KR100722741B1 - Multilayer printed circuit board and fabricating method therefore - Google Patents

Abstract

An upper circuit pattern, a lower circuit pattern, and an inner circuit pattern formed from at least a pair of first metal layers and a second metal layer interposed between the first metal layer and the first metal layer; A resin composition layer for embedding the circuit pattern, a blind via hole formed in the resin composition layer to connect the upper circuit pattern and the lower circuit pattern, an outer circuit pattern connected to the blind via hole formed in the resin composition layer, and connected to the outer circuit pattern The multilayer printed circuit board including the external connection means is excellent in signal transmission, excellent in heat dissipation, does not require a reinforcing material, and has excellent dielectric properties and high transmission loss at high frequencies, particularly 20 GHz or more.

Non-halogen, blind beer hole, semi-additive, multilayer metal core

Description

Multilayer printed circuit board and its manufacturing method {MULTILAYER PRINTED CIRCUIT BOARD AND FABRICATING METHOD THEREFORE}

1 is a cross-sectional view showing a state in which a resistor is located on a part of a first metal layer in a method of manufacturing a multilayer printed circuit board according to a practical example of the present invention.

FIG. 2 is a cross-sectional view illustrating a state in which an upper circuit pattern is formed by removing a portion of the first metal layer in FIG. 1. FIG.

3 is a cross-sectional view illustrating a state in which a resin composition layer is stacked on an upper circuit pattern in FIG. 2 and a lower circuit pattern is formed on a first metal layer.

4 is a cross-sectional view illustrating a state in which a resin composition layer is stacked on a lower circuit pattern in FIG. 3.

FIG. 5 is a cross-sectional view illustrating a blind via hole and an outer layer circuit formed on the resin composition layer in FIG. 4; FIG.

6 is a cross-sectional view showing a state in which a permanent protective film and a solder ball formed in FIG.

7 is a cross-sectional view of a multilayer printed circuit board according to Comparative Example 1;

8 is a sectional view of a multilayer printed circuit board according to Comparative Example 2;

9 is a sectional view of a multilayer printed circuit board according to Comparative Example 3. FIG.

<Description of Drawing>

11: first metal layer 13: second metal layer

15: etching resistor 17: upper circuit pattern

18: lower circuit pattern 19: inner layer circuit pattern

21: resin composition layer 23: blind via hole

25: external circuit pattern 27: permanent protective film

29: solder ball for chip bonding 31: solder ball for board bonding

The present invention relates to a multilayer printed circuit board that can be connected to a chip and a method of manufacturing the same.

Recently, electronic devices are becoming smaller, thinner, and lighter, and semiconductor chips mounted on such electronic devices are becoming more and more highly integrated. For this reason, wire bonding and flip chip bonding are widely used as a method of mounting a semiconductor chip on a substrate, and a high density printed circuit board corresponding thereto is manufactured.

In order to increase the density of printed circuit boards, many printed circuit boards have been manufactured by using a thin wire or a semi-additive method. In addition, a stack via or the like has been devised for practical connection with a semiconductor chip (see Japanese Patent Application Laid-Open No. 2003-23222). In this case, there is also a method of manufacturing a high density printed wiring board using only a build-up method on one surface without using a core material. However, a stiffener may be laminated after becoming a finished product for coreless use. A method of building up one side of a thick metal plate and removing the metal plate of the reinforcing material after semiconductor chip mounting is also used.

In addition, when the semiconductor chip and the printed circuit board are used in a high frequency environment, when the frequency band is 1 GHz or more, particularly 20 GHz or more, the dielectric tangent becomes high, causing noise. In addition, it is true that the conventional printed circuit board is not suitable for the recent various regulations that emphasize environment and safety.

In order to solve this problem, a high frequency printed wiring board using a glass-based Teflon-based copper clad laminate was developed (see Japanese Patent Laid-Open No. 2003-338670). However, Teflon not only requires a special pretreatment process when copper plating, but also has a problem in that a semiconductor chip having a high heat generation cannot be used because of poor heat dissipation.

The present invention provides a multilayer printed circuit board having excellent signal transmission and excellent heat dissipation.

The present invention does not require a reinforcing material, and provides a multilayer printed circuit board having excellent dielectric properties and improved transmission loss at high frequencies, particularly 20 GHz or more.

The present invention provides a non-halogen (non halogen) multilayer printed circuit board having a flame resistance of UL94V-0.

According to an aspect of the present invention, there is provided a multilayer printed circuit board including: an upper circuit pattern, a lower circuit pattern, and an internal circuit pattern formed from at least a pair of first metal layers and a second metal layer interposed and stacked between the first metal layer and the first metal layer; A resin composition layer laminated on one circuit pattern and buried in an upper circuit pattern and a lower circuit pattern, a blind via hole formed in the resin composition layer and connected to the upper circuit pattern and the lower circuit pattern, and formed in the resin composition layer and blinded. An outer circuit pattern connected to the via hole and an external connection means connected to the outer circuit pattern.

The multilayer printed circuit board according to embodiments of the present invention may describe one or more of the following features. For example, the first metal layer may be formed of copper foil or copper foil alloy, and the second metal layer may be formed of nickel, aluminum, tin, titanium, stainless, or an alloy thereof, alloy 42. The first metal layer and the second metal layer may have a thickness of about 50 μm to about 300 μm. In addition, a pair of first metal layers may be stacked on both surfaces of the second metal layer.

