KR100719225B1 - Temperature control system for semiconductor manufacturing process - Google Patents

Abstract

Temperature control system for semiconductor manufacturing process that can maximize energy use efficiency by constructing low-temperature and high-temperature latent heat material (PCM) as separate energy sources to store and convert heat storage energy and heat storage energy for semiconductor manufacturing process It is about.

According to an embodiment of the present invention, a temperature control system for controlling the temperature of semiconductor equipment used in a semiconductor manufacturing process, comprising: a distribution valve connected to the semiconductor equipment and distributing a refrigerant from the semiconductor equipment; A refrigerant loop portion having a connected plate heat exchanger and a mixed stirrer for stirring and supplying the refrigerant passing through the plate heat exchanger to the semiconductor equipment; A refrigeration system loop portion having a refrigeration unit connected to the plate heat exchanger and forming a cycle, and a latent heat tank having a PCM heat exchanger connected to the freezing unit and forming a cycle therein, and the refrigerant from the semiconductor equipment is transferred to the switching of the distribution valve. By the PCM heat exchanger is provided a temperature control system for a semiconductor manufacturing process, characterized in that flowing into the mixing stirrer.

Latent heat, temperature control system, PCM tank, PCM heat exchanger

Description

TEMPERATURE CONTROL SYSTEM FOR SEMICONDUCTOR MANUFACTURING PROCESS

1 is a schematic view for explaining a chiller structure for a conventional semiconductor equipment.

Figure 2 is a block diagram illustrating a temperature control system for a semiconductor manufacturing process according to an embodiment of the present invention.

Figure 3 is a schematic diagram for explaining a latent heat (PCM) tank used in the temperature control system for a semiconductor manufacturing process according to an embodiment of the present invention.

Figure 4 is a schematic diagram for explaining the coupling relationship between the mixing stirrer and the tank used in the temperature control system for a semiconductor manufacturing process according to an embodiment of the present invention.

** Description of Codes for Major Configurations of Drawings **

100: temperature control system for semiconductor manufacturing process

110: freezer 120: PCM tank

130: plate heat exchanger 140: mixing stirrer

150: refrigerant tank 160: TCU

170: pump 180: semiconductor equipment

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to semiconductor manufacturing equipment. More specifically, low-temperature and high-temperature latent heat (PCM) materials are configured as separate energy sources to store and convert heat storage and heat storage energy to be used in semiconductor manufacturing processes. The present invention relates to a temperature control system for a semiconductor manufacturing process capable of maximizing utilization efficiency.

Generally, one of the temperature control systems used in the semiconductor manufacturing process, the chiller is a semiconductor manufacturing equipment used in the semiconductor manufacturing process. The wafer is placed on the chuck and a predetermined process, in particular etching, is performed. And chemical vapor deposition (CVD), which are applied to improve the manufacturing defects of semiconductor devices by effectively removing heat generated during a manufacturing process under a constant temperature condition.

Recently, as the degree of integration of semiconductor devices is improved, the wafer size is increased and integrated in size from 200 mm to 300 mm or more, so that it is possible to quickly and precisely control the temperature rise and fall due to a wide range of process temperatures ranging from low temperature and high temperature processes. The heat source constituting the system requires a considerable amount of energy, and the fatigue of the system is increasing accordingly.

However, in the semiconductor manufacturing process, a system that can accumulate the above energy in the chiller system, supply fluidly when needed, and save energy, has a limitation in its application range. In order to efficiently use the energy saving of the chiller system, by applying a phase change material (PCM), which is a phase change material, to the system, energy is accumulated or cooled to accumulate or heat the building by using late-night electric power, food storage refrigerator, and electronics. There are some limited uses in communications and industrial cooling / heating systems.

1 is a schematic diagram for explaining a conventional chiller structure for semiconductor equipment to be used when used to rise and fall below the process temperature during the semiconductor manufacturing process.

As shown in FIG. 1, the chiller structure 10 for semiconductor equipment includes a cooling tank 12 having a vaporizer 12a and a heater 12b, a liquefier 16 connected to the cooling tank 12, and a liquefier. Compressor 17 connected to 16, plate heat exchanger 18 connected to compressor 17 and sending refrigerant gas to cooling tank 12, connected to cooling tank 12 and pumping main equipment 14 And a RTD sensor 19 connected between the pump 15 and the main equipment 14 and the pump 15.

