that a safety accident occurs during loading / unloading of a gas tank. In addition, the present invention relates to a gas tank inner surface grinder for semiconductors which can prevent gas deterioration by polishing all inner surfaces of a gas tank.

In general, the inner surface of a tank or a formula containing ultra-pure gas made of stainless steel should have a surface roughness like a mirror. In other words, when the surface roughness of the inner surface of the tank falls, various impurities and harmful substances are attached to the inner surface of the tank, and the microorganisms multiply, and when the microorganisms are attached and start breeding in the tank, various gases stored in the tank are deteriorated. There is a problem.

In addition, since the inner surface of the tank is easily corroded due to the propagation of microorganisms as described above, there is a problem in that the tanks need to be replaced with a new tank within a short time after the tanks are installed.

When the gas supplied from the contaminated tank is supplied to the semiconductor line, the defect rate of the semiconductor is increased, so that the inner surface of the tank is polished to prevent the gas from deteriorating.

Conventionally, a method of grinding a gas tank is a method in which a worker grinds an inner surface of a tank by hand using a hand grinder or the like, and a polishing is performed by physical friction between the abrasive and the inner surface of the tank by inserting an abrasive into the tank and rotating the tank. And electrolytic methods. Since the present invention relates to a polishing method by an abrasive among the above-described polishing methods, only the polishing method by an abrasive is described below.

The gas tank inner surface grinder according to the prior art is, for example, configured to include a base, a plurality of containers installed on the base and accommodating the gas tank, and driving means for rotating the container.

According to the gas tank inner surface grinder according to the prior art, after the operator inserts and seals the abrasive into the gas tank and seals it, the tank is connected to the crane and transported to the grinder side, and the crane mounts the tank to the container and the crane Remove the tank from the tank to complete the loading of the tank. Subsequently, the container is driven through the driving means to polish the inner surface of the tank by the abrasive. When polishing is completed, the container is opened and the tank inside the container is connected to the crane and loaded at a predetermined place.

The gas tank polishing machine according to the prior art has the following problems.

After the gas tank is mounted on the crane and transported to the grinder through the crane, the operator must mount the gas tank in the grinder and mount the gas tank on the crane. Or when connected to a crane, the gas tank may fall into the operator's body, so there is a problem of a safety accident in which the operator is injured.

In addition, the gas tank is mounted on the polishing machine after the abrasive is put into the inside, and when the abrasive is rotated in the circumferential direction inside the polishing machine, the abrasive polishes the inner circumferential surface by rubbing the inner circumferential surface of the gas tank. Because it rotates while maintaining, i.e., all parts of the gas tank maintain the same distance as the rotation axis, which is the center of rotation, the abrasive reaches all corners of the gas tank (lower bottom part and upper head part (opening part) of the gas tank). Therefore, there is a problem that does not fit the entire area of the gas tank to the desired illuminance. After polishing the gas tank, the degree of polishing of the gas tank is inspected. In this case, if an incomplete polishing area is found in a part of the gas tank, the polishing cost is increased because it needs to be re-polished. If the semiconductor gas is injected without finding a problem, the semiconductor gas is deteriorated.

In order to solve such a problem, the inner surface grinding machine of the gas container has been proposed as a registered utility model No. 409701.

The inner surface of the gas container grinder according to the prior art includes a base having a support shaft extending in the front and rear directions, an upper body having a lower end rotatably coupled to the support shaft to be tilted in the left and right directions, and both ends having the base and An actuator connected to the upper body to tilt the upper body left and right by stretching, a rotating shaft mounted to the upper body in a horizontal direction, a pair of rotating plates mounted parallel to both sides of the rotating shaft, and It is configured to support the gas container and is configured to include a plurality of containers rotatably mounted in the horizontal direction between the rotating plate, and a driving device to rotate the rotating plate and the container.

