KR100699792B1 - Plasma cleaning apparatus of magazine insert type jig structure - Google Patents

Abstract

A plasma cleaning apparatus of a magazine insert type jig structure is provided to apply a surface mounting magazine irrespective of a size of a printed circuit board without drawing the printed circuit board. A chamber(200) is installed inside a main body of a system. The chamber includes a vacuum exhaust port, a gas inlet, a ground socket(220), and an electrode socket(230). A caster is installed at a bottom surface of a rectangular cart. A base plate(420) slides along a guide rail which is arranged on an upper surface of the cart and a bottom surface of the chamber. The base plate includes ground and electrode blocks corresponding to the ground and the electrode sockets. A floating plate is installed horizontally to an upper surface of the base plate. A power electrode plate(422) is formed vertically between the floating plates on the upper surface of the base plate. A ground electrode plate(424) is installed in parallel to the power electrode plate on the upper surface of the base plate to form a discharge gap. A surface mounting magazine(500) is installed on an upper surface of the floating plate.

Description

PLAZA CLEANING APPARATUS OF MAGAZINE INSERT TYPE JIG STRUCTURE}

Figure 1 (a), (b) is an illustration of a plasma cleaning apparatus for a printed circuit board according to the prior art,

Figure 2 is a side view showing the installation state of the plasma cleaning apparatus of the magazine charging jig structure according to the present invention,

Figure 3 (a), (b) is a schematic view of a magazine loaded jig structure viewed from the front and side of the chamber according to the present invention,

Figure 4a ~ d is an exemplary view showing various embodiments of the magazine jig structure according to the present invention,

Figure 5 is an exemplary view showing the configuration of the gas inlet and exhaust port formed in the chamber according to the present invention.

♧ description of the symbols for the main parts of the drawing ♧

100 .... body 200 .... chamber

210 .... Exhaust port 220 .... Ground socket

230 .... electrode socket 240 .... gas inlet

300 .... bogie 400 .... magazine-loading jig structure

420 .... base plate 422 .... power electrode plate

424 .... Earth plate 430 .... Insulation guide

440 .... ground plate 450 .... hole

462 .... electrode 464 .... ground rod

500 .... Surface Mount Magazine

The present invention relates to a plasma cleaning device having a magazine-type jig structure for improving productivity of surface mount technology, and more particularly, to improve quality and reliability in surface mount technologies such as wire bonder and flip chip hybrid mounting. The present invention relates to a plasma cleaning apparatus of a magazine-loaded jig structure, which is applied to a bonding preprocess of a surface mount device or a prefill process of underfill, to be suitable for improvement of productivity and convenience of operation.

Recently, due to the rapid development of the information and electronics industry such as mobile phones, DVDs, displays, and digital home appliances, the demand for electronic components is rapidly increasing, and researches on new material development and improved processes are continuously conducted.

In particular, the assembly technology of printed circuit boards has evolved from insertion mounting technology (IMT) to surface mounting technology (SMT) due to the development of printed circuit boards, electronic components, and equipments, chip components, flip chips, chip scale packages (CSP), etc. The demand for surface-mount technology is exploding as next-generation package mounting and lead-free soldering take off.

On the other hand, the human desire to improve the quality of life along with the improvement of living standards has given the homework of the manufacturing process of eco-friendly electronic parts that are light and short.

Accordingly, the surface mount technology of the printed circuit board requires a small size, light weight, multi-pin, high speed, and high functionality of the package, and reduces the size of the wire bonding and the flip chip bonding to accommodate these requirements. Technology is being applied.

With the development of this manufacturing technology, the demand for surface cleaning and surface mount technology of printed circuit boards is increasing rapidly. This is because various organic substances on land on the surface of the substrate to which surface mount devices are to be combined, This is because foreign matter removal such as oxide film, conductive float, nickel, and the like, and surface modification of the surface of the substrate on which underfill is to be applied have an important effect on securing high quality and high reliability of high density, compact and lightweight surface mount technology.

