KR100698379B1 - Apparatus for trapping semiconductor residual product of semiconductor manufacturing system - Google Patents

Abstract

An apparatus for trapping a semiconductor residual product of a semiconductor manufacturing system is provided to improve trap and exhaust efficiencies by trapping uniformly the semiconductor residual product from the entire portion of the semiconductor manufacturing system using an improved arrangement of trap plates and trap members. An apparatus(10) for trapping a semiconductor residual product of a semiconductor manufacturing system includes a plurality of trap plates(31) stacked with each other. The apparatus further includes a plurality of trap members. The plurality of trap members trap the semiconductor residual product of a powder type. The plurality of trap members are alternately arranged between the plurality of trap plates.

Description

Reaction byproduct collection device of semiconductor manufacturing system {APPARATUS FOR TRAPPING SEMICONDUCTOR RESIDUAL PRODUCT OF SEMICONDUCTOR MANUFACTURING SYSTEM}

1 is a block diagram of the installation configuration of the collecting device according to the present invention.

Figure 2 is an external perspective view of the collecting device according to the present invention.

3 is a perspective view of the collecting device cutaway of FIG.

4 is a cross-sectional view of the collecting device of FIG.

5 is a perspective view of a collecting unit of the collecting device according to the present invention.

6 is a bottom perspective view of the collecting part of FIG. 5;

7 is a perspective view of the cutaway of the collecting part of FIG.

8 is a perspective view of a heat exchange unit of the collecting device according to the present invention.

<Explanation of symbols for the main parts of the drawings>

10: collecting device 20: housing

21: inlet 22: outlet

30: collecting part 31: trap plate

32: collecting member 36: auxiliary trap plate

40: heat exchanger 41: heater

42: plate

The present invention relates to a reaction by-product collecting device of a semiconductor fabrication system, and more particularly, the collection of reaction by-products per unit volume is carried out uniformly over the entire collection section, the amount to be collected is maximized, and at the same time the gaseous reaction by-products By implementing a configuration that minimizes the resistance of the discharge flow path to obtain an excellent product with improved collection efficiency.

The semiconductor manufacturing process is divided into the pre-process and the post-process, and the pre-process means a physical / chemical process of depositing and etching a thin film on a wafer to manufacture a semiconductor chip. It refers to a package fabrication process in which a wafer is cut to a specific standard, placed on a separately produced lead frame, and bonded after wire bonding.

In the above process, the entire process includes silane and arsine, which inject a wafer into a process chamber that provides a space for performing the process, and form a working atmosphere for performing deposition and etching of a thin film on the wafer. arsine), boron chloride, etc., and gas such as hydrogen is injected into the chamber to perform the chip manufacturing process.

At this time, a large amount of toxic gas containing various ignition gases, corrosive foreign substances and toxic components are generated inside the process chamber during the entire process, and a screw must be provided in the semiconductor manufacturing system to purify and release the harmful gases. A scrubber is installed.

Since such a scrubber purifies only the reaction byproducts in the form of gas, when the reaction byproducts proceed to the outside of the process chamber and become solid in the form of powder, the exhaust pressure rises due to sticking to the exhaust line and flows into the vacuum pump, causing the pump to malfunction. Problems such as contamination, harmful gas flow back into the process chamber, and contamination of the wafer were exposed.

In order to solve this problem, a collecting device (commonly referred to as a trap device) including a function of a scrubber is installed between the process chamber and the vacuum pump to collect the solidified reaction byproduct.

This collection device is implemented as a cold trap device or a hot trap device to solidify the gaseous reaction by-products in the housing, and collect the solidified powder reaction by-products in the collecting member mounted inside the housing to purify the vacuum pump. The reaction byproduct gas is allowed to proceed.

The reaction by-product solidified by this process is able to be discharged to the outside collected and purified gas by the collecting device.

Although the above-described conventional collecting device solves problems such as failure of the vacuum pump and contamination of the wafer, the reaction by-products of the gas introduced through the inlet of one side are not uniformly collected over the entire section of the trap after solidification. This occurs because the inlet of the gas and the initial point when heating or cooling the reaction byproduct are biased to either side.