According to the conventional gas container inner surface grinder configured as described above, when the gas container is polished, the upper body is inclined to the left and right to cause the container to oscillate to polish the lower bottom part and the upper head part of the gas container. There is a problem in that the swinging method according to the prior art requires a large driving force to tilt the upper body since the upper body is inclined from side to side to which all structures such as containers and driving means are installed.

In addition, since the driving means is a gear type, there is a problem that a large mechanical noise is generated.

In addition, the above-described registered utility model No. 4,097,1 also causes the above-described problems as it carries the gas tank by a crane.

The present invention is to solve the above-mentioned problems, the operation of mounting and replacing the gas tank for polishing the inner surface of the gas tank that stores the ultra-pure gas in the key components of the equipment for producing a semiconductor The purpose of the present invention is to provide an internal grinding machine for a semiconductor gas tank that can be automated and prevent safety accidents.

In addition, another object of the present invention is to reduce the mechanical noise when grinding the gas tank.

Another object of the present invention is to maintain the roughness of all the inner surface of the gas tank to the extent that the gas does not deteriorate.

Gas tank inner surface polishing machine for semiconductor according to the present invention for achieving the above object, the tank polishing unit; And a tank loading unit for putting a gas tank into the container of the gas tank polishing unit and removing the gas tank from the container, wherein the gas tank loading unit includes a base frame disposed at a predetermined distance from the tank polishing unit, and the base A moving block mounted on the frame so as to be moved forward and backward to the tank polishing unit side through a guide means, a tank loading bar having one side coupled to the moving block and an adsorption unit adsorbing the gas tank by magnetic force on the other side, the tank loading bar Characterized in that configured to include an operating unit for operating.

According to the gas tank inner surface grinder for semiconductors according to the present invention, the gas tank is automatically mounted on the container through the tank loading unit and the gas tank that has been polished is automatically removed from the container. It can prevent accidental accidents such as bumps and bruises or falling gas tanks to workers.

In addition, since the gas tank is mounted inclined with respect to the rotation axis, the abrasive filled inside the gas tank also polishes the lower bottom portion and the upper injection portion of the gas tank, so that all inner surfaces of the gas tank can be aligned to the desired degree of roughness, and consequently the gas tank. It can prevent the deterioration of the gas filled in.

In addition, since the container receives power through the belt and revolves and rotates, no noise is generated when the container is driven, thereby improving reliability of the device.

The features and advantages of the present invention will become more apparent from the following detailed description based on the accompanying drawings. Prior to this, the terms or words used in the present specification and claims are defined in the technical spirit of the present invention on the basis of the principle that the inventor can appropriately define the concept of the term in order to explain his invention in the best way. It must be interpreted to mean meanings and concepts.

As shown in Fig. 1 and Fig. 2, the gas tank inner surface grinder according to the present invention includes a tank polishing portion that rotates (rotates and revolves) the tank 1 to polish the inner surface of the tank by the abrasive material introduced into the tank. 100; And it is made of a tank loading unit 200 for loading the tank (injecting the tank in the tank polishing unit or taking out the tank in the tank polishing unit), each component will be described in detail below.

The tank polishing unit 100 is installed in the cabinet 110 having a space therein, the cabinet 110 at regular intervals along the circumferential direction, and the tanks are mounted therein, respectively, through driving means to be described later. And a plurality of containers 120 for rotating and revolving the tank to grind the inner surface of the tank, and driving means 130 for rotating and revolving the container 120.

Cabinet 110 is supported by the ground and consists of a cylindrical body 111 of which a portion is open, the cover 112 for opening and closing the opening of the main body 111. The main body 111 has a circular space therein because the container 120 rotates and revolves so that the abrasive in the tank 1 moves while the inside of the tank 1 moves by the centrifugal force. It is formed in an arc shape when viewed from the side. The cover 112 is formed in an arc shape having the same curvature as the arc-shaped opening of the main body 111 to open and close the opening of the main body 111. The cover 112 opens and closes the opening while sliding by receiving the rotational force of the driving motor 114 through the power transmission means 113. The power transmission unit 113 is coupled to both the driving sprocket 113a and the cover 112 in the longitudinal direction of the drive motor 114 and the pulley connected to each other and is engaged with the driving sprocket 113a to drive the sprocket 113a. It may be made of a chain 113b sliding by the rotational force of. A guide groove may be formed in the main body 111 for a stable opening and closing operation of the cover 112.