Cleaning and surface modification of printed circuit boards has recently been made environmentally friendly, economical, and excellent surface cleaning and surface modification ability, and plasma cleaning technology suitable for high-density, small size and light weight with the rise of environmental problems.

For example, in the case of the plasma cleaning apparatus as shown in FIG. 1A, a plurality of electrodes 3 are provided inside the chamber 1 for vacuum plasma processing, and the printed circuit board 4, which is an object to be treated, may be replaced with the electrodes ( 3) placed in between, after evacuating the vacuum and introducing gas into the chamber (1), and then applying a voltage between the electrodes (3) to generate a plasma, using the generated plasma at this time Washing and surface modification of (4) were performed.

However, such a cleaning device should be loaded into a jig by hand during the operation of the printed circuit board 4, and the printed circuit board 4 is loaded into the chamber 1 using the jig. Difficult to remodel, it was difficult to actively respond to the printed circuit board (4) of various sizes.

As another example, as shown in (b) of Figure 1, by using a rack (rack) 5 to correspond to the printed circuit board 4 of various sizes to compensate for the disadvantages of the jig.

In this case, regardless of the size of the printed circuit board 4, the printed circuit board (4) is mounted and placed in the plasma chamber 1 has the advantage that it can be processed, but in a dedicated magazine used in the surface mounting process printed circuit board ( 4) Take out them by hand manually and mount them on the rack 5 (same as the case of jig), and then perform plasma cleaning and surface modification process. The problem of time, manpower and economic waste still existed as it must be put into the reflow process or underfill application process.

The present invention has been created in view of the above-described problems of the prior art, and solved this problem. In consideration of the characteristics of the surface mounting process, the drawing process of the printed circuit board through manual operation is omitted in the magazine for surface mounting process. By eliminating defects caused by humans in this process, greatly improving the convenience, efficiency and productivity of the work, and actively applying magazines for surface-mounting processes, we actively respond to printed circuit boards of various sizes. In addition, the main object of the present invention is to provide a plasma cleaning apparatus of a magazine-loaded jig structure, which is invented to enhance the surface treatment quality.

In order to achieve the above technical problem, the present invention includes a chamber having a grounding socket and an electrode socket embedded in a system main body and connected to an exhaust port for exhausting gas, a gas inlet, and an external power supply; A bogie having a rectangular frame shape with a caster fixed to the bottom surface; A base plate sliding along a guide rail disposed on an upper surface of the bogie and a bottom of the chamber and having a ground and an electrode block connected to the ground and the electrode socket; A floating plate in contact with and insulated from an upper end of the base plate; A power electrode plate vertically fixed to the upper surface of the base plate with the floating plate therebetween; A ground electrode plate electrically insulated from the top surface of the base plate and disposed in parallel with the power electrode plate to form a discharge gap; Regardless of the size of the printed circuit board has a magazine form that can be stored in a large amount, there is a technical feature to provide a plasma cleaning device of the magazine-loaded jig structure comprising a surface-mounted magazine mounted on the upper surface of the floating plate. .

In this case, the power electrode plate is disposed on the left and right side wall of the chamber, the ground electrode plate is characterized in that it is disposed inside the chamber.

In addition, the external power supply to the ground and electrode socket is characterized in that the sine wave or pulse power in the frequency range of 1 KHz ~ 90 MHz.

In addition, the discharge gap between the power electrode plate and the ground electrode plate is characterized in that it is configured to be variable by adjusting the position of the power electrode plate.

Furthermore, the power electrode plate, the ground electrode plate, the base plate, and the floating plate is also characterized in that it is made of any one form selected from the shape of a frame, bar, bar, rod.

In addition, the power electrode plate, the ground electrode plate and the surface-mounting magazine is characterized in that it is installed in multiple sets in the transverse direction.

In addition, the shield plate is interposed between a pair of the power electrode plate, the ground electrode plate and a surface mount magazine.