Therefore, when the collection process is biased on either side, the amount of solidified reaction byproducts per unit area is reduced, so that the collection efficiency is very low, and the collected reaction byproducts reduce the gas flow path. This leads to a slow gas progression, thereby causing a problem in that the collection and exhaust efficiency, such as a small collection amount, is very low.

The present invention has been invented to solve the above problems, the reaction by-product gas is solidified to be uniformly collected on the collecting member after the solidified reaction by-product gas, the reaction by-product collection to collect the maximum amount of the reaction by-product collected in the unit volume It is an object to provide a device.

In order to achieve the above object, the present invention has the following configuration.

In the present invention, trap plates are arranged in a plurality of layers in the trap plate spaced therein, the collecting member for collecting the reaction by-products in the form of powder solidified into the trap plate of one side or the other side for each layer trap plate It is mounted to the section, it is configured to be arranged so that both points on which the collecting member is mounted alternately for each floor.

At the same time, the present invention, the trap plate is arranged in a plurality of layers in the interval spaced therein, the trapping device is installed in each trap plate, the trap plate is installed inclined toward any one side of each layer In this case, the inclined states are alternately installed on the opposite sides of each floor.

In addition, the present invention, the trap plate is installed therein, the inlet and outlet are formed on both sides of the reaction plate by the gas is passed through the trap plate in order to realize each of the above configuration as a collecting device; A collecting unit to which the trap plate and the collecting member are coupled; It is composed of a heat exchanger coupled to the inside of the housing so as to be provided inside the trap plate to solidify the reaction by-product gas.

Hereinafter, exemplary embodiments of the present invention to which the above configuration is applied will be described in detail with reference to the accompanying drawings.

1 is a block diagram illustrating an installation of a collecting device according to the present invention, FIG. 2 is an external perspective view of a collecting device according to the present invention, and FIG.

Referring to the drawings, the collecting device 10 according to the present invention is installed between the process chamber 1 and the vacuum pump 2, the process chamber 1 is a space in which the entire process of manufacturing the chip is performed, Reaction by-products generated at this time is progressed by the vacuum pump (2) is discharged to the outside as is well known.

The collecting device 10 has a basic configuration consisting of a housing 20, a collecting part 30, and a heat exchange part 40.

The housing 20 has a trap plate 31 constituting the collecting unit 30 is configured to be the exterior of the device, the inlet (2) on both sides of the reaction by-product gas proceeds through the trap plate 31 21 and outlet 22 are formed respectively.

Here, the inlet 21 of the housing 20 is formed at the point of the housing 20 located on the center line of the trap plate 31, the outlet 22 is provided with a trap plate 31 in its inner circumference A wall 23 protruding inward is formed.

This configuration is a configuration for uniformly spreading the reaction by-products of the gas introduced through the inlet 21 in the housing 20, the wall 23 is a solidified reaction by-products into the vacuum pump (2) It is a configuration to prevent inflow.

The collecting part 30 is configured by combining the trap plate 31 and the collecting member 32, the configuration of the trap plate 31 and the collecting member 32 is as shown in Figs.

5 is a perspective view of a collecting unit of the collecting device according to the present invention, FIG. 6 is a bottom perspective view of the collecting unit of FIG. 5, and FIG. 7 is a cutaway perspective view of the collecting unit of FIG. 5.

1 to 7, the trapping unit 30 is provided with trap plates 31 stacked in a plurality of layers while maintaining a mutual distance therebetween, and a plurality of trap plates 31 are coupled to each other through a coupling rod ( 33) is integrated.

Here, the trap plate 31 is formed in a circular shape, the hollow 34 is formed on the inside to give a space to be installed the heat exchange unit 40 to be described later, the perforations of various specifications for the introduced reaction by-products to pass through A plurality of 35 are formed.

The collecting member 32 is formed in the form of a mesh plate corresponding to the trap plate 31, and is mounted on the trap plate 31 is bonded by an adhesive or separate coupling means (bolts, pins, etc.).

