DE60012762T2 - Einrichtung und verfahren zur qualitätsüberwachung mit hilfe statistischer prozessteuerung - Google Patents
Einrichtung und verfahren zur qualitätsüberwachung mit hilfe statistischer prozessteuerung Download PDFInfo
- Publication number
- DE60012762T2 DE60012762T2 DE60012762T DE60012762T DE60012762T2 DE 60012762 T2 DE60012762 T2 DE 60012762T2 DE 60012762 T DE60012762 T DE 60012762T DE 60012762 T DE60012762 T DE 60012762T DE 60012762 T2 DE60012762 T2 DE 60012762T2
- Authority
- DE
- Germany
- Prior art keywords
- process control
- control
- analysis
- manufacturing
- statistical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000000034 method Methods 0.000 title claims description 117
- 238000003070 Statistical process control Methods 0.000 title claims description 33
- 238000012544 monitoring process Methods 0.000 title claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 142
- 230000008569 process Effects 0.000 claims description 78
- 239000004065 semiconductor Substances 0.000 claims description 66
- 238000004886 process control Methods 0.000 claims description 49
- 238000004458 analytical method Methods 0.000 claims description 48
- 238000012986 modification Methods 0.000 claims description 17
- 230000004048 modification Effects 0.000 claims description 17
- 238000004364 calculation method Methods 0.000 claims description 11
- 238000001514 detection method Methods 0.000 claims description 11
- 238000005259 measurement Methods 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 2
- 230000004044 response Effects 0.000 claims description 2
- 238000012369 In process control Methods 0.000 claims 2
- 238000010965 in-process control Methods 0.000 claims 2
- 235000012431 wafers Nutrition 0.000 description 36
- 238000012545 processing Methods 0.000 description 7
- 238000013515 script Methods 0.000 description 6
- 238000004590 computer program Methods 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- 230000018109 developmental process Effects 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000011217 control strategy Methods 0.000 description 3
- 230000000875 corresponding effect Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000000206 photolithography Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000275 quality assurance Methods 0.000 description 2
- 230000009897 systematic effect Effects 0.000 description 2
- 238000010998 test method Methods 0.000 description 2
- 238000013519 translation Methods 0.000 description 2
- 238000002872 Statistical quality control Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 238000013100 final test Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 238000005389 semiconductor device fabrication Methods 0.000 description 1
- 238000007619 statistical method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000029305 taxis Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000001960 triggered effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41885—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by modeling, simulation of the manufacturing system
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41875—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32017—Adapt real process as function of changing simulation model, changing for better results
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32191—Real time statistical process monitoring
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32201—Build statistical model of past normal proces, compare with actual process
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/42—Servomotor, servo controller kind till VSS
- G05B2219/42001—Statistical process control spc
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Automation & Control Theory (AREA)
- Quality & Reliability (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Factory Administration (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Feedback Control In General (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US412679 | 1999-10-05 | ||
