KR100746983B1 - Organic light emitting diode panel - Google Patents

Abstract

In the encapsulation process, an organic light emitting device panel capable of preventing the light emitted for curing the sealant from being scattered in the substrate is prevented from being damaged by the scattered light. The organic light emitting device panel according to the present invention includes a substrate divided into an active region in which a pixel region is formed and an inactive region in which wiring is formed, a lower electrode pattern formed on an active region of the substrate, and a lower electrode pattern formed on the active region. An insulating layer formed to expose a partial region to define a pixel region, an insulating layer formed to extend to an inactive region to cover the wiring, a barrier rib formed on the insulating layer formed on the active region, and an exposed lower electrode pattern formed on the pixel region. An array panel unit including a light emitting organic layer, a partition formed on the active region, and an upper electrode formed on the light emitting organic layer and extending to an inactive region to cover an insulating layer formed on the inactive region; And an encapsulation cap attached to the upper electrode and the sealant formed on the inactive region of the substrate to encapsulate the array panel portion, wherein the upper electrode reflects light irradiated when light is irradiated from the top of the encap cap to cure the sealant. It prevents the light emitting organic layer from being damaged.

Organic light emitting element, encapsulation, sealant curing, organic damage

Description

Organic light emitting device panel {ORGANIC LIGHT EMITTING DIODE PANEL}

1 is a cross-sectional view showing an organic light emitting device panel according to the prior art.

2 is a cross-sectional view illustrating an organic light emitting device panel according to an exemplary embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

100: array panel portion 102: active area

104: inactive area 106: wiring

108: sealant 110: substrate

120: lower electrode pattern 130: insulating film

140: partition 150: light emitting organic layer

160: upper electrode 200: sealing cap

The present invention relates to an organic light emitting device, and more particularly, in the encapsulation process, the light irradiated for the sealant curing is prevented from being scattered in the substrate, thereby preventing the organic material formed on the substrate from being damaged by the scattered light. It relates to an organic light emitting device panel that can be.

The organic light-emitting device can be driven at low voltage, and can solve the drawbacks of LCDs such as thinning, wide viewing angles, and fast response speeds. It is attracting attention as a next-generation display that has the advantages of having image quality and simple manufacturing process, which is advantageous in future price competition.

Such an organic light emitting device has an organic light emitting material formed in a space between a lower plate having a form in which an ITO transparent electrode pattern is formed as a positive electrode on a transparent glass substrate and an upper plate in which a metal electrode is formed as a negative electrode on a substrate, thereby forming a transparent electrode. And a display device that emits light while a current flows through the organic light emitting material when a predetermined voltage is applied between the metal electrode and the metal electrode.

Such an organic light emitting device needs to cap the entire device using a metal or glass cap after the fabrication of the device is completed because organic materials used for light emission are vulnerable to temperature and humidity. It is called process. Therefore, an encapsulation process is essential for manufacturing a reliable organic light emitting display device.

However, as shown in FIG. 1, in the case of the encapsulation process using the glass cap 20, the sealant 18 is cured by irradiating light from the upper portion of the glass cap 20. The glass cap 20 was sealed on the board | substrate 10 by doing this.

However, in the process of irradiating light to cure the sealant 18, the light irradiated to the active region 12 of the substrate 10 is the upper electrode of the metal material formed on the organic material 30 and the partition 40. Although reflected by 50 may prevent the organic material 30 from being damaged, light irradiated onto the inactive region 14 of the substrate 10 on which the wiring 16 is formed may pass through the wiring 16. 10) to be projected into and scattered within the substrate 10.

Therefore, the organic material 30 formed in the outermost part of the active region 12 of the substrate 10 is damaged, and thus the damaged organic material 30 has a problem in that it causes device defects by changing its characteristics.

An object of the present invention is to provide an organic light emitting device panel that can prevent the light irradiated for curing the sealant in the substrate during the sealing process.

Technical problems to be achieved by the present invention are not limited to the technical problems mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description.

The organic light emitting device panel according to an embodiment of the present invention for solving the above technical problem, the substrate is divided into an active region in which the pixel region is formed and an inactive region in which the wiring is formed, a lower electrode formed on the active region of the substrate An insulating layer formed to define a pixel region by exposing a portion of a pattern, a lower electrode pattern formed on the active region, and extending to an inactive region to cover the wiring; a barrier rib formed on the insulating layer formed on the active region; A light emitting organic layer formed on the exposed lower electrode pattern of the region, and an upper electrode formed on the barrier rib and the light emitting organic layer formed on the active region and extending to the inactive region to cover the insulating film formed on the inactive region; An array panel unit; And an encapsulation cap attached to the upper electrode and the sealant formed on the inactive region of the substrate to encapsulate the array panel portion, wherein the upper electrode reflects light irradiated when light is irradiated from the top of the encap cap to cure the sealant. It prevents the light emitting organic layer from being damaged.