The resin composition layer may be formed of an epoxy resin, a cyanic acid ester resin, a marimide resin, a polyimide resin, a functional group-added polyphenylene ether resin, or a combination thereof, or may be a liquid crystal polyester resin or a cyanic acid ester resin. And the resin composition layer may be formed by a mixture of the cyanic acid ester resin and the liquid crystal polyester fiber cloth base. A curing agent and / or a catalyst may be added to the resin composition layer. The resin composition layer may be formed by a woven or nonwoven fabric of glass fiber woven or nonwoven fabric, polykisazor fiber, wholly aromatic polyamide fiber, liquid crystalline polyester fiber.

The external connection means may be a solder ball formed in the resin composition layer, and may be made of a solder ball for chip bonding connected to a chip and a solder ball for substrate bonding connected to a substrate.

A permanent protective film may be formed on the outer circuit pattern, and may be formed by an incombustible solder resist. The resin composition layer may be non halogen and self extinguishing (UL94V-1).

In accordance with an aspect of the present invention, there is provided a method of manufacturing a multilayer printed circuit board, including stacking first metal layers on both surfaces of a second metal layer, and forming a resin composition layer after forming an upper circuit pattern on a first metal layer on one surface. And forming a lower circuit pattern on the first metal layer on the other surface and an inner circuit pattern on the second metal layer, and then laminating a resin composition layer, and a blind via connected to the upper circuit pattern and the lower circuit pattern on the resin composition layer. Forming a hole, and simultaneously filling the blind via hole and forming an outer layer circuit.

The method of manufacturing a multilayer printed circuit board according to embodiments of the present invention may have one or more of the following features. For example, the first metal layer may be formed of copper foil or a copper foil alloy, and the second metal layer may be formed of nickel, aluminum, tin, titanium, stainless, or an alloy thereof, alloy 42. The first metal layer and the second metal layer may have a thickness of about 50 μm to about 300 μm. The first metal layer may be laminated on both surfaces of the second metal layer by pressure welding under conditions of room temperature and low pressure. Both surfaces of the second metal layer may be ion etched before pressing the first metal layer, and the first metal layer may be formed by plating on both sides of the second metal layer.

The resin composition layer may be formed of an epoxy resin, a cyanic acid ester resin, a marimide resin, a polyimide resin, a functional group-added polyphenylene ether resin, or a combination thereof, or may be formed of a liquid crystal polyester resin or a cyanic acid ester resin. . And the resin composition layer may be formed by a mixture of the cyanic acid ester resin and the liquid crystal polyester fiber cloth base.

A curing agent and / or a catalyst may be added to the resin composition layer, and the resin composition layer may be formed by a woven or nonwoven fabric of glass fiber woven or nonwoven fabric, polykisazor fiber, wholly aromatic polyamide fiber, liquid crystalline polyester fiber. .

The external connection means may be a solder ball formed in the resin composition layer, and the solder ball may be a solder ball for chip bonding connected to a chip and a solder ball for substrate bonding connected to a substrate. The outer layer of the resin composition layer may further comprise the step of forming a permanent protective film on the outer circuit pattern. The permanent protective film may be an inflammable solder resist, may be non halogen, and may have a characteristic of self extinguishing (UL94V-1).

Hereinafter, an embodiment of a multilayer printed circuit board and a method of manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings. In the following description, the same or corresponding components are given the same reference numerals. And duplicate description thereof will be omitted.

Referring to FIG. 6, a multilayer printed circuit board according to an exemplary embodiment of the present invention is a multilayer printed circuit board for connecting a semiconductor chip (not shown) by flip chip bonding. In the present invention, the first metal layer of the metal plate including a total of three layers of the first metal layers 11 and 11 'formed of copper or a copper alloy and the second metal layer 13 made of another metal, for example nickel or an alloy thereof. After the upper circuit pattern 17 is formed on (11), the resin composition layer 21 is disposed thereon. The lower circuit pattern 18 is formed on the first metal layer 11 ′ stacked on the opposite layer, and the resin composition layer 21 is laminated again after removing the exposed portion of the second metal layer 13 in the center. Then, blind via holes 23 are formed on both surfaces, and then filled with copper plating. Then, the external circuit pattern 25 is formed on the surface layer, and the resin composition layer 21 is formed again on both surfaces, and then the blind via hole 23 is formed, copper plating and circuit formation are repeated to fabricate a multilayer printed circuit board. .

When the printed circuit board is used in a high frequency environment, a liquid crystal polyester resin composition having a melting point of 270 ° C. or higher is used for the signal transmission circuit layer, that is, the outermost layer. And in order to make the whole self-extinguishing non-halogen (non-halogen), the self-extinguishing (UL94V-0) thing is used for the resin composition used internally as non-halogen. In addition, the permanent protective film 27 used for the surface layer of the non-halogen printed circuit board also uses a non-halogen self-extinguishing (UL94VTM-0). In addition, a substrate-reinforced thermosetting resin composition can be used as the permanent protective film 27 used for the outermost layer of the printed circuit board in order to increase the strength of the entire printed circuit board.

In the metal plate used for the printed circuit board according to the present embodiment, in order to make the metal layer into three layers of different kinds of metals, only one metal is processed to form the upper circuit pattern 17, and then metal surface treatment is performed as necessary. Then, a B stage resin composition layer, for example, the semiadditive resin composition layer is laminated | stacked and hardened on it. The lower circuit pattern 18 is formed on the first metal layer 11 ′ on the opposite side, and the second metal layer 13 in the center is left. After that, the inner second circuit pattern 19 is formed by dissolving and removing the central second metal layer 13, so that the circuit moves and there is no problem of position difference, and there is no crack or the like of the resin composition layer 21. Can be produced.