In the chiller structure 10 for semiconductor equipment shown in FIG. 1, the compressor 17 and the heater 12b serving as the heat source device are operated rapidly. Therefore, in order to control the process temperature of the main equipment 14, the power consumption and the output and operating time of the cooling tank 12 and the heater 12b of the chiller system are increased, which in terms of energy, the power consumption or energy consumption is reduced. Unnecessarily increased.

In addition, in order to reach a desired process temperature, the amount of use of the heater 12b, which is a heat source device, increases, which causes a phenomenon that the stabilization response speed of the entire system is delayed by increasing the deviation time for stabilization of the control.

When the chiller structure 10 described above is driven in the semiconductor manufacturing process, when the temperature lowering and raising is required to control to the final process temperature, the chiller structure 10 is applied to a temperature in supplying a cold heat source of uniform temperature to the main equipment 14. As a result, the response time decreases and the control time is delayed. As a result, the system performance decreases due to uniform cooling and heating of the system, thereby lowering the reliability of the chiller structure 10. Cause problems.

Furthermore, when the initial working process temperature is changed from the initial working process temperature to the desired process temperature during the semiconductor manufacturing process, the amount of driving of the chiller system increases rapidly compared to the initial process temperature, thereby increasing the energy consumption of the chiller structure 10 and the overall system. There is a problem of inferior temperature uniformity.

Finally, regardless of the irregular load shape used at the process temperature, effective coping is not effective in maintaining the operation and the set temperature of the chiller structure 10 accurately, thereby reducing the reliability of the system. .

Therefore, the present invention was created to solve the problems of the prior art as described above, the object of the present invention is to configure the low-temperature and high-temperature latent heat material (PCM) as a separate energy source to accumulate, regenerated energy It is to provide a temperature control system for the semiconductor manufacturing process that can maximize the energy utilization efficiency by storing and converting the used in the semiconductor manufacturing process.

In order to achieve the above object, a preferred embodiment of the present invention is a temperature control system for controlling the temperature of semiconductor equipment used in a semiconductor manufacturing process, the distribution is connected to the semiconductor equipment to distribute the refrigerant from the semiconductor equipment A refrigerant loop portion including a valve, a plate heat exchanger connected to the distribution valve, and a mixing stirrer for stirring and supplying the refrigerant passing through the plate heat exchanger to the semiconductor equipment; A refrigeration system loop portion having a refrigeration unit connected to the plate heat exchanger and forming a cycle, and a latent heat tank having a PCM heat exchanger connected to the freezing unit and forming a cycle therein, and the refrigerant from the semiconductor equipment is transferred to the switching of the distribution valve. It provides a temperature control system for a semiconductor manufacturing process characterized in that it is introduced into the mixing stirrer via a PCM heat exchanger.

According to a preferred feature of the invention, the refrigerant loop portion further comprises a pair of first and second solenoid valves, wherein the first solenoid valve is connected between the distribution valve and the PCM heat exchanger, and the second solenoid valve Is connected between the distribution valve and the plate heat exchanger.

According to a preferred feature of the invention, the refrigeration system loop portion further comprises a refrigerant tank connected between the mixing stirrer and the semiconductor equipment having a heater and a pump for supplying the refrigerant in the refrigerant tank to the semiconductor equipment.

According to a preferred feature of the invention, a temperature sensor and a temperature control unit are provided inside the mixing stirrer.

According to a further preferred feature of the invention, the refrigeration system loop portion further comprises a pair of third and fourth solenoid valves, wherein the third solenoid valve is connected between the freezer and the PCM heat exchanger and the fourth solenoid valve Is connected between the refrigerator and the plate heat exchanger.

According to a further preferred feature of the invention, both the third and fourth solenoid valves are opened in the initial state.

According to an even more preferred feature of the invention, when the semiconductor process reaches a desired process temperature, the fourth solenoid valve is adjusted so that the refrigerant is injected into the low temperature PCM heat exchanger via the PCM heat exchanger.