Specific details of other embodiments are included in the detailed description and the accompanying drawings.

Advantages and features of the present invention and methods for achieving them will be apparent with reference to the embodiments described below in detail with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but may be implemented in various different forms, only the present embodiments to make the disclosure of the present invention complete, and common knowledge in the art to which the present invention pertains. It is provided to fully inform the person having the scope of the invention, which is defined only by the scope of the claims. Like reference numerals refer to like elements throughout.

In addition, in the drawings, the size and thickness of layers and films or regions are exaggerated for clarity of description, and when any film or layer is described as being formed "on" of another film or layer, It may be directly on top of the other film or layer, and a third other film or layer may be interposed therebetween.

2 is a cross-sectional view illustrating an organic light emitting device panel according to an exemplary embodiment of the present invention.

2, an organic light emitting diode panel according to an exemplary embodiment of the present invention includes an array panel unit 100 and an encapsulation cap 200.

The array panel unit 100 includes a substrate 110, a lower electrode pattern 120, an insulating layer 130, a partition wall 140, a light emitting organic layer 150, and an upper electrode 160.

The substrate 110 is a base layer for forming an organic light emitting device panel according to an embodiment of the present invention, and a transparent insulating substrate such as a glass substrate is mainly used. However, a plastic substrate having excellent transparency can also be used.

The substrate 110 is divided into an active region 102 and an inactive region 104 in which a pixel region is formed. That is, the substrate 110 is divided into an active region 102 which is a region where light actually emits from the pixel region and an inactive region 104 which is a region where no light is emitted. A wiring 106 is formed on the inactive region 104 to be electrically connected to the lower electrode pattern 120 or the upper electrode 160.

The lower electrode pattern 120 is formed in the active region 102 on the substrate 110 in a shape of a predetermined pattern mainly through a photo process. The lower electrode pattern 120 should have a transparent property since light emitted from the light emitting organic layer 150 should be transmitted. In general, an indium tin oxide (ITO) electrode or an indium zinc oxide (IZO) electrode is mainly used.

However, since the ITO electrode and the IZO electrode are also oxide electrodes, the electrical conductivity is low, and thus the signal transmission speed is significantly lowered, which may cause signal delay. To solve this problem, a transparent ITO pattern or an IZO pattern is used. Accordingly, a solid chromium (Cr) electrode may be disposed.

On the other hand, when using the glass substrate as the substrate 110, a thin film of silicon dioxide (SiO ₂ ) between the glass substrate and the ITO layer so as not to move the metal ions from the glass substrate to the lower electrode pattern 120 barrier (Barrier) It can also be used as a layer.

The insulating layer 130 extends not only on the active region 102 of the substrate 110 on which the lower electrode pattern 120 is formed, but also on the non-active region 104 on which the wiring 106 is formed. The insulating layer 130 formed on the active region 102 in which the lower electrode pattern 120 is formed is formed to expose a portion of the lower electrode pattern 120 to define a pixel region, and an inactive region in which the wiring 106 is formed. The insulating film 130 formed on the 104 is formed to cover the wiring 106.

In this case, the insulating layer 130 formed on the inactive region 104 of the substrate 110 may be formed higher than the height of the wiring 106 so as to cover the wiring 106. In addition, the insulating layer 130 formed on the inactive region 104 of the substrate 110 may be formed together when the insulating layer 130 is formed on the active region 102 of the substrate 110.

The insulating layer 130 may be formed using an insulating material such as a silicon nitride film, a silicon oxide film, or the like.

The partition wall 140 is formed on the insulating layer 130 formed on the active region 102 of the substrate 110, and is formed on the insulating layer 130 between the pixel regions so that the length direction is perpendicular to the lower electrode pattern 120. do. The partition wall 140 may have an inverse tapered shape and may be formed using an insulating material such as a negative photosensitive film.

The light emitting organic layer 150 is formed on the exposed lower electrode pattern 120 in the pixel area, and includes a light emitting layer or the like to form a single layer or a multilayer structure. The light emitting organic layer 150 is a material that is electrically excited when subjected to an electric field, and thus generates light. For reference, as a material of the light emitting layer, aluminum complexes (Alq3) are generally used the most.

The light emitting organic layer 150 may be formed using CVD (Chemical Vapor Deposition), but is generally formed using a vacuum deposition method.

The upper electrode 160 is formed on the partition wall 140 and the light emitting organic layer 150 formed on the active region 102 of the substrate 110, and extends to the inactive region 104 of the substrate 110. Is formed to cover the insulating film 130 formed on the inactive region (104). That is, it is formed over the active region 102 and the non-active region 104 of the substrate 110.

