KR100708009B1 - 통계적 공정 제어를 이용하여 제어기의 성능을 모니터하는 방법 및 장치 - Google Patents

통계적 공정 제어를 이용하여 제어기의 성능을 모니터하는 방법 및 장치 Download PDF

Info

Publication number
KR100708009B1
KR100708009B1 KR1020027004424A KR20027004424A KR100708009B1 KR 100708009 B1 KR100708009 B1 KR 100708009B1 KR 1020027004424 A KR1020027004424 A KR 1020027004424A KR 20027004424 A KR20027004424 A KR 20027004424A KR 100708009 B1 KR100708009 B1 KR 100708009B1
Authority
KR
South Korea
Prior art keywords
manufacturing
analysis
manufacturing model
controller
process controller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1020027004424A
Other languages
English (en)
Korean (ko)
Other versions
KR20020047215A (ko
Inventor
톱랙앤소니제이.
캠벨윌리엄제이.
Original Assignee
어드밴스드 마이크로 디바이시즈, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 어드밴스드 마이크로 디바이시즈, 인코포레이티드 filed Critical 어드밴스드 마이크로 디바이시즈, 인코포레이티드
Publication of KR20020047215A publication Critical patent/KR20020047215A/ko
Application granted granted Critical
Publication of KR100708009B1 publication Critical patent/KR100708009B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41885Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by modeling, simulation of the manufacturing system
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/32Operator till task planning
    • G05B2219/32017Adapt real process as function of changing simulation model, changing for better results
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/32Operator till task planning
    • G05B2219/32191Real time statistical process monitoring
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/32Operator till task planning
    • G05B2219/32201Build statistical model of past normal proces, compare with actual process
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/42Servomotor, servo controller kind till VSS
    • G05B2219/42001Statistical process control spc
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Factory Administration (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Feedback Control In General (AREA)
KR1020027004424A 1999-10-05 2000-04-28 통계적 공정 제어를 이용하여 제어기의 성능을 모니터하는 방법 및 장치 Expired - Fee Related KR100708009B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/412,679 1999-10-05
US09/412,679 US6560503B1 (en) 1999-10-05 1999-10-05 Method and apparatus for monitoring controller performance using statistical process control

Publications (2)

Publication Number Publication Date
KR20020047215A KR20020047215A (ko) 2002-06-21
KR100708009B1 true KR100708009B1 (ko) 2007-04-16

Family

ID=23633988

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020027004424A Expired - Fee Related KR100708009B1 (ko) 1999-10-05 2000-04-28 통계적 공정 제어를 이용하여 제어기의 성능을 모니터하는 방법 및 장치

Country Status (6)