According to a preferred feature of the invention, the low temperature and the high temperature PCM tank is provided with two layers of steel case and the heat insulating material filled between the steel case.

According to a preferred feature of the invention, the high temperature PCM is made of any one selected from the group consisting of B18, B19, B14, B13, B12, B11, B10, B8.

According to a preferred feature of the invention, the low temperature PCM is made of any one selected from the group consisting of NaCl-H ₂ O-based material or A7, A18, A19, A14, A13, A12, A11, X1, A10, A8.

Hereinafter, a temperature control system for a semiconductor manufacturing process according to a preferred embodiment of the present invention having the configuration as described above will be described in detail with reference to the accompanying drawings.

2 is a block diagram illustrating a temperature control system for a semiconductor manufacturing process according to an embodiment of the present invention.

As shown in FIG. 2, the temperature control system 100 for a semiconductor manufacturing process according to an exemplary embodiment of the present invention includes a refrigerator 110, a latent heat change (PCM) tank 120, and a fourth solenoid valve. Plate-type heat exchanger (130) receiving the refrigerant and hot gas from the refrigerator (110) through the (Vs4), mixed stirrer (140) receiving the cooled gas from the plate heat exchanger (130) The refrigerant tank 150 and the semiconductor equipment 180 which receive the refrigerant from the mixing stirrer 140 through the refrigerant pipe are included.

According to one embodiment of the invention, the temperature control system 100 for a semiconductor manufacturing process is a low-temperature of about -60 ℃ to 0 ℃ and a high temperature liquid latent material of about 50 ℃ to 150 ℃ energy supply type heat source device As it relates to the energy-saving chiller used by storing and converting the heat storage energy / heat storage energy, it is characterized in that it can maximize the energy utilization efficiency.

Referring to FIG. 2, the temperature control system 100 for a semiconductor manufacturing process is largely divided into a coolant loop and a refrigerator loop.

In the refrigerant loop portion, the refrigerant, which is cooling water, flows through the refrigerant pipe, which is a passage. The plate heat exchanger 130 cools and heats the refrigerant introduced through the refrigerant pipe, the refrigerant tank 150 for storing the refrigerant, the first and second pumps 170 and 172 for circulating the refrigerant, and the refrigerant. Dispensing valve (Vd) and the first to second solenoid valve (Vs1 to Vs2) for controlling the amount, a temperature sensor for controlling the distribution valve (Vd) by sensing the temperature of the refrigerant and a TCU (Temperature Control Unit for controlling the temperature) 160) and the mixing stirrer 140 in the tank to maintain the temperature uniformity of the refrigerant.

On the other hand, the refrigeration system loop unit cools and heats the refrigerant by heat-exchanging the refrigerant by the refrigerant gas and the hot gas when the process temperature changes, and the refrigerator 110 which cools the refrigerant by the refrigerant gas, It consists of a PCM tank 120 for storing high temperature latent heat. In the PCM tank 120, a PCM heat exchanger 122 is installed to heat exchange the refrigerant.

The temperature control system 100 for the semiconductor manufacturing process used in the semiconductor process is a third and fourth solenoid valve (Vs3, Vs4) of the refrigerator 110 in order to supply the refrigerant having an accurate and precise temperature to the semiconductor equipment 180. ), The compressor and the auxiliary equipment of the refrigerator 110 initially output the maximum energy in order to endotherm in the fully open state to achieve a desired temperature, for example, a process temperature of approximately -20 ° C. At this time, when a certain amount of time passes, the process temperature is reached, so that the compressor and the heater 152 in the refrigerant tank 150, which are the main components of the refrigerator 110 used as the heat source device, sense the temperature, As the energy output decreases, it outputs a certain amount of energy and finally reaches a stable process temperature.

However, when the semiconductor process temperature changes, the energy output of the above-described heat source device is rapidly increased as in the initial process conditions.