| US09/412,679 US6560503B1 (en) | 1999-10-05 | 1999-10-05 | Method and apparatus for monitoring controller performance using statistical process control |
| PCT/US2000/011522 WO2001025865A1 (en) | 1999-10-05 | 2000-04-28 | Method and apparatus for monitoring controller performance using statistical process control |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE60012762D1 DE60012762D1 (de) | 2004-09-09 |
| DE60012762T2 true DE60012762T2 (de) | 2005-08-11 |
Family
ID=23633988
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60012762T Expired - Lifetime DE60012762T2 (de) | 1999-10-05 | 2000-04-28 | Einrichtung und verfahren zur qualitätsüberwachung mit hilfe statistischer prozessteuerung |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6560503B1 (enExample) |
| EP (1) | EP1218806B1 (enExample) |
| JP (1) | JP2003511750A (enExample) |
| KR (1) | KR100708009B1 (enExample) |
| DE (1) | DE60012762T2 (enExample) |
| WO (1) | WO2001025865A1 (enExample) |
Families Citing this family (55)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020049565A1 (en) * | 1998-03-19 | 2002-04-25 | Kirila Gene E. | Process and device to continuously monitor and control a manufacturing process |
| US7069101B1 (en) | 1999-07-29 | 2006-06-27 | Applied Materials, Inc. | Computer integrated manufacturing techniques |
| US6556884B1 (en) * | 2000-06-16 | 2003-04-29 | Advanced Micro Devices, Inc. | Method and apparatus for interfacing a statistical process control system with a manufacturing process control framework |
| US6725402B1 (en) * | 2000-07-31 | 2004-04-20 | Advanced Micro Devices, Inc. | Method and apparatus for fault detection of a processing tool and control thereof using an advanced process control (APC) framework |
| US7188142B2 (en) | 2000-11-30 | 2007-03-06 | Applied Materials, Inc. | Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility |
| US7123978B2 (en) * | 2000-12-27 | 2006-10-17 | Insyst Ltd. | Method for dynamically targeting a batch process |
| US6910947B2 (en) | 2001-06-19 | 2005-06-28 | Applied Materials, Inc. | Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life |
| US7047099B2 (en) | 2001-06-19 | 2006-05-16 | Applied Materials Inc. | Integrating tool, module, and fab level control |
| US7160739B2 (en) | 2001-06-19 | 2007-01-09 | Applied Materials, Inc. | Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles |
| US6913938B2 (en) | 2001-06-19 | 2005-07-05 | Applied Materials, Inc. | Feedback control of plasma-enhanced chemical vapor deposition processes |
| US7201936B2 (en) | 2001-06-19 | 2007-04-10 | Applied Materials, Inc. | Method of feedback control of sub-atmospheric chemical vapor deposition processes |
| US7082345B2 (en) | 2001-06-19 | 2006-07-25 | Applied Materials, Inc. | Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities |
| US7101799B2 (en) | 2001-06-19 | 2006-09-05 | Applied Materials, Inc. | Feedforward and feedback control for conditioning of chemical mechanical polishing pad |
| US7337019B2 (en) | 2001-07-16 | 2008-02-26 | Applied Materials, Inc. | Integration of fault detection with run-to-run control |
| US6984198B2 (en) | 2001-08-14 | 2006-01-10 | Applied Materials, Inc. | Experiment management system, method and medium |
| TW518645B (en) * | 2001-09-24 | 2003-01-21 | Powerchip Semiconductor Corp | Method and system of automatic wafer manufacture quality control |
| US8180587B2 (en) * | 2002-03-08 | 2012-05-15 | Globalfoundries Inc. | System for brokering fault detection data |
| US7225047B2 (en) | 2002-03-19 | 2007-05-29 | Applied Materials, Inc. | Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements |
| US6772035B2 (en) * | 2002-05-17 | 2004-08-03 | Micron Technology, Inc. | Synthesizing semiconductor process flow models |
| CN100351725C (zh) | 2002-08-01 | 2007-11-28 | 应用材料有限公司 | 用于在先进工艺控制系统中处理歪曲的度量数据的方法、系统和介质 |
| US6925347B1 (en) * | 2002-08-19 | 2005-08-02 | Advanced Micro Devices, Inc. | Process control based on an estimated process result |
| DE10252605A1 (de) * | 2002-11-12 | 2004-06-24 | Infineon Technologies Ag | Verfahren, Vorrichtung, computerlesbarer Speicher und Computerprogramm-Element zum rechnergestützten Überwachen und Regeln eines Herstellungsprozesses |