Country Link
US (1) US6560503B1 (enExample)
EP (1) EP1218806B1 (enExample)
JP (1) JP2003511750A (enExample)
KR (1) KR100708009B1 (enExample)
DE (1) DE60012762T2 (enExample)
WO (1) WO2001025865A1 (enExample)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020049565A1 (en) * 1998-03-19 2002-04-25 Kirila Gene E. Process and device to continuously monitor and control a manufacturing process
US7069101B1 (en) 1999-07-29 2006-06-27 Applied Materials, Inc. Computer integrated manufacturing techniques
US6556884B1 (en) 2000-06-16 2003-04-29 Advanced Micro Devices, Inc. Method and apparatus for interfacing a statistical process control system with a manufacturing process control framework
US6725402B1 (en) 2000-07-31 2004-04-20 Advanced Micro Devices, Inc. Method and apparatus for fault detection of a processing tool and control thereof using an advanced process control (APC) framework
US7188142B2 (en) 2000-11-30 2007-03-06 Applied Materials, Inc. Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility
US7123978B2 (en) * 2000-12-27 2006-10-17 Insyst Ltd. Method for dynamically targeting a batch process
US6913938B2 (en) 2001-06-19 2005-07-05 Applied Materials, Inc. Feedback control of plasma-enhanced chemical vapor deposition processes
US7047099B2 (en) 2001-06-19 2006-05-16 Applied Materials Inc. Integrating tool, module, and fab level control
US7201936B2 (en) 2001-06-19 2007-04-10 Applied Materials, Inc. Method of feedback control of sub-atmospheric chemical vapor deposition processes
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US7101799B2 (en) 2001-06-19 2006-09-05 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
US7082345B2 (en) 2001-06-19 2006-07-25 Applied Materials, Inc. Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities
US6910947B2 (en) 2001-06-19 2005-06-28 Applied Materials, Inc. Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
US7337019B2 (en) 2001-07-16 2008-02-26 Applied Materials, Inc. Integration of fault detection with run-to-run control
US6984198B2 (en) 2001-08-14 2006-01-10 Applied Materials, Inc. Experiment management system, method and medium
TW518645B (en) * 2001-09-24 2003-01-21 Powerchip Semiconductor Corp Method and system of automatic wafer manufacture quality control
US8180587B2 (en) * 2002-03-08 2012-05-15 Globalfoundries Inc. System for brokering fault detection data
US7225047B2 (en) 2002-03-19 2007-05-29 Applied Materials, Inc. Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements
US6772035B2 (en) * 2002-05-17 2004-08-03 Micron Technology, Inc. Synthesizing semiconductor process flow models
JP2005535130A (ja) 2002-08-01 2005-11-17 アプライド マテリアルズ インコーポレイテッド 最新のプロセス制御システム内で誤って表された計測データを取り扱う方法、システム、および媒体
US6925347B1 (en) * 2002-08-19 2005-08-02 Advanced Micro Devices, Inc. Process control based on an estimated process result
DE10252605A1 (de) * 2002-11-12 2004-06-24 Infineon Technologies Ag Verfahren, Vorrichtung, computerlesbarer Speicher und Computerprogramm-Element zum rechnergestützten Überwachen und Regeln eines Herstellungsprozesses
CN1720490B (zh) 2002-11-15 2010-12-08 应用材料有限公司 用于控制具有多变量输入参数的制造工艺的方法和系统
US6941177B2 (en) * 2002-12-17 2005-09-06 Xerox Corporation System and method for implementing real-time applications based on stochastic compute time algorithms
US7581140B1 (en) * 2002-12-18 2009-08-25 Advanced Micro Devices, Inc. Initiating test runs based on fault detection results
US6912433B1 (en) * 2002-12-18 2005-06-28 Advanced Mirco Devices, Inc. Determining a next tool state based on fault detection information
US7333871B2 (en) 2003-01-21 2008-02-19 Applied Materials, Inc. Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools
US7213478B2 (en) * 2003-02-18 2007-05-08 Tokyo Electron Limited Method for automatic configuration of processing system
US7205228B2 (en) 2003-06-03 2007-04-17 Applied Materials, Inc. Selective metal encapsulation schemes
US7354332B2 (en) 2003-08-04 2008-04-08 Applied Materials, Inc. Technique for process-qualifying a semiconductor manufacturing tool using metrology data
US8036869B2 (en) * 2003-09-30 2011-10-11 Tokyo Electron Limited System and method for using first-principles simulation to control a semiconductor manufacturing process via a simulation result or a derived empirical model
US8073667B2 (en) * 2003-09-30 2011-12-06 Tokyo Electron Limited System and method for using first-principles simulation to control a semiconductor manufacturing process
US8032348B2 (en) * 2003-09-30 2011-10-04 Tokyo Electron Limited System and method for using first-principles simulation to facilitate a semiconductor manufacturing process
US8050900B2 (en) * 2003-09-30 2011-11-01 Tokyo Electron Limited System and method for using first-principles simulation to provide virtual sensors that facilitate a semiconductor manufacturing process
US7356377B2 (en) 2004-01-29 2008-04-08 Applied Materials, Inc. System, method, and medium for monitoring performance of an advanced process control system
US7010382B2 (en) * 2004-02-26 2006-03-07 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for improving process control for semiconductor manufacturing operations
US6980873B2 (en) 2004-04-23 2005-12-27 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for real-time fault detection, classification, and correction in a semiconductor manufacturing environment
US7437404B2 (en) * 2004-05-20 2008-10-14 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for improving equipment communication in semiconductor manufacturing equipment
US6961626B1 (en) 2004-05-28 2005-11-01 Applied Materials, Inc Dynamic offset and feedback threshold
US7096085B2 (en) 2004-05-28 2006-08-22 Applied Materials Process control by distinguishing a white noise component of a process variance
US8615314B1 (en) * 2004-09-02 2013-12-24 Advanced Micro Devices, Inc. Process control using analysis of an upstream process
US7457729B2 (en) * 2005-01-11 2008-11-25 Verigy (Singapore) Pte. Ltd. Model based testing for electronic devices
US8675176B2 (en) * 2005-02-25 2014-03-18 Asml Netherlands B.V. Parameter control in a lithographic apparatus using polarization
US7117059B1 (en) * 2005-04-18 2006-10-03 Promos Technologies Inc. Run-to-run control system and operating method of the same
KR100699856B1 (ko) * 2005-07-29 2007-03-27 삼성전자주식회사 반도체소자를 제조하는 공정의 제어시스템 및 이를 이용한제어방법
US7720553B2 (en) * 2006-08-31 2010-05-18 Dell Products L.P. Service metric portfolio management
US8682466B2 (en) * 2007-05-04 2014-03-25 Taiwan Semiconductor Manufacturing Company, Ltd. Automatic virtual metrology for semiconductor wafer result prediction
US7873585B2 (en) * 2007-08-31 2011-01-18 Kla-Tencor Technologies Corporation Apparatus and methods for predicting a semiconductor parameter across an area of a wafer
US9760073B2 (en) * 2010-05-21 2017-09-12 Honeywell International Inc. Technique and tool for efficient testing of controllers in development
TWI647630B (zh) * 2017-05-08 2019-01-11 萬泰科技股份有限公司 生產效率監控系統
JP7326344B2 (ja) 2018-05-24 2023-08-15 アプライド マテリアルズ インコーポレイテッド 空間分解ウエハ温度制御のための仮想センサ
KR102589004B1 (ko) * 2018-06-18 2023-10-16 삼성전자주식회사 반도체 불량 분석 장치 및 그것의 불량 분석 방법
EP4012421B1 (en) 2020-12-11 2024-08-21 Nxp B.V. System and method for monitoring feedback circuits
US20230081446A1 (en) * 2021-09-10 2023-03-16 Applied Materials, Inc. Using elemental maps information from x-ray energy-dispersive spectroscopy line scan analysis to create process models
CN117490809B (zh) * 2023-12-19 2024-03-26 成都秦川物联网科技股份有限公司 用于智慧生产的超声波燃气表测试方法及工业物联网系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5546312A (en) * 1993-09-20 1996-08-13 Texas Instruments Incorporated Use of spatial models for simultaneous control of various non-uniformity metrics
KR19980026111A (ko) * 1996-10-07 1998-07-15 김광호 반도체 제조를 위한 통계적 공정관리 방법
KR19980702034A (ko) * 1995-02-09 1998-07-15 마이클 엘. 린치 폴리우레탄 패드의 처리 특성을 예측하는 방법 및 장치

