JP2003511750A - 統計的プロセス制御を使用してコントローラの性能を監視するための方法および装置 - Google Patents

統計的プロセス制御を使用してコントローラの性能を監視するための方法および装置

Info

Publication number
JP2003511750A
JP2003511750A JP2001528761A JP2001528761A JP2003511750A JP 2003511750 A JP2003511750 A JP 2003511750A JP 2001528761 A JP2001528761 A JP 2001528761A JP 2001528761 A JP2001528761 A JP 2001528761A JP 2003511750 A JP2003511750 A JP 2003511750A
Authority
JP
Japan
Prior art keywords
controller
manufacturing
processing
analysis
control
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001528761A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003511750A5 (enExample
Inventor
トプラック,アンソニー・ジェイ
キャンベル,ウィリアム・ジェイ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of JP2003511750A publication Critical patent/JP2003511750A/ja
Publication of JP2003511750A5 publication Critical patent/JP2003511750A5/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41885Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by modeling, simulation of the manufacturing system
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B19/00Programme-control systems
    • G05B19/02Programme-control systems electric
    • G05B19/418Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
    • G05B19/41875Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by quality surveillance of production
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/32Operator till task planning
    • G05B2219/32017Adapt real process as function of changing simulation model, changing for better results
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/32Operator till task planning
    • G05B2219/32191Real time statistical process monitoring
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/32Operator till task planning
    • G05B2219/32201Build statistical model of past normal proces, compare with actual process
    • GPHYSICS
    • G05CONTROLLING; REGULATING
    • G05BCONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
    • G05B2219/00Program-control systems
    • G05B2219/30Nc systems
    • G05B2219/42Servomotor, servo controller kind till VSS
    • G05B2219/42001Statistical process control spc
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Automation & Control Theory (AREA)
  • Quality & Reliability (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Factory Administration (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Feedback Control In General (AREA)
JP2001528761A 1999-10-05 2000-04-28 統計的プロセス制御を使用してコントローラの性能を監視するための方法および装置 Pending JP2003511750A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/412,679 1999-10-05
US09/412,679 US6560503B1 (en) 1999-10-05 1999-10-05 Method and apparatus for monitoring controller performance using statistical process control
PCT/US2000/011522 WO2001025865A1 (en) 1999-10-05 2000-04-28 Method and apparatus for monitoring controller performance using statistical process control

Publications (2)

Publication Number Publication Date
JP2003511750A true JP2003511750A (ja) 2003-03-25
JP2003511750A5 JP2003511750A5 (enExample) 2007-05-24

Family

ID=23633988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001528761A Pending JP2003511750A (ja) 1999-10-05 2000-04-28 統計的プロセス制御を使用してコントローラの性能を監視するための方法および装置

Country Status (6)

Country Link
US (1) US6560503B1 (enExample)
EP (1) EP1218806B1 (enExample)
JP (1) JP2003511750A (enExample)
KR (1) KR100708009B1 (enExample)
DE (1) DE60012762T2 (enExample)
WO (1) WO2001025865A1 (enExample)