The trap plate 31 is installed to be inclined toward one side of each floor in the collecting unit 30, and the inclined state is alternately installed to the opposite side of each floor to be inclined so that one side of the trap plate 31 has an interval between the trap plates 31. It is formed in a narrow interval section (S1), the other side is formed in a wide interval section (S2).

In particular, in the wide interval section S2 formed by alternately inclining the trap plate 31, an auxiliary trap plate 36 for increasing the collection amount of the reaction by-product is provided, and the auxiliary trap plate 36 is a trap. It is formed with a smaller area than the plate 31.

Here, the auxiliary trap plate 36 is horizontally installed by dividing the inclination angle of the wide interval section (S2) into two, and is formed in a half area of the trap plate 31, that is formed in the form of a semi-circular plate both sides It is configured to balance the collection amount of.

At this time, the trapping amount balance of both sides is the trapping capacity in the wide interval (S2) due to the different interval (meaning the collection interval) of each trap plate 31 of the wide interval section (S2) and narrow interval section (S1) Since it is apparent that the number is small, it means that the auxiliary trap plate 36 is installed in the wide interval section S2 to maintain the balance for the collection interval of the narrow interval section S1.

In addition, the trap plate 31, the collecting member 32 for collecting the reaction by-product in the form of a solidified powder is mounted on a portion of one side or the other side for each trap plate 32 of each layer, the collecting member 32 Both mounted points are arranged so as to be alternated every one or more floors.

In particular, the collecting member 32 is preferably configured to be mounted on each half of the trap plate 31, which is formed only in the next layer of the trap plate 31 layer in which the collecting member 32 is installed. The trap plate 31 formed of only 35 is alternately arranged to minimize resistance when the gaseous reaction by-products are advanced.

Here, the trap plate 31 of the uppermost layer and the lowermost layer of the trap plate 31 is provided to maintain the horizontal and the collecting member 32 is mounted throughout the entire period so that the collection amount of the reaction by-products at the beginning and the end of the trap plate 31 It is desirable to maximize.

The heat exchanger 40 is installed inside the trap plate 31 to solidify the reaction by-product gas, and is composed of a heater 41, a plate body 42, and a coupling core material 43.

The heater 41 is provided inside the hollow 34 of the trap plate 31 is wound in the form of a coil, the plate body 42 is laminated with a plurality of the main body 42 while maintaining a mutual interval inside the heater 41 Configured to induce reaction byproduct progression.

The coupling core material 43 is a configuration for integrating a plurality of plate bodies 42 by penetratingly coupled to each of the plurality of laminated plate bodies 42. In the drawing, reference numeral 44 denotes a coupling core material 43 of the heat exchange part 40. It is a trap plate in which the hollow 34 is not formed to be fixedly coupled.

The collection device configured as described above, when the reaction by-products are introduced through the inlet 21 of the housing 20, the introduced reaction by-products are solidified while passing through the trap plate 31, and the solidified reaction by-products are collected in the collecting member 32. Only the reaction by-products of the collected and purified gas proceed to the vacuum pump 2 through the outlet 22.

Here, solidification of the introduced reaction by-products is performed by heating the heater 41 of the heat exchanger 40 so that the inside of the housing 20 is formed as a working atmosphere, and the perforation 35 of the trap plate 31 is performed. The reaction by-products proceed between the mesh grid space of the collecting member 32 and the plate body 42 inside the heater 41 to solidify and collect.

At this time, the collection of the reaction by-products are inclined by alternately installed on both sides of the trap plate 31 in the narrow interval section (S2) of one side narrowing the collection interval by the narrow interval itself to improve the collection amount, and then proceeded thereafter. Reaction by-products are collected in the other narrow interval (S1) alternated with the narrow interval (S1) to increase the overall balance and capture capacity of the capture.

At this time, the auxiliary trap plate 36 installed in the wide interval section (S2) is configured to increase the collection capacity even more, the collecting member 32 is each 1/1 to the trap plate 31 of each layer It is installed only in the section 2, and the mounted positions are alternated for each layer, and the progress of the reaction by-products delayed by the collecting member 32 proceeds quickly through the perforations of the layers, thereby improving the discharge efficiency of the purified reaction float gas. Is increased.