As shown in FIG. 2, in the case of supplying a low temperature refrigerant of about -10 ° C. to be supplied to the semiconductor equipment 180, first, the cooled refrigerant formed by the refrigerator 110 has several layers of plate heat exchanger fins. After exchanging heat in the plate heat exchanger 130 manufactured by stacking in a multi-layer, and finally the heat absorbed in the refrigerant tank 150 by using a heater 152 installed in the refrigerant tank 150 By controlling, a process temperature having a uniform temperature condition is formed, and the refrigerant having a uniform process temperature thus obtained is finally supplied to the main equipment 180 by using the pump 170.

When a uniform process temperature condition is formed, the third and fourth solenoid valves Vs3 and Vs4, which regulate the flow of the cooled refrigerant at first, are fully opened to meet the process temperature of the refrigerant, and then a certain amount of time passes. The second solenoid valve Vs4 in the direction of the plate heat exchanger 130 constituting the refrigeration system loop is closed at the same time as the process temperature is reached, and the PCM heat exchanger in the PCM tank 120 shown in FIG. Heat exchange is performed by introducing a refrigerant into the low temperature PCM tank 124 filled with the low temperature latent heat solution 124a through 122.

3 is a schematic diagram illustrating a latent heat change (PCM) tank used in a temperature control system for a semiconductor manufacturing process according to an exemplary embodiment of the present invention. As shown in FIG. 3, the PCM tank 120 used in the temperature control system for the semiconductor manufacturing process according to the embodiment of the present invention includes a PCM heat exchanger 122, a low temperature PCM tank 124, and a high temperature PCM tank. 126. The low temperature PCM tank 124 and the high temperature PCM tank 126 are each insulated between the first steel cases 124b and 126b, the second steel cases 124c and 126c, and the first and second steel cases, respectively. 124d and 126d, the low temperature latent heat solution 124a and the high temperature latent heat solution 126a respectively filled in the first steel cases 124b and 126b. According to an embodiment of the present invention, the PCM heat exchanger 122 is manufactured by stacking a plurality of plate heat exchanger fins.

When the second solenoid valve Vs2 in the direction of the plate heat exchanger 130 is closed, the mixture is uniformly mixed with the refrigerant cooled by the initial plate heat exchanger 130 to store cold energy or to replenish the cooled refrigerant. In order to use a mixing agitator (Mixing Agitator) (140).

According to one embodiment of the invention the high temperature PCM is characterized in that it is made of any one selected from the group consisting of B18, B19, B14, B13, B12, B11, B10, B8.

In addition, the low temperature PCM is characterized in that it is made of any one selected from the group consisting of NaCl-H ₂ O-based material or A7, A18, A19, A14, A13, A12, A11, X1, A10, A8.

4 is a schematic diagram illustrating a coupling relationship between a mixing stirrer and a tank used in a temperature control system for a semiconductor manufacturing process according to an exemplary embodiment of the present invention.

As shown in FIG. 4, the mixing stirrer 140 used in the temperature control system for the semiconductor manufacturing process according to the exemplary embodiment of the present invention is coupled to the inside of the stirrer tank 144. In the upper portion of the mixing stirrer 140, a power supply unit 142 for supplying power is installed at the upper portion of the stirrer tank 144. In addition, the TCU 160 is preferably formed inside the stirrer tank 144.

That is, the mixing stirrer 140 is fixedly installed at the upper portion of the stirrer tank 144, and when the power supply unit 142 applies power, the mixed stirrer rotates in a predetermined direction to mix the injected refrigerant. The mixed refrigerant is supplied to the refrigerant tank 150 of the final stage to reach a stable process temperature desired by the user. Therefore, energy of a heat source device such as a refrigerator 110, a heater 152, etc. constituting a temperature control system for a semiconductor manufacturing process may be efficiently reduced.

As such, in order to store and supply the energy of the refrigerant cooled before the temperature control system for the semiconductor manufacturing process is driven, the supply of the appropriate refrigerant flowing into the semiconductor device 180 should be considered according to the specifications of the equipment and the mixing stirrer 140 By controlling the distribution valve (Vd) in accordance with the temperature of the refrigerant in the) to control the amount of refrigerant flowing into each portion.