Thereafter, the surface on which the lower circuit pattern 18 is formed is subjected to a metal surface treatment, if necessary, and then a semi-additive resin composition is laminated and cured. After the blind via hole 23 is formed in the resin composition layers 21 formed on both surfaces of the metal plate, the desmear treatment, the filling with copper plating, and the formation of the external circuit pattern 25 are repeated.

The three-layer structure of the first metal layers 11 and 11 'stacked on both sides of the second metal layer 13 is processed one by one, but depending on the circuit structure, both surfaces of the first metal layers 11 and 11' are simultaneously processed. can do. As the resin composition layer 21, a B stage thermosetting resin composition and a B stage thermosetting resin composition of substrate reinforcement can also be used. When using the resin composition of substrate reinforcement, it is necessary to make the thickness of the metal layer of the surface which forms the circuit of a metal plate thin, and to prevent a circuit from contacting a base material. Moreover, when the liquid crystal polyester resin composition was used for lamination | stacking on at least the transmission circuit surface, the printed circuit board was suitable for use in a high frequency environment, and was excellent as a printed wiring board for semiconductor plastic packages etc. for high frequency use. In addition, the resin composition layer 21 used therein can be non-halogenized at the same time as it has digestibility (UL94V-0). In addition, the solder resist covering the surface can be self-extinguishable (UL94VTM-0) with non-halogen, so that the entire printed circuit board can be UL94V-0.

Referring to FIG. 1, a metal plate used in the present invention includes a metal plate 13 having a second metal layer 13 formed of a heterogeneous metal between at least one pair of first metal layers 11 and 11 ′ made of copper or a copper alloy. It has a layer structure. As copper or copper alloy, electrolytic copper or rolled copper can be used. Other dissimilar metals used in the second metal layer are not particularly limited, but dissimilar metals which do not dissolve when etching the copper or copper alloy to form the upper circuit pattern 17 and the lower circuit pattern 18 are used. The etchant used to form the upper circuit pattern 17 and the lower circuit pattern 18 may be one capable of selectively etching the first metal layers 11 and 11 '.

The second metal layer 13 may be formed of, for example, an alloy of nickel, aluminum, tin, titanium and alloys thereof, stainless steel, 42 alloy, and the like. Hard and soft metal sheets can be used, and high elastic modulus and high thermal conductivity can be used. The thickness of the first metal layers 11 and 11 ′ and the second metal layer 13 is not particularly limited, but may be 50 to 300 μm, but is not limited thereto.

The method of stacking the first metal layer 11 on both sides of the second metal layer 13 according to the embodiment of the present invention is not particularly limited and a general method may be used. For example, a method of placing the first metal layers 11 and 11 ′ on both sides of the second metal layer 13 and then performing pressure welding at normal temperature and low pressure may be mentioned. In this case, ion etching or the like is performed as a metal surface pretreatment (activation treatment) before rolling. There is also a method of plating the first metal layers 11 and 11 'on both surfaces of the second metal layer 13.

The method of forming the upper circuit pattern 17 and the lower circuit pattern 18 on the first metal layers 11 and 11 ′ of the printed circuit board according to an exemplary embodiment of the present invention is not particularly limited. Can be used. After formation of the upper circuit pattern 17, the circuit surface can be subjected to a known treatment, for example, black copper oxide treatment, CZ treatment of Mack Corporation, and the like, as necessary. After disposing a resin composition such as an additive resin composition and heating, curing, or semi-curing it, the lower circuit pattern 18 is formed on the first metal layer 11 ′ on the opposite side, and then the second exposed center is formed. The metal layer 13 is dissolved and removed. Then, if necessary, the metal surface is treated to arrange a resin composition such as an additive resin composition on at least this surface, and to be heated, cured or semi-cured. After the blind via holes 23 are formed on both surfaces with a laser, desmearing is performed as necessary, electroless copper plating or electro copper plating is performed, and the blind via holes 23 are filled with copper plating. In this case, if the resin composition to be laminated is a thermoplastic resin composition having a melting point of 270 ° C or higher, such as a general thermosetting resin composition or a liquid crystal polyester resin composition, the metal foil, for example, copper foil is disposed thereon, and then heated and pressurized in a vacuum. To obtain a copper plate. And the well-known method, for example, copper foil of a surface layer is etched to 1-5 micrometers, and the blind via hole 23 is formed by methods, such as a carbon dioxide laser, a UV-YAG laser, and a UV-Vanadate laser, on this. Thereafter, if necessary, the inside of the blind via hole 23 is desmeared, and then the inside of the via hole 23 is filled with copper plating.

A well-known thing can be used as the resin composition layer 21 used for the multilayer printed circuit board which concerns on a present Example. For example, a thermosetting resin, a thermoplastic resin having a melting point of 270 ° C or higher, a UV selective thermosetting resin, or the like can be used. Generally as a thermosetting resin, a well-known thing can be used. For example, well-known resins, such as an epoxy resin, a cyanic acid ester resin, a marimide resin, a polyimide resin, a functional group addition polyphenylene ether resin, etc. can be used individually or in combination of 2 or more types. And as a thermoplastic resin, the high heat resistant thermoplastic resin of melting | fusing point 270 degreeC or more, such as liquid crystalline polyester resin, can be used. In addition, UV-selective thermosetting resins for general semi-additives can also be used. Of course, mixtures thereof can also be used. In order to improve the reliability of the printed circuit board, a thermosetting resin composition may be used. As the thermoplastic resin composition, a liquid crystal polyester resin composition may be used.