Families Citing this family (55)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020049565A1 (en) * 1998-03-19 2002-04-25 Kirila Gene E. Process and device to continuously monitor and control a manufacturing process
US7069101B1 (en) 1999-07-29 2006-06-27 Applied Materials, Inc. Computer integrated manufacturing techniques
US6556884B1 (en) 2000-06-16 2003-04-29 Advanced Micro Devices, Inc. Method and apparatus for interfacing a statistical process control system with a manufacturing process control framework
US6725402B1 (en) 2000-07-31 2004-04-20 Advanced Micro Devices, Inc. Method and apparatus for fault detection of a processing tool and control thereof using an advanced process control (APC) framework
US7188142B2 (en) 2000-11-30 2007-03-06 Applied Materials, Inc. Dynamic subject information generation in message services of distributed object systems in a semiconductor assembly line facility
US7123978B2 (en) * 2000-12-27 2006-10-17 Insyst Ltd. Method for dynamically targeting a batch process
US6913938B2 (en) 2001-06-19 2005-07-05 Applied Materials, Inc. Feedback control of plasma-enhanced chemical vapor deposition processes
US7047099B2 (en) 2001-06-19 2006-05-16 Applied Materials Inc. Integrating tool, module, and fab level control
US7201936B2 (en) 2001-06-19 2007-04-10 Applied Materials, Inc. Method of feedback control of sub-atmospheric chemical vapor deposition processes
US7160739B2 (en) 2001-06-19 2007-01-09 Applied Materials, Inc. Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
US7101799B2 (en) 2001-06-19 2006-09-05 Applied Materials, Inc. Feedforward and feedback control for conditioning of chemical mechanical polishing pad
US7082345B2 (en) 2001-06-19 2006-07-25 Applied Materials, Inc. Method, system and medium for process control for the matching of tools, chambers and/or other semiconductor-related entities
US6910947B2 (en) 2001-06-19 2005-06-28 Applied Materials, Inc. Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life
US7337019B2 (en) 2001-07-16 2008-02-26 Applied Materials, Inc. Integration of fault detection with run-to-run control
US6984198B2 (en) 2001-08-14 2006-01-10 Applied Materials, Inc. Experiment management system, method and medium
TW518645B (en) * 2001-09-24 2003-01-21 Powerchip Semiconductor Corp Method and system of automatic wafer manufacture quality control
US8180587B2 (en) * 2002-03-08 2012-05-15 Globalfoundries Inc. System for brokering fault detection data
US7225047B2 (en) 2002-03-19 2007-05-29 Applied Materials, Inc. Method, system and medium for controlling semiconductor wafer processes using critical dimension measurements
US6772035B2 (en) * 2002-05-17 2004-08-03 Micron Technology, Inc. Synthesizing semiconductor process flow models
JP2005535130A (ja) 2002-08-01 2005-11-17 アプライド マテリアルズ インコーポレイテッド 最新のプロセス制御システム内で誤って表された計測データを取り扱う方法、システム、および媒体
US6925347B1 (en) * 2002-08-19 2005-08-02 Advanced Micro Devices, Inc. Process control based on an estimated process result
DE10252605A1 (de) * 2002-11-12 2004-06-24 Infineon Technologies Ag Verfahren, Vorrichtung, computerlesbarer Speicher und Computerprogramm-Element zum rechnergestützten Überwachen und Regeln eines Herstellungsprozesses
CN1720490B (zh) 2002-11-15 2010-12-08 应用材料有限公司 用于控制具有多变量输入参数的制造工艺的方法和系统
US6941177B2 (en) * 2002-12-17 2005-09-06 Xerox Corporation System and method for implementing real-time applications based on stochastic compute time algorithms
US7581140B1 (en) * 2002-12-18 2009-08-25 Advanced Micro Devices, Inc. Initiating test runs based on fault detection results
US6912433B1 (en) * 2002-12-18 2005-06-28 Advanced Mirco Devices, Inc. Determining a next tool state based on fault detection information
US7333871B2 (en) 2003-01-21 2008-02-19 Applied Materials, Inc. Automated design and execution of experiments with integrated model creation for semiconductor manufacturing tools
