KR100753913B1 - Microphone assembly - Google Patents

Abstract

A microphone assembling body is provided to reduce the thickness and weight of products by simplifying a pull-in path of a tool through the arrangement of a circuit board. A microphone assembling body includes a case(301), a plurality of components(310), a circuit board(303), and an interface ring(302). The case(301) defines a receiving space(S). The plurality of components(310) is received inside of the receiving space(S) to be vibrated by a sound. The circuit board(303) transmits capacitance change according to the vibration of the plurality of components(310) to a signal terminal of an electronic machine after electrically processing the capacitance change through circuit structures. The interface ring(302) supports the plurality of components(310) in a state of being received inside of the receiving space(S) and electrically connects the plurality of components(310) and the circuit board(303) in a state of being connected to the circuit board(303). The interface ring(302) has a body(302b) and a conductive coating film(302a). The body(302b) guides a curling part of the case(301) to receive the plurality of components(310) in the receiving space(S). The conductive coating film(302a) electrically connects the plurality of components(310) and the circuit board(303) by being connected to the plurality of components(310) and the circuit board(303) while covering an inner side frame of the body(302b).

Description

Microphone assembly

1 is an exemplary view showing a microphone assembly according to the prior art.

Figure 2 is an exploded perspective view showing a separate microphone assembly according to the present invention.

Figure 3 is a cross-sectional view showing the assembled state of the microphone assembly according to the present invention.

Figure 4 is an exploded perspective view showing a separate microphone assembly according to another embodiment of the present invention.

Figure 5 is a cross-sectional view showing the assembly state of the microphone assembly according to another embodiment of the present invention.

Figure 6 is an exploded perspective view showing a separate microphone assembly according to another embodiment of the present invention.

7 and 8 are cross-sectional views showing the assembled state of the microphone assembly according to another embodiment of the present invention.

The present invention relates to a microphone assembly, and more particularly, <a circuit board capable of performing parallel functions of an interface board and a PCB by receiving a circuit structure previously arranged on a PCB,> and <a function of a PCB In order to replace a part, an interface ring which has a ring shape in which a part area (for example, an inner area) is removed to provide a new free space for occupying the circuit structure (or forming a back chamber) By further arranging, the natural thickness reduction of the instruments (e.g., insulating base ring, conductive base ring, etc.) is induced, thereby inducing the unnecessary thickness / weight increase of the product to be naturally offset and compensated, on the producer side. By arranging the circuit boards, the thickness / weight of the product due to this can be effectively enjoyed, while effectively enjoying the advantage of simplifying the entry path of the jig. It relates that the microphone assembly can be guided to avoid flexible.

Recently, with the rapid development of technology in the field of information and communication devices such as mobile phones and telephones, and in the field of acoustic devices such as amplifiers, there is a demand for a microphone assembly for converting acoustic energy into electrical energy. It also shows a sharp increase.

In general, such a microphone assembly, for example, a surface mount microphone assembly, is surface mounted on a signal terminal of a printed circuit board embedded in an electronic device (information and communication device, sound device, etc.), thereby making an electrical connection with the printed circuit board. By forming, the acoustic energy / electric energy conversion role given to the person can be normally performed.

Under this conventional arrangement, the microphone assembly typically forms a rounded <circular profile> for the realization of optimized sound quality.

However, if the microphone assembly is to form a round circular profile, as described in detail in Utility Model Application No. 2004-9539 filed by the present applicant (name: printed circuit board for microphone), the microphone on the producer side It is difficult to fix (determine) the position of the assembly in a specific direction, for example, it is difficult to face the problem of difficult to mount the electronic device side surface of the microphone, the problem of difficult to contact the test probe to the positive terminal.

In order to solve this problem, the present applicant, through the above 9539 devised, the existing, the position of the positive electrode terminal is moved to the center portion of the PCB, and through this, without a separate microphone assembly direction alignment procedure on the producer side, only, <PCB The simple operation of mounting the positive terminal placed in the center of the printed circuit board on the electronic device>, or the simple operation of contacting the test probe to the center of the PCB>, the electrical connection between the positive terminal and the electronic device It is possible to flexibly secure the <electrical connection between the positive terminal and the test probe> to provide a technique for guiding the electrical characteristics reading (or electrical external connection) of the positive terminal so that it does not have any difficulty. Presented.