As shown in FIG. 4, the container 120 includes a main body 121 opened upward, a lid 122 covering the opening of the main body 121, a locking means 123 and a main body 121 of the lid 122. It is formed in the cover 122 and consists of a tank mounting portion 124 on which the tank 1 is mounted.

The cover 122 may be formed in a vertically symmetrical structure with the main body 121 in a state coupled to the main body 121, and the opening and closing structure may be rotated by connecting one side of the longitudinal direction through the hinge 125, for example. 121) can be opened and closed.

The locking means 123 may be a bolt and a nut configured to keep the body 121 and the cover 122 in a coupled state or to separate the cover 122 from the body 121.

The tank mounting part 124 forms a circular space in which the tank 1 can be inserted in a state in which the main body 121 and the cover 122 are coupled to each other.

Here, the container 120 is characterized in that the abrasive injected into the tank 1 is configured to be able to swing, for example, the main body 121 and the cover 122 assembly of the drive means 130 to be described later It is installed parallel to the rotating shaft 131, the tank mounting portion 124 is formed to be inclined with respect to the rotating shaft 131.

Although the tank mounting portion 124 is illustrated in two curved pieces formed on the main body 121 and the cover 122 in the drawing, the tank mounting portion 124 is not limited to the illustrated one, and all forms inclined with respect to the rotating shaft are provided. It will be possible.

As shown in FIG. 3, the driving means 130 has a rotation shaft 131 arranged in the longitudinal direction inside the cabinet 110 and a predetermined interval (interval at which the container 120 can be mounted) on the rotation shaft 131. Spaced apart and rotated together with the rotating shaft 131 (orbiting on the basis of the container 120), and the first and second rotating plates 132 and the first rotating plate which are installed to rotate (rotate) therebetween. The rotating motor 133 rotates the rotating plate 132 and rotates the container 120, and the rotating motor 134 rotates the containers 120, respectively.

The idle motor 133 and the rotation shaft 131 are connected to the idle belt 135.

2 and 3, the power transmission structure of the rotating motor 134 and the container 120 is as follows.

On the rotating shaft 131, the driving pulley 137 connected to the rotating motor 134 and the first rotating belt 136-1 is rotatably connected, and the driving pulley 137 is connected to any one container 120-1. A second rotation belt 136-2 connected to transfer power is connected. As shown in FIG. 2, the container 120-1 and the remaining containers 120-2, 120-n are rotated in a third rotation. It is connected to the power transmission by the belt 136-3. At this time, one or more tension holding rollers 137 and idle rollers 138 are further provided between the containers 120-1, 120-n to maintain the tension of the third rotating belt 136-3. Can lose. The tension holding roller 137 is installed to be movable in the tension adjusting direction on any one rotating plate 132 to adjust the tension of the third rotating belt (136-3).

As shown in FIG. 5, the present invention may further include an alignment unit 140 to prevent the container 120 from shaking when the tank 1 is replaced (mounted in the container 120 or taken out of the container 120). Alignment unit 140 is mounted to the base block 141, the base block 141 which is installed to be rotated in front of the opening of the main body 110 of the cabinet 100, the first rotating plate 132 at the end (Or may be formed on both the first and second rotating plates, and in the drawing, it is illustrated as being formed only on the first rotating plate 132) and is provided with a holder 142a which is caught by the stopper 132a formed to protrude. It may be made of a stay 142 to restrict the rotation of the first rotating plate 132 by the fluid pressure.