When it is necessary to lower the overall dielectric properties for the purpose of using the printed wiring board of the present invention for high frequency applications, a thermosetting resin such as a cyanic acid ester resin composition is used. In addition, in order to avoid transmission loss and the like at a high frequency of 20 GHz or more, a cyanate ester resin composition may be used alone or in combination with a liquid crystal polyester fiber cloth base material without using glass fibers. As the thermoplastic resin composition, a liquid crystal polyester resin composition may be used, and such a mixture may be used.

The following may be used as the cyanic acid ester resin, which is a thermosetting resin that can be used in the multilayer printed circuit board according to the present embodiment. For example, 1,3- or 1,4-zigianat benzene, 1,3,5-tricyanat benzene, 1,3-, 1,4-, 1,6-, 1,8-, 2, 6- or 2,7-zicyanathnaphthalene, 1,3,6-tricyanathnaphtharene, 4,4-zicyanatbiphenyl, nasa (4-cyanatphenyl) methane, 2,2-screw (4- Cyanatephenyl) propane, 2,2-screw (3,5-gibromo4-cyanaphenyl) propane, screw (4-cyanaphenyl) ether, screw (4-cyanaphenyl) thioether, screw (4 Cyanatephenyl) sulfone, tris (4-cyanatphenyl) hospite, tris (4-cyanaphenylphenyl) phosphate, and sodium cyanate obtained by the reaction of a novolak with cyanide halide; It can be used 1 type or in combination of 2 or more types.

And Japanese Patent Publications No. 41-11712, No. 43-18468, No. 44-4791, No. 45-11712, No. 46-41112, No. 47-26853, and No. 51-63149 Cyanic acid esters such as those described herein may also be used. Moreover, the prepolymer of the molecular weight 400-6,000 which has the triazine ring formed by trimerization of the cyanate group of such a cyanate ester compound is used. The prepolymer can be obtained by reacting by a known method. For example, cyanic acid ester monomers include acids such as mineral acid and Lewis acid; Bases such as tertiary amines such as sodium arcolat; salts such as sodium carbonate and the like can be obtained by polymerizing as a catalyst. Among these prepolymers, unreacted monomers are also included in the form of a mixture of monomers and prepolymers, and these are suitably used as the thermosetting resin component of the present invention. In addition, liquid cyanate esters may be used, and one or two or more thereof may be used in combination.

An additive can be mix | blended in the said thermosetting resin. For example, thermosetting resins, thermoplastic resins, well-known organic and inorganic fillers, dyes, pigments, thickeners, lubricants, antifoaming agents, dispersants, leveling agents, photosensitizers, gloss agents, polymerization initiators, and Chiki plasticizers other than those described above. Various additives are added in combination according to the purpose and use. As needed, the compound which has a reactor mix | blends an appropriate amount with a hardening | curing agent and a catalyst. In addition, a flame retardant, a flame retardant by cancellation, a non-halogen type, a flame retardant, etc. can be used. When making it non-halogen, the flame retardant for non-halogens can be added to a thermosetting resin composition, and it can be made flame-retardant.

In addition, since the liquid crystalline polyester resin itself is non-halogen self-extinguishing, by using this alone, the whole substrate can be made non-halogen. In addition, by using a self-extinguishing (VTM-0) self as a non-halogen as the precious metal plating resistor, the entire printed circuit board can be made non-halogen of UL94V-0.

Although the thermosetting resin composition according to the present embodiment itself is cured by heating, when the curing rate is slow and the workability and economy are poor, a curing agent and a catalyst are used in the thermosetting resin composition. Generally the usage-amount is 0.005-10 weight part with respect to 100 weight part of thermosetting resins, Preferably 0.01-5 weight part can be used.

As the molecular structure of the liquid crystal polyester resin used in the present embodiment, a common one can be used, and one or more thereof can be used in combination. An additive can also be mix | blended and used in the range which does not have a big influence on a characteristic. The melting point is 270 ℃ or more that can withstand the processing when using a printed circuit board. The thickness is not particularly limited and is, for example, 3 to 200 µm, more specifically 5 to 150 µm. When thickness is thin, it is difficult to join to the unevenness | corrugation of the mat surface of metal foil, and it cannot contain a metal conductor circuit. And if it is thick, the thickness of the entire printed circuit board cannot be made thin, the price rises, and the overall mechanical strength becomes weak.

In the resin composition layer 21 according to the present embodiment, a substrate may be used. What can be used as a substrate may be a general substrate used for a printed circuit board. Specifically, general well-known glass fiber woven fabrics and nonwoven fabrics, such as E, NE, T, and D glass; Woven fabric, nonwoven fabric of polyoxysazor fiber, wholly aromatic polyamide fiber, liquid crystalline polyester fiber; Such honcho spring etc. are mentioned. In order to improve the adhesiveness with resin, such a base material can use what used the well-known process of the surface of a base material.

When the method used in the present embodiment is a semi-additive method, after the blind via hole 23 is drilled through the resin composition layers 21 on both sides, the resin composition layer is defected, and the blind via holes are made by electroless copper plating and electro copper plating. 23) Charge the inside. Then, the external circuit pattern 25 is formed, and this process is repeated. In this case, in order to prevent warpage of the printed circuit board, a metal may be reinforced around the printed circuit board. Of course, the full additive method can also be used.

There is no particular limitation on the conditions of the laminate molding, and when the thermosetting resin composition is used, the temperature is 100 to 300 ° C., specifically 110 to 250 ° C., the pressure is 1 to 50 kgf / cm ² , the degree of vacuum is 10 mmHg or less and the time is 5 to 120. Molding under conditions of minutes. The semi-additive resin composition is often semi-cured before complete curing, after which the resin composition is laminated. In this case, post-curing is performed after copper plating. The temperature and time are selected from the above conditions.