However, in this case, when the positive terminal of the PCB is shifted a certain distance to the inner side of the PCB and disposed about the center of the PCB, the <Prior art field> of Patent Application No. 2004-97277 (name: microphone assembly) filed by the present applicant As mentioned in detail in the above, on the producer side, in the situation where the microphone assembly is electrically mounted on the electronics side printed circuit board, the jig (C: shown in FIG. 1) for extraction of the defective assembly is introduced into the anode terminal side. In the situation where the repaired microphone assembly needs to be remounted on the electronic circuit board, it is difficult to bring the jig for remounting the repair assembly to the positive terminal side. .

Of course, in this case, if the difficulty in pulling in the jig, the producer side can not normally proceed with the removal procedure of the defective assembly, the remounting procedure of the repair assembly, etc. In the end, even in the single bad situation of the microphone assembly, There is a serious problem in that the entire printed circuit board must be discarded or replaced unnecessarily.

In order to solve this problem, the present applicant through the previous 97277 patent, as shown in Figure 1, the diaphragm assembly 111, the spacer ring (Spacer ring: 114), insulating base ring 115, dielectric plate ( 116, an interface board 120 capable of fixedly supporting the case 101 on which the conductive base ring 117, the PCB 102, etc. are mounted, and having predetermined interface terminals 121 at its outer edge thereof: Interface board is provided separately, through which the case utilizes the interface terminals 121 of the interface board 120 as an intermediate medium instead of the positive and negative terminals 102a and 102b of the PCB 102, By inducing the surface to be naturally mounted on the circuit terminal 200a of the side printed circuit board 200, the retraction path of the defective assembly extraction jig (C) and the repair assembly remounting jig (C) can be naturally simplified. Presented a guide to help (Where reference numeral M denotes acoustic, 101a denotes a sound wave inlet, 112 denotes a diaphragm, 113 denotes a polar ring, 123 denotes a fixing groove, 124 denotes a bonding means, 10 denotes a junction, and BC denotes a back chamber).

Of course, under the implementation environment of the 97277 patent, without having to consider the PCB-side positive electrode terminal (102a, 102b), which is difficult to access from the producer side, the jig toward the interface terminals 121 of the interface board 120, which is easily accessible. Even with a simple operation of drawing in (T), the extraction procedure of the defective assembly, the remounting procedure of the repair assembly, etc. can be easily performed, and as a result, the entire printed circuit board 200 due to the sole failure of the microphone 100 is completed. It was easy to avoid the problem of disposal.

However, the use of the interface board 120 as described above allows the producer to flexibly enjoy <the advantage of simplifying the entrance path of the jig C>, but in the aftermath, the microphone assembly 100 The overall thickness is proportional to the placement of the interface board 120, as well as the problem that the overall weight of the microphone assembly 100, in proportion to the placement of the interface board 120, the heavy becomes inevitably heavy, There is no choice but to take it.

Of course, reducing the thickness of the insulating base ring 115, the conductive base ring 117, etc. disposed in the microphone assembly 100 increases the overall thickness / weight of the assembly 100 due to the additional placement of the interface board 120. Although the problem may be offset and blocked to some extent, the insulating base ring 115 and the conductive material are carefully considered in consideration of the space occupied by the circuit structures 102c and 102d formed on the PCB 102 and the space formed in the back chamber BC. There are many limitations to follow to reduce the thickness of the base ring 117, etc. In the situation where the thickness, weight, etc. of the microphone assembly 100 greatly increase due to the placement of the interface board 102, The producer (consumer) side can not avoid various damages (eg, damage to the quality of the electronic device employing the microphone assembly, damage to the overall product production cost, etc.).

Accordingly, an object of the present invention is to <receive the circuit structure that was previously disposed on the PCB, the circuit board capable of performing the interface board and the function of the PCB in parallel>, <while replacing the part of the function of the existing PCB, Interfaces can be additionally arranged to have a ring shape in which some regions (eg, inner regions) are removed, thereby newly providing a free space for occupying the circuit structure (or forming a back chamber). By inducing a natural thickness reduction of (eg, insulating basering, conductive basering, etc.), and thereby inducing the unnecessary thickness / weight increase of the product to be naturally compensated and compensated, the arrangement of the circuit board on the producer side Through this, it is possible to effectively enjoy the advantage of simplifying the entry path of the jig, while flexibly avoiding the problem of thickness / weight of the product. It is to de.