US7213478B2 (en) * 2003-02-18 2007-05-08 Tokyo Electron Limited Method for automatic configuration of processing system
US7205228B2 (en) 2003-06-03 2007-04-17 Applied Materials, Inc. Selective metal encapsulation schemes
US7354332B2 (en) 2003-08-04 2008-04-08 Applied Materials, Inc. Technique for process-qualifying a semiconductor manufacturing tool using metrology data
US8036869B2 (en) * 2003-09-30 2011-10-11 Tokyo Electron Limited System and method for using first-principles simulation to control a semiconductor manufacturing process via a simulation result or a derived empirical model
US8073667B2 (en) * 2003-09-30 2011-12-06 Tokyo Electron Limited System and method for using first-principles simulation to control a semiconductor manufacturing process
US8032348B2 (en) * 2003-09-30 2011-10-04 Tokyo Electron Limited System and method for using first-principles simulation to facilitate a semiconductor manufacturing process
US8050900B2 (en) * 2003-09-30 2011-11-01 Tokyo Electron Limited System and method for using first-principles simulation to provide virtual sensors that facilitate a semiconductor manufacturing process
US7356377B2 (en) 2004-01-29 2008-04-08 Applied Materials, Inc. System, method, and medium for monitoring performance of an advanced process control system
US7010382B2 (en) * 2004-02-26 2006-03-07 Taiwan Semiconductor Manufacturing Co., Ltd. Method and system for improving process control for semiconductor manufacturing operations
US6980873B2 (en) 2004-04-23 2005-12-27 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for real-time fault detection, classification, and correction in a semiconductor manufacturing environment
US7437404B2 (en) * 2004-05-20 2008-10-14 Taiwan Semiconductor Manufacturing Company, Ltd. System and method for improving equipment communication in semiconductor manufacturing equipment
US6961626B1 (en) 2004-05-28 2005-11-01 Applied Materials, Inc Dynamic offset and feedback threshold
US7096085B2 (en) 2004-05-28 2006-08-22 Applied Materials Process control by distinguishing a white noise component of a process variance
US8615314B1 (en) * 2004-09-02 2013-12-24 Advanced Micro Devices, Inc. Process control using analysis of an upstream process
US7457729B2 (en) * 2005-01-11 2008-11-25 Verigy (Singapore) Pte. Ltd. Model based testing for electronic devices
US8675176B2 (en) * 2005-02-25 2014-03-18 Asml Netherlands B.V. Parameter control in a lithographic apparatus using polarization
US7117059B1 (en) * 2005-04-18 2006-10-03 Promos Technologies Inc. Run-to-run control system and operating method of the same
KR100699856B1 (ko) * 2005-07-29 2007-03-27 삼성전자주식회사 반도체소자를 제조하는 공정의 제어시스템 및 이를 이용한제어방법
US7720553B2 (en) * 2006-08-31 2010-05-18 Dell Products L.P. Service metric portfolio management
US8682466B2 (en) * 2007-05-04 2014-03-25 Taiwan Semiconductor Manufacturing Company, Ltd. Automatic virtual metrology for semiconductor wafer result prediction
US7873585B2 (en) * 2007-08-31 2011-01-18 Kla-Tencor Technologies Corporation Apparatus and methods for predicting a semiconductor parameter across an area of a wafer
US9760073B2 (en) * 2010-05-21 2017-09-12 Honeywell International Inc. Technique and tool for efficient testing of controllers in development
TWI647630B (zh) * 2017-05-08 2019-01-11 萬泰科技股份有限公司 生產效率監控系統
JP7326344B2 (ja) 2018-05-24 2023-08-15 アプライド マテリアルズ インコーポレイテッド 空間分解ウエハ温度制御のための仮想センサ
KR102589004B1 (ko) * 2018-06-18 2023-10-16 삼성전자주식회사 반도체 불량 분석 장치 및 그것의 불량 분석 방법
EP4012421B1 (en) 2020-12-11 2024-08-21 Nxp B.V. System and method for monitoring feedback circuits
US20230081446A1 (en) * 2021-09-10 2023-03-16 Applied Materials, Inc. Using elemental maps information from x-ray energy-dispersive spectroscopy line scan analysis to create process models
CN117490809B (zh) * 2023-12-19 2024-03-26 成都秦川物联网科技股份有限公司 用于智慧生产的超声波燃气表测试方法及工业物联网系统