In addition, when laminating and bonding a liquid-crystal polyester resin composition layer, it is pressure 1-50 kgf / cm <^2> , More specifically, at the temperature more than the temperature which liquid crystalline polyester resin melt | dissolves, ie, 10-50 degreeC higher than melting | fusing point, Integrate by laminating at 5 to 30 kgf / cm ² or under vacuum for 1 to 60 minutes or 2 to 40 minutes. Of course, it is also possible to manufacture a printed circuit board by using a liquid crystal polyester resin alone.

The metal used for the first metal layer 11 is not particularly limited, and copper foils such as electrolytic copper and rolled copper, nickel foils and alloy foils thereof may be used, but a single copper foil may be used. Thickness of 1 ~ 35μm can be used. As a printed circuit board, an electrolytic copper foil is used suitably. In high frequency applications, transfer loss can be reduced by using unevenness of the mat surface of 2 μm or less, more specifically 1 μm or less, and a small electrolytic copper foil, a rolled copper foil, or the like as the Rz value.

Copper plating generally uses a well-known method. For example, after formation of the blind via hole 23, a known desmear treatment, a plasma treatment, and the like are performed, followed by electroless copper plating and electroplating. The present copper plating is used for filling blind via holes 23 to form stack vias. After that, an external circuit pattern 25 is formed on the surface, and finally a precious metal plating resistor is formed, and then nickel plating and gold plating are performed.

In order to make the whole printed circuit board non-halogen and UL94V-0, the solder resist resin composition itself which forms the permanent protective film 27 itself uses the thing of the flame resistance (UL94VTM-0). In this case, the substrate is added to improve the strength of the entire printed circuit board. The resin composition may be a thermosetting resin composition, a thermoplastic resin composition, or a UV selective thermosetting resin composition. In addition, a thermosetting resin composition may be used to improve the reliability of the printed circuit board.

The semiconductor chip is mounted on the multilayer printed circuit board formed by the above method by flip chip bonding. The underfill resin is then filled to form a semiconductor package. Of course, the wire bonding method can also be used. The back surface can also be connected to the solder balls 29 and 31 or directly to the main board (not shown) by hand.

Hereinafter, the present invention will be described in detail through examples and comparative examples of a multilayer printed circuit board according to an exemplary embodiment of the present invention. However, "part" shows a weight part unless there is particular notice.

Example 1

900 parts of 2,2-screw (4-cyanaphenyl) propane and 100 parts of screw (4-marimide phenyl) methane are dissolved at 150 ° C. and reacted for 4.5 hours to obtain a mixture of prepolymer and monomer. Varnish A was prepared by dissolving in a mixed solvent of N, N'-dimethyl formamide. To this, 400 parts of bisphenol A type epoxy resin (brand name: Epicoat 1001, product made by Japan Epoxy Resin Co., Ltd.) and 600 parts of cresol novolac type epoxy resin (product name: ESCN-220F, manufactured by Sumitomo Chemical Co., Ltd.) were added and dissolved and mixed uniformly. Then, 0.4 part of zinc octylate was added as a catalyst to dissolve, followed by uniformly stirring to obtain varnish B. 2200 parts of aluminum hydroxide (average particle diameter: 1.5 micrometers) and 20 parts of zinc molybdate supporting talc (brand name: KEMGARD911C, the product made by Shawin Williams Co., Ltd.) were mix | blended with this as an inorganic filler, and it stirred and mixed uniformly, and obtained varnish C.

Varnish D was prepared by adding 5 parts of blue pigments (trade name: copper phthalocyanine blue KRO, Cigigment Blue 15: 3, manufactured by Sanyo Dyestuff Co., Ltd.) to the varnish C. The varnish D was impregnated into a glass cloth having a thickness of 12 µm and dried to obtain a prepreg E having a gelation time of 155 seconds (at170 ° C) and a thickness of 35 µm. The flame resistance of the laminate obtained by laminating the prepreg E under vacuum at 190 ° C., 20 kgf / cm ² and 5 mmHg for 1.5 hours was UL94V-0. Moreover, the resin composition sheet | seat of 100 micrometers in thickness was produced, without using a base material, and it tested using this, The result was UL94VTM-0.

In addition, the varnish C was applied / dried on a mat surface of a low profile copper foil (brand name: Olin XTF, Olin® Brass, Rz: 0.5 μm) having a thickness of 35 μm rolled copper foil carrier, and gelation time was 133 seconds (at170 ° C.). ), B-stage thermosetting resin composition sheet F with copper foil which is 70 micrometers in thickness of thermosetting resin composition was obtained. Furthermore, the gelation time 125 second (at170 degreeC) and the B-stage B thermosetting agent resin composition sheet G with copper foil which is 40 micrometers in thickness of a thermosetting resin composition were obtained.

And three layers of metal plates (brand name: FINE CLAD, which bonded the rolled alloy plate which consists of Cu: 97.3%, Fe: 2.5%, P: 0.1%, Zn: 0.1% of thickness 50micrometer on both surfaces of the nickel foil of 0.8 micrometer in thickness, After attaching the anti-etching film to one surface of the copper alloy (see Fig. 1) using Dongyang Steel Co., Ltd., an upper circuit pattern 17 was formed using an etchant that cannot dissolve the nickel foil as the second metal layer. (See Figure 2). After the black copper oxide treatment was performed on the surface of the upper circuit pattern 17, the B-stage thermosetting resin composition sheet F with copper foil was disposed on this surface, followed by lamination and molding at 190 ° C. and a pressure of 20 kgf / cm ² for 1.5 hours. The gap was filled (see FIG. 3). The copper alloy on the opposite side also forms the lower circuit pattern 18 in the same manner, and then removes and removes the nickel foil, which is the exposed second metal layer 13, with an etchant that does not dissolve the copper alloy, thereby removing the inner circuit pattern 19. ) Was formed. Then, black copper oxide treatment was performed on the surface of the conductor circuit, and the substrate was dried at 125 ° C. for 1 hour. Then, the B-stage thermosetting resin composition sheet F with copper foil was disposed on the circuit surface, and laminated molding was performed under the same conditions, as in FIG. 4.