Other objects of the present invention will become more apparent from the following detailed description and the accompanying drawings.

In order to achieve the above object, in the present invention, a case in which an accommodating space is defined, and a mechanism vibrating by sound while being accommodated in the accommodating space, form a directional edge, and electrically / physically contact the case. A circuit board which is surface-mounted on a signal terminal of the electronic device in a supported state and electrically processes the capacitance change caused by the vibration of the apparatus through the circuit structures, and transmits it to the signal terminal side of the electronic device; Disclosed is a microphone assembly consisting of a combination of interface rings for holding the instruments and being in contact with the circuit board while housed in a space, the interface ring electrically connecting the instruments and the circuit board.

In this case, the front interface ring is preferably between the appliances and the circuit board, while supporting the instruments, forming a donut shape with the inner side emptied so that the space occupied by the circuit structures can be secured, A body for guiding the curing portion of the case and the inner surface of the body to cover the inner part of the case so that the instruments can be encapsulated in the receiving space, and in contact with the instruments and the circuit board, The conductive coating film to be electrically connected is taken.

Hereinafter, with reference to the accompanying drawings, described in more detail the microphone assembly according to the present invention.

As shown in FIG. 2, the microphone assembly 300 according to the present invention has a sound wave inlet 301a, a round cylindrical case 301 in which a receiving space S is defined, and a housing space of the case. While being sealed in S, the instrument 310 vibrating by the sound M input through the sound wave inlet 101a is combined.

At this time, the front mechanism 310 is sequentially mounted on the upper portion of the case 301, for example, the diaphragm assembly 311, the spacer ring (314) that is sequentially mounted in the receiving space (S) of the case 301. ), The insulating base ring 315, the dielectric plate 316, the conductive base ring 317, and the like may be combined (of course, the mechanisms 310 may have a kind, arrangement form, etc., depending on the situation). Elastic deformation).

In this case, the diaphragm assembly 311 has a configuration in which a polar ring (313) and a diaphragm 312 are combined, and the dielectric plate 316 is elastically made of, for example, a metal material or a Si material according to a situation. Can be taken.

Here, the front case 301 is made of, for example, aluminum (Al) or copper (Cu), the polar ring 313 is, for example, a nickel plated (Prass) plate (Prass plate) The spacer ring 314 is made of, for example, a PET film having a thickness of about 35 μm to 46 μm, and the diaphragm 312 is about 2.5 μm to 3.5 μm thick coated with gold or nickel. It is made of a PET film having (of course, the material, shape, etc. of each of these components will be able to achieve a variety of deformation depending on the situation is natural).

In this situation, the preceding conductive base ring 317 electrically connects the dielectric plate 316 and the circuit board 303 described later, so that the diaphragm 312 and the dielectric plate 316 of the diaphragm assembly 313 are electrically connected. When a current signal variation occurs according to the gap change, the current signal variation is transferred to the transistor 303a of the circuit board 303, and the insulating base ring 315 is connected to the conductive base ring 317 and the dielectric. By covering the edge of the plate 316, the conductive base ring 317 and the dielectric plate 316 serves to block the electrical contact with the inner wall of the case 301. In this case, the preceding insulating base ring 315 may be replaced with an insulating film (film) coated on the inner wall of the case 301 according to circumstances.

At this time, as shown in Figure 3, the outer edge 301b of the case 301 is bent in the direction of the receiving space (S) through a series of curling procedures to external the mechanisms 310 inside the receiving space (S) It is possible to firmly form a structure for sealing from the.

In this case, a conductive adhesive (eg, conductive) for improving the adhesive force while maintaining an electrical connection therebetween on the outer edge 301b of the case and the electrical (physical) contact surface CA1 of the circuit board 303. Solder cream) (in this case, since the case 301 serves as a negative terminal of the microphone assembly 300, a series of electrical connections must be maintained with the circuit board 303, and thus, the case 301). If an adhesive is disposed on the contact surface CA1 between the outer edge 301b of the circuit board 303 and the circuit board 303, the adhesive must be a conductive adhesive).

Of course, as will be described later, in the case where the conductive adhesive is further disposed on the contact surface CA2 of the interface ring 302 and the circuit board 303, the case 301 can be used without the additional arrangement of the conductive adhesive. Since the electrical / physical fixing / connection relationship with the circuit board 303 can be maintained via the upper contact surface CA1, in this case, the arrangement of the conductive adhesive may be flexibly omitted.