Furthermore, the power electrode plate, the ground electrode plate and the surface mount magazine are formed in a pair, and are also characterized in that they are dually installed in the longitudinal direction, and the power electrode plate, the ground electrode plate and the surface mount magazine are formed in a pair. It is also characterized by being installed in a double direction in the longitudinal direction and in a multiple installation in the transverse direction.

In addition, when the power electrode plate, the ground electrode plate and the surface mount magazine form a pair, one of the ground electrode plates is removed, and the removed ground electrode plate and the opposite power electrode plate are arranged to be moved. When the power electrode plate, the ground electrode plate, and the surface mount magazine form a pair, two pairs of the power electrode plate and the ground electrode plate for plasma generation are removed, and the gap between the power electrode plate and the ground electrode plate is removed. The wide formation also has its technical characteristics.

In addition, the gas inlet and the exhaust port provided on the left and right sides of the chamber are configured to operate alternately with each other, and the power electrode plate and the ground electrode plate has a technical feature in that the hole is formed perforated.

Hereinafter, with reference to the accompanying drawings will be described in detail a preferred embodiment according to the present invention.

Figure 2 is a side view showing the installation state of the plasma cleaning apparatus of the magazine charging jig structure according to the present invention.

As shown in FIG. 2, the chamber 200, which is a plasma processing chamber, is provided at an appropriate location of the system main body 100, and the chamber 200 is evacuated or exhausted inside the left and right walls of the chamber 200. Exhaust ports 210 for each are installed.

In addition, the rear wall of the chamber 200 is provided with sockets 220 and 230 connected to an external power supply.

In addition, the front of the chamber 200 is provided with a magazine charging jig structure 400 which is movable by the trolley 300.

This bogie structure is the same / similar to that disclosed in Utility Model Registration No. 384218 (2005.5.4) “PCB Horizontal Wash Window Using Plasma”, filed and filed by the applicant.

Therefore, a detailed description of the components for the bogie-type structure, such as the guide rail 410, the guide roll 412, the electrode block 414, the ground block 416, the stopper 418 will be omitted here. do.

3 (a) and 3 (b) are schematic views of a magazine-loaded jig structure viewed from the front and side of the chamber according to the present invention, respectively.

As shown in (a) and (b) of FIG. 3, an electrode block 414 in contact with an electrode socket 230 connected to an external power supply source, and a guide roll 412 moving along the guide rail 410. The attached base plate 420 is provided; An upper surface of the base plate 420 is provided with a floating plate 510 of an appropriate size to electrically separate the surface mount magazine 500 from the power source.

In this case, the material of the floating plate 510 is generally preferably an insulator, but a conductor may be applicable to a special process such as a bias power supply using a conductive surface mounting magazine.

In addition, as the external power supply, 40 KHz low frequency (LF) power and 13.56 MHz RF (Radio Frequency) power, which are generally used for plasma processing of a printed circuit board, are applied, but in this system, 1 KHz to 90 MHz It is possible to apply sine wave or pulse power in the frequency range.

On the other hand, a power electrode plate 422 and a ground electrode plate 424 for plasma formation are installed vertically on the upper surface of the base plate 420, wherein the power electrode plate 422 and the ground electrode plate 424 Are arranged in an equilibrium at an appropriate distance to each other to form a discharge gap G, and also have a paired electrode structure for plasma generation.

The electrode structure is formed on the left and right sides of the base plate 420 to form a space in which the surface mounting magazine 500 shown in FIGS. 2 and 4A, 4B, and 4D will be charged.

In this case, the power electrode plate 422 is electrically connected to the base plate 420, and the ground electrode plate 424 is electrically disconnected from the base plate 420 by the insulating guide 430.

In addition, the left and right ground electrode plates 424 are electrically and mechanically connected to the upper ground plate 440 on which the ground block 416 is formed to be in contact with the ground socket 220 connected to an external power supply.

Here, the discharge gap (G) is configured by the distance between the power electrode plate 422 and the ground electrode plate 424, it is natural that the gap interval can be varied for an appropriate processing effect.

At this time, the gap spacing is variable by adjusting the position of the power electrode plate 422, preferably in the range of several to several tens of millimeters.