That is, when the tank 1 is polished, the stay 142 is mounted so as not to interfere, and when the tank 1 is mounted in or removed from the container 120, the base block 141 of the alignment unit 140 is removed. ) So that the holder 142a of the stay 142 corresponds to the stopper 132a of the first rotating plate 132, and then stretches the stay 142 to hang the holder 142a on the stopper 132a. By fixing, the position of the first rotating plate 132 is aligned.

As shown in FIG. 2 and FIG. 6, the gas tank loading unit 200 performs a function of mounting the polishing target tank 1 to the container 120 or removing the tank 1 from which polishing is completed, and as follows. Can be.

The base frame 210 has a moving block 220, which will be described later, is seated and is disposed at a predetermined distance from the cabinet 110 of the tank polishing unit 100.

The moving block 220 is mounted to the base frame 210 so as to be able to move forward and backward toward the cabinet 110.

The tank loading bar 230 is a first loading bar 231, one side of which is connected to the hinge 231a to the moving block 220 to rotate the tank 1 in the height and direction of the container 120, one side of the first loading bar ( A second loading bar that is connected to the hinge 232a to rotate in a direction orthogonal to the rotation direction of the first loading bar 231 at the other end of the 231 to redirect the tank 1 to the tank mounting portion 124 of the container 120. It consists of 232. The second loading bar 232 is provided with an adsorption part 233 that attracts the tank 1 by magnetic force. The adsorption part 233 is preferably an electromagnet that generates a magnetic force when the current is applied, and the magnetic force is extinguished when the current is blocked, and has the same curvature as the outer circumferential surface of the tank 1.

That is, as shown in FIG. 7A, when a current is applied to the adsorption part 233 while the tank 1 is upright, magnetic force is generated in the adsorption part 233, and the tank 1 is adsorbed to the adsorption part 233. When the first loading bar 231 is rotated in the state, the first loading bar 231 is rotated counterclockwise to the state of FIG. 7B. Subsequently, the moving block 220 is advanced as shown in FIG. 7C, and then, as shown in FIG. 7D, the second loading bar 232 is rotated to insert the tank 1 into the tank mounting part 124 of the container 120 and then the adsorption part. The tank 1 is separated from the adsorption part 233 by cutting off the current applied to 233.

As described above, the first and second loading bars 231 and 232 load the tank 1 by a rotation method, respectively, and operate through hydraulic or pneumatic rotary cylinders 234 and 235.

The moving block 220 is mounted to the base frame 210 through the guide means 240 so as to be able to move forward and backward. The guide means 240 may be formed of an LM guide formed between the base frame 210 and the moving block 220 and a forward and backward cylinder (not shown) for advancing and moving the moving block 220.

The operation of the moving block 220 and the loading bar 230 of the tank loading unit 200 may be performed according to a value calculated in advance according to the distance from the tank polishing unit 100, the positional relationship of the container 120, and the like. That is, when the switch is operated, the moving block 220 and the loading bar 230 move and rotate according to a predetermined value. Alternatively, the sensor may be mounted within a radius of motion of the moving block 220 and the loading bar 230, and the operation of the moving block 220 and the loading bar 230 may be controlled based on the sensing value of the sensor.

In the figure, reference numeral 236 is a support part which is formed to extend in the adsorption part 233 and the bottom part of the tank 1 is supported.

The operation of the semiconductor gas tank inner surface polishing machine according to the present invention configured as described above is as follows.

1. Tank loading

When the tank 1 is loaded, the revolving motor 133 and the rotating motor 134 are controlled to set the container 120 in the loading position, and the operator opens the cover 124 of the cabinet 110 by operating a switch. The 111 is opened, and the stay 142 of the alignment unit 140 is hooked on the stopper 132a of the first rotating plate 132 to restrain the rotation of the container 120. Then, the locking means 123 is released to open the cover 122 of the container 120 to open the body 121.