In this situation, as shown in Figs. 2 and 3, the present invention takes measures to newly arrange the interface ring 302 and the circuit board 303 by modifying the existing structure.

Here, the interface ring 302 partially replaces the role of the existing PCB, and the circuit structures 303a by supporting the front mechanisms 310 in a state of being accommodated in the accommodation space S of the case 301. A function of defining the &quot; occupied space of the circuit structures 303a and 303b &quot;, &quot; formation space of the back chamber BC &quot;, and the like, is in contact with the circuit board 303 on the top of the 303b. , The function of electrically connecting the instruments 310 and the circuit board 303, for example, the function of electrically connecting the conductive base ring 317 and the circuit board 303.

In this case, the contact surface CA2 of the interface ring 302 and the circuit board 303 maintains an electrical connection therebetween, while maintaining an electrical connection therebetween, for example, a conductive adhesive (for example, a conductive solder cream) (in this case, the interface). Since the ring 302 serves to electrically connect the instruments 310 and the circuit board 303, the ring 302 must maintain a series of electrical connections with the circuit board 303. If an adhesive is placed on the contact surface CA2 between the 302 and the circuit board 303, the adhesive must be a conductive adhesive).

Of course, as described above, when the conductive adhesive is further disposed on the outer edge 301b of the case 301 and the contact surface CA1 of the circuit board 303, the case 301 additionally arranges the conductive adhesive itself. Without this, since the electrical / physical fixing / connection relationship with the circuit board 303 can be maintained via the upper contact surface CA2, in this case, the arrangement of the conductive adhesive may be flexibly omitted.

Here, the circuit board 303 is provided with a circuit structure for electrical signal processing, for example, a transistor 303a, a capacitor 303b, and the like, for example, in the existing, flexible and parallel to the role of the interface board and the PCB In the outside of the case 301, the case 301, which houses the mechanisms 310 and the interface ring 302, is electrically / physically contacted (fixed) and supported, so as to be electrically connected to the case. While maintaining the relationship, the surface is mounted on the signal terminal 400a provided in the printed circuit board 400 of the electronic device, thereby changing the capacitance change caused by the vibration of the mechanisms 310 303a and the capacitor 303b. After the electrical processing through the) and the like, and delivers it to the signal terminal 400a side provided in the printed circuit board 400 of the electronic device> (in this case, the case 301 is the microphone assembly 300 Because it acts as the negative terminal of Must maintain a series of electrical connections with the robot 303).

Of course, signal processing results such as transistors 303a and capacitors 303b may be provided on a part of the rear surface of the circuit board 303 that is in contact with the signal terminal 400a of the printed circuit board 400, for example, on the outer edge of the rear surface. Since the connection terminals 304 are transmitted to the 400a side, on the producer side, for example, <the necessity of selectively extracting the mounted microphone assembly 300 from the printed circuit board 400>, <the repaired assembly When the necessity of remounting the 300 on the printed circuit board 400 side>, the extraction jig (C), the mounting jig (C), etc. are introduced into the connection terminal 304 which is easily accessible. By doing so, it is possible to proceed naturally to the desired assembly procedures for removing the defective assembly, reassembly of the repair assembly.

At this time, as shown in Figure 2, the circuit board 303 of the present invention is a directional outer border, for example, while forming a part, while the other part is a round border, triangular border, square border, pentagon border, hexagonal border Since the oval edges (of course, the shape of the outer edges can be variously formed on the premise that they have directionality), under the implementation environment of the present invention, on the producer side, the conventional PCB (of course, such conventional Unlike the PCB having a round shape according to the outer profile of the case), the position of the microphone assembly 300 may be changed even when no action is taken, such as forming an anode terminal at the center of the circuit board 303. By fixing in a specific direction, for example, the procedure of <surface mounting on an electronic device> or <procedure of contacting a test probe> can be easily performed. It is able to.

Under the system of the present invention, as described above, the circuit structures 303a and 303b for electrically processing the capacitance change of the mechanisms 310 are conventionally a circuit board that performs the role of the interface board and the PCB in parallel. Since the interface ring 302 of the present invention partially replaces the role of the existing PCB because it is moved to the 303 side, the shape of the self-shaped, for example, <part of the area (eg, the inner side 302d) without any problems (burdens). Area) can be implemented as a donut shape (ring shape)> (see FIG. 2).