| US7272459B2 (en) | 2002-11-15 | 2007-09-18 | Applied Materials, Inc. | Method, system and medium for controlling manufacture process having multivariate input parameters |
| US6941177B2 (en) * | 2002-12-17 | 2005-09-06 | Xerox Corporation | System and method for implementing real-time applications based on stochastic compute time algorithms |
| US7581140B1 (en) * | 2002-12-18 | 2009-08-25 | Advanced Micro Devices, Inc. | Initiating test runs based on fault detection results |
| US6912433B1 (en) * | 2002-12-18 | 2005-06-28 | Advanced Mirco Devices, Inc. | Determining a next tool state based on fault detection information |
| US7333871B2 (en) | 2003-01-21 | 2008-02-19 | Applied Materials, Inc. | Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools |
| KR101009384B1 (ko) * | 2003-02-18 | 2011-01-19 | 도쿄엘렉트론가부시키가이샤 | 처리시스템의 자동 구성 방법 |
| US7205228B2 (en) | 2003-06-03 | 2007-04-17 | Applied Materials, Inc. | Selective metal encapsulation schemes |
| US7354332B2 (en) | 2003-08-04 | 2008-04-08 | Applied Materials, Inc. | Technique for process-qualifying a semiconductor manufacturing tool using metrology data |
| US8036869B2 (en) * | 2003-09-30 | 2011-10-11 | Tokyo Electron Limited | System and method for using first-principles simulation to control a semiconductor manufacturing process via a simulation result or a derived empirical model |
| US8032348B2 (en) * | 2003-09-30 | 2011-10-04 | Tokyo Electron Limited | System and method for using first-principles simulation to facilitate a semiconductor manufacturing process |
| US8073667B2 (en) * | 2003-09-30 | 2011-12-06 | Tokyo Electron Limited | System and method for using first-principles simulation to control a semiconductor manufacturing process |
| US8014991B2 (en) * | 2003-09-30 | 2011-09-06 | Tokyo Electron Limited | System and method for using first-principles simulation to characterize a semiconductor manufacturing process |
| US7356377B2 (en) | 2004-01-29 | 2008-04-08 | Applied Materials, Inc. | System, method, and medium for monitoring performance of an advanced process control system |
| US7010382B2 (en) * | 2004-02-26 | 2006-03-07 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and system for improving process control for semiconductor manufacturing operations |
| US6980873B2 (en) | 2004-04-23 | 2005-12-27 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and method for real-time fault detection, classification, and correction in a semiconductor manufacturing environment |
| US7437404B2 (en) * | 2004-05-20 | 2008-10-14 | Taiwan Semiconductor Manufacturing Company, Ltd. | System and method for improving equipment communication in semiconductor manufacturing equipment |
| US7096085B2 (en) | 2004-05-28 | 2006-08-22 | Applied Materials | Process control by distinguishing a white noise component of a process variance |
| US6961626B1 (en) | 2004-05-28 | 2005-11-01 | Applied Materials, Inc | Dynamic offset and feedback threshold |
| US8615314B1 (en) * | 2004-09-02 | 2013-12-24 | Advanced Micro Devices, Inc. | Process control using analysis of an upstream process |
| US7457729B2 (en) * | 2005-01-11 | 2008-11-25 | Verigy (Singapore) Pte. Ltd. | Model based testing for electronic devices |
| US8675176B2 (en) * | 2005-02-25 | 2014-03-18 | Asml Netherlands B.V. | Parameter control in a lithographic apparatus using polarization |
| US7117059B1 (en) * | 2005-04-18 | 2006-10-03 | Promos Technologies Inc. | Run-to-run control system and operating method of the same |
| KR100699856B1 (ko) * | 2005-07-29 | 2007-03-27 | 삼성전자주식회사 | 반도체소자를 제조하는 공정의 제어시스템 및 이를 이용한제어방법 |
| US7720553B2 (en) * | 2006-08-31 | 2010-05-18 | Dell Products L.P. | Service metric portfolio management |
| US8682466B2 (en) * | 2007-05-04 | 2014-03-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Automatic virtual metrology for semiconductor wafer result prediction |
| US7873585B2 (en) * | 2007-08-31 | 2011-01-18 | Kla-Tencor Technologies Corporation | Apparatus and methods for predicting a semiconductor parameter across an area of a wafer |