In addition, compared with the initial process temperature of about -10 ° C, for example, when used at a process temperature of about 30 ° C, the hot gas of the refrigerator 110 is filled with an aqueous solution filled with a high temperature latent heat material. The hot gas is introduced through the PCM heat exchanger 122 in the direction of the high temperature PCM tank 126 to exchange heat with the refrigerant. At this time, in order to store the heated energy or to replenish the heated refrigerant, the plate heat exchanger 130 of the refrigerator 110 is uniformly mixed with the cooled refrigerant and the refrigerant is uniformly mixed into the refrigerant tank at the final stage. By doing so, energy of a heat source device such as the refrigerator 110 or the heater 152 can be efficiently reduced.

As described above, the present invention has been described and illustrated with reference to the preferred embodiments, but it will be apparent to those skilled in the art that various modifications may be made without departing from the spirit and scope of the present invention.

According to a preferred embodiment of the present invention, a chiller device, which is a semiconductor manufacturing equipment used in a semiconductor manufacturing process, comprises a low temperature of about -60 ° C to 0 ° C and a liquid latent material of about 50 ° C to 150 ° C as an energy supplying heat source device. By storing and converting the regenerated energy / heat storage energy is effective to maximize the energy utilization efficiency.

In addition, in order to reach a desired process temperature, by minimizing the amount of cooler or heater that is a heat source device, the deviation time stabilized in the control is reduced, which improves the stabilization response speed of the entire system.

Claims (10)

In the temperature control system for controlling the temperature of the semiconductor equipment used in the semiconductor manufacturing process, A distribution valve connected to the semiconductor equipment for distributing refrigerant from the semiconductor equipment, a plate heat exchanger connected to the distribution valve, and a mixing stirrer for stirring and supplying the refrigerant passing through the plate heat exchanger to the semiconductor equipment A refrigerant loop portion; And A refrigeration system loop part connected to the plate heat exchanger and forming a cycle, and a refrigeration system loop part including a latent heat tank having a PCM heat exchanger connected to the freezer and forming a cycle therein; The refrigerant from the semiconductor equipment is introduced into the mixing stirrer through the PCM heat exchanger by the switching of the distribution valve temperature control system for a semiconductor manufacturing process. The method of claim 1, The refrigerant loop portion further includes a pair of first and second solenoid valves, wherein the first solenoid valve is connected between the distribution valve and the PCM heat exchanger, and the second solenoid valve is connected to the distribution valve and the plate type. Temperature control system for a semiconductor manufacturing process, characterized in that connected between the heat exchanger. The method of claim 2, The refrigeration system loop unit further comprises a refrigerant tank connected between the mixing stirrer and the semiconductor equipment and having a heater, and a pump for supplying the refrigerant in the refrigerant tank to the semiconductor equipment. Regulation system. The method of claim 3, wherein Temperature control system for the semiconductor manufacturing process, characterized in that the temperature sensor and the temperature control unit is provided inside the mixing stirrer. The method of claim 3, wherein The refrigeration system loop portion further includes a pair of third and fourth solenoid valves, wherein the third solenoid valve is connected between the freezer and the PCM heat exchanger, and the fourth solenoid valve is connected to the freezer and the plate heat exchanger. Temperature control system for a semiconductor manufacturing process, characterized in that connected between. The method of claim 5, In the initial state, the temperature control system for a semiconductor manufacturing process, characterized in that both the third and fourth solenoid valve is open. The method of claim 6, And when the semiconductor process reaches a desired process temperature, the fourth solenoid valve is adjusted so that the refrigerant is injected into a low temperature PCM heat exchanger via the PCM heat exchanger. The method of claim 5, The low temperature and the high temperature PCM tank is a temperature control system for a semiconductor manufacturing process, characterized in that it comprises a two-ply steel case and the insulation filled between the steel case. The method of claim 1, The high temperature PCM is a temperature control system for a semiconductor manufacturing process, characterized in that made of any one selected from the group consisting of B18, B19, B14, B13, B12, B11, B10, B8. The method of claim 1, The low temperature PCM is NaCl-H ₂ O-based material or A7, A18, A19, A14, A13, A12, A11, X1, A10, A8 temperature control for the semiconductor manufacturing process, characterized in that made of any one selected from the group consisting of system.

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