Of course, under the structure in which the inner side 302d region of the interface ring 302 is rounded, as shown in FIG. 3, the space BS having a portion occupied by a thickness t is shown in FIG. 3. ) Can be newly secured as a free space, and this space BS is occupied by the spaces of the circuit structures 303a and 303b newly moved to the circuit board 303 (that is, moved downward compared to the prior art). >, <The formation space of the back chamber (BC)> and the like can be naturally utilized.

Naturally, through the utilization of this space BS, when the downward transfer arrangement of the circuit structures 303a and 303b to the circuit board 303 side is flexibly realized, at the top of the circuit board 303, the dielectric plate Some mechanisms, such as the insulating base ring 315 and the conductive base ring 317, which support the 316 to form the back chamber BC, are referred to as the space occupied by the circuit structures 303a and 303b. For example, the circuit structures 303a and 303b move downward, without adversely affecting the formation space of the back chamber BC, so that their thicknesses can be naturally reduced. In the end, under such thickness reduction of the insulating base ring 315 and the conductive base ring 317, the overall thickness T of the microphone assembly 300 employing them can be flexibly maintained at a minimum value (of course, As such, in such a situation that the overall thickness of the assembly decreases, The overall weight of the body, too, see why doemeun able to reduce the flexibility, and will be granted).

In short, thanks to the structural characteristics of the interface ring 302, the newly secured space t by the thickness t is a new space that can realize the transfer of the circuit structures 303a and 303b to the circuit board 303 side. By inducing a natural thickness reduction such as the insulating base ring 315, the conductive base ring 317, and the like, even when the circuit board 303 is disposed, the unnecessary thickness increase of the assembly 300 can be canceled and compensated. It will be able to flexibly serve as a series of reward spaces to guide.

Of course, under this unique structure of the present invention, if the overall thickness T and weight of the microphone assembly 300 can be kept to a minimum value, on the producer (consumer) side under the additional arrangement of the circuit board 303, While effectively enjoying the advantage of simplifying the inlet path of the jig (C), various damages due to the increase in the thickness / weight of the microphone assembly 300 (for example, damage to the quality of the electronic device employing the microphone assembly, It is easy to avoid damages such as an increase in overall production cost.

In this case, as shown in FIG. 2, the interface ring 302 of the present invention has a configuration in which the body 302b and the conductive coating film 302a are closely combined.

In this case, as shown in FIG. 3, the body 302b takes a structure interposed between the instruments 310 and the circuit board 303, and the structure supporting the instruments 310. A donut shape in which the inner side 302d is emptied, and the like, and the upper portion of the circuit board 303 includes the space occupied by the circuit structures 303a and 303b, the formation space of the back chamber BC, and the like. The case 301 serves to guide the instruments 310 while defining the thickness of the insulating base ring 315, the conductive base ring 317, and the like. When the outer edge 301b is bent by the curing procedure to seal and accommodate it in its own accommodating space, it performs a role of stably supporting and guiding the curry portion of the case 301, for example, the outer edge 301b. Done.

In addition, the conductive coating film 302a covers the inner side 302d of the body 302b (see FIG. 2), and, upon completion of the assembly of the microphone assembly 300, with the instruments 310 and the circuit board 303. By taking the structure in contact, the circuit board 303 serves to electrically connect the devices 310, for example, the dielectric plate 316, the conductive base ring 317, and the like (of course, the conductive coating film 302a). ) Can make various variations depending on the situation).

At this time, the body 302b of the interface ring 302 is an insulating material (for example, the same material as the existing PCB) so that the above-described conductive coating film 302a and the case 301 can be electrically separated (of course, the interface ring 302 The type of insulating material forming a) may be variously modified depending on circumstances.

Here, when the conductive coating film 302a covering the inner side 302d of the body 302b and the outer edge 301b of the case 301 surrounding the outside of the body 302b are in contact with each other, unexpected In the present invention, since the electrical short phenomenon can be induced, as shown in the drawing, the inner side 302d of the body 302b, the cured portion of the case 301, for example, the outer rim 301b A measure for forming a step 302c for electrically separating the conductive coating film 302a is taken.

Of course, under the formation of the stepped 302c, the outer edge 301b of the case 301 and the conductive coating film 302a may naturally block unnecessary electrical contact with each other, and eventually, the assembly 100 may have The damage caused by the electric short can be flexibly avoided.