And after peeling off the 35μm carrier copper foil 33 on both sides shown in Figure 4, by drilling a blind via hole of 50μm in diameter with a UV-YAG laser on both sides by one side and then desmearing. After 1μm of electroless copper plating, a pattern resistor is formed, and the inside of the via hole 23 is filled with electric copper plating, and the copper plating and pattern resistors for the circuit are peeled off, followed by flash etching, and an external circuit of line / space = 20 / 20μm. A pattern 25 is formed (see FIG. 5). Then, black copper oxide treatment was performed to obtain the substrate H. After arrange | positioning the said B stage thermosetting resin composition sheet G with copper foil on both surfaces, the process of carrying out lamination by the same method was repeated, and the printed wiring board I was obtained.

After applying the CZ treatment to the printed wiring board I, one sheet of the prepreg E was disposed on both surface layers, and a fluorine resin film having a thickness of 50 μm was disposed on both outer sides thereof, and then laminated molding was performed under the above conditions. The blind blind via hole 23 was formed in the place which connects a flip chip, and the place which connects the handball of the opposite side using a UV-YAG laser. Then, after performing a plasma processing process, nickel plating and gold plating were performed. A bump 29 was formed on the flip chip connection portion of this surface by a solder free hand, and the handball 31 was connected to the back surface thereof to produce a multilayer printed circuit board as shown in FIG. Table 1 shows the evaluation results of the multilayer printed circuit board manufactured as described above.

Example 2

Using the substrate G of Example 1, a resin composition for semiadditives (trade name: APL-3601, manufactured by Sumitomo Bakelite Co., Ltd., UL94VTM-0) having a thickness of 40 μm was placed on both surfaces thereof with non-halogen, and laminated at 40 ° C. for 40 minutes. After molding, the surface PET film is peeled off. After forming a blind via hole with a diameter of 50 μm using a UV-YAG laser, desmearing it to make defects, attaching 1 μm of electroless copper plating, forming a pattern resistor on the surface, and filling the inside of the via hole with electric copper plating, The composition layer 21 was copper-plated. After the pattern resist was peeled off, the resin composition layer 21 was cured at 210 ° C. for 1 hour, and an external circuit pattern 25 having a line / space = 20/20 μm was formed by flash etching (see FIG. 5). The external circuit pattern 25 was subjected to CZ treatment of Mack Corporation, and a liquid crystal polyester resin composition sheet having a melting point of 280 ° C. was disposed on both surfaces thereof at a thickness of 50 μm. : Olin XTF, manufactured by Olin 'Brass, Rz: 0.5 µm) were placed and laminated at 10 ° C. under a vacuum of 5 mmHg or less for 10 minutes, and then the carrier copper foil 33 of the surface layer was peeled off. In the same manner, a blind via hole 23 having a diameter of 50 μm is formed, desmearing, electroless copper plating, pattern resistor formation, all copper plating including the inside of the via hole, pattern resist stripping, and flash etching, and line / space = 15 / The circuit of 15 micrometers was formed, and the printed wiring board J of five layers was produced. After the CZ process of this surface, the prepreg E of Example 1 is arrange | positioned on it, and laminated | stack-molding like Example 1 is carried out. Laser processing was carried out in the same manner to perform nickel plating and gold plating to connect bumps and handballs. Table 1 shows the evaluation results of the printed circuit board manufactured as described above.

Comparative Example 1

7 is a cross-sectional view of the multilayer printed circuit board according to Comparative Example 1. FIG. After forming a through hole using a glass Teflon double-sided copper clad laminate with 12 μm electrolytic copper foil (roughness Rz: 3.7 μm) on both sides, and having a thickness of 0.3 mm, the copper plating was applied after fluorine-based tetra surface treatment to improve copper adhesion. Process board K was obtained. At this time, in the case where the fluorine-based tetra surface treatment was not performed, copper plating caused poor adhesion, resulting in poor conduction. A non-halogen UV selective thermosetting resistor (trade name: PSR4000AUS308, manufactured by Taiyo Ink Co., Ltd.) with a low halogen content is formed on the surface with nickel plating, After gold plating, bumps and handballs were connected to produce a printed circuit board as shown in FIG. Table 1 shows the results of the evaluation of the printed circuit board. In FIG. 7, reference numeral 41 denotes a permanent protective film, 43 denotes a handball for bonding semiconductor chips, 45 denotes a glass cloth-based fluororesin composition, and 47 denotes a motherboard bonding handball. Represent the solder resist.