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2655904B2 (ja) * 1989-02-06 1997-09-24 三菱重工業株式会社 適応制御装置
JPH06244261A (ja) * 1990-12-31 1994-09-02 Texas Instr Inc <Ti> 半導体装置製造プロセス制御用センサ
US5257206A (en) * 1991-04-08 1993-10-26 Praxair Technology, Inc. Statistical process control for air separation process
US5408405A (en) 1993-09-20 1995-04-18 Texas Instruments Incorporated Multi-variable statistical process controller for discrete manufacturing
US5526293A (en) 1993-12-17 1996-06-11 Texas Instruments Inc. System and method for controlling semiconductor wafer processing
US5452218A (en) 1994-02-03 1995-09-19 Texas Instruments System and method for determining quality analysis on fabrication and/or assembly design using shop capability data
US5659467A (en) * 1996-06-26 1997-08-19 Texas Instruments Incorporated Multiple model supervisor control system and method of operation
US5987398A (en) 1998-04-30 1999-11-16 Sony Corporation Method and apparatus for statistical process control of machines and processes having non-constant mean of a response variable
US6230069B1 (en) 1998-06-26 2001-05-08 Advanced Micro Devices, Inc. System and method for controlling the manufacture of discrete parts in semiconductor fabrication using model predictive control
US6298470B1 (en) * 1999-04-15 2001-10-02 Micron Technology, Inc. Method for efficient manufacturing of integrated circuits