Under the situation where the microphone assembly 300 of the present invention having such a structure is mounted on an electronic device, for example, a printed circuit board 400 of a mobile communication terminal, a user using the mobile communication terminal initiates a call desired by the user. When a series of sounds (M), for example, a user's voice is introduced through the sound inlet (301a) of the case 301, the diaphragm 312 immediately vibrates at a constant speed by the sounds (M). Take a mechanism.

Of course, when the vibration of the diaphragm 312 proceeds, the gap formed between the diaphragm 312 and the dielectric plate 316 is changed at a constant speed by the vibration, the diaphragm 312 and The electrostatic field between the dielectric plates 316 also changes in correspondence with sound, and accordingly, according to a general law of electrostatic induction, the potential of the dielectric plate 316 can also be quickly changed in correspondence with sound.

In this state, when the potential variable value of the dielectric plate 316 is transferred to the gate electrode of the transistor 303a disposed on the circuit board 303 via the conductive base ring 317, the conductive coating film 302a, or the like, The transistor 303a amplifies a current value according to the corresponding potential variable value, and then outputs the current value to the printed circuit board 400 embedded in the mobile communication terminal. Through the self-transmission operation of the electronic device (mobile communication terminal) that is in progress, it is possible to easily output its own voice to the outside.

Meanwhile, as shown in FIGS. 4 and 5, under the implementation environment of the present invention, some of the above-described apparatuses 310, for example, the conductive base ring 317, may be omitted in a flexible manner.

At this time, since the conductive coating film 302a is additionally formed at the edge of the side 302d of the body 302b of the interface ring 302, as shown in the drawing, as described above, the conductive base ring 317 Even if the arrangement of) is omitted, the potential varying situation of the dielectric plate 316 can be normally transferred to the circuit structures 303a and 303b of the circuit board 303 without any problem, and consequently, the assembly of the present invention. 300 is able to normally perform the acoustic energy / electrical energy conversion role given to them.

Of course, in this way, when the arrangement of the conductive base ring 317 can be flexibly omitted, the overall thickness (T) and weight of the microphone assembly 300 employing the same can be maintained even smaller value, As a result, the producer (consumer) side can effectively enjoy improved product productivity (product usability).

Meanwhile, as shown in FIG. 6 and FIG. 7, under another embodiment of the present invention, the microphone assembly 300 of the present invention in which the above-described slimming structure (ie, thickness / weight minimization structure) is realized is applied to the applicant. Flexible application of the patent application No. 2005-69158 (named "mobile communication terminal and surface-mounted microphone assembly employed therein") filed previously by the electronic device, such as a printed circuit board (eg, mobile communication terminal 21) The main circuit board 25 may be inserted into the battery 28 side of the rear surface 25c.

In this case, the case 301 of the microphone assembly 300 is inserted into the rear surface 25c of the battery 28 of the printed circuit board 25 so as to be exposed to the voice inlet port 22a of the mobile communication terminal 21. A through hole 25f may be additionally disposed (where reference numeral 22 denotes a lower body of the mobile communication terminal, 24 an upper body, 26 a link circuit board, and 27 a server circuit board).

Of course, thus, the microphone assembly 300 of the present invention can flexibly take the so-called "reverse type structure" in which the microphone assembly 300 of the present invention is inserted and exposed to the through hole 25f toward the rear surface 25c of the printed circuit board 25. If possible, as a result, the mobile communication terminal 21 is stably guaranteed to minimize self space, thereby flexibly eliminating the necessity of arranging the space on the keypad 23 side for mounting the microphone assembly 300. In the end, it is possible to naturally slim down the overall size of his own without any difficulty, in accordance with the recent user needs.

Under such a changed environment, as shown in the drawing, the above-described circuit board 303 supports the front connection terminal 304 from its rear outer edge to support its front outer edge, eg, the case 301. The change is made to move to the outer edge of the support surface (in this case, the circuit board 303 may take a change to partially extend its outer space in consideration of the arrangement of the connection terminal 304).

Of course, when the circuit board 303 flexibly considers the reverse type structure of the assembly 300, and changes the arrangement of moving the connection terminal 304 from its rear side to its front outer edge, Although the case 301 is inserted into the through hole 25f of the printed circuit board 25, and a difficult situation in which the circuit board 303 is turned upside down is formed, the assembly 300 can be used without difficulty. It is possible to form a normal electrical connection relationship (surface mounting relationship) with the signal terminals 25b.