Comparative Example 2

8 is a cross-sectional view of the multilayer printed circuit board according to Comparative Example 2. FIG. In Example 1, only a copper alloy having a thickness of 125 µm is used, and a black copper oxide treatment is performed after a circuit is formed by connecting to a peripheral edge by a regular method. Then, the B stage thermosetting resin composition sheet F was laminated on the roll at 100 ° C. with a linear pressure of 5 kgf / cm, and then the PET film of the surface layer was peeled off. Then, an electrolytic copper foil having a thickness of 12 μm was placed thereon, and then 190 ° C. , 20 kgf / cm ² , laminated bonding in a vacuum of 5 mmHg or less. After the surface layer copper foil was etched to 2 μm in the same manner as in Example 1, blind via holes were formed and copper plating was charged, and circuit formation and lamination were repeated to fabricate a six-layer printed circuit board. And the solder resist sheet used the UV selective thermosetting resistor of the comparative example 1. The printed circuit board manufactured as described above is illustrated in FIG. 8. Table 1 shows the experimental results for the printed circuit board manufactured as shown in FIG. 8. In Fig. 8, reference numeral 43 denotes a handball for semiconductor chip bonding, 47 denotes a main board bonding handball, 51 denotes a cured thermosetting resin composition, and 53 denotes a permanent protective film.

Comparative Example 3

A copper alloy having a thickness of 125 µm is used as the substrate, and a B stage epoxy resin composition sheet having a temperature of 200 ° C. and a thickness of 50 µm is placed on both surfaces, and an electrolytic copper foil having a thickness of 12 µm is placed thereon. After the resin composition for semiadditives of Example 2 was arrange | positioned on it, a lamination and a blind via hole are formed by the method similar to Example 2. The desmearing process, copper plating, and circuit formation were repeated to produce four layers of buildup printed circuit boards on both sides of a 125 μm thick copper alloy. And after covering 1 layer with full copper plating, it heated at 200 degreeC for 10 minutes, and peeled each 5 layers of printed wiring boards from the center. Thereafter, circuits were formed on both surfaces, and the surface layer was coated with the UV selective thermosetting resistors of Comparative Example 1 to produce multilayer printed circuit boards in the same manner. The printed circuit board manufactured as described above is illustrated in FIG. 9. And the experimental results for Comparative Example 3 are shown in Table 1. In Fig. 9, reference numeral 55 denotes a copper alloy plate, 57 denotes a copper foil, 59 denotes an epoxy resin composition, and 61 denotes an electrolytic copper foil.

Table 1

Example 1 Example 2 Comparative Example 1 Comparative Example 2 Comparative Example 3 Machining Pretreatment not needed not needed Special handling required not needed not needed Staggered circuit none none none Center circuit is out of order none Stack structure has exist has exist none none has exist Curved state (㎛) 47 61 210 120 569 Curved state after flip chip mounting (㎛) 67 81 275 155 Not measurable Flame resistance V-0 V-0 HB HB V-1 Contains Br, Cl Non-halogen Non-halogen - Non-halogen Non-halogen Heat dissipation 34 37 71 45 - Transmission loss (dB) at 25㎓ - -3.5 -7.5 -27 - Dielectric constant (25㎓) 4.7 2.9 2.3 4.8 -

How to measure

(1) Hole pretreatment: Indicates the presence or absence of special treatment before copper plating of holes.

(2) Circuit gap: Analyze the gap of 100μm or more from the position where the circuit is formed.

(3) Stack structure: presence of stack structure.

(4) Warpage: After fabrication of the printed wiring board, the warpage after measuring the size of 40x40mm and mounting a 13mm flip chip in the center with a lead reflow hander (Max. Temperature: 260 ° C) is measured. The printed circuit board of Comparative Example 3, which does not adhere the reinforcing substrate, was not measured because the reflow treatment was not performed.

(5) Flame resistance: The board | substrate was produced after removing the copper foil for circuits in the same structure, and measured according to UL-94.

（6） Br, Cl content: measured according to Japan Printed Circuit Board Industry Association (JPCA) standard JPCA-ES-01-1999. The thing of each 900 ppm or less of Br and Cl of the board | substrate with a soldering resist was made into non-halogen. Since solder resists are flammable and self-extinguishing in non-halogen itself, the flame resistance becomes HB or V-1 when using a flammable one. Since it is not prescribed about fluorine, it was not measured.

(7) Heat dissipation: After connecting a semiconductor chip, the underfill resin was poured and hardened, and it connected to the main board, and used for 1000 hours continuously, and measured the package temperature.

(8) Transmission loss: The transmission loss to 25 GHz was measured using a microstrip line with an insulating layer of 100 ± 15 μm, a line width of 220 ± 15 μm, a line thickness of 35 ± 5 μm, and a length of 10 cm. And in Example 2, the liquid crystal polyester resin composition layer was measured.

(9) Dielectric constant: The dielectric constant to 25 GHz was measured by the cavity resonance method.

Experiment result

As can be seen from Table 1, the multi-layer printed circuit board according to the embodiment of the present invention did not have a pre-processing and a circuit gap. In addition, warpage of the entire circuit did not occur as much as in Comparative Example 1 and Comparative Example 3, but also exhibited characteristics of flame resistance and non-halogenity. And Example 1 and Example 2 of the Example of this invention are excellent in heat dissipation, and exhibit the outstanding characteristic compared with Comparative Example 1 and Comparative Example 3 in transmission loss and dielectric constant.

Although the embodiments of the present invention have been described above, various changes and modifications of the present invention should also be construed as falling within the scope of the present invention as long as the technical idea of the present invention is realized.

The present invention can provide a multilayer printed circuit board having excellent signal transmission and excellent heat dissipation.

The present invention does not require a reinforcing material, and can provide a multilayer printed circuit board having excellent dielectric properties and excellent transmission loss at a high frequency, particularly 20 GHz or more.

The present invention can provide a non-halogen (non halogen) multilayer printed circuit board having a flame resistance of UL94V-0.