In addition, the arrangement of the power electrode plate 422 and the ground electrode plate 424 is to position the power electrode plate 422 toward the left and right wall surfaces of the chamber 200 and to place the ground electrode plate 424 inward. It is particularly preferable that high quality treatment is possible by suppressing the action of unwanted electrons.

In addition, the power electrode plate 422 and the ground electrode plate 424 may be formed by drilling a plurality of holes 450 to facilitate the flow of radicals such as discharge gas and ions.

The magazine charged jig structure 400 is possible for a variety of applications to further improve the efficiency and productivity of work.

For example, Figures 4a, b, c, d shows various embodiments of such a magazine-type jig structure 400.

4A shows an example in which two magazine-loaded jig structures 400 according to the present invention are dually installed in the transverse direction, and FIG. 4B shows an example in which the dually installed magazines are installed in the longitudinal direction.

At this time, the shield plate (P) between the power electrode plate 422 provided on the outer side of the ground electrode plate 424 in order to prevent the mutual disturbance of the plasma generated in each jig structure 400 in the lateral installation It is preferable to install.

4A and 4B may also be implemented, as well as a pair of two pairs of power electrode plates 422 and ground electrode plates 424 for generating plasma in the magazine-type jig structure 400. And increase the gap between the power electrode plate 422 and the ground electrode plate 424 sufficiently, or remove the ground electrode plate 424 on one side and remove the power electrode plate 424 opposite to the removed ground electrode plate 424. By moving 422, it is also applicable to the form as shown in Figure 4c.

Herein, the power electrode plate 422 and the ground electrode plate 424 are not necessarily limited to a plate-shaped conductive member having holes 450 formed therein, and may have a frame shape or bar that can perform the same function. (Rod) or the shape of the electrode rod 462 and the ground rod 464, as shown in FIG. 4D.

In addition, Figure 5 is a schematic diagram showing the configuration of the gas inlet and exhaust port formed in the chamber according to the present invention.

As shown in FIG. 5, the exhaust port 210 is located at the center of the left and right wall surfaces of the chamber 200, and the gas inlet 240 is configured to be parallel to the left and right wall surfaces of the chamber 200.

In addition, the gas inlet 240 and the exhaust port 210 configured at the left and right sides effectively enter the printed circuit board with ions and various radicals generated during the plasma cleaning and surface modification, thereby improving uniformity and quality. It is desirable to control to operate alternately.

That is, when the discharge gas is injected through the gas inlet 240 on the right side, the exhaust is made to the exhaust port 210 on the left side, so that the movement of particles naturally moves from the right side to the left side, and reversible after an appropriate time (several to several tens of seconds). Can be enabled.

The operating relationship of the present invention made of such a configuration is as follows.

In the surface mounting process, the surface mounting magazine 500 into which the printed circuit board is loaded before the reflow process or the underfill coating process is mounted on the floating plate 510 of the jig as it is, and the chamber 200 is used by using the bogie 300. Fit inside.

Subsequently, when power is applied after the vacuum and the reaction gas are supplied, power is applied to the power electrode plate 422 and the ground electrode plate 424 through the electrode socket 230 and the ground socket 220.

At this time, the base plate 420 and the ground plate 440 are also supplied with power, but in the discharge gap G between the power electrode plate 422 and the ground electrode plate 424 which are structurally easy to form a plasma. The plasma is formed to increase energy efficiency.

Plasma that is concentrated in the discharge gap G generates electrons, ions and various radicals, and the particles are guided to the magazine together with the gas particles by the action of the gas inlet 240 and the exhaust port 210 which are controlled to operate alternately. Cleaning and surface modification are then performed.

In this process, the ground electrode plate 424 installed inside the inflow of electrons to suppress the action of unwanted electrons.

When the plasma treatment is completed, the magazine charging jig structure 400 is taken out of the chamber 200, and the magazine is put into a reflow process or an underfill coating process, which is a subsequent process as it is, and another standby magazine is processed in the same manner to improve productivity. And convenience of operation.