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02206804A (ja) * 1989-02-06 1990-08-16 Mitsubishi Heavy Ind Ltd 適応制御装置
JPH05157449A (ja) * 1991-04-08 1993-06-22 Union Carbide Ind Gases Technol Corp 空気分離プロセスの統計的プロセス制御方法
JPH06244261A (ja) * 1990-12-31 1994-09-02 Texas Instr Inc <Ti> 半導体装置製造プロセス制御用センサ

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5546312A (en) 1993-09-20 1996-08-13 Texas Instruments Incorporated Use of spatial models for simultaneous control of various non-uniformity metrics
US5408405A (en) 1993-09-20 1995-04-18 Texas Instruments Incorporated Multi-variable statistical process controller for discrete manufacturing
US5526293A (en) 1993-12-17 1996-06-11 Texas Instruments Inc. System and method for controlling semiconductor wafer processing
US5452218A (en) 1994-02-03 1995-09-19 Texas Instruments System and method for determining quality analysis on fabrication and/or assembly design using shop capability data
US5698455A (en) * 1995-02-09 1997-12-16 Micron Technologies, Inc. Method for predicting process characteristics of polyurethane pads
US5659467A (en) * 1996-06-26 1997-08-19 Texas Instruments Incorporated Multiple model supervisor control system and method of operation
KR19980026111A (ko) * 1996-10-07 1998-07-15 김광호 반도체 제조를 위한 통계적 공정관리 방법
US5987398A (en) 1998-04-30 1999-11-16 Sony Corporation Method and apparatus for statistical process control of machines and processes having non-constant mean of a response variable
US6230069B1 (en) 1998-06-26 2001-05-08 Advanced Micro Devices, Inc. System and method for controlling the manufacture of discrete parts in semiconductor fabrication using model predictive control
US6298470B1 (en) * 1999-04-15 2001-10-02 Micron Technology, Inc. Method for efficient manufacturing of integrated circuits

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02206804A (ja) * 1989-02-06 1990-08-16 Mitsubishi Heavy Ind Ltd 適応制御装置
JPH06244261A (ja) * 1990-12-31 1994-09-02 Texas Instr Inc <Ti> 半導体装置製造プロセス制御用センサ
JPH05157449A (ja) * 1991-04-08 1993-06-22 Union Carbide Ind Gases Technol Corp 空気分離プロセスの統計的プロセス制御方法

Also Published As

Publication number Publication date
KR100708009B1 (ko) 2007-04-16
US6560503B1 (en) 2003-05-06
DE60012762T2 (de) 2005-08-11
KR20020047215A (ko) 2002-06-21
DE60012762D1 (de) 2004-09-09
EP1218806B1 (en) 2004-08-04
WO2001025865A1 (en) 2001-04-12
EP1218806A1 (en) 2002-07-03

Similar Documents

Publication Publication Date Title
JP2003511750A (ja) 統計的プロセス制御を使用してコントローラの性能を監視するための方法および装置
EP1330684B1 (en) Method and apparatus for embedded process control framework in tool systems
US6556884B1 (en) Method and apparatus for interfacing a statistical process control system with a manufacturing process control framework
US6442496B1 (en) Method and apparatus for dynamic sampling of a production line
US6405144B1 (en) Method and apparatus for programmed latency for improving wafer-to-wafer uniformity
CN1285109C (zh) 施行最终临界尺寸控制的方法及装置
US6610550B1 (en) Method and apparatus for correlating error model with defect data
US6647309B1 (en) Method and apparatus for automated generation of test semiconductor wafers
JP2005510083A (ja) 統合計測データをフィードフォワードデータとして利用するための方法および装置
US6560506B2 (en) Method and apparatus for control for semiconductor processing for reducing effects of environmental effects
US6532428B1 (en) Method and apparatus for automatic calibration of critical dimension metrology tool
KR20020063295A (ko) 공정 제어 시스템
JP2003506898A (ja) 重ね合せレジストレーションのランごとの制御のための方法および装置
WO2004012230A2 (en) Dynamic targeting for a process control system
US6597447B1 (en) Method and apparatus for periodic correction of metrology data
US6947803B1 (en) Dispatch and/or disposition of material based upon an expected parameter result
KR101000545B1 (ko) 1차 공정 제어기를 보완하기 위한 2차 공정 제어기
US6698009B1 (en) Method and apparatus for modeling of batch dynamics based upon integrated metrology
US6571371B1 (en) Method and apparatus for using latency time as a run-to-run control parameter
US6834213B1 (en) Process control based upon a metrology delay
US6905895B1 (en) Predicting process excursions based upon tool state variables
US6871114B1 (en) Updating process controller based upon fault detection analysis
US6912436B1 (en) Prioritizing an application of correction in a multi-input control system
US7117062B1 (en) Determining transmission of error effects for improving parametric performance
US7120514B1 (en) Method and apparatus for performing field-to-field compensation

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070328

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070328

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20100202

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20100428

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20100817