Claims (36)

An upper circuit pattern, a lower circuit pattern, and an internal circuit pattern formed from at least a pair of first metal layers and a second metal layer interposed between the first metal layers and stacked; A resin composition layer laminated on the first metal layer and buried in the upper circuit pattern and the lower circuit pattern; A blind via hole formed in the resin composition layer and connected to the upper circuit pattern and the lower circuit pattern; An outer circuit pattern formed on the resin composition layer and connected to the blind via hole; Multi-layer printed circuit board having an external connection means connected to the outer circuit pattern. The method of claim 1, The first metal layer is a multilayer printed circuit board formed of copper foil or copper foil alloy. The method of claim 2, The second metal layer is a multilayer printed circuit board formed of nickel, aluminum, tin, titanium, stainless or alloys thereof, alloy 42. The method of claim 1, The thickness of the first metal layer and the second metal layer is a multilayer printed circuit board of 50 ~ 300㎛. The method of claim 1, A multilayer printed circuit board having a pair of the first metal layer stacked on both sides of the second metal layer. The method of claim 1, The resin composition layer is a multilayer printed circuit board formed by epoxy resin, cyanic acid ester resin, marimide resin, polyimide resin, functional group addition polyphenylene ether resin or a combination thereof. The method of claim 1, The resin composition layer is a multilayer printed circuit board formed by a liquid crystal polyester resin. The method of claim 1, The resin composition layer is a multilayer printed circuit board of cyanic acid ester resin. The method of claim 1, The resin composition layer is a multilayer printed circuit board formed by a mixture of a cyanic acid ester resin and a liquid crystal polyester fiber cloth base. The method of claim 6, The resin composition layer is a multilayer printed circuit board is added with a curing agent and / or a catalyst. The method of claim 1, The resin composition layer is a multilayer printed circuit board formed of a woven or nonwoven fabric of glass fiber woven or nonwoven fabric, polykisazor fiber, wholly aromatic polyamide fiber, liquid crystal polyester fiber. The method of claim 1, The external connection means is a multilayer printed circuit board is a solder ball formed on the resin composition layer. The method of claim 12, The solder ball is a multi-layer printed circuit board which is a solder ball for chip bonding and a board for solder bonding to the board connected to the chip. The method of claim 1, A multilayer printed circuit board having a permanent protective film formed on the outer circuit pattern. The method of claim 14, The permanent protective film is a multilayer printed circuit board is a solder resist. The method of claim 15, The solder resist is a multi-layer printed circuit board of the refractory. The method of claim 1, The resin composition layer is a non-halogen (non halogen) and self-extinguishing (UL94V-1) multilayer printed circuit board. (a) depositing a first metal layer on both sides of the second metal layer; (b) forming an upper circuit pattern on the first metal layer on one surface and then laminating a resin composition layer; (c) forming a lower circuit pattern on the first metal layer on the other surface and an internal circuit pattern on the second metal layer, and then laminating a resin composition layer; (d) forming a blind via hole connected to the upper circuit pattern and the lower circuit pattern in the resin composition layer; (e) filling the blind via hole and simultaneously forming an outer layer circuit pattern. The method of claim 18, The first metal layer is a multilayer printed circuit board manufacturing method formed of copper foil or copper foil alloy. The method of claim 19, And the second metal layer is formed of nickel, aluminum, tin, titanium, stainless or an alloy thereof, alloy 42. The method of claim 18, The first metal layer and the second metal layer has a thickness of 50 ~ 300㎛ multi-layer printed circuit board manufacturing method. The method of claim 18, The first metal layer is a multilayer printed circuit board manufacturing method is laminated on both sides of the second metal layer by pressure welding under conditions of room temperature and low pressure. The method of claim 22, And ion-etching both surfaces of the second metal layer before the pressure welding of the first metal layer. The method of claim 18, The first metal layer is a multilayer printed circuit board manufacturing method formed by plating on both sides of the second metal layer. The method of claim 18, The resin composition layer is a method of manufacturing a multilayer printed circuit board formed by epoxy resin, cyanic acid ester resin, marimide resin, polyimide resin, functional group addition polyphenylene ether resin or a combination thereof. The method of claim 18, The resin composition layer is a multilayer printed circuit board manufacturing method formed by a liquid crystal polyester resin. The method of claim 18, The resin composition layer is a cyanate ester resin multilayer printed circuit board manufacturing method. The method of claim 18, The resin composition layer is a multilayer printed circuit board manufacturing method formed by a mixture of a cyanic acid ester resin and a liquid crystal polyester fiber cloth base. The method of claim 18, The resin composition layer is a multilayer printed circuit board manufacturing method to which a curing agent and / or a catalyst is added. The method of claim 18, The resin composition layer is a multi-layer printed circuit board manufacturing method formed of a woven or non-woven fabric of glass fiber woven or non-woven fabric, polykisosa fiber, wholly aromatic polyamide fiber, liquid crystal polyester fiber. The method of claim 18, Forming an external connection means connected to the outer circuit pattern; The external connection means is a solder ball formed in the resin composition layer is a multilayer printed circuit board manufacturing method. The method of claim 31, wherein The solder ball is a chip bonding solder ball is connected to the chip and a solder ball for bonding the board is connected to the substrate manufacturing method of a multilayer printed circuit board. The method of claim 18, (f) forming a permanent protective film on the outer circuit pattern. The method of claim 33, wherein Wherein the permanent protective film is a solder resist multilayer printed circuit board manufacturing method. The method of claim 34, wherein The solder resist is a flame-retardant multilayer printed circuit board manufacturing method. The method of claim 18, The resin composition layer is a non-halogen (non halogen) and self-extinguishing (UL94V-1) of the multilayer printed circuit board manufacturing method.

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