As described in detail above, the present invention has a structure that can be applied to the surface-mounted magazine as it is without the withdrawal of the printed circuit board by a separate manual in the surface-mounted magazine only applied regardless of the size of the printed circuit board It is possible.

In addition, it is possible to secure high reliability of the final product by eliminating the defect caused by the human hand by eliminating the manual operation of drawing out the printed circuit board.

In addition, while performing a high-quality surface cleaning and surface modification, it is very efficient, simple and easy to work, it is possible to improve the productivity dramatically.

Claims (13)

A chamber built in the system main body and having a ground socket and an electrode socket connected to a vacuum exhaust exhaust port, a gas inlet, and an external power supply; A bogie having a rectangular frame shape with a caster fixed to the bottom surface; A base plate sliding along a guide rail disposed on an upper surface of the bogie and a bottom of the chamber and having a ground and an electrode block connected to the ground and the electrode socket; A floating plate in contact with and insulated from an upper end of the base plate; A power electrode plate vertically fixed to the upper surface of the base plate with the floating plate therebetween; A ground electrode plate electrically insulated from the top surface of the base plate and disposed in parallel with the power electrode plate to form a discharge gap; Regardless of the size of the printed circuit board has a magazine form that can be stored in a large amount, the plasma cleaning device of the magazine loaded jig structure characterized in that it comprises a surface-mounted magazine mounted on the upper surface of the floating plate. The method according to claim 1, The power electrode plate is disposed on the left and right side wall of the chamber, and the ground electrode plate is disposed in the interior of the chamber plasma cleaning apparatus of the magazine charging jig structure. The method according to claim 1, The external power supply supplied to the ground socket and the electrode socket is a sine wave or pulse power in the frequency range of 1 KHz ~ 90 MHz plasma cleaning device of the magazine-type jig structure. The method according to claim 1, And a discharge gap between the power electrode plate and the ground electrode plate is configured to be variable by adjusting the position of the power electrode plate. The method according to claim 1, The power electrode plate, the ground electrode plate, the base plate, the floating plate is a plasma cleaning device of a magazine charging jig structure, characterized in that formed in any one form selected from the shape of a frame, bar, bar, rod. The method according to claim 1, The power electrode plate, the ground electrode plate and the surface-mounted magazine is a plasma cleaning device of the magazine charging jig structure, characterized in that the multi-installation in the transverse direction to form a set. The method according to claim 6, The plasma cleaning device of the magazine-type jig structure, characterized in that the shield plate is interposed between one of the power electrode plate, the ground electrode plate and the surface mount magazine. The method according to claim 1, The power electrode plate, the ground electrode plate and the surface-mounted magazine is a plasma cleaning device of the magazine charging jig structure, characterized in that the pair is installed in the longitudinal direction in a pair. The method according to claim 1, The power electrode plate, the ground electrode plate and the surface-mounted magazine is a pair of plasma cleaning apparatus of the magazine charging jig structure, characterized in that it is installed in a pair in the longitudinal direction and at the same time multiple installation in the transverse direction. The method according to claim 1, When the power electrode plate, the ground electrode plate and the surface mount-only magazine form a pair, the magazine plate is characterized by removing one ground electrode plate and moving the power electrode plate opposite to the removed ground electrode plate. Plasma cleaning device of the vertical jig structure. The method according to claim 1, When the power electrode plate, the ground electrode plate, and the surface mount magazine form a pair, two pairs of the power electrode plate and the ground electrode plate for plasma generation are removed, and the space between the power electrode plate and the ground electrode plate is widened. The plasma cleaning device of the magazine charging jig structure, characterized in that. The method according to claim 1, And a gas charging inlet jig structure configured to alternately operate the gas inlet and the exhaust port provided at the left and right sides of the chamber. The method according to any one of claims 1 to 13, The plasma cleaning device of the magazine-type jig structure, characterized in that the hole formed in the power electrode plate and the ground electrode plate perforated.

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