The upper electrode 160 is generally made of a metal material such as chromium or aluminum to reflect light (for example, ultraviolet (UV)) emitted from the top of the encapsulation cap 200. Therefore, since light does not enter the substrate 110 during curing of the sealant 108 during the encapsulation process, light scattering does not occur in the substrate 110. Damage to the light emitting organic layer 150 formed thereon may be prevented.

Meanwhile, the upper electrode 160 formed on the insulating layer 130 formed on the inactive region 104 of the substrate 110 is formed together when the upper electrode 160 formed on the partition wall 140 and the light emitting organic layer 150 is formed. Can be That is, the upper electrode 160 formed on the active region 102 and the inactive region 104 of the substrate 110 may be formed at the same time.

For reference, the upper electrode 160 formed on the partition wall 140 and the light emitting organic layer 150, that is, the surface of the upper electrode 160 formed on the active region 102 of the substrate 110 (the light emitting organic layer 150 and The facing surface) may be formed as a mirror surface to reflect the light generated from the light emitting organic layer 150 in the direction of the substrate 110.

The encapsulation cap 200 is bonded by the upper electrode 160 and the sealant 108 formed on the inactive region 104 of the substrate 110 to encapsulate the array panel unit 100. The encapsulation cap 200 is formed using a transparent material such as glass so as to transmit light emitted from the top to cure the sealant 108.

However, the light transmitted through the encapsulation cap 200 is reflected by the upper electrode 160 formed in the inactive region 104 of the substrate 110 after passing through the sealant 108. As a result, since light is not projected into the substrate 110, the light emitting organic layer 150 may be prevented from being damaged by scattered light.

As described above, in the organic light emitting device panel according to the embodiment of the present invention, in the process of curing the sealant 108 during the encapsulation process, light emitted from the upper portion of the encapsulation cap 200 is projected onto the substrate 110 so that the substrate 110 is formed. A light emitting organic layer formed on the active region 102 by scattered light by forming an upper electrode of a metal material on the active region 102 and the inactive region 104 of the substrate 110 so as to prevent scattering therein. (150) to prevent damage. As a result, the defect of the device can be reduced.

Although the embodiments of the present invention have been described above with reference to the accompanying drawings and tables, the present invention is not limited to the above embodiments, but may be manufactured in various forms, and common knowledge in the art to which the present invention pertains. Those skilled in the art can understand that the present invention can be implemented in other specific forms without changing the technical spirit or essential features of the present invention. Therefore, it should be understood that the embodiments described above are exemplary in all respects and not restrictive.

According to the organic light emitting device panel according to the embodiment of the present invention, in the process of curing the sealant during the encapsulation process, the active region of the substrate to prevent light emitted from the top of the encapsulation cap is projected onto the substrate and scattered in the substrate And forming an upper electrode of the metal material on the inactive region to prevent the light emitting organic layer formed on the active region from being damaged by scattered light. As a result, the defect of the device can be reduced.

Claims (7)

Exposing a substrate divided into an active region where a pixel region is formed and an inactive region where a wiring is formed, a lower electrode pattern formed on the active region of the substrate, and a partial region of the lower electrode pattern formed on the active region; An insulating layer formed to define a pixel area, the insulating layer extending to the inactive area to cover the wiring, a barrier rib formed on the insulating layer formed on the active area, and an exposed lower electrode pattern formed on the pixel area. An array panel unit including a light emitting organic layer and an upper electrode formed on the barrier rib formed on the active region and the light emitting organic layer and extending to the inactive region to cover the insulating layer formed on the inactive region; And An encapsulation cap attached to the upper electrode and a sealant formed on the inactive region of the substrate to encapsulate the array panel portion, The upper electrode reflects the irradiated light when the light is irradiated from the top of the encapsulation cap to cure the sealant, and prevents the light emitting organic layer from being damaged. And the insulating film formed on the inactive region of the substrate is formed to be higher than the height of the wiring so as to cover the wiring. The method of claim 1, The upper electrode is an organic light emitting device panel, characterized in that the metal material containing chromium or aluminum. The method of claim 1, The encapsulation cap is an organic light emitting device panel, characterized in that the glass. delete The method of claim 1, The insulating film is an organic light emitting device panel, characterized in that the insulating material comprising a silicon nitride film or a silicon oxide film. The method of claim 1, And the insulating layer formed on the inactive region of the substrate is formed together with the formation of the insulating layer formed on the active region of the substrate. The method of claim 1, And the upper electrode formed on the inactive region of the substrate is formed together with the upper electrode formed on the active region of the substrate.

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