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5546312A (en) * 1993-09-20 1996-08-13 Texas Instruments Incorporated Use of spatial models for simultaneous control of various non-uniformity metrics
KR19980702034A (ko) * 1995-02-09 1998-07-15 마이클 엘. 린치 폴리우레탄 패드의 처리 특성을 예측하는 방법 및 장치
KR19980026111A (ko) * 1996-10-07 1998-07-15 김광호 반도체 제조를 위한 통계적 공정관리 방법

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
1019980026111 *
1019980702034 *

Also Published As

Publication number Publication date
US6560503B1 (en) 2003-05-06
DE60012762T2 (de) 2005-08-11
JP2003511750A (ja) 2003-03-25
KR20020047215A (ko) 2002-06-21
DE60012762D1 (de) 2004-09-09
EP1218806B1 (en) 2004-08-04
WO2001025865A1 (en) 2001-04-12
EP1218806A1 (en) 2002-07-03

Similar Documents

Publication Publication Date Title
KR100708009B1 (ko) 통계적 공정 제어를 이용하여 제어기의 성능을 모니터하는 방법 및 장치
US6442496B1 (en) Method and apparatus for dynamic sampling of a production line
US6556884B1 (en) Method and apparatus for interfacing a statistical process control system with a manufacturing process control framework
US6708075B2 (en) Method and apparatus for utilizing integrated metrology data as feed-forward data
US6484064B1 (en) Method and apparatus for running metrology standard wafer routes for cross-fab metrology calibration
CN100578747C (zh) 用于模型预测的动态适应性取样率
US6304999B1 (en) Method and apparatus for embedded process control framework in tool systems
US6610550B1 (en) Method and apparatus for correlating error model with defect data
KR20020063295A (ko) 공정 제어 시스템
US6756243B2 (en) Method and apparatus for cascade control using integrated metrology
US6560506B2 (en) Method and apparatus for control for semiconductor processing for reducing effects of environmental effects
US6645780B1 (en) Method and apparatus for combining integrated and offline metrology for process control
KR20060034690A (ko) 결함 검출에 기초하여 계측 디스패칭을 수행하는 방법 및장치
US6947803B1 (en) Dispatch and/or disposition of material based upon an expected parameter result
KR101000545B1 (ko) 1차 공정 제어기를 보완하기 위한 2차 공정 제어기
US6698009B1 (en) Method and apparatus for modeling of batch dynamics based upon integrated metrology
US6834213B1 (en) Process control based upon a metrology delay
US6571371B1 (en) Method and apparatus for using latency time as a run-to-run control parameter
US6788988B1 (en) Method and apparatus using integrated metrology data for pre-process and post-process control
US6871114B1 (en) Updating process controller based upon fault detection analysis
US7236848B2 (en) Data representation relating to a non-sampled workpiece
US6912436B1 (en) Prioritizing an application of correction in a multi-input control system
US7899634B1 (en) Method and apparatus for analysis of continuous data using binary parsing

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U12-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 4

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 5

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R11-asn-PN2301

PN2301 Change of applicant

St.27 status event code: A-5-5-R10-R14-asn-PN2301

FPAY Annual fee payment

Payment date: 20120322

Year of fee payment: 6

PR1001 Payment of annual fee

St.27 status event code: A-4-4-U10-U11-oth-PR1001

Fee payment year number: 6

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20130410

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

R18-X000 Changes to party contact information recorded

St.27 status event code: A-5-5-R10-R18-oth-X000

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20130410