Subsequently, as illustrated in FIG. 7A, the tank 1 is closely seated on the adsorption part 233 and the support part 236, and a current is applied to the adsorption part 233. In this case, a magnetic force is generated in the adsorption part 233 and the tank 1 is adsorbed by the adsorption part 233. In this state, when the first loading bar 231 is rotated through the first rotation cylinder 234, the first loading bar 231 rotates in a counterclockwise direction to obtain the state of FIG. 7B. Subsequently, the moving block 220 is advanced as shown in FIG. 7C, and then the tank 1 is inserted into the tank mounting part 124 of the container 120 by rotating the second loading bar 232 clockwise as shown in FIG. 7D. . The above process is set by the controller in advance, and when the switch is operated, each process is performed step by step based on the set value.

When the tank 1 is inserted into the tank mounting part 124, the current applied to the adsorption part 233 is cut off to separate the tank 1 from the adsorption part 233.

As a result, when the mounting of the tank 1 is completed, the cover 122 of the container 120 is covered and the container 120 is sealed through the locking means 123.

When the mounting of the tank 1 is completed, the alignment unit 140 is released and then the container 120 is set to the loading position. Position setting of the container 120 may be made through the control of the idle motor 133.

In this manner, the tank 1 is mounted on all the containers 120 provided in the cabinet 110, and when the mounting of the tank 1 is completed, the cover 110 of the cabinet 110 is covered to seal the cabinet 110. do.

2. Polishing

When power is applied to the idle motor 133, the rotating shaft 131 rotates through the idle belt 135, and the first and second rotating plates 132 are rotated by the rotating force of the rotating shaft 131, so that the containers 120 may be rotated. Idle.

When power is applied to the rotating motor 134, the containers 120 rotate through the first to third rotating belts 136-1, 136-2, and 136-3. As described above, the first and second rotating plates 132 and the container 120 are driven through the belt, so that the mechanical noise is very small.

As the container 120 rotates and revolves as described above, the abrasive filled in the tank 1 moves by the centrifugal force and rubs with the inner surface of the tank 1, thereby polishing the inner surface of the tank 1, and in particular, the tank 1 Since the inclination with respect to the rotating shaft 131 through the tank mounting portion 124, the abrasive can be rocked in the form of "∞" to polish both the lower bottom portion and the upper injection portion of the tank (1).

Polishing of the tank 1 may be performed for a predetermined time or may be controlled by the operator on or off.

3. Tank unloading

When the grinding of the tank 1 is completed and the driving of the idle motor 133 and the rotating motor 134 are stopped, the container 120 is automatically set to the unloading position, and the operator operates the switch to cover the cabinet 110. Open the main body 111 by opening the 112 and, as in the case of loading, hang the stay 142 of the alignment unit 140 on the stopper 132a to restrain the rotation of the container 120. Open the cover 122 and open it.

When loading is completed, the tank loading unit 200 may return to an initial position (a position for loading the tank 1 in an upright position relative to the ground) so as not to interfere with the tank polishing unit 100, and the method at the time of loading According to the tank loading unit 200 is set to the unloading position.

The adsorption part 233 and the support part 236 are brought into close contact with the outer circumferential surface and the bottom of the tank 1 mounted in the container 120, and a current is applied to the adsorption part 233 to adsorb the tank 1 by magnetic force. The part 233 is made to adsorb | suck.

Subsequently, the tank loading unit 200 is operated in the reverse order as in loading so that the tank 1 stands up with respect to the ground.

1 is an external configuration diagram of a gas tank inner surface polishing machine for semiconductors according to the present invention.

2 is a side view of a gas tank inner surface polishing machine for semiconductors according to the present invention;

3 is a plan view of the tank polishing portion applied to the semiconductor gas tank inner surface polishing machine according to the present invention.

Figure 4 is a perspective view of a container applied to the semiconductor gas tank inner surface polishing machine according to the present invention.

5 is a configuration diagram of an alignment unit applied to a gas tank inner surface polishing machine for semiconductors according to the present invention.

Figure 6 is a block diagram of a tank loading portion applied to the semiconductor gas tank inner surface polishing machine according to the present invention.

Figure 7a to 7d is a flow chart of the tank loading unit applied to the semiconductor gas tank inner surface polishing machine according to the present invention.