Naturally, even under this embodiment of the present invention, thanks to the structural features of the interface ring 302, the newly secured space t by the thickness t is the circuit board 303 of the circuit structures 303a and 303b. By acting as a new space capable of realizing the () side transfer, inducing a natural thickness reduction of the insulating base ring 315, the conductive base ring 317, etc., even in the arrangement of the circuit board 303, the assembly 300 It is possible to flexibly play a role as a series of compensation spaces that can guide the unnecessary increase in the thickness of the compensation, and finally, on the producer side (consumer) side under the additional arrangement of the circuit board 303, While effectively enjoying the advantage of simplifying the inlet path of (C), various damages caused by the thickness / weight increase of the microphone assembly 300 (eg, the quality of the electronic device employing the microphone assembly). Easily is possible to avoid the damage to be lowered, and the damage that the overall production cost increases).

As shown in FIG. 8, the reverse structure of the microphone assembly 300 according to another embodiment of the present invention may be, of course, the aforementioned <conductive base ring abbreviation structure> (see FIGS. 4 and 5). Through this, it can be realized flexibly.

Of course, as such, while the reverse structure of the assembly 300 becomes a reality, in addition, even the placement of the conductive base ring 317 in the assembly 300 can be flexibly omitted, the assembly of the assembly 300 or product The overall thickness T and weight can be proportionately maintained at a smaller value, which in turn allows the producer (consumer) side to enjoy more improved product productivity (product usability).

As described in detail above, in the present invention, <circuit boards, which are previously arranged to receive circuit structures previously arranged on a PCB, may simultaneously perform a function of an interface board and a PCB>, and replace some of the functions of the existing PCB. In addition, the interfacing may further include a ring shape in which a partial region (eg, an inner region) is removed, thereby newly providing a free space required for occupying the circuit structure (or forming a back chamber). On the producer side, by inducing a natural thickness reduction of the instruments (e.g., insulating basering, conductive basering, etc.) and thereby inducing unnecessary offset / compensation of the product's thickness / weight. Through the placement of, it effectively enjoys the advantage of simplifying the entry path of the jig, while flexing the thickness / weight problem of the product caused by this. So you can avoid can guide.

The present invention described above has an overall useful effect in various types of microphone assemblies.

And, in the foregoing, specific embodiments of the present invention have been described and illustrated, but it is obvious that the present invention may be variously modified and implemented by those skilled in the art. Such modified embodiments should not be understood individually from the technical spirit or point of view of the present invention and such modified embodiments should fall within the scope of the appended claims of the present invention.

Claims (6)

A case in which an accommodation space is defined; Instruments vibrating by sound while being accommodated in the accommodation space; Forming a directional rim, the surface is mounted on the signal terminal of the electronic device in a state in which the case is in electrical / physical contact and support on the outside of the case, and changes the capacitance according to the vibration of the mechanism A circuit board which is electrically processed to transmit the signal to the signal terminal of the electronic device; An interface ring configured to support the apparatuses in the accommodating space and to electrically connect the apparatuses and the circuit board in contact with the circuit board, The interface ring is interposed between the instruments and the circuit board, and supports the instruments, and forms the inner side of the hollow structure so that the space occupied by the circuit structures is secured, and the instruments are accommodated in the receiving space. A body for guiding the curry portion of the case so as to be possible; And a conductive coating film covering the inner edge of the body and in contact with the instruments and the circuit board to electrically connect the instruments and the circuit board. delete The microphone assembly of claim 1, wherein a stepped portion is formed at an inner edge of the body to electrically separate the cured portion of the case and the conductive coating layer. The microphone assembly of claim 1, wherein the body is made of an insulating material so that the conductive coating film and the case can be electrically separated. The conductive adhesive according to any one of claims 1, 3 and 4, wherein a conductive adhesive is further disposed on any one of the contact surface of the case and the circuit board, the contact surface of the interface ring and the circuit board, or both. Microphone assembly. The electrical circuit of any one of claims 1, 3, and 4, wherein the circuit structures and the signal terminal are electrically connected to an outer edge of the front or rear surface of the circuit board in contact with the signal terminal of the electronic device. Microphone assembly, characterized in that the connecting terminal for the formed.

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