| US9760073B2 (en) * | 2010-05-21 | 2017-09-12 | Honeywell International Inc. | Technique and tool for efficient testing of controllers in development |
| TWI647630B (zh) * | 2017-05-08 | 2019-01-11 | 萬泰科技股份有限公司 | 生產效率監控系統 |
| WO2019226252A1 (en) | 2018-05-24 | 2019-11-28 | Applied Materials, Inc. | Virtual sensor for spatially resolved wafer temperature control |
| KR102589004B1 (ko) * | 2018-06-18 | 2023-10-16 | 삼성전자주식회사 | 반도체 불량 분석 장치 및 그것의 불량 분석 방법 |
| EP4012421B1 (en) | 2020-12-11 | 2024-08-21 | Nxp B.V. | System and method for monitoring feedback circuits |
| US20230081446A1 (en) * | 2021-09-10 | 2023-03-16 | Applied Materials, Inc. | Using elemental maps information from x-ray energy-dispersive spectroscopy line scan analysis to create process models |
| CN117490809B (zh) * | 2023-12-19 | 2024-03-26 | 成都秦川物联网科技股份有限公司 | 用于智慧生产的超声波燃气表测试方法及工业物联网系统 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2655904B2 (ja) * | 1989-02-06 | 1997-09-24 | 三菱重工業株式会社 | 適応制御装置 |
| JPH06244261A (ja) * | 1990-12-31 | 1994-09-02 | Texas Instr Inc <Ti> | 半導体装置製造プロセス制御用センサ |
| US5257206A (en) * | 1991-04-08 | 1993-10-26 | Praxair Technology, Inc. | Statistical process control for air separation process |
| US5546312A (en) | 1993-09-20 | 1996-08-13 | Texas Instruments Incorporated | Use of spatial models for simultaneous control of various non-uniformity metrics |
| US5408405A (en) | 1993-09-20 | 1995-04-18 | Texas Instruments Incorporated | Multi-variable statistical process controller for discrete manufacturing |
| US5526293A (en) | 1993-12-17 | 1996-06-11 | Texas Instruments Inc. | System and method for controlling semiconductor wafer processing |
| US5452218A (en) | 1994-02-03 | 1995-09-19 | Texas Instruments | System and method for determining quality analysis on fabrication and/or assembly design using shop capability data |
| US5698455A (en) * | 1995-02-09 | 1997-12-16 | Micron Technologies, Inc. | Method for predicting process characteristics of polyurethane pads |
| US5659467A (en) * | 1996-06-26 | 1997-08-19 | Texas Instruments Incorporated | Multiple model supervisor control system and method of operation |
| KR19980026111A (ko) * | 1996-10-07 | 1998-07-15 | 김광호 | 반도체 제조를 위한 통계적 공정관리 방법 |
| US5987398A (en) | 1998-04-30 | 1999-11-16 | Sony Corporation | Method and apparatus for statistical process control of machines and processes having non-constant mean of a response variable |
| US6230069B1 (en) | 1998-06-26 | 2001-05-08 | Advanced Micro Devices, Inc. | System and method for controlling the manufacture of discrete parts in semiconductor fabrication using model predictive control |
| US6298470B1 (en) * | 1999-04-15 | 2001-10-02 | Micron Technology, Inc. | Method for efficient manufacturing of integrated circuits |
-
1999
- 1999-10-05 US US09/412,679 patent/US6560503B1/en not_active Expired - Fee Related
-
2000
- 2000-04-28 DE DE60012762T patent/DE60012762T2/de not_active Expired - Lifetime
- 2000-04-28 KR KR1020027004424A patent/KR100708009B1/ko not_active Expired - Fee Related
- 2000-04-28 JP JP2001528761A patent/JP2003511750A/ja active Pending
- 2000-04-28 EP EP00928556A patent/EP1218806B1/en not_active Expired - Lifetime
- 2000-04-28 WO PCT/US2000/011522 patent/WO2001025865A1/en not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| DE60012762D1 (de) | 2004-09-09 |
| WO2001025865A1 (en) | 2001-04-12 |
| KR100708009B1 (ko) | 2007-04-16 |
| KR20020047215A (ko) | 2002-06-21 |
| US6560503B1 (en) | 2003-05-06 |
| EP1218806B1 (en) | 2004-08-04 |
| JP2003511750A (ja) | 2003-03-25 |
| EP1218806A1 (en) | 2002-07-03 |
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| Date | Code | Title | Description |
|---|---|---|---|
| 8364 | No opposition during term of opposition | ||
| 8327 | Change in the person/name/address of the patent owner |
Owner name: GLOBALFOUNDRIES INC., GRAND CAYMAN, KY |
|
| 8328 | Change in the person/name/address of the agent |
Representative=s name: GRUENECKER, KINKELDEY, STOCKMAIR & SCHWANHAEUSSER, |