<Description of Signs for Main Parts of Drawings>

100: tank polishing unit, 110: cabinet

120 container, 130 drive means

140: alignment unit, 200: tank loading unit

210; Base frame, 220: moving block

230: loading bar,

Claims (8)

Cabinet 110 consisting of a main body and a cover connected to the main body so as to be open and close, a plurality of containers 120 are installed at a predetermined interval along the circumferential direction inside the cabinet and the gas tank is replaceably accommodated therein, A tank polishing part (100) consisting of driving means (130) for rotating and revolving the container to polish the inner circumferential surface of the gas tank by means of abrasives introduced into the gas tank; And, Including a tank loading unit 200 for injecting a gas tank into the container of the gas tank grinding unit and withdraw the gas tank from the container, The gas tank loading unit, A base frame 210 disposed at a predetermined distance from the tank polishing unit, A moving block 220 mounted on the base frame so as to be able to move forward and backward to the tank polishing unit side via a guide means 240; One side is coupled to the moving block and the tank loading bar 230 having an adsorption portion for adsorbing the gas tank by magnetic force on the other side, Gas tank inner surface grinding machine for semiconductor, characterized in that it comprises an operating unit for operating the tank loading bar. The tank loading bar of claim 1, wherein one end of the tank loading bar is hinged to the moving block to convert the gas tank into a height and a direction of the container, and one end of the tank loading bar is the other end of the first loading bar. A second loading bar 232 hinged to rotate in a direction orthogonal to the first loading bar, and mounted to the second loading bar and adsorbing part 233 mounted to the second loading bar to adsorb the gas tank by magnetic force. A gas tank inner surface grinder for semiconductors, characterized in that made. The inner surface of the gas tank for semiconductor according to claim 1 or 2, wherein the guide means comprises an LM guide formed between the base frame and the moving block and a forward and backward cylinder for moving the moving block forward and backward. Grinding machine. The method of claim 2, The tank loading bar operation unit may be mounted between the movable block and the first loading bar to rotate the first loading bar from the tank seating part to the container side or from the container side to the tank seating part side. And a second rotating cylinder (235) mounted between the first loading bar and the second loading bar to rotate the second loading bar toward the container side or vice versa. The method of claim 1, The driving means may include a rotating shaft 131 arranged in a longitudinal direction inside the cabinet, spaced apart at a predetermined interval on the rotating shaft to rotate together with the rotating shaft, and the container being rotatably installed therebetween. Two rotating plate 132, the rotating shaft and the idle belt 135 is connected to the idle motor 133 to revolve the container through the rotating shaft, the driving pulley 137 and idling coupled to the rotating shaft on the rotating shaft and the first Rotating motor 134 connected through a rotating belt 136-1, a second rotating belt 136-2 connecting any one of the drive pulley and the container and the plurality of containers by connecting the second rotating belt And a third rotation belt (136-3) configured to rotate the containers by the rotational force transmitted through the gas tank inner surface grinder for semiconductor. The method of claim 5, And an alignment part (140) mounted to the cabinet body to stop the first and second rotating plates while replacing the gas tank. The method of claim 6, The alignment unit is provided with a base block 141 rotatably installed in the main body of the cabinet, a holder 142a which is mounted to the base block and is caught by a stopper 132a formed on the first and second rotating plates. And a stay 142 for restraining the rotation of the first and second rotating plates by the fluid pressure supplied therein. The method of claim 5, The container is formed on the other side of the main body 121 and the cover 122, the main body and the cover is installed in parallel to the rotation axis while the opposite side of the longitudinal direction is connected to open and close through the hinge, the main body and the cover Lock means 123 to maintain the locked state, and the inside of the main body and the cover is formed inclined with respect to the rotating shaft and the tank mounting portion 124, the gas tank is seated in the inclination of the tank mounting portion A gas tank inner surface grinder for semiconductors, characterized by oscillating motion.

Images