As described above, in the present invention, uniform collection is performed over the entire section of the apparatus, so that the reaction by-products of the gas proceed rapidly and the collection capacity of the reaction by-products is dramatically increased, thereby improving the collection and discharging efficiency of the apparatus. You get an effect.

In addition, the present invention provides a space for collecting and storing the solidified reaction by-products is not the reaction by-product powder is introduced into the vacuum pump, thereby improving the reliability of the device according to the failure of the vacuum pump have.

Claims (15)

In the collecting device in which the trap plates are spaced apart from each other and stacked in multiple layers, A collecting member for collecting the reaction by-product collected in the form of powder that is solidified is mounted on a part of either side of one side and the other side for each trap plate of each layer, and both points on which the collecting member is mounted are alternately arranged for each layer. Reaction by-product collection device of the semiconductor manufacturing system, characterized in that. The method of claim 1, wherein the collecting member Reactor by-product collection device of the semiconductor manufacturing system, characterized in that each mounted on the half section of the trap plate. The method of claim 1, Reactor by-product collection device of the semiconductor manufacturing system, characterized in that the trap plate of the uppermost layer and the lowermost layer is equipped with a collecting member over the whole period. The apparatus of claim 1, wherein the collecting member is formed in the form of a mesh plate corresponding to the trap plate and mounted on the trap plate. . In the trapping device is installed in a plurality of layers are spaced apart from each other inside the trap plate, the trap member is mounted on each trap plate, The trap plate is installed inclined toward any one side of each layer, the reaction by-product collection device of the semiconductor fabrication system, characterized in that the inclined state alternately installed on each other side inclined. The method of claim 5, A secondary trap plate for increasing the collection amount of the reaction by-product is provided in a wide interval formed by alternately inclined trap plate is formed, the auxiliary trap plate is formed in a smaller area than the trap plate, characterized in that Reaction by-product collection device. The method of claim 6, wherein the auxiliary trap plate A device for collecting reaction byproducts of a semiconductor manufacturing system, characterized in that it is horizontally divided into two inclined angles and is formed in a half area of a trap plate, and is configured to balance the amount of collection on both sides. The method according to any one of claims 5 to 7, The trap plate is provided with a collecting member for collecting the reaction by-products in the form of powder that is solidified in one portion of one side and the other side for each trap plate of each layer, and the one side and the two points on which the collecting member is mounted The reaction by-product collecting device of the semiconductor manufacturing system, characterized in that arranged in the interval of any one of the two layers. The method of claim 8, wherein the collecting member Reactor by-product collection device of the semiconductor manufacturing system, characterized in that each mounted on the half section of the trap plate. The method of claim 8, The trap plate of the uppermost layer and the lowermost layer is provided to keep horizontal, and the reaction by-product collection device of the semiconductor manufacturing system, characterized in that the collecting member is mounted throughout the entire period. The apparatus of claim 8, wherein the collecting member is formed in a mesh plate shape corresponding to the trap plate and mounted on the trap plate. The method according to claim 1 or 5, A housing having the trap plate installed therein and each having an inlet and an outlet formed on both sides of the reaction byproduct gas passing through the trap plate; A collecting unit to which the trap plate and the collecting member are coupled; The reaction by-product collection device of the semiconductor manufacturing system, characterized in that the heat exchanger is installed inside the trap plate, and solidifies the reaction by-product gas to form the interior of the housing in the working atmosphere. The method of claim 12, wherein the housing A reaction by-product capture device of a semiconductor manufacturing system, characterized in that the inlet is formed at a point in the housing located on the centerline of the trap plate. The method of claim 12, wherein the housing Reaction by-product collection device of the semiconductor manufacturing system, characterized in that the inner wall of the outlet is formed with a projecting wall protruding the trap plate is installed. The method of claim 12, wherein the heat exchange unit A heater coupled to the inside of the housing and positioned inside the trap plate and wound in a coil shape; Retaining by-product collection device of the semiconductor manufacturing system, characterized in that consisting of a plurality of plates that are spaced apart from each other inside the heater to induce the reaction by-product